Anti-falling clamping support for reflow soldering of electric device
By using anti-falling trays during SMT reflow soldering, the problem of heavier devices on the back dropping in the highest temperature zone is solved, and the welding quality is improved and the maintenance cost is greatly reduced.
Patent Information
- Application Number
- CN202421881879.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-06
AI Technical Summary
During SMT reflow soldering, large and heavier devices on the back are prone to fall off in the reflow zone at the highest temperature, resulting in a decrease in welding quality and an increase in repair costs.
An anti-falling tray for reflow soldering of electrical devices is designed. The tray is equipped with an insertion interface in the middle, and the protrusion is arranged on the tray. Multiple connection holes are arranged at the four corners of the tray. By adding a new tray design on the furnace fixture, the heavier devices are supported to prevent them from falling during the reflow soldering process.
It effectively prevents the heavier components on the back of the secondary reflow soldering process from falling in the highest reflow temperature zone, improving product quality and reducing maintenance costs.
Smart Images
Figure CN223053220U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of SMT reflow soldering, and more specifically, to an anti-drop chuck for reflow soldering of electrical components. Background Art
[0002] SMT reflow soldering, also known as surface mount technology reflow soldering, is a soldering method commonly used in the manufacturing of electronic products. It is suitable for soldering surface mount components onto printed circuit boards. Through SMT reflow soldering, a high-precision and high-efficiency soldering process can be achieved. It has better automation capabilities and production efficiency compared to traditional manual soldering methods. In addition, SMT reflow soldering can also use lead-free solder to meet the requirements of environmental friendliness.
[0003] The inventor believes that during the two reflow soldering processes on the front and back sides of SMT, when using solder paste with a similar melting range for the second reflow soldering, some heavier large components on the back are likely to fall off in the reflow zone with the highest temperature. Based on the above problems, we provide an anti-drop chuck for reflow soldering of electrical components.
[0004] The above information disclosed in this background art is only used to increase the understanding of the background art of the utility model. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Utility Model
[0005] In order to solve the problem of preventing larger and heavier components on the back from falling off during the second reflow soldering process as mentioned in the above background art, the utility model provides an anti-drop chuck for reflow soldering of electrical components.
[0006] The anti-drop chuck for reflow soldering of electrical components provided by the utility model adopts the following technical solutions:
[0007] An anti-drop chuck for reflow soldering of electrical components includes a chuck. An insertion opening is provided in the middle of the chuck; a protrusion is provided on the chuck, and the side end of the protrusion is arranged in the insertion opening; a plurality of connection holes are sequentially provided at the four corners of the chuck. The new chuck design on the furnace fixture can ensure that during the second reflow soldering with the same melting range solder paste, abnormal situations where heavier components fall off in the highest reflow temperature zone can be avoided, improving product quality and saving maintenance costs.
[0008] Preferably, a plurality of through holes are equidistantly provided on the side surface of the chuck. The provision of the through holes facilitates the heat dissipation of the chuck and reduces the weight of the chuck.
[0009] Preferably, the chuck is made of polyethylene material.
[0010] Preferably, the inner side edge of the insertion opening is rounded. This design can prevent the inner side edge of the insertion opening from scratching the electrical components.
[0011] Preferably, the position of the side surface of the card holder relative to the connection hole is an arc structure.
[0012] Preferably, a rubber washer is assembled inside the connection hole for the user to assemble the card holder.
[0013] Preferably, the outer side edge of the card holder is rounded to prevent the side edge of the card holder from scratching the user's hand when the user installs the card holder.
[0014] In summary, the present utility model includes the following beneficial technical effects:
[0015] By assembling the card holder on the external mold plate, then snap-fitting the pin header into the insertion interface, and then welding. By newly designing a card holder on the furnace passing fixture to hold heavier components, preventing the heavier components on the back from falling off during the reflow soldering process; adding this new design on the furnace passing fixture can ensure that during the reflow soldering of the secondary same-melting-range solder paste, the abnormity of the heavier components falling off in the highest reflow temperature zone is avoided, improving the product quality and saving the maintenance cost.
[0016] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description. Description of the Drawings
[0017] Figure 1 is a schematic structural diagram of an anti-drop card holder for reflow soldering of an electrical component in an embodiment of the present utility model;
[0018] Figure 2 is a schematic structural diagram of the other side of an anti-drop card holder for reflow soldering of an electrical component in an embodiment of the present utility model;
[0019] Figure 3 is a schematic structural diagram of an anti-drop card holder II for reflow soldering of an electrical component in an embodiment of the present utility model;
[0020] Figure 4 is a schematic structural diagram of an anti-drop card holder III for reflow soldering of an electrical component in an embodiment of the present utility model;
[0021] Figure 5 is a schematic structural diagram of an anti-drop card holder IV for reflow soldering of an electrical component in an embodiment of the present utility model.
[0022] Description of the reference numerals: 1. Card holder; 2. Insertion interface; 3. Protrusion; 4. Connection hole; 5. Through hole. Detailed Embodiments
[0023] The following is a further detailed description of the present utility model with reference to the attached Figures 1 to 5 drawings.
[0024] It should be noted that the attached drawings are schematic and not drawn to scale. For the sake of clarity and convenience in the figures, the relative sizes and proportions of the parts shown in the figures are exaggerated or reduced in size for illustration. Any dimensions are merely exemplary and not limiting. In addition, the same reference signs are used for the same structures, elements, or fittings that appear in more than two figures to reflect similar features.
[0025] An embodiment of the present utility model discloses an anti - shedding card holder for reflow soldering of electrical components. Referring to Figures 1 to 5 , an anti - shedding card holder for reflow soldering of electrical components includes a card holder 1, an insertion opening 2 is provided in the middle of the card holder 1; a protrusion 3 is provided on the card holder 1, and the side end of the protrusion 3 is arranged in the insertion opening 2; a plurality of connection holes 4 are sequentially arranged at the four corners of the card holder 1. The new design of the card holder 1 on the furnace - passing fixture can ensure that during the secondary reflow soldering of the same - melting - range solder paste, the abnormal situation of heavy components falling off in the highest reflow temperature zone is avoided, improving product quality and saving maintenance costs.
[0026] Specifically, a plurality of through - holes 5 are equidistantly arranged on the side surface of the card holder 1. The provision of the through - holes 5 is conducive to the heat dissipation of the card holder and reducing the weight of the card holder 1.
[0027] Specifically, the card holder 1 is made of polyethylene material.
[0028] Specifically, the inner side edge of the insertion opening 2 is rounded. This design can prevent the inner side edge of the insertion opening 2 from scratching electrical components (such as power sockets, simple coils, etc.).
[0029] Specifically, the position of the side surface of the card holder 1 relative to the connection holes 4 is an arc structure.
[0030] Specifically, a rubber washer is assembled inside the connection hole 4 for the user to assemble the card holder 1.
[0031] Specifically, the outer side edge of the card holder 1 is rounded to prevent the side edge of the card holder 1 from scratching the user's hand when the user installs the card holder 1.
[0032] The standard parts used in the present utility model can all be purchased from the market. The special - shaped parts can be customized according to the description in the specification and the attached drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machines, parts, and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be elaborated here.
[0033] The implementation principle of an anti - shedding card holder for reflow soldering of electrical components in an embodiment of the present utility model is as follows: First, assemble the card holder 1 on the external mold plate, then snap the pin header into the insertion interface 2, and then perform soldering. By newly designing the card holder 1 on the furnace fixture, heavier components are supported to prevent the heavier components on the back from falling off during the secondary reflow soldering process. With this new design on the furnace fixture, it can ensure that during the secondary reflow soldering of solder paste with the same melting range, the abnormal situation of the heavier components falling off in the highest reflow temperature zone can be avoided, improving product quality and saving maintenance costs.
[0034] In the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.
[0035] In the present utility model, unless otherwise clearly specified and limited, the terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0036] In the present utility model, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0037] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0038] In the attached drawings of the disclosed embodiments of the present utility model, only the structures related to the disclosed embodiments are involved, and other structures can refer to the general design. Without conflict, the same embodiment and different embodiments of the present invention can be combined with each other.
[0039] Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. An anti-dropping tray for reflow soldering of electrical components, characterized in that: include: A card tray (1), wherein a plug-in interface (2) is provided in the middle of the card tray (1); A protrusion (3) is provided on the card holder (1), and a side end of the protrusion (3) is arranged in the insertion port (2); A plurality of connection holes (4) are sequentially arranged at four corners of the card holder (1).
2. The anti-dropping card holder for reflow soldering of electrical components according to claim 1, characterized in that: A plurality of through holes (5) are equidistantly provided on the side surface of the card holder (1).
3. The anti-dropping card holder for reflow soldering of electrical components according to claim 1, characterized in that: The card holder (1) is made of polyethylene material.
4. The anti-dropping tray for reflow soldering of electrical components according to claim 1, characterized in that: The inner side edge of the plug interface (2) is rounded.
5. The anti-dropping card holder for reflow soldering of electrical components according to claim 1, characterized in that: The position of the side surface of the card holder (1) relative to the connection hole (4) is an arc structure.