Metal combined sealing element forming die

Abstract

The utility model relates to the technical field of dies, in particular to a metal combined sealing element forming die which comprises an upper die plate and a lower die plate, an upper die is fixedly installed at the bottom of the upper die plate, a lower die is fixedly installed at the top of the lower die and located at the bottom of the upper die, an upper die core is arranged at the bottom of the upper die, and a lower die core is arranged at the bottom of the lower die. An upper mold core matched with the upper mold core for use is arranged at the top of the upper mold, a lower mold core matched with the upper mold core for use is arranged at the top of the lower mold, and the interiors of the upper mold core and the lower mold core are used for forming the metal combined sealing element. The upper mold core is cooled, the semiconductor refrigeration plate cools the lower mold core from the lower side, so that the metal combined sealing element formed between the upper mold core and the lower mold core can be rapidly cooled and demolded, and the forming speed of the mold on the metal combined sealing element is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of molds, and specifically relates to a forming mold for a metal combined seal. Background Technique

[0002] A mold is various dies and tools used in industrial production to obtain the required products by methods such as injection molding, blow molding, extrusion, die casting, forging, smelting, stamping, etc.

[0003] In the prior art, such as a plastic injection mold device for an automotive seal proposed in the patent application number "CN202110382474.7", it includes an upper mold base, and a lower mold base corresponding to the upper mold base. Mold grooves are provided inside both the upper mold base and the lower mold base, and an injection port is provided above the upper mold base.

[0004] However, for the mold proposed in the above patent application, after the seal is formed, the seal cannot be cooled in time, and the formed seal needs to be cooled before demolding. As a result, the mold in the prior art cannot be quickly demolded after the seal is formed, affecting the forming speed of the seal. Content of the Utility Model

[0005] The purpose of the utility model is to provide a forming mold for a metal combined seal to solve the problems proposed in the above background technique.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A forming mold for a metal combined seal includes an upper template and a lower template. An upper mold is fixedly installed at the bottom of the upper template, and a lower mold is fixedly installed at the top of the lower mold and at the bottom of the upper mold. An upper mold core is provided at the bottom of the upper mold, and a lower mold core that cooperates with the upper mold core is provided at the top of the lower mold. The upper mold core and the lower mold core are used for the forming of the metal combined seal.

[0008] A cavity is opened at the top of the upper mold. A coolant input pipe and a coolant output pipe are respectively fixedly connected to both sides of the cavity. One ends of the coolant input pipe and the coolant output pipe both extend to the outside of the upper mold. Solenoid valves are fixedly connected to the outer surfaces of the coolant input pipe and the coolant output pipe at the upper mold. A flow dividing ring is fixedly connected inside the cavity for dividing the coolant flow.

[0009] Preferably, a closing plate is provided at the top of the cavity. A plurality of fixing bolts are provided on the closing plate, and the fixing bolts are threadedly connected to the bottom of the inner wall of the cavity for fixing the closing plate to the top of the cavity.

[0010] Preferably, heat-conducting grooves arranged in an annular array are formed in the inner wall of the cavity around the flow dividing ring, and metal heat-conducting shafts are arranged in the heat-conducting grooves.

[0011] Preferably, a heat dissipation air duct is formed at the top of the upper mold, and an L-shaped connecting air duct is formed at the top of the closing plate. The L-shaped connecting air duct is communicated with the heat dissipation air duct.

[0012] Preferably, rectangular plates are fixedly installed on the same side of the upper template, the upper mold and the lower mold through bolts, and a control handle is fixedly connected to one side of the rectangular plate.

[0013] Preferably, a semiconductor refrigerating plate is fixedly connected to the bottom of the lower template. The semiconductor refrigerating plate is annularly designed. A guide shaft is fixedly installed on the lower template, and the top of the guide shaft sequentially penetrates through the lower mold, the upper mold and extends into the interior of the upper template.

[0014] The beneficial effects of the present utility model:

[0015] The mold proposed by the present utility model can perform injection molding of a metal combined seal between the upper mold core and the lower mold core. After the injection molding is completed, the coolant enters the cavity to cool the upper mold core, and the semiconductor refrigerating plate cools the lower mold core from below, so that the metal combined seal formed between the upper mold core and the lower mold core can be quickly cooled and demolded, improving the molding speed of the mold for the metal combined seal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts;

[0017] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 is the present utility model Figure 1 a schematic diagram of the structure at the bottom of the lower template in;

[0019] Figure 3 is the present utility model Figure 1 a schematic diagram of the structure at the bottom of the upper mold in;

[0020] Figure 4 is the present utility model Figure 1 a schematic diagram of the structure at the bottom of the lower mold in;

[0021] Figure 5 is the present utility model Figure 1 a schematic diagram of the structure at the bottom of the upper mold in;

[0022] Figure 6 is a schematic diagram of the structure inside the hollow cavity of the present utility model Figure 5 of the present utility model;

[0023] Figure 7 is a side view of the upper mold of the present utility model Figure 6 of the present utility model.

[0024] The reference numerals in the figure are as follows:

[0025] 1. upper template, 2. lower template, 3. upper mold, 301. upper mold core, 4. lower mold, 401. lower mold core, 5. cavity, 6. coolant input pipe, 7. coolant output pipe, 8. solenoid valve, 9. flow splitting ring, 10. closing plate, 11. fixing bolt, 12. heat conduction groove, 13. metal heat conduction shaft, 14. heat dissipation air duct, 15. L-shaped connecting air duct, 16. rectangular plate, 17. control handle, 18. semiconductor refrigeration plate, 19. guiding shaft. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0027] A metal combined seal forming mold includes an upper template 1 and a lower template 2. The bottom of the upper template 1 is fixedly installed with an upper mold 3, and the top of the lower mold 4 and at the bottom of the upper mold 3 is fixedly installed with a lower mold 4. The bottom of the upper mold 3 is provided with an upper mold core 301, and the top of the lower mold 4 is provided with a lower mold core 401 that cooperates with the upper mold core 301. The upper mold core 301 and the lower mold core 401 are used for the forming of the metal combined seal.

[0028] A cavity 5 is opened at the top of the upper mold 3. The two sides of the cavity 5 are respectively fixedly connected with a coolant input pipe 6 and a coolant output pipe 7. One ends of the coolant input pipe 6 and the coolant output pipe 7 both extend to the outside of the upper mold 3. Solenoid valves 8 are fixedly connected to the outer surfaces of the coolant input pipe 6 and the coolant output pipe 7 at the upper mold 3. A flow splitting ring 9 is fixedly connected inside the cavity 5 for splitting the coolant.

[0029] As Figure 1 、 Figure 2 、 Figure 3 and Figure 4, the upper template 1 and the upper die 3 are fixedly installed together through a bolt structure, and the lower template 2 and the lower die 4 are also installed together through a bolt structure. The upper template 1 and the upper die 3 can be driven by an external device to move up and down, which is convenient for injection molding of metal combined seals on the upper die core 301 and the lower die core 401. When the upper die 3 and the lower die 4 are combined together, the upper die core 301 and the lower die core 401 can be closed together, and both the upper die 3 and the lower die 4 are made of heat-conducting materials.

[0030] As Figure 6 and Figure 7 , the coolant input pipe 6 and the coolant output pipe 7 connected to both sides of the cavity 5 are respectively connected to the external pipeline. When the solenoid valve is opened, the external coolant can enter the cavity 5 through the coolant input pipe 6, drive the heat inside the upper die core 301 below the upper die 3, and then be output from the cavity 5 through the coolant output pipe 7. When the coolant passes through the cavity 5, the flow dividing ring 9 has a guiding effect on the coolant, so that the coolant is divided from both sides of the flow dividing ring 9.

[0031] A closing plate 10 is arranged at the top of the cavity 5, and a plurality of fixing bolts 11 are arranged on the closing plate 10. The fixing bolts 11 are threadedly connected to the bottom of the inner wall of the cavity 5 for fixing the closing plate 10 to the top of the cavity 5.

[0032] Heat-conducting grooves 12 arranged in an annular array are opened on the inner wall of the cavity 5 and around the flow dividing ring 9, and metal heat-conducting shafts 13 are arranged in the heat-conducting grooves 12.

[0033] As Figure 3 , Figure 5 and Figure 6 , the bottom of the metal heat-conducting shaft 13 is directly connected to the metal components inside the upper die core 301, improving the heat dissipation capacity of the upper die core 301.

[0034] A heat dissipation air duct 14 is opened at the top of the upper die 3, and an L-shaped connecting air duct 15 is opened at the top of the closing plate 10. The L-shaped connecting air duct 15 is communicated with the heat dissipation air duct 14.

[0035] As Figure 1 and Figure 5 , by using the communication between the L-shaped connecting air duct 15 and the heat dissipation air duct 14, the external air flow can pass above the upper die 3 to form heat dissipation above the closing plate 10.

[0036] Rectangular plates 16 are fixedly installed on the same side of the upper template 1, the upper die 3 and the lower die 4 through bolts, and a control handle 17 is fixedly connected to one side of the rectangular plate 16.

[0037] As Figure 1, by fixing the control handle 17 on one side of the upper template 1, the upper mold 3 and the lower mold 4, it is convenient to carry them when the upper template 1, the upper mold 3 and the lower mold 4 are not installed.

[0038] A semiconductor refrigeration plate 18 is fixedly connected to the bottom of the lower template 2. The semiconductor refrigeration plate 18 adopts an annular design. A guide shaft 19 is fixedly installed on the lower template 2. The top of the guide shaft 19 sequentially penetrates through the lower mold 4, the upper mold 3 and extends into the interior of the upper template 1.

[0039] Such as Figure 1 , Figure 2 , Figure 3 and Figure 4 , the top of the guide shaft 19 sequentially penetrates through the lower mold 4, the upper mold 3 and extends into the interior of the upper template 1, playing a role in guiding and positioning between the lower template 2, the lower mold 4, the upper mold 3 and the upper template 1, facilitating the quick alignment between the lower template 2, the lower mold 4, the upper mold 3 and the upper template 1. The semiconductor refrigeration plate 18 is closely attached to the lower mold 4, which can assist in dissipating heat from the metal combined seal in the upper and lower die cores 401 of the lower mold 4.

[0040] Compared with the related technology, a metal combined seal forming mold provided by the present utility model has the following beneficial effects:

[0041] The mold proposed by the present utility model can perform injection molding of metal combined seals between the upper die core 301 and the lower die core 401. After the injection molding is completed, the coolant enters the cavity 5 to cool the upper die core 301, and the semiconductor refrigeration plate 18 cools the lower die core 401 from below, so that the metal combined seal formed between the upper die core 301 and the lower die core 401 can be quickly cooled and demolded, improving the forming speed of the mold for the metal combined seal.

[0042] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A metal composite seal forming die, comprising an upper die plate (1) and a lower die plate (2), characterized in that: An upper mold (3) is fixedly installed at the bottom of the upper mold plate (1), a lower mold (4) is fixedly installed at the top of the lower mold (4) and located at the bottom of the upper mold (3), an upper mold core (301) is arranged at the bottom of the upper mold (3), and a lower mold core (401) used in conjunction with the upper mold core (301) is arranged at the top of the lower mold (4), and the upper mold core (301) and the lower mold core (401) are used for molding the metal composite seal; A cavity (5) is provided at the top of the upper mold (3), and a coolant inlet pipe (6) and a coolant outlet pipe (7) are fixedly connected to the two sides of the cavity (5), respectively. One end of the coolant inlet pipe (6) and the coolant outlet pipe (7) extend to the outside of the upper mold (3), and the coolant inlet pipe (6) and the coolant outlet pipe (7) are fixedly connected to a solenoid valve (8) at the outer surface of the upper mold (3). A diverter ring (9) is fixedly connected in the cavity (5) for diverting the coolant.

2. A metal composite seal forming mold according to claim 1, characterized in that: A closing plate (10) is arranged at the top of the cavity (5), and a plurality of fixing bolts (11) are arranged on the closing plate (10). The fixing bolts (11) are threadedly connected to the bottom of the inner wall of the cavity (5) to fix the closing plate (10) to the top of the cavity (5).

3. A metal composite seal forming mold according to claim 2, characterized in that: Heat-conducting grooves (12) in a ring array are provided on the inner wall of the cavity (5) and around the diverter ring (9), and a metal heat-conducting shaft (13) is arranged in the heat-conducting groove (12).

4. A metal composite seal forming mold according to claim 2, characterized in that: A heat dissipation duct (14) is provided on the top of the upper mold (3), and an L-shaped connecting duct (15) is provided on the top of the closing plate (10); the L-shaped connecting duct (15) and the heat dissipation duct (14) are connected.

5. The metal composite seal molding die according to claim 1, characterized in that: A rectangular plate (16) is fixedly mounted on the same side of the upper template (1), the upper mold (3) and the lower mold (4) by means of bolts, and a control handle (17) is fixedly connected to one side of the rectangular plate (16).

6. The metal composite seal molding die according to claim 1, characterized in that: The bottom of the lower template (2) is fixedly connected to a semiconductor refrigeration plate (18), which is designed to be annular. A guide shaft (19) is fixedly installed on the lower template (2), and the top of the guide shaft (19) passes through the lower mold (4) and the upper mold (3) in sequence and extends to the interior of the upper template (1).

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