Automatic radiator assembling system

Abstract

The utility model provides an automatic radiator assembling system. The automatic radiator assembling system comprises a feeding and discharging mechanism, a conveying mechanism, a carrying assembly, a magnetic bead placing device, a crystal device placing device, a ceramic chip placing device, a radiating block placing device, an insulating particle placing device, a locking device and a first control assembly. The first control assembly controls the material moving assembly to move a sealing gasket to a carrying disc on the upper layer of the conveying mechanism, the magnetic bead placing equipment places magnetic beads to corresponding hole positions of the sealing gasket, the crystal device placing equipment places crystal devices to corresponding positions of the sealing gasket, the ceramic chip placing equipment places ceramic chips to corresponding positions of the crystal devices, and the conveying mechanism conveys the ceramic chips to the conveying mechanism. The heat dissipation block placing equipment places heat dissipation blocks on corresponding hole sites of a sealing gasket, the insulation particle placing equipment places insulation particles on corresponding positions of the sealing gasket, and the locking equipment carries out locking work on the positions, needing locking, of the sealing gasket, so that automatic assembly of the heat dissipation device is completed, the steps are simple, the number of needed personnel is small, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of automation equipment, in particular to an automatic radiator assembly system. Background Art

[0002] The radiator of the charging power module is used to quickly dissipate the heat generated by the charging power module during the charging process to the surrounding environment, so as to keep the module in a low-temperature working state. If the heat generated by the charging power module cannot be dissipated in time, it may cause the module to overheat, affect its normal charging operation, and even damage. Therefore, the radiator plays a role in protecting the charging power module from the influence of high temperature, ensuring the normal operation and stability of the charging power module.

[0003] In the related art, the radiator includes a heat dissipation block, a magnetic bead, a gasket, a ceramic sheet, an insulating particle and a crystal device. During the assembly process of the radiator, the crystal device is first trimmed and formed manually, the ceramic sheet is coated, then the magnetic bead is picked up with tweezers and placed into the corresponding hole of the gasket, the crystal device that has been trimmed and formed is inserted into the corresponding position of the gasket, the ceramic sheet that has been coated is placed at the corresponding position of the crystal device, the heat dissipation block is inserted into the corresponding position of the gasket, and finally the insulating particle is picked up and placed into the corresponding hole of the gasket, and the installation is completed by screwing, resulting in the assembly of the radiator being carried out manually, with cumbersome steps, a large number of required personnel, and high costs. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide an automatic radiator assembly system, aiming to solve the problems of cumbersome steps and high costs in the manual assembly of radiators in the related art.

[0005] To solve the above technical problem, the utility model provides an automatic radiator assembly system, including:

[0006] A loading and unloading mechanism, provided with a heat dissipation block loading component, a gasket loading component and a unloading component;

[0007] A transmission mechanism, arranged on one side of the loading and unloading mechanism, the transmission mechanism is used to convey a carrier tray, and the conveying mode of the carrier tray on the transmission mechanism is two-layer circulation rotation up and down;

[0008] A material handling component, arranged on the transmission mechanism, the material handling component is used to move the gasket conveyed by the gasket loading component to the upper layer of the transmission mechanism, and move the radiator conveyed by the upper layer of the transmission mechanism to the unloading component;

[0009] A magnetic bead placement device, arranged on one side of the transmission mechanism;

[0010] A crystal device placement device, arranged on one side of the transfer mechanism;

[0011] A ceramic sheet placement device, arranged on one side of the transfer mechanism;

[0012] A heat sink placement device, arranged on one side of the transfer mechanism, and the heat sink feeding component is used to supply materials to the heat sink placement device;

[0013] An insulating particle placement device, arranged on one side of the transfer mechanism;

[0014] A locking device, arranged on one side of the transfer mechanism; and,

[0015] A first control component, electrically connected to the heat sink feeding component, the heat sink feeding component, the discharging component, the transfer mechanism, the magnetic bead placement device, the crystal device placement device, the ceramic sheet placement device, the heat sink placement device, the insulating particle placement device, the locking device, and the material handling component respectively;

[0016] Wherein, the magnetic bead placement device, the crystal device placement device, the ceramic sheet placement device, the heat sink placement device, the insulating particle placement device, the locking device, and the material handling component are distributed in sequence.

[0017] Optionally, the transfer mechanism includes:

[0018] A cabinet;

[0019] An upper layer transfer component, arranged on the surface of the cabinet and electrically connected to the first control component;

[0020] A lower layer transfer component, arranged inside the cabinet and electrically connected to the first control component, and the conveying direction of the lower layer transfer component is opposite to that of the upper layer transfer component; and,

[0021] A carrier plate lifting component, arranged on the cabinet and electrically connected to the first control component, there are two carrier plate lifting components, and the two carrier plate lifting components, the upper layer transfer component, and the lower layer transfer component together form a conveying method of circulating and flowing in upper and lower layers.

[0022] Optionally, the carrier plate lifting component includes:

[0023] A lifting drive source, arranged on the cabinet and electrically connected to the first control component;

[0024] A support frame, arranged on the lifting drive source, and the lifting drive source is used to drive the support frame to rise to connect with the upper layer transfer component or descend to connect with the lower layer transfer component; and,

[0025] A transfer component, disposed on the support frame and electrically connected to the first control component; wherein, when the support frame is connected to the upper transfer component, the conveying direction of the transfer component is the same as that of the upper transfer component; when the support frame is connected to the lower transfer component, the conveying direction of the transfer component is the same as that of the lower transfer component.

[0026] Optionally, the material handling component includes:

[0027] A material handling moving module, disposed on the transfer mechanism and electrically connected to the first control component, and the material handling moving module straddles above the gasket feeding component and the blanking component;

[0028] A material handling lifting module, disposed on the material handling moving module and electrically connected to the first control component; and,

[0029] A material handling clamping component, disposed on the material handling lifting module and electrically connected to the first control component.

[0030] Optionally, the magnetic bead placement device includes:

[0031] A magnetic bead feeder, disposed on the surface of the transfer mechanism and electrically connected to the first control component;

[0032] A magnetic bead handling module, disposed on the surface of the transfer mechanism and electrically connected to the first control component; and,

[0033] A magnetic bead adsorption component, disposed on the magnetic bead handling module and electrically connected to the first control component.

[0034] Optionally, the crystal device placement device includes:

[0035] A crystal device forming device, disposed on one side of the transfer mechanism and electrically connected to the first control component;

[0036] A crystal device handling module, disposed on the surface of the transfer mechanism and electrically connected to the first control component; and,

[0037] A fourth crystal device clamping component, disposed on the crystal device handling module and electrically connected to the first control component.

[0038] Optionally, the ceramic chip placement device includes:

[0039] A ceramic chip coating device, disposed on one side of the transfer mechanism and electrically connected to the first control component;

[0040] A ceramic sheet handling module, disposed on the surface of the transfer mechanism and electrically connected to the first control component; and,

[0041] A fifth ceramic sheet clamping component, disposed on the ceramic sheet handling module and electrically connected to the first control component.

[0042] Optionally, the heat sink placement device includes:

[0043] A heat sink handling module, disposed on the transfer mechanism and electrically connected to the first control component;

[0044] A heat sink rotating component, disposed on the heat sink handling module and electrically connected to the first control component; and,

[0045] A heat sink clamping component, disposed on the heat sink rotating component and electrically connected to the first control component.

[0046] Optionally, the insulating particle placement device includes:

[0047] An insulating particle feeder, disposed on the surface of the transfer mechanism and electrically connected to the first control component;

[0048] An insulating particle handling module, disposed on the surface of the transfer mechanism and electrically connected to the first control component; and,

[0049] An insulating particle clamping component, disposed on the insulating particle handling module and electrically connected to the first control component.

[0050] Optionally, the locking device includes:

[0051] A screw driving module, disposed on the surface of the transfer mechanism and electrically connected to the first control component; and,

[0052] A screw driving component, disposed on the screw driving module and electrically connected to the first control component.

[0053] Compared with related technologies, the beneficial effects of an automatic radiator assembly system in the present utility model are as follows: The first control component controls the material handling component to move the gasket on the gasket feeding component to the carrier plate on the upper layer of the transmission mechanism. The transmission mechanism drives the gasket through the carrier plate to successively pass through the bead placement device, the crystal device placement device, the ceramic sheet placement device, the heat sink placement device, the insulating particle placement device, and the locking device. The bead placement device places beads on the corresponding holes of the gasket, the crystal device placement device places the crystal devices that have completed trimming and forming on the corresponding positions of the gasket, the ceramic sheet placement device places the coated ceramic sheets on the corresponding positions of the crystal devices, the heat sink placement device places the heat sinks on the corresponding holes of the gasket, the insulating particle placement device places the insulating particles on the corresponding positions of the gasket, and the locking device performs locking work at the positions where locking is required on the gasket, thereby completing the automatic assembly of the radiator. The steps are simple, the number of personnel required is small, and the cost is low. Moreover, during the assembly process, there is no need for personnel to frequently contact crystal devices and ceramic sheets, etc., which can reduce electrostatic damage to personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0055] Figure 1 is a schematic structural diagram of the automatic radiator assembly system provided by the embodiment of the present utility model;

[0056] Figure 2 is Figure 1 an enlarged view of detail A therein;

[0057] Figure 3 is an assembly schematic diagram of the loading and unloading mechanism and the transmission mechanism in the automatic radiator assembly system provided by the embodiment of the present utility model;

[0058] Figure 4 is a schematic structural diagram of the crystal device forming equipment provided by the embodiment of the present utility model;

[0059] Figure 5 is an assembly schematic diagram of the storage tube assembly and the feeding mechanism in the crystal device forming equipment provided by the embodiment of the present utility model;

[0060] Figure 6 is an assembly schematic diagram of the crystal device handling component, the cutting component, and the bending component in the crystal device forming equipment provided by the embodiment of the present utility model;

[0061] Figure 7 It is a schematic structural diagram of the ceramic chip coating device provided by an embodiment of the present utility model;

[0062] Figure 8 It is an assembly schematic diagram of the vibration transfer component and the ceramic chip adsorption component in the ceramic chip coating device provided by an embodiment of the present utility model;

[0063] Figure 9 It is a schematic structural diagram of the first coating component in the ceramic chip coating device provided by an embodiment of the present utility model;

[0064] Figure 10 It is an assembly schematic diagram between the ceramic chip handling component and each carrier stage in the ceramic chip coating device provided by an embodiment of the present utility model.

[0065] In the attached drawings, each reference numeral represents: 1. Loading and unloading mechanism; 11. Heat sink loading component; 12. Gasket loading component; 13. Unloading component; 2. Transmission mechanism; 21. Cabinet; 22. Upper layer transmission component; 23. Lower layer transmission component; 24. Carrier plate lifting component; 241. Lifting drive source; 242. Support frame; 243. Transfer transmission component; 3. Material handling component; 31. Handling moving module; 32. Handling lifting module; 33. Handling clamping component; 4. Bead placement device; 5. Crystal device placement device; 51. Crystal device forming equipment; 511. Forming frame; 5111. First intermediate loading table; 5112. Cutting loading table; 5113. Bending loading table; 5114. Second intermediate loading table; 512. Storage tube component; 513. Feeding mechanism; 5131. Pushing moving track; 5132. Pushing belt; 5133. Pushing moving source; 5134. Feeding vibration source; 5135. Feeding vibration track; 5136. Limiting plate; 5137. Blocking component; 5138. Pushing component; 514. Crystal device handling component; 5141. Crystal device handling drive source; 5142. First crystal device clamping component; 5143. Second crystal device clamping component; 5144. Third crystal device clamping component; 5145. Handling connection plate; 515. Cutting component; 5151. Cutting frame; 5152. Cutting drive source; 5153. Cutting seat; 5154. Cutting tool; 516. Bending component; 5161. Bending frame; 5162. Bending drive source; 5163. Bending part; 517. Plasma blower; 52. Crystal device handling module; 6. Ceramic chip placement device; 61. Ceramic chip coating equipment; 611. Coating frame; 6111. First intermediate loading platform; 6112. First coating loading table; 6113. Turning loading platform; 6114. Second coating loading platform; 6115. Second intermediate loading platform; 6116. Feeding loading platform; 612. Ceramic chip feeding component; 6121. Vibration feeding mechanism; 61211. Vibration disk feeding component; 61212. Linear vibration feeding component; 6122. Vibration handling component; 6123. Ceramic chip adsorption component; 61231. Adsorption seat; 61232. Adsorption lifting component; 61233. Rotation drive source; 61234. Adsorption part; 613. Ceramic chip handling component; 6131. Ceramic chip handling drive source; 6132. First ceramic chip clamping component; 6133. Second ceramic chip clamping component; 6134. Third ceramic chip clamping component; 6135. Fourth ceramic chip clamping component; 6136. Transfer connection plate; 614. First coating component; 6141. First coating seat; 6142. First coating lifting component; 6143. First spraying component; 61431. First nozzle; 61432. First printing seat; 61433. First printing screen; 615. Ceramic chip turning component; 6151. Turning seat; 6152. Turning lifting component; 6153. Turning drive source;6154. Inverted clamping assembly; 616. Second coating assembly; 62. Ceramic sheet handling module; 7. Heat sink placement device; 8. Insulating particle placement device; 9. Locking device. Detailed implementation mode

[0066] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

[0067] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0068] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" and "several" mean two or more, unless otherwise specifically defined.

[0069] Embodiment:

[0070] Please refer to Figures 1 to 10, an embodiment of the present utility model provides a radiator automatic assembly system, including a loading and unloading mechanism 1, a transmission mechanism 2, a material handling component 3, a magnetic bead placement device 4, a crystal device placement device 5, a ceramic sheet placement device 6, a heat sink placement device 7, an insulating particle placement device 8, a locking device 9, and a first control component. The loading and unloading mechanism 1 is provided with a heat sink loading component 11, a gasket loading component 12, and a unloading component 13; the transmission mechanism 2 is arranged on one side of the loading and unloading mechanism 1, and the transmission mechanism 2 is used for conveying a carrier tray, and the conveying mode of the carrier tray on the transmission mechanism 2 is two-layer cyclic flow; the material handling component 3 is arranged on the transmission mechanism 2, and the material handling component 3 is used for moving the gasket conveyed by the gasket loading component 12 to the upper layer of the transmission mechanism 2, and moving the radiator conveyed by the upper layer of the transmission mechanism 2 to the unloading component 13; the magnetic bead placement device 4 is arranged on one side of the transmission mechanism 2; the crystal device placement device 5 is arranged on one side of the transmission mechanism 2; the ceramic sheet placement device 6 is arranged on one side of the transmission mechanism 2; the heat sink placement device 7 is arranged on one side of the transmission mechanism 2, and the heat sink loading component 11 is used for feeding the heat sink placement device 7; the insulating particle placement device 8 is arranged on one side of the transmission mechanism 2; the locking device 9 is arranged on one side of the transmission mechanism 2; the first control component is electrically connected to the heat sink loading component 11, the gasket loading component 12, the unloading component 13, the transmission mechanism 2, the magnetic bead placement device 4, the crystal device placement device 5, the ceramic sheet placement device 6, the heat sink placement device 7, the insulating particle placement device 8, the locking device 9, and the material handling component 3 respectively; wherein, the magnetic bead placement device 4, the crystal device placement device 5, the ceramic sheet placement device 6, the heat sink placement device 7, the insulating particle placement device 8, the locking device 9, and the material handling component 3 are distributed in sequence.

[0071] The first control component controls the material handling component 3 to move the gasket on the gasket loading component 12 to the carrier tray on the upper layer of the transmission mechanism 2. The transmission mechanism 2 drives the gasket to pass through the magnetic bead placement device 4, the crystal device placement device 5, the ceramic sheet placement device 6, the heat sink placement device 7, the insulating particle placement device 8, and the locking device 9 in sequence through the carrier tray. The magnetic bead placement device 4 places the magnetic beads at the corresponding holes of the gasket, the crystal device placement device 5 places the crystal device that has completed the corner cutting and forming at the corresponding position of the gasket, the ceramic sheet placement device 6 places the coated ceramic sheet at the corresponding position of the crystal device, the heat sink placement device 7 places the heat sink at the corresponding holes of the gasket, the insulating particle placement device 8 places the insulating particles at the corresponding position of the gasket, and the locking device 9 performs the locking work at the position where locking is required on the gasket, thereby completing the automatic assembly of the radiator. The steps are simple, the number of required personnel is small, and the cost is low. Moreover, during the assembly process, there is no need for personnel to frequently contact the crystal device and the ceramic sheet, etc., which can reduce the electrostatic damage of personnel.

[0072] Please refer to Figure 1 ,Figure 2 And Figure 3 , the transmission mechanism 2 includes a cabinet 21, an upper-layer transmission component 22, a lower-layer transmission component 23, and a carrier plate lifting component 24. The upper-layer transmission component 22 is arranged on the surface of the cabinet 21 and electrically connected to the first control component, so that the gasket loaded on the carrier plate is conveyed on the surface of the cabinet 21, and thus other components can be installed on the gasket. The lower-layer transmission component 23 is arranged inside the cabinet 21 and electrically connected to the first control component. The conveying direction of the lower-layer transmission component 23 is opposite to that of the upper-layer transmission component 22, that is, the upper-layer transmission component 22 and the lower-layer transmission component 23 are respectively distributed outside and inside the cabinet 21, which can maximize the utilization of the space of the cabinet 21 and reduce the external dimension of the transmission mechanism 2. The carrier plate lifting component 24 is arranged on the cabinet 21 and electrically connected to the first control component. There are two carrier plate lifting components 24. The two carrier plate lifting components 24, the upper-layer transmission component 22, and the lower-layer transmission component 23 together form a conveying method of circulating and flowing between the upper and lower layers. Specifically, one carrier plate lifting component 24 drives the carrier plate on the upper-layer transmission component 22 to the lower-layer transmission component 23, and the other carrier plate lifting component 24 drives the carrier plate on the lower-layer transmission component 23 to the upper layer, realizing the conveying method of circulating and flowing between the upper and lower layers of the carrier plate.

[0073] In some embodiments, as Figure 2 and Figure 3 shown, both the upper-layer transmission component 22 and the lower-layer transmission component 23 are conveyor belt components. The upper-layer transmission component 22 is provided with a magnetic bead placement station, a crystal device placement station, a ceramic chip placement station, a heat sink placement station, an insulating particle placement station, and a locking station which are sequentially distributed along its conveying direction. A plurality of lifting cylinders and a plurality of infrared sensors are arranged on the surface of the cabinet 21. The plurality of lifting cylinders and the plurality of infrared sensors are arranged in one-to-one correspondence with the magnetic bead placement station, the crystal device placement station, the ceramic chip placement station, the heat sink placement station, the insulating particle placement station, and the locking station. When the infrared sensor detects that there is a carrier plate at the corresponding station, the lifting cylinder jacks up the carrier plate to position the carrier plate at the corresponding station.

[0074] Please refer to Figure 1 and Figure 3, the tray lifting assembly 24 includes a lifting drive source 241, a support frame 242, and a transfer transmission assembly 243. The lifting drive source 241 is disposed on the cabinet 21 and electrically connected to the first control assembly; the support frame 242 is disposed on the lifting drive source 241, and the lifting drive source 241 is used to drive the support frame 242 to rise to connect with the upper transfer assembly 22 or descend to connect with the lower transfer assembly 23; the transfer transmission assembly 243 is disposed on the support frame 242 and electrically connected to the first control assembly; wherein, when the support frame 242 is connected to the upper transfer assembly 22, the conveying direction of the transfer transmission assembly 243 is the same as that of the upper transfer assembly 22, so as to convey the tray on the upper transfer assembly 22 to the support frame 242, or convey the tray on the support frame 242 to the upper transfer assembly 22; when the support frame 242 is connected to the lower transfer assembly 23, the conveying direction of the transfer transmission assembly 243 is the same as that of the lower transfer assembly 23, so as to convey the tray on the support frame 242 to the lower transfer assembly 23, or convey the tray on the lower transfer assembly 23 to the support frame 242.

[0075] It should be noted that one of the two tray lifting assemblies 24 is at the head end of the cabinet 21, and the other is at the tail end of the cabinet 21; wherein, for the tray lifting assembly 24 corresponding to the head end, when the support frame 242 is connected to the upper transfer assembly 22, the material handling assembly 3 moves the gasket onto the tray on the support frame 242, and the lifting drive source 241 drives the support frame 242 to descend to drive the tray to descend until the support frame 242 is connected to the lower transfer assembly 23. At this time, the transfer transmission assembly 243 conveys the tray loaded with the gasket to the lower transfer assembly 23, and then the lifting drive source 241 drives the support frame 242 to rise to the initial state; for the tray lifting assembly 24 corresponding to the tail end, when the support frame 242 is connected to the lower transfer assembly 23, the lifting drive source 241 drives the support frame 242 to rise to drive the tray to rise until the support frame 242 is connected to the upper transfer assembly 22. At this time, the transfer transmission assembly 243 conveys the tray loaded with the gasket to the upper transfer assembly 22, and then the lifting drive source 241 drives the support frame 242 to descend to the initial state.

[0076] According to actual needs, the lifting drive source 241 can be a linear module, and the linear module is vertically arranged; the transfer transmission assembly 243 can be a conveyor belt, and the conveyor belt is arranged on the support frame 242; a sensor is arranged on the support frame 242, and the sensor is used to detect whether there is a tray on the support frame 242.

[0077] Please refer to Figure 2 and Figure 3, the material handling component 3 includes a handling moving module 31, a handling lifting module 32, and a handling clamping component 33. The handling moving module 31 is disposed on the transmission mechanism 2 and electrically connected to the first control component. The handling moving module 31 is straddled above the gasket feeding component 12 and the discharging component 13; the handling lifting module 32 is disposed on the handling moving module 31 and electrically connected to the first control component; the handling clamping component 33 is disposed on the handling lifting module 32 and electrically connected to the first control component. The handling moving module 31 can drive the handling lifting module 32 to move above the gasket feeding component 12 or the discharging component 13. The handling lifting module 32 can drive the handling clamping component 33 to move in a direction close to or away from the upper part of the gasket feeding component 12 or the discharging component 13, so that the handling clamping component 33 can clamp the gasket on the gasket feeding component 12 and carry it to the upper layer transmission component 22, or clamp the radiator on the upper layer transmission component 22 and carry it to the discharging component 13.

[0078] According to actual needs, the handling moving module 31 can be a linear module. One end of the linear module is fixed to the cabinet body 21, and the other end is straddled above the heat sink feeding component 11, the gasket feeding component 12, and the discharging component 13. Among them, the heat sink feeding component 11, the gasket feeding component 12, and the discharging component 13 are distributed in sequence, and the heat sink feeding component 11 is closest to the transmission mechanism 2. The heat sink feeding component 11, the gasket feeding component 12, and the discharging component 13 can use a conveyor belt for feeding or discharging. The handling lifting module 32 can be a motor, and the handling clamping component 33 can be a combination of a cylinder and a claw.

[0079] Please refer to Figure 1 , the magnetic bead placement device 4 includes a magnetic bead supplier, a magnetic bead handling module, and a magnetic bead adsorption component. The magnetic bead supplier is disposed on the surface of the transmission mechanism 2 and electrically connected to the first control component. The magnetic bead supplier is used to supply magnetic beads; the magnetic bead handling module is disposed on the surface of the transmission mechanism 2 and electrically connected to the first control component. The magnetic bead handling module transports the magnetic beads supplied by the magnetic bead supplier to the upper layer transmission component 22; the magnetic bead adsorption component is disposed on the magnetic bead handling module and electrically connected to the first control component. The magnetic bead adsorption component can adsorb the magnetic beads provided by the magnetic bead supplier and place the adsorbed magnetic beads on the corresponding holes of the gasket.

[0080] According to actual needs, the magnetic bead handling module can be a manipulator or a linear module, and the magnetic bead adsorption component can be a vacuum adsorber. The nozzle of the vacuum adsorber is blocked in the middle and vacuum adsorbed at the edge.

[0081] Please refer to Figure 1 and Figure 4, the crystal device placement equipment 5 includes a crystal device forming equipment 51 and a crystal device handling module 52. The crystal device forming equipment 51 is arranged on one side of the transmission mechanism 2 and electrically connected to the first control component. The crystal device forming equipment 51 is used to supply transistors that have been cut and formed. The crystal device handling module 52 is arranged on the surface of the transmission mechanism 2 and electrically connected to the first control component. The crystal device handling module 52 can be a manipulator or a linear module. The crystal device handling module 52 is used to transfer the crystal devices on the crystal device forming equipment 51 to the upper transmission component 22. The fourth crystal device clamping component is arranged on the crystal device handling module 52 and electrically connected to the first control component. The fourth crystal device clamping component can be a combination of a cylinder and a clamp. The fourth crystal device clamping component is used to clamp the crystal devices on the crystal device forming equipment 51 or place the crystal devices on the upper transmission component 22.

[0082] Please refer to Figure 4 , Figure 5 and Figure 6 , the crystal device forming equipment 51 includes a forming frame 511, a material storage tube component 512, a feeding mechanism 513, a crystal device handling component 514, a cutting component 515, a bending component 516 and a second control component. The forming frame 511 is provided with a first intermediate loading table 5111, a cutting loading table 5112, a bending loading table 5113 and a second intermediate loading table 5114 which are distributed at intervals in sequence; the material storage tube component 512 is arranged on the forming frame 511. The material storage tube component 512 is used to store the material tubes, and a plurality of crystal devices are arranged along the length direction of the material tubes; the feeding mechanism 513 is arranged on the forming frame 511. The feeding mechanism 513 is used to convey the crystal devices in the material tubes to the first intermediate loading table 5111; the crystal device handling component 514 is arranged on the forming frame 511. The crystal device handling component 514 is used to transfer the crystal devices on the first intermediate loading table 5111 to the cutting loading table 5112, transfer the crystal devices on the cutting loading table 5112 to the bending loading table 5113, and transfer the crystal devices on the bending loading table 5113 to the second intermediate loading table 5114; the cutting component 515 is arranged on the forming frame 511. The cutting component 515 is used to cut the pins of the crystal devices on the cutting loading table 5112; the bending component 516 is arranged on the forming frame 511. The bending component 516 is used to bend the pins of the crystal devices on the bending loading table 5113; the second control component is arranged on the forming frame 511. The second control component is electrically connected to the cutting component 515, the bending component 516, the feeding mechanism 513 and the crystal device handling component 514 respectively.

[0083] By setting a cutting component 515 and a bending component 516 on the crystal forming device, the pins of the crystal device can be automatically cut and bent. The first intermediate loading table 5111 is fed by a feeding mechanism 513, and the transfer of the crystal device between the first intermediate loading table 5111, the cutting loading table 5112, the bending loading table 5113, and the second intermediate loading table 5114 is completed by the crystal device handling component 514, thereby realizing the automatic feeding and automatic transfer of the crystal device, enabling the automatic processing and forming of the crystal device, and greatly improving the production efficiency and product consistency. In addition, there is no manual contact during the processing and forming process of the crystal device, which can avoid electrostatic damage.

[0084] It should be noted that the crystal device can be a transistor. The first intermediate loading table 5111 is used to place the crystal device conveyed by the feeding mechanism 513, and the second intermediate loading table 5114 is used to place the crystal device that has completed cutting and forming. Grooves adapted to the crystal device are provided on the first intermediate loading table 5111, the cutting loading table 5112, the bending loading table 5113, and the second intermediate loading table 5114 to place the crystal device, and infrared detectors are provided on the first intermediate loading table 5111, the cutting loading table 5112, the bending loading table 5113, and the second intermediate loading table 5114. The infrared detector can detect whether the crystal device is placed in the groove, and the second control component determines whether to perform the next process according to the detection result of the infrared detector.

[0085] Please refer to Figure 4 and Figure 6, the crystal device handling assembly 514 includes a crystal device handling drive source 5141, a first crystal device clamping assembly 5142, a second crystal device clamping assembly 5143, and a third crystal device clamping assembly 5144. The crystal device handling drive source 5141 is disposed on the forming frame 511 and electrically connected to the second control assembly; the first crystal device clamping assembly 5142 is disposed on the crystal device handling drive source 5141 and electrically connected to the second control assembly. The first crystal device clamping assembly 5142 is configured to move between the cutting loading table 5112 and the first intermediate loading table 5111 under the drive of the crystal device handling drive source 5141, so that the first crystal device clamping assembly 5142 can move to the first intermediate loading table 5111 under the drive of the crystal device handling drive source 5141 to clamp the crystal device, and move to the cutting loading table 5112 under the drive of the crystal device handling drive source 5141 to place the crystal device for the cutting assembly 515 to cut, completing the transfer of the crystal device between the cutting loading table 5112 and the first intermediate loading table 5111. The second crystal device clamping assembly 5143 is disposed on the crystal device handling drive source 5141 and electrically connected to the second control assembly. The second crystal device clamping assembly 5143 is configured to move between the cutting loading table 5112 and the bending loading table 5113 under the drive of the crystal device handling drive source 5141, so that the second crystal device clamping assembly 5143 can move to the cutting loading table 5112 under the drive of the crystal device handling drive source 5141 to clamp the crystal device whose pins have been cut, and move to the bending loading table 5113 under the drive of the crystal device handling drive source 5141 to place the crystal device for the bending assembly 516 to bend, completing the transfer of the crystal device between the cutting loading table 5112 and the bending loading table 5113. The third crystal device clamping assembly 5144 is disposed on the crystal device handling drive source 5141 and electrically connected to the second control assembly. The third crystal device clamping assembly 5144 is configured to move between the bending loading table 5113 and the second intermediate loading table 5114 under the drive of the crystal device handling drive source 5141, so that the third crystal device clamping assembly 5144 can move to the bending loading table 5113 under the drive of the crystal device handling drive source 5141 to clamp the crystal device whose pins have been bent, and move to the second intermediate loading table 5114 under the drive of the crystal device handling drive source 5141 to place the crystal device, completing the transfer of the crystal device between the bending loading table 5113 and the second intermediate loading table 5114, thereby completing the automatic transfer of the crystal device on the equipment.

[0086] According to actual needs, the crystal device transport drive source 5141 can be a linear module and a manipulator, etc., and the first crystal device clamping assembly 5142, the second crystal device clamping assembly 5143 and the third crystal device clamping assembly 5144 can all be composed of a cylinder and a clamp; wherein, the first crystal device clamping assembly 5142, the second crystal device clamping assembly 5143 and the third crystal device clamping assembly 5144 can be driven by the same crystal device transport drive source 5141, or can be driven by different crystal device transport drive sources 5141, for example, the linear module is provided with one, and the first crystal device clamping assembly 5142, the second crystal device clamping assembly 5143 and the third crystal device clamping assembly 5144 are connected to the same linear module; or, the linear module is provided with three, and the three linear modules are connected to the first crystal device clamping assembly 5142, the second crystal device clamping assembly 5143 and the third crystal device clamping assembly 5144 one-to-one.

[0087] In some embodiments, Figure 6 As shown, the crystal device transport driving source 5141 is a linear module, and the crystal device transporting component 514 also includes a transport connecting plate 5145 arranged on the crystal device transporting driving source 5141, and the first crystal device clamping component 5142, the second crystal device clamping component 5143 and the third crystal device clamping component 5144 are all arranged at intervals on the same side of the transport connecting plate 5145, that is, the first crystal device clamping component 5142, the second crystal device clamping component 5143 and the third crystal device clamping component 5144 are connected to the same crystal device transport driving source 5141, so that the moving actions of the first crystal device clamping component 5142, the second crystal device clamping component 5143 and the third crystal device clamping component 5144 can be kept consistent, thereby avoiding interference between the clamping components due to asynchronous actions; moreover, the number of linear modules set can be reduced to reduce costs. Among them, the distance between the first crystal device clamping assembly 5142 and the second crystal device clamping assembly 5143 is the same as the distance between the first intermediate transfer platform 5111 and the cutting transfer platform 5112, and the distance between the second crystal device clamping assembly 5143 and the third crystal device clamping assembly 5144 is the same as the distance between the cutting transfer platform 5112 and the bending transfer platform 5113, so as to ensure that the crystal device transport driving source 5141 can drive the first crystal device clamping assembly 5142, the second crystal device clamping assembly 5143 and the third clamping group to move synchronously to the waiting position, the material picking position or the material placing position, wherein the waiting position is the position where the transport clamping assembly is staggered with the transfer platform, the material picking position is the position where the transport clamping assembly is on the transfer platform when clamping the crystal device, and the material placing position is the position where the transport clamping assembly is on the transfer platform when placing the crystal device.

[0088] According to actual needs, the first intermediate transfer platform 5111, the cutting platform 5112, the bending platform 5113 and the second intermediate transfer platform 5114 are all arranged on one side of the crystal device transport driving source 5141 which is provided with a transport connecting plate 5145. The straight line connecting the first intermediate transfer platform 5111, the cutting platform 5112, the bending platform 5113 and the second intermediate transfer platform 5114 is parallel to the axial direction of the crystal device transport driving source 5141.

[0089] See also Figure 4 and Figure 5 The feeding mechanism 513 includes a material pushing moving track 5131, a material pushing belt 5132 and a material pushing moving source 5133. The material pushing moving track 5131 is arranged on the molding frame 511, one end of the material pushing moving track 5131 is connected to the first intermediate transfer platform 5111, and the material pushing moving track 5131 is used to support the material tube. The material pushing belt 5132 is arranged on the material pushing moving track 5131, and the material pushing belt 5132 can extend into the material tube to push the crystal device, so that the crystal device in the material tube can be transported to the first intermediate transfer platform 5111; the material pushing moving source 5133 is arranged on the molding frame 511 and is electrically connected to the second control component, and the material pushing belt 5132 is connected to the material pushing moving source 5133, and the material pushing moving source 5133 is used to drive the material pushing belt 5132 to move along the length direction of the material pushing moving track 5131, so that the material pushing belt 5132 can push the crystal device in the material tube to move.

[0090] In some embodiments, the push belt 5132 and the push moving source 5133 may be meshed transmission, for example, the push belt 5132 is provided with meshing teeth on the side close to the push moving track 5131, and the push moving source 5133 may be a motor, and the output end of the motor is provided with a gear, and the gear meshes with the meshing teeth for transmission, so that the feeding drive source can drive the push belt 5132 to move. Moreover, the push belt 5132 is provided with a pressing piece on the side away from the push moving track 5131, and the pressing piece presses the push belt 5132 against the meshing teeth, thereby ensuring that the gear and the meshing teeth are closely matched.

[0091] According to actual needs, the pusher moving source 5133 can be a servo motor, and the transmission length of the pusher belt 5132 can be recorded by an encoder; moreover, an infrared detector is provided at one end of the pusher moving track 5131 close to the first intermediate transfer platform 5111, and the infrared detector is used to detect the crystal device in the material tube, so as to facilitate confirmation of whether the crystal device in the material tube is pushed out. The pusher belt 5132 has a certain rigidity, so as to ensure that the crystal device in the material tube can be pushed to move; moreover, the pusher belt 5132 is adapted to the material tube, so that the pusher belt 5132 can be easily extended into or out of the material tube; the length of the pusher belt 5132 is longer than the length of the material tube, so as to ensure that the pusher belt 5132 can push out all the crystal devices in the material tube.

[0092] Please refer to Figure 4 and Figure 5 As shown in FIGS. and, the feeding mechanism 513 further includes a feeding vibration source 5134, a feeding vibration track 5135, and a limiting plate 5136. The feeding vibration source 5134 is disposed on the molding frame 511 and electrically connected to the second control component; the feeding vibration track 5135 is connected to the feeding vibration source 5134. The two ends of the feeding vibration track 5135 are respectively connected to the first intermediate loading table 5111 and the pushing moving track 5131. The feeding vibration track 5135 is used for vibrating and feeding under the drive of the feeding vibration source 5134. Among them, the feeding vibration track 5135 is connected to the pushing moving track 5131 through the first intermediate loading table 5111; the limiting plate 5136 is disposed on the feeding vibration track 5135. An active gap is provided between the limiting plate 5136 and the feeding vibration track 5135. The active gap is used to accommodate the crystal device, so that the limiting plate 5136 can limit the crystal device to vibrate only within the active gap, avoiding the crystal device from detaching from the feeding vibration track 5135.

[0093] It should be noted that the feeding vibration source 5134, the feeding vibration track 5135, and the limiting plate 5136 together constitute a linear vibration feeding. Compared with the feeding of the pushing belt 5132, setting the linear vibration feeding can more accurately control the moving distance of the crystal device and avoid the crystal device from getting stuck between the first intermediate loading table 5111 and the feeding vibration track 5135. In addition, compared with vibrating the crystal device in the material tube out, pushing the crystal device in the material tube by the pushing belt 5132 is more convenient, and the structure is simpler and the cost is lower.

[0094] Please refer to Figure 4 and Figure 5, in some embodiments, the first intermediate transfer platform 5111 can be movably arranged on the molding frame 511, and the first intermediate transfer platform 5111 can move to the transfer position and the loading position. For example, the first intermediate transfer platform 5111 can be connected to the molding frame 511 through a cylinder; wherein, when the cylinder drives the first intermediate transfer platform 5111 to move forward, the first intermediate transfer platform 5111 moves to the loading position. At this time, the opening of the groove on the first intermediate transfer platform 5111 faces the feeding vibrating track 5135 to ensure that the feeding vibrating track 5135 can convey the crystal device into the groove; when the cylinder drives the first intermediate transfer platform 5111 to move backward, the first intermediate transfer platform 5111 moves to the transfer position. At this time, the opening of the groove on the first intermediate transfer platform 5111 is arranged in a dislocation manner with the feeding vibrating track 5135, and the first crystal device clamping assembly 5142 can clamp the crystal device to pick up the material, and will not be interfered by the feeding vibrating track 5135 during the picking process. Moreover, an infrared detector is arranged above the first intermediate transfer platform 5111. When the infrared detector detects that a crystal device is placed on the first intermediate transfer platform 5111, the second control component controls the feeding vibrating track 5135 to stop vibrating, and the first intermediate transfer platform 5111 starts to move from the loading position to the transfer position.

[0095] Please refer to Figure 5 , the material tubes accommodated in the material tube assembly 512 are stacked, and the pushing moving track 5131 is arranged on one side of the material tube assembly 512. The feeding mechanism 513 further includes a blocking component 5137 and a pushing component 5138. The blocking component 5137 is arranged on the molding frame 511. The blocking component 5137 is provided with a movable blocking piece. The blocking piece is arranged on the side of the pushing moving track 5131 away from the material tube assembly 512. Setting the blocking piece can block the left and right movement of the material tube when the pushing belt 5132 pushes the crystal device, and improve the smoothness of the crystal device pushing. The pushing component 5138 is arranged on the molding frame 511 and is electrically connected to the second control component. The pushing direction of the pushing component 5138 is from the material tube assembly 512 towards the blocking piece. The pushing component 5138 can push the material tube stored in the material tube assembly 512 onto the pushing moving track 5131, and can also push the material tube on the pushing moving track 5131 out of the pushing moving track 5131, thereby realizing the automation of feeding. Among them, when the pushing component 5138 pushes the material tube onto the pushing moving track 5131 for the first time, after all the crystal devices in the material tube are pushed out, the pushing component 5138 makes a second push to push the material tube out of the pushing moving track 5131, and then proceeds to the next cycle.

[0096] Please refer to Figure 5, in some embodiments, the blocking assembly 5137 further includes a baffle, which is connected to the material storage tube assembly 512 and disposed above the moving feeding track. The baffle can limit the up-and-down movement of the material tubes on the moving feeding track. The blocking piece can be a hinge, one piece of the hinge is fixed on the baffle, and the other piece is suspended. The suspended blade of the hinge can block the left-and-right movement of the material tube. The pushing assembly 5138 includes a pushing source, a pushing connecting plate, and a push rod. The pushing source is fixed below the material storage tube assembly 512 and connected to the pushing connecting plate. The pushing connecting plate is slidably connected to the material storage tube assembly 512. The push rod is fixed on the pushing connecting plate. Driven by the pushing connecting plate, the push rod pushes the material tube in the direction of the blocking piece, so that the material tube can be pushed onto the pushing moving track 5131 and pushed out from the pushing moving track 5131. Among them, the pushing source can be a motor, and a guiding assembly can be provided between the pushing connecting plate and the material storage tube assembly 512 to guide the sliding of the pushing connecting plate. For example, one of the pushing connecting plate and the material storage tube assembly 512 is provided with a guide rail, and the other is provided with a guiding groove, and the guide rail is slidably assembled in the guiding groove.

[0097] Please refer to Figure 5 , the material storage tube assembly 512 includes a base and a bracket. The base is fixed to the molding frame 511, and the bracket is fixed to the base. There are two brackets, and the two brackets enclose to form a material storage cavity. The material tubes are stacked in the material storage cavity. The pushing assembly 5138 sequentially pushes the material tubes in the material storage cavity onto the pushing moving track 5131 from bottom to top. Among them, an empty groove communicating with the material storage cavity is provided on the base, and the push rod extends into the material storage cavity, so that the surface of the push rod on the side close to the bracket relative to the base protrudes, so that the push rod can push the material tube. According to actual needs, a material tube storage basket is further provided on the molding frame 511. The material tube storage basket is disposed on one side of the moving feeding track and is used for storing the material tubes.

[0098] Please refer to Figure 4 and Figure 6 , the cutting assembly 515 includes a cutting frame 5151, a cutting drive source 5152, a cutting seat 5153, and a cutting tool 5154. The cutting frame 5151 is disposed on the molding frame 511; the cutting drive source 5152 is disposed on the cutting frame 5151 and electrically connected to the second control assembly; the cutting seat 5153 is disposed on the cutting drive source 5152; the cutting tool 5154 is disposed on the cutting seat 5153. The cutting tool 5154 is disposed above the cutting loading table 5112. The cutting drive source 5152 drives the cutting seat 5153 to move up and down, and the cutting seat 5153 drives the cutting tool 5154 to move up and down, so that the cutting tool 5154 can move to cooperate with the cutting loading table 5112 to cut the pins of the crystal device, so that the length of the pins of the crystal device is within a suitable range. According to actual needs, the cutting drive source 5152 can be a motor.

[0099] In some embodiments, the cutting assembly 515 further includes a pressing air cylinder, which is disposed on the cutting frame 5151 and electrically connected to the second control assembly. The pressing air cylinder is used to press the crystal device when the cutting tool 5154 cuts the pins, ensuring the normal progress of cutting. A guide rail is provided between the cutting seat 5153 and the cutting frame 5151, and the guide rail can guide the sliding of the cutting seat 5153.

[0100] Please refer to Figure 4 and Figure 6 , the bending assembly 516 includes a bending frame 5161, a bending driving source 5162 and a bending member 5163. The bending frame 5161 is disposed on the forming machine frame 511; the bending driving source 5162 is disposed on the bending frame 5161 and electrically connected to the second control assembly; the bending member 5163 is disposed on the bending driving source 5162, and the bending member 5163 is located above the bending loading table 5113. The bending driving source 5162 drives the bending member 5163 to move up and down, so that the bending member 5163 can move to cooperate with the bending loading table 5113 to bend the pins of the crystal device, so as to form the pins of the crystal device. According to actual needs, the bending driving source 5162 can be an air cylinder.

[0101] Please refer to Figure 4 and Figure 5 , the crystal device forming equipment 51 further includes a vision detection assembly and a plasma blower 517. The vision detection assembly is disposed on the forming machine frame 511 and electrically connected to the second control assembly. There are two vision detection assemblies, and the detection directions of the two vision detection assemblies respectively face the cutting loading table 5112 and the bending loading table 5113. The vision detection assembly can perform real-time detection on the chamfering and forming of the crystal device, ensuring that the chamfering and forming meet the process requirements; among them, the vision detection assembly can be a camera assembly or a CCD assembly, etc. The plasma blower 517 is disposed on the forming machine frame 511 and electrically connected to the second control assembly. The blowing direction of the plasma blower 517 faces the first intermediate loading table 5111. The setting of the plasma blower 517 can reduce static electricity and protect the electrical safety of the crystal device.

[0102] Please refer to Figure 1 and Figure 7, the ceramic chip placement device 6 includes a ceramic chip coating device 61, a ceramic chip handling module 62, and a fifth ceramic chip clamping component. The ceramic chip coating device 61 is disposed on one side of the transfer mechanism 2 and electrically connected to the first control component. The ceramic chip coating device 61 is used to provide ceramic chips that have been double-sided coated. The ceramic chip handling module 62 is disposed on the surface of the transfer mechanism 2 and electrically connected to the first control component. The ceramic chip handling module 62 can be a manipulator or a linear module. The ceramic chip handling module 62 is used to transfer the ceramic chips on the ceramic chip coating device 61 to the upper transfer component 22. The fifth ceramic chip clamping component is disposed on the ceramic chip handling module 62 and electrically connected to the first control component. The fifth ceramic chip clamping component can be a combination of a cylinder and a jaw. The fifth ceramic chip clamping component is used to clamp the ceramic chips on the ceramic chip coating device 61 or place the ceramic chips on the upper transfer component 22.

[0103] Please refer to Figures 7 to 10 , the ceramic chip coating device 61 is used to coat the first side and the second side of the ceramic chip that are oppositely arranged. The ceramic chip coating device 61 includes: a coating frame 611, a ceramic chip feeding component 612, a ceramic chip handling component 613, a first coating component 614, a ceramic chip flipping component 615, a second coating component 616, and a third control component. The coating frame 611 is provided with a first intermediate loading platform 6111, a first coating loading platform, a flipping loading platform 6113, a second coating loading platform 6114, and a second intermediate loading platform 6115 that are sequentially and spaced apart; the ceramic chip feeding component 612 is disposed on the coating frame 611. The ceramic chip feeding component 612 is used to supply ceramic chips to the first intermediate loading platform 6111; the ceramic chip handling component 613 is disposed on the coating frame 611. The ceramic chip handling component 613 is used to transfer the ceramic chips on the first intermediate loading platform 6111 to the first coating loading platform, transfer the ceramic chips on the first coating loading platform to the flipping loading platform 6113, transfer the ceramic chips on the flipping loading platform 6113 to the second coating loading platform 6114, and transfer the ceramic chips on the second coating loading platform 6114 to the second intermediate loading platform 6115; the first coating component 614 is disposed on the coating frame 611. The first coating component 614 is used to coat the first side of the ceramic chip placed on the first coating loading platform; the ceramic chip flipping component 615 is disposed on the coating frame 611. The ceramic chip flipping component 615 is used to flip the ceramic chip placed on the flipping loading platform 6113; the second coating component 616 is disposed on the coating frame 611. The second coating component 616 is used to coat the second side of the ceramic chip placed on the second coating loading platform 6114; the third control component is disposed on the coating frame 611. The third control component is electrically connected to the ceramic chip feeding component 612, the ceramic chip handling component 613, the first coating component 614, the ceramic chip flipping component 615, and the second coating component 616 respectively.

[0104] The first coating component 614 on the ceramic chip coating device 61 is used to coat the first side of the ceramic chip on the first coating carrier table. The ceramic chip flipping component 615 flips the ceramic chip that has completed the coating of the first side, so that the second coating component 616 can coat the second side of the ceramic chip, completing the automatic coating of the first side and the second side of the ceramic chip. Each coating is only applied to the current side, which can ensure the force of coating and printing, make the silicone grease evenly coated on the ceramic chip, avoid the risk of missing printing or under-printing, and at the same time ensure the consistency of the silicone grease printing thickness. In addition, the ceramic chip feeding component 612 supplies materials, and the transfer of ceramic chips between the first intermediate carrier table 6111, the first coating carrier table, the flipping carrier table 6113, the second coating carrier table 6114, and the second intermediate carrier table 6115 is realized through the ceramic chip handling component 613, which can realize the automatic feeding and automatic transfer of ceramic chips, so that the ceramic chips are automatically coated, greatly improving the production efficiency.

[0105] It should be noted that the first intermediate carrier table 6111 is used to place the ceramic chips supplied by the ceramic chip feeding component 612, and the second intermediate carrier table 6115 is used to place the ceramic chips that have completed double-sided coating. Grooves adapted to the ceramic chips are provided on the first intermediate carrier table 6111, the first coating carrier table, the flipping carrier table 6113, the second coating carrier table 6114, and the second intermediate carrier table 6115 to place the ceramic chips. Infrared detectors are provided on the first intermediate carrier table 6111, the first coating carrier table, the flipping carrier table 6113, the second coating carrier table 6114, and the second intermediate carrier table 6115. The infrared detectors can detect whether the ceramic chips are placed in the grooves, and the third control component determines whether to perform the next process according to the detection results of the infrared detectors.

[0106] Please refer to Figure 7 and Figure 10, the ceramic sheet flipping assembly 615 includes a flipping base 6151, a flipping lifting assembly 6152, a flipping drive source 6153, and a flipping clamping assembly 6154. The flipping base 6151 is disposed on the coating rack 611; the flipping lifting assembly 6152 is disposed on the flipping base 6151 and electrically connected to the third control assembly; the flipping drive source 6153 is disposed on the flipping lifting assembly 6152 and electrically connected to the third control assembly. The flipping lifting assembly 6152 is configured to drive the flipping drive source 6153 to move in a direction closer to or away from the flipping carrier 6113, specifically, the flipping lifting assembly 6152 drives the flipping drive source 6153 to move up and down; the flipping clamping assembly 6154 is disposed on the flipping drive source 6153 and electrically connected to the third control assembly. The flipping clamping assembly 6154 is disposed above the flipping carrier 6113. The flipping clamping assembly 6154 is configured to clamp the ceramic sheet, and the flipping drive source 6153 is configured to drive the flipping clamping assembly 6154 to rotate, so that the flipping clamping assembly 6154 drives the ceramic sheet to flip, specifically, the flipping clamping assembly 6154 drives the ceramic sheet to flip from the first side to the second side; wherein, when on the first coating carrier, the first side of the ceramic sheet is disposed opposite to the first coating assembly 614, and when on the second coating carrier 6114, the second side of the ceramic sheet is disposed opposite to the second coating assembly 616.

[0107] According to actual needs, the flipping lifting assembly 6152 can be a cylinder, the flipping drive source 6153 can be a motor, the flipping drive source 6153 is connected to the piston rod of the flipping lifting assembly 6152 through a flipping connecting plate. A guide rail and a guide seat are provided between the flipping connecting plate and the flipping base 6151. One of the guide rail and the guide seat is disposed on the flipping connecting plate, and the other is disposed on the flipping base 6151. The guide rail is slidably assembled in the guide seat to guide the lifting of the flipping drive source 6153. The flipping clamping assembly 6154 can be a combination of a cylinder and a jaw, and the cylinder drives the jaw to clamp or release the ceramic sheet.

[0108] Please refer to Figure 7 and Figure 10, the ceramic sheet handling assembly 613 includes a ceramic sheet handling drive source 6131, a first ceramic sheet clamping assembly 6132, a second ceramic sheet clamping assembly 6133, a second ceramic sheet clamping assembly 6133, and a fourth ceramic sheet clamping assembly 6135. The ceramic sheet handling drive source 6131 is disposed on the coating rack 611 and electrically connected to the third control assembly. The first ceramic sheet clamping assembly 6132 is disposed on the ceramic sheet handling drive source 6131 and electrically connected to the third control assembly. The first ceramic sheet clamping assembly 6132 is used to move between the first transfer stage 6111 and the first coating stage under the drive of the ceramic sheet handling drive source 6131, so that the first ceramic sheet clamping assembly 6132 can move to the first transfer stage 6111 to clamp the ceramic sheet under the drive of the ceramic sheet handling drive source 6131, and move to the first coating stage to place the ceramic sheet for coating by the first coating assembly 614, completing the transfer of the ceramic sheet between the first transfer stage 6111 and the first coating stage. The second ceramic sheet clamping assembly 6133 is disposed on the ceramic sheet handling drive source 6131 and electrically connected to the third control assembly. The second ceramic sheet clamping assembly 6133 is used to move between the first coating stage and the turning stage 6113 under the drive of the ceramic sheet handling drive source 6131, so that the second ceramic sheet clamping assembly 6133 can move to the first coating stage to clamp the ceramic sheet under the drive of the ceramic sheet handling drive source 6131, and move to the turning stage 6113 to place the ceramic sheet for flipping by the ceramic sheet flipping assembly 615, completing the transfer of the ceramic sheet between the first coating stage and the turning stage 6113. The second ceramic sheet clamping assembly 6133 is disposed on the ceramic sheet handling drive source 6131 and electrically connected to the third control assembly. The second ceramic sheet clamping assembly 6133 is used to move between the turning stage 6113 and the second coating stage 6114 under the drive of the ceramic sheet handling drive source 6131, so that the second ceramic sheet clamping assembly 6133 can move to the turning stage 6113 to clamp the ceramic sheet under the drive of the ceramic sheet handling drive source 6131, and move to the second coating stage 6114 to place the ceramic sheet for coating by the second coating assembly 616, completing the transfer of the ceramic sheet between the turning stage 6113 and the second coating stage 6114.The fourth ceramic chip clamping component 6135 is arranged on the ceramic chip handling drive source 6131 and electrically connected to the third control component. The fourth ceramic chip clamping component 6135 is used to move between the second coating stage 6114 and the second intermediate transfer stage 6115 under the drive of the ceramic chip handling drive source 6131, so that the fourth ceramic chip clamping component 6135 can move to the second coating stage to clamp the ceramic chip under the drive of the ceramic chip handling drive source 6131, and move to the second intermediate transfer stage 6115 to place the ceramic chip under the drive of the ceramic chip handling drive source 6131, completing the transfer of the ceramic chip between the second coating stage 6114 and the second intermediate transfer stage 6115, thereby completing the automatic transfer of the ceramic chip on the ceramic chip coating device 61.

[0109] According to actual needs, the ceramic chip handling drive source 6131 can be a linear module, a manipulator, etc. The first ceramic chip clamping component 6132, the second ceramic chip clamping component 6133, the second ceramic chip clamping component 6133, and the fourth ceramic chip clamping component 6135 can all be composed of a cylinder and a jaw. Among them, the first ceramic chip clamping component 6132, the second ceramic chip clamping component 6133, the second ceramic chip clamping component 6133, and the fourth ceramic chip clamping component 6135 can be driven by the same ceramic chip handling drive source 6131, or can be driven by different ceramic chip handling drive sources 6131. For example, there is one linear module, and the first ceramic chip clamping component 6132, the second ceramic chip clamping component 6133, the second ceramic chip clamping component 6133, and the fourth ceramic chip clamping component 6135 are connected to the same linear module, or there are four linear modules, and the first ceramic chip clamping component 6132, the second ceramic chip clamping component 6133, the second ceramic chip clamping component 6133, and the fourth ceramic chip clamping component 6135 are respectively connected to four linear modules in one-to-one correspondence.

[0110] Please refer to Figure 10In some embodiments, the ceramic sheet transport driving source 6131 can be a linear module, and the ceramic sheet transporting component 613 also includes a transfer connecting plate 6136 arranged on the ceramic sheet transporting driving source 6131, and the first ceramic sheet clamping component 6132, the second ceramic sheet clamping component 6133, the second ceramic sheet clamping component 6133, and the fourth ceramic sheet clamping component 6135 are arranged at intervals on the same side of the transfer connecting plate 6136, that is, the first ceramic sheet clamping component 6132, the second ceramic sheet clamping component 6133, the second ceramic sheet clamping component 6133 and the fourth ceramic sheet clamping component 6135 are connected to the same linear module, so that the moving actions of each transfer clamping component can be kept consistent, avoiding interference between each clamping component due to asynchronous actions; moreover, the number of linear modules set can be reduced to reduce costs. The distance between the first ceramic sheet clamping assembly 6132 and the second ceramic sheet clamping assembly 6133 is the same as the distance between the first intermediate stage 6111 and the first coating stage, the distance between the second ceramic sheet clamping assembly 6133 and the second ceramic sheet clamping assembly 6133 is the same as the distance between the first coating stage and the flip stage 6113, and the distance between the second ceramic sheet clamping assembly 6133 and the fourth ceramic sheet clamping assembly 6135 is the same as the distance between the flip stage 6113 and the second coating stage 6114. The distances are the same to ensure that the ceramic wafer transport drive source 6131 can drive the first ceramic wafer clamping assembly 6132, the second ceramic wafer clamping assembly 6133, the third ceramic wafer clamping assembly 6133 and the fourth ceramic wafer clamping assembly 6135 to move synchronously to the waiting position, the material picking position or the material placing position, wherein the waiting position is the position where the transfer clamping assembly is staggered with the stage, the material picking position is the position where the transfer clamping assembly clamps the ceramic wafer on the stage, and the material placing position is the position where the transfer clamping assembly places the ceramic wafer on the stage.

[0111] According to actual needs, the first middle transfer platform 6111, the first coating platform, the flipping platform 6113, the second coating platform 6114, and the second middle transfer platform 6115 are all arranged on the side of the ceramic sheet transporting drive source 6131 where the transfer connecting plate 6136 is provided, and the straight line connecting the first middle transfer platform 6111, the first coating platform, the flipping platform 6113, the second coating platform 6114, and the second middle transfer platform 6115 is parallel to the axial direction of the ceramic sheet transporting drive source 6131.

[0112] See also Figure 7 and Figure 8, a feeding carrier table 6116 is further provided on the coating rack 611. The ceramic sheet feeding assembly 612 includes a vibrating feeding mechanism 6121, a vibrating transfer assembly 6122, and a ceramic sheet adsorption assembly 6123. The vibrating feeding mechanism 6121 is arranged on the coating rack 611 and electrically connected to the third control assembly. The vibrating ceramic sheet feeding assembly 612 is used to vibrate and supply ceramic sheets to the feeding carrier table 6116; the vibrating transfer assembly 6122 is arranged on the coating rack 611 and electrically connected to the third control assembly; the ceramic sheet adsorption assembly 6123 is arranged on the vibrating transfer assembly 6122 and electrically connected to the third control assembly. The ceramic sheet adsorption assembly 6123 is used to move between the feeding carrier table 6116 and the first intermediate transfer table 6111 under the drive of the vibrating transfer assembly 6122, so that the ceramic sheet adsorption assembly 6123 can move to the feeding carrier table 6116 to adsorb ceramic sheets under the drive of the vibrating transfer assembly 6122, and move to the first intermediate transfer table 6111 to place ceramic sheets under the drive of the vibrating transfer assembly 6122, completing the transfer of ceramic sheets between the feeding carrier table 6116 and the first intermediate transfer table 6111.

[0113] Please refer to Figure 7 and Figure 8 , the vibrating feeding mechanism 6121 includes a vibrating disk feeding assembly 61211 and a linear vibrating feeding assembly 61212. The vibrating disk feeding assembly 61211 is arranged on the coating rack 611 and electrically connected to the third control assembly; the linear vibrating feeding assembly 61212 is arranged on the coating rack 611 and electrically connected to the third control assembly. The two ends of the linear vibrating feeding assembly 61212 are respectively connected to the vibrating disk feeding assembly 61211 and the feeding carrier table 6116. The vibrating disk feeding assembly 61211 supplies materials to the linear vibrating feeding assembly 61212, and the linear vibrating feeding assembly 61212 supplies materials to the feeding carrier table 6116. According to actual needs, a large number of ceramic sheets are placed in the feeding tray of the vibrating disk feeding assembly 61211. The linear vibrating feeding assembly 61212 is provided with a linear vibrating feeding track. The two ends of the linear vibrating feeding track are respectively connected to the feeding tray and the feeding carrier table 6116. An infrared sensor is arranged at one end of the linear vibrating feeding track connected to the feeding tray. The infrared sensor is used to detect whether there are ceramic sheets on the linear vibrating feeding track. The third control assembly controls whether the vibrating disk feeding assembly 61211 supplies materials to the linear vibrating feeding track according to the detection result of the infrared sensor.

[0114] Please refer to Figure 8In some embodiments, the feeding platform 6116 is movably disposed on the coating frame 611 and is provided with a groove for accommodating the ceramic sheet, and the feeding platform 6116 can be moved to a feeding position and a suction position. For example, the feeding platform 6116 is connected to the coating frame 611 through a cylinder, wherein when the cylinder drives the feeding platform 6116 to move forward, the feeding platform 6116 moves to the feeding position, and the opening of the groove on the feeding platform 6116 faces the direct vibration feeding position. Track to ensure that the direct vibration feeding track can transport the ceramic piece into the groove; when the cylinder drives the feeding platform 6116 to move backward, the feeding platform 6116 moves to the suction position, at which time the groove of the feeding platform 6116 is located below the ceramic piece adsorption component 6123, so that the ceramic piece adsorption component 6123 can adsorb the ceramic piece, and the opening of the groove on the feeding platform 6116 is staggered with the direct vibration feeding track to prevent the direct vibration feeding track from continuing to feed. In addition, an infrared sensor is provided on the feeding platform 6116, and the infrared sensor is used to detect whether there is a ceramic piece in the groove. The third control component controls the feeding platform 6116 to move to the feeding position or the suction position according to the detection result of the infrared sensor, and controls the direct vibration feeding track to start or stop vibration feeding.

[0115] See also Figure 8 The vibration transfer assembly 6122 includes a transfer seat and a transfer drive source, the transfer seat is arranged on the coating frame 611, the transfer drive source is arranged on the transfer seat and is electrically connected to the third control assembly, and the ceramic sheet adsorption assembly 6123 is arranged on the transfer drive source, so that the transfer drive source can drive the ceramic sheet adsorption assembly 6123 to move left and right between the feeding stage 6116 and the first intermediate stage 6111. According to actual needs, the transfer drive source can be a linear module, a cylinder or a manipulator, etc.

[0116] See also Figure 7 and Figure 8, the ceramic chip adsorption assembly 6123 includes an adsorption base 61231, an adsorption lifting assembly 61232, a rotation driving source 61233, and an adsorbing member 61234. The adsorption base 61231 is arranged on the vibration transfer assembly 6122; the adsorption lifting assembly 61232 is arranged on the adsorption base 61231 and electrically connected to the third control assembly; the rotation driving source 61233 is arranged on the adsorption lifting assembly 61232 and electrically connected to the third control assembly. The rotation driving source 61233 is used to move between the feeding carrier 6116 and the first intermediate carrier 6111 under the drive of the adsorption lifting assembly 61232; the adsorbing member 61234 is arranged on the rotation driving source 61233 and electrically connected to the third control assembly. The adsorbing member 61234 is used to rotate under the drive of the rotation driving source 61233. Among them, the adsorption lifting assembly 61232 drives the adsorbing member 61234 to move up and down, so that the adsorbing member 61234 can adsorb the ceramic chip on the feeding carrier 6116; the rotation driving source 61233 drives the adsorbing member 61234 to rotate, so that the adsorbing member 61234 can drive the ceramic chip to rotate, thereby adjusting the placement orientation of the ceramic chip to facilitate the subsequent coating process.

[0117] According to actual needs, the adsorption lifting assembly 61232 can be a cylinder, a manipulator, a motor, etc., the rotation driving source 61233 can be a motor, etc., and the adsorbing member 61234 can be a vacuum adsorption cylinder, and the end of the vacuum adsorption cylinder adsorbs the ceramic chip. A guide rail and a guide seat can be arranged between the adsorption base 61231 and the adsorption lifting assembly 61232. The guide rail and the guide seat are in sliding fit, and one of the guide rail and the guide seat is arranged on the adsorption base 61231, and the other is arranged on the adsorption lifting assembly 61232, so as to guide the lifting of the adsorption base 61231.

[0118] Please refer to Figure 7 and Figure 9, the first coating assembly 614 includes a first coating base 6141, a first coating lifting assembly 6142, and a first spraying assembly 6143. The first coating base 6141 is disposed on the coating rack 611; the first coating lifting assembly 6142 is disposed on the first coating base 6141 and electrically connected to the third control assembly; the first spraying assembly 6143 is disposed on the first coating lifting assembly 6142 and electrically connected to the third control assembly. The first spraying assembly 6143 is located above the first coating stage. The first spraying assembly 6143 is provided with a first nozzle 61431 and a first printing base 61432 having a concave cavity. The first nozzle 61431 is used to supply silicone grease to the first printing base 61432. A first printing screen 61433 adapted to the ceramic chip is provided at the bottom of the concave cavity. The first printing screen 61433 is located directly above the first coating stage. When the first coating lifting assembly 6142 drives the first printing base 61432 to move downward until the first printing screen 61433 is in contact with the ceramic chip, the first nozzle 61431 sprays silicone grease onto the first printing base 61432, and the first printing screen 61433 prints the silicone grease on the first side of the ceramic chip. After printing, the first coating lifting assembly 6142 drives the first spraying assembly 6143 to rise upward.

[0119] According to actual needs, the first coating lifting assembly 6142 can be a cylinder, a motor, etc. A cylinder can be provided between the first nozzle 61431 and the first coating lifting assembly 6142, and the cylinder can drive the first nozzle 61431 to move back and forth, so as to conveniently adjust the position of the first nozzle 61431. The first printing base 61432 is slidably assembled on the first coating base 6141, and the first printing base 61432 is connected to the first coating lifting assembly 6142; a guide rail and a guide seat are provided between the first printing base 61432 and the first coating base 6141, and the guide rail and the guide seat are in sliding fit, and one of the guide rail and the guide seat is disposed on the first coating base 6141, and the other is disposed on the first printing base 61432, so as to guide the lifting of the first printing base 61432.

[0120] Please refer to Figure 7, the second coating assembly 616 includes a second coating base, a second coating lifting assembly, and a second spraying assembly. The second coating base is disposed on the coating frame 611; the second coating lifting assembly is disposed on the second coating base and electrically connected to the third control assembly; the second spraying assembly is disposed on the second coating lifting assembly and electrically connected to the third control assembly. The second spraying assembly is disposed above the second coating stage 6114. The second spraying assembly is provided with a second nozzle and a second printing base having a concave cavity. The second nozzle is used to supply silicone grease to the second printing base. The bottom of the concave cavity is provided with a second printing screen adapted to the ceramic chip. The second printing screen is disposed directly above the second coating stage 6114. When the second coating lifting assembly drives the second printing base to move downward until the second printing screen is in contact with the ceramic chip, the second nozzle sprays silicone grease onto the second printing base, and the second printing screen prints the silicone grease on the second side of the ceramic chip. After printing is completed, the second coating lifting assembly drives the second spraying assembly to rise upward.

[0121] According to actual needs, the second coating lifting assembly can be a cylinder, a motor, etc. A cylinder can be provided between the second nozzle and the second coating lifting assembly, and the cylinder can drive the second nozzle to move back and forth, so as to conveniently adjust the position of the second nozzle. The second printing base is slidably assembled on the second coating base and is connected to the second coating lifting assembly; a guide rail and a guide seat are provided between the second printing base and the second coating base. The guide rail and the guide seat are slidably matched, and one of the guide rail and the guide seat is disposed on the second coating base, and the other is disposed on the second printing base, so as to guide the lifting of the second printing base.

[0122] The ceramic chip coating device 61 further includes a visual monitoring assembly. The visual monitoring assembly is disposed on the coating frame 611 and electrically connected to the third control assembly. There are two visual monitoring assemblies, and the monitoring directions of the two visual monitoring assemblies respectively face the first coating stage and the second coating stage 6114. The visual monitoring assembly can monitor the coating of the ceramic chip to avoid missing coating and undercoating. According to actual needs, the visual monitoring assembly can be a camera assembly, a CCD assembly, etc.

[0123] Please refer to Figure 1, the heat sink placement device 7 includes a heat sink handling module, a heat sink rotation assembly, and a heat sink clamping assembly. The heat sink handling module is disposed on the transmission mechanism 2 and electrically connected to the first control assembly. The heat sink handling module can be a manipulator or a linear module, etc. The heat sink handling module is used to transport the heat sinks supplied by the heat sink loading assembly 11 to the upper layer transmission assembly 22. The heat sink rotation assembly is disposed on the heat sink handling module and electrically connected to the first control assembly. The heat sink rotation assembly can be a motor. The heat sink rotation assembly is used to drive the heat sink clamping assembly to flip, and the heat sink clamping assembly drives the gasket to flip, so that the gasket is on the top and the heat sink is on the bottom. The heat sink clamping assembly is disposed on the heat sink rotation assembly and electrically connected to the first control assembly. The heat sink clamping assembly can be a combination of a cylinder and a jaw. The heat sink clamping assembly is used to clamp the heat sinks on the heat sink loading assembly 11 or place the heat sinks on the upper layer transmission assembly 22.

[0124] Please refer to Figure 1 , the insulating particle placement device 8 includes an insulating particle feeder, an insulating particle handling module, and an insulating particle clamping assembly. The insulating particle feeder is disposed on the surface of the transmission mechanism 2 and electrically connected to the first control assembly. The insulating particle feeder is used to supply insulating particles. The insulating particle handling module is disposed on the surface of the transmission mechanism 2 and electrically connected to the first control assembly. The insulating particle handling module can be a manipulator or a linear module. The insulating particle handling module is used to transport the insulating particles on the insulating particle feeder to the upper layer transmission assembly 22. The insulating particle clamping assembly is disposed on the insulating particle handling module and electrically connected to the first control assembly. The insulating particle clamping assembly can be a combination of a cylinder and a jaw. The insulating particle clamping assembly is used to clamp the insulating particles on the insulating particle feeder or place the insulating particles on the upper layer transmission assembly 22.

[0125] Please refer to Figure 1 , the locking device 9 includes a screw driving module and a screw driving component. The screw driving module is disposed on the surface of the transmission mechanism 2 and electrically connected to the first control assembly. The screw driving module can be a manipulator or a linear module. The screw driving module is used to drive the screw driving component to move to the locking position. The screw driving component is disposed on the screw driving module and electrically connected to the first control assembly. The screw driving component drives the screw to be driven at the corresponding position of the gasket, so as to complete the locking work.

[0126] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A radiator automatic assembly system, characterized in that: include: The loading and unloading mechanism is provided with a heat sink loading assembly, a sealing pad loading assembly and a unloading assembly; A transmission mechanism is arranged on one side of the loading and unloading mechanism, and the transmission mechanism is used to transport the carrier, and the carrier on the transmission mechanism is transported in a two-layer circulation manner; A material moving assembly, arranged on the transmission mechanism, for moving the sealing gasket conveyed by the sealing gasket loading assembly to the upper layer of the transmission mechanism, and for moving the radiator conveyed by the upper layer of the transmission mechanism to the unloading assembly; A magnetic bead placement device is arranged on one side of the transmission mechanism; A crystal device placement device is arranged on one side of the transmission mechanism; A ceramic sheet placing device is arranged on one side of the transmission mechanism; A heat sink placement device is arranged on one side of the transmission mechanism, and the heat sink feeding assembly is used to feed the heat sink placement device; An insulating particle placing device is arranged on one side of the transmission mechanism; a locking device, disposed on one side of the transmission mechanism; and A first control component is electrically connected to the heat sink loading component, the heat sink loading component, the unloading component, the transmission mechanism, the magnetic bead placement device, the crystal device placement device, the ceramic sheet placement device, the heat sink placement device, the insulating particle placement device, the locking device and the material handling component; Among them, the magnetic bead placement equipment, the crystal device placement equipment, the ceramic sheet placement equipment, the heat sink placement equipment, the insulating particle placement equipment, the locking equipment and the material handling assembly are distributed in sequence.

2. The automatic radiator assembly system according to claim 1, characterized in that: The transmission mechanism comprises: Cabinet; An upper transmission component, disposed on the surface of the cabinet and electrically connected to the first control component; a lower transmission component, which is disposed in the cabinet and electrically connected to the first control component, wherein the conveying direction of the lower transmission component is opposite to the conveying direction of the upper transmission component; and The carrier plate lifting component is arranged in the cabinet and electrically connected to the first control component. There are two carrier plate lifting components. The two carrier plate lifting components, the upper transmission component and the lower transmission component together form a conveying mode of upper and lower layer circulation.

3. The automatic radiator assembly system according to claim 2, characterized in that: The carrier plate lifting assembly comprises: A lifting drive source, disposed in the cabinet and electrically connected to the first control component; A support frame, arranged on the lifting drive source, the lifting drive source is used to drive the support frame to rise to connect with the upper transmission component or to descend to connect with the lower transmission component; and A transfer transmission component is arranged on the support frame and electrically connected to the first control component; wherein, when the support frame is connected to the upper transmission component, the conveying direction of the transfer transmission component is the same as the conveying direction of the upper transmission component; when the support frame is connected to the lower transmission component, the conveying direction of the transfer transmission component is the same as the conveying direction of the lower transmission component.

4. The automatic radiator assembly system according to claim 1, characterized in that: The material handling assembly comprises: A moving module is arranged on the transmission mechanism and electrically connected to the first control component, and the moving module is arranged across the sealing pad loading component and the unloading component; A moving and lifting module is disposed on the moving and movable module and is electrically connected to the first control component; and The moving clamping component is disposed on the moving lifting module and is electrically connected to the first control component.

5. The automatic radiator assembly system according to claim 1, characterized in that: The magnetic bead placement device comprises: A magnetic bead supplier, disposed on the surface of the transmission mechanism and electrically connected to the first control component; a magnetic bead transport module, disposed on the surface of the transmission mechanism and electrically connected to the first control component; and The magnetic bead adsorption component is disposed on the magnetic bead transport module and is electrically connected to the first control component.

6. The automatic assembling system for heat sink according to claim 1, characterized in that: The crystal device placement equipment comprises: A crystal device forming device, disposed on one side of the transmission mechanism and electrically connected to the first control component; a crystal device transport module, disposed on the surface of the transmission mechanism and electrically connected to the first control component; and The fourth crystal device clamping component is disposed on the crystal device transporting module and is electrically connected to the first control component.

7. The automatic assembling system for heat sink according to claim 1, characterized in that: The ceramic sheet placing device comprises: A ceramic sheet coating device, disposed on one side of the transmission mechanism and electrically connected to the first control component; a ceramic sheet transport module, disposed on the surface of the transmission mechanism and electrically connected to the first control component; and The fifth ceramic sheet clamping assembly is disposed on the ceramic sheet conveying module and is electrically connected to the first control assembly.

8. The automatic assembling system for heat sink according to claim 1, characterized in that: The heat sink placement device comprises: A heat sink transport module, disposed on the transmission mechanism and electrically connected to the first control component; a heat sink rotating assembly, disposed on the heat sink transport module and electrically connected to the first control assembly; and The heat sink clamping assembly is disposed on the heat sink rotating assembly and is electrically connected to the first control assembly.

9. The automatic assembling system for heat sink according to claim 1, characterized in that: The insulating particle placing device comprises: An insulating particle supplier, disposed on the surface of the transmission mechanism and electrically connected to the first control component; an insulating particle transport module, disposed on the surface of the transmission mechanism and electrically connected to the first control component; and The insulating particle clamping component is disposed on the insulating particle conveying module and is electrically connected to the first control component.

10. The automatic assembling system for heat sink according to claim 1, characterized in that: The locking device comprises: a screw driving module, disposed on the surface of the transmission mechanism and electrically connected to the first control component; and The screw driving component is arranged on the screw driving module and is electrically connected to the first control component.

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