Ceramic substrate LED lamp

Abstract

The utility model discloses a ceramic substrate LED lamp which comprises a ceramic substrate, an I TO film, a heat conduction strip, a heat dissipation plate and a plurality of LED chips. The I TO thin film is arranged at the upper end of the ceramic substrate, a circuit is etched on the I TO thin film, a plurality of hole sites are formed in the I TO thin film, conductive discs connected with the upper end of the ceramic substrate are installed in the hole sites, the conductive discs are electrically connected with the circuit on the I TO thin film, and the LED chips are welded to the upper ends of the conductive discs respectively; one side of the ceramic substrate extends towards the other side and is provided with a plurality of heat dissipation through holes, the lower ends of the heat dissipation through holes are provided with openings penetrating downwards, and the openings penetrate from one side of the ceramic substrate to the other side of the ceramic substrate; the heat dissipation plate is attached to the lower end of the ceramic substrate, heat conduction strips are inserted into the heat dissipation through holes in a matched mode, the lower ends of the heat conduction strips protrude towards the interior of the opening and are fixedly connected with the upper end of the heat dissipation plate, heat in the ceramic substrate can be transmitted to the heat dissipation plate in an accelerated mode through the heat conduction strips, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamps, and particularly relates to a ceramic substrate LED lamp. Background Art

[0002] With the continuous maturity of LED technology, traditional incandescent lamps will gradually be replaced by LED lamps. And LED lamps with ceramic as the substrate have gradually emerged.

[0003] In the prior art, the utility model patent of "a new type of ceramic substrate LED lamp" with the patent publication number of "CN203686694U" records: including a ceramic substrate, a conductive circuit layer and an LED chip, a heat dissipation structure is provided on one surface of the ceramic substrate, the conductive circuit layer is arranged on the other surface of the ceramic substrate, and the LED chip is welded on the conductive circuit layer. Its characteristics are: except for the pads used for welding on the conductive circuit layer of the ceramic substrate, a layer of low-temperature glaze is printed and coated on the rest of the conductive circuit layer; a solder paste stencil is arranged on the pads of the conductive circuit layer for welding, and a layer of solder paste for welding with the LED chip is printed on the solder paste stencil. This structure can quickly and effectively conduct and dissipate the heat generated when the LED chip works, making the LED lamp have higher luminous efficiency and longer service life, and this structure is highly insulated, practical and safe.

[0004] However, in the above patent, the heat dissipation structure is directly mounted on the side of the ceramic substrate away from the LED chip. The heat generated when the LED chip works needs to completely penetrate the ceramic substrate before reaching the heat dissipation structure for heat dissipation. And in order to maintain a certain strength, the substrate cannot be too thin, thus reducing the heat dissipation efficiency. Summary of the Utility Model

[0005] In order to solve the deficiencies in the above prior art, the utility model proposes a ceramic substrate LED lamp.

[0006] In order to achieve the above technical effects, the utility model adopts the following scheme:

[0007] A ceramic substrate LED lamp includes a ceramic substrate, an ITO thin film, a heat conduction strip, a heat dissipation plate and a plurality of LDE chips;

[0008] The ITO thin film is provided at the upper end of the ceramic substrate. The ITO thin film is etched with circuits. A plurality of holes are opened on the ITO thin film. Conductive disks connected to the upper end of the ceramic substrate are installed in the holes. The conductive disks are electrically connected to the circuits on the ITO thin film. A plurality of LED chips are respectively welded on the upper ends of the plurality of conductive disks;

[0009] On one side of the ceramic substrate, several heat dissipation through holes are provided and extend towards the other side. An opening penetrating downward is provided at the lower end of the heat dissipation through hole, and the opening penetrates from one side of the ceramic substrate to the other side.

[0010] The heat dissipation plate is mounted on the lower end of the ceramic substrate. A heat conduction strip is inserted into the heat dissipation through hole in a matching manner. The lower end of the heat conduction strip protrudes into the opening and is fixedly connected to the upper end of the heat dissipation plate.

[0011] In a preferred technical solution, the cross-sectional shape of the heat dissipation through hole is circular or triangular with the apex facing upward.

[0012] In a preferred technical solution, several grooves are provided at the lower end of the heat dissipation plate and extend from one side of the ceramic substrate to the other side.

[0013] In a preferred technical solution, several heat conduction strips and the heat dissipation plate are integrally formed.

[0014] In a preferred technical solution, a SiO2 protective layer is provided at the upper end of the ITO thin film, and several through holes for welding LED chips are provided on the SiO2 protective layer.

[0015] In a preferred technical solution, a solder paste stencil is provided on the conductive pad, and a layer of solder paste for welding LED chips is printed on the solder paste stencil.

[0016] Compared with the prior art, the beneficial effects are as follows:

[0017] The structure of the present utility model is simple and convenient to use. The LED chip is welded to one end of the ceramic substrate, and the heat dissipation plate is mounted on the other end of the ceramic substrate. Moreover, several heat conduction strips are provided inside the ceramic substrate, and the heat conduction strips are connected to the heat dissipation plate. Through the present utility model, the heat inside the ceramic substrate can be quickly transferred to the heat dissipation plate through the heat conduction strips, instead of gradually diffusing inside the ceramic substrate and then being transferred to the heat dissipation plate after penetrating the ceramic substrate, thus improving the heat dissipation efficiency. Description of the Drawings

[0018] Figure 1 is a cross-sectional schematic diagram of the present utility model;

[0019] Figure 2 is Figure 1 the enlarged structural schematic diagram of part A in

[0020] Reference numerals: 1, ceramic substrate; 2, ITO thin film; 3, LED chip; 4, heat dissipation through hole; 5, opening; 6, heat conduction strip; 7, heat dissipation plate; 8, groove; 9, SiO2 protective layer; 10, through hole; 11, conductive pad; 12, solder paste stencil; 13, solder paste. Detailed Embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0022] A ceramic substrate LED lamp includes a ceramic substrate 1, an ITO thin film 2, a heat conducting strip 6, a heat dissipation plate 7, and a number of LDE chips. The heat conducting strip 6 and the heat dissipation plate 7 are both made of aluminum. The thermal conductivity of aluminum is higher than that of ceramics. Therefore, compared with the ceramic substrate 1, aluminum can conduct and dissipate heat faster.

[0023] The ITO thin film 2 is provided at the upper end of the ceramic substrate 1. The ITO thin film 2 is etched with circuits. A number of holes are provided in the ITO thin film 2. Conductive discs 11 connected to the upper end of the ceramic substrate 1 are installed in the holes. The conductive discs 11 are electrically connected to the circuits on the ITO thin film 2. A number of LED chips 3 are respectively welded to the upper ends of the number of conductive discs 11, thereby electrically connecting the LED chips 3 to the circuits.

[0024] A number of heat dissipation through holes 4 are provided on one side of the ceramic substrate 1 extending towards the other side. An opening 5 penetrating downward is provided at the lower end of the heat dissipation through hole 4. The opening 5 penetrates from one side of the ceramic substrate 1 to the other side. The opening 5 is arranged along the length of the heat dissipation through hole 4.

[0025] The heat dissipation plate 7 is mounted on the lower end of the ceramic substrate 1. The heat conducting strip 6 is inserted into the heat dissipation through hole 4 in a matching manner. The lower end of the heat conducting strip 6 protrudes into the opening 5 and is fixedly connected to the upper end of the heat dissipation plate 7.

[0026] The LED chip 3 is welded to one end of the ceramic substrate 1. The heat dissipation plate 7 is mounted on the other end of the ceramic substrate 1. A number of heat conducting strips 6 are provided through the ceramic substrate 1. The heat conducting strips 6 are connected to the heat dissipation plate 7. Through the present utility model, the heat in the ceramic substrate 1 can be quickly transferred to the heat dissipation plate 7 through the heat conducting strips 6, rather than gradually diffusing in the ceramic substrate 1 and then penetrating the ceramic substrate 1 to be transferred to the heat dissipation plate 7, thus improving the heat dissipation efficiency.

[0027] In a preferred technical solution, the cross-sectional shape of the heat dissipation through hole 4 is circular or triangular with the apex facing upward.

[0028] For the triangular or circular heat dissipation through hole 4, after pressure is applied to the upper end of the ceramic substrate 1, the pressure at the upper end of the heat dissipation through hole 4 can be dispersed to both sides, thereby improving the strength of the ceramic substrate 1 after the holes are opened.

[0029] In a preferred technical solution, a number of grooves 8 are provided at the lower end of the heat dissipation plate 7 extending from one side of the ceramic substrate 1 towards the other side.

[0030] By providing a groove 8, the surface area of the heat dissipation plate 7 is increased, improving the heat dissipation efficiency.

[0031] In a preferred technical solution, a plurality of heat conducting strips 6 are integrally formed with the heat dissipation plate 7.

[0032] The heat conducting strip 6 and the heat dissipation plate 7 are integrally formed, without breaks or connection gaps in the middle, which can improve the efficiency of heat transfer from the heat conducting strip 6 to the heat dissipation plate 7.

[0033] In a preferred technical solution, an SiO2 protective layer 9 is provided at the upper end of the ITO thin film 2, and a plurality of through holes 10 for welding the LED chip 3 are provided on the SiO2 protective layer 9.

[0034] The ITO thin film 2 is protected by the SiO2 protective layer 9 and is insulated.

[0035] In a preferred technical solution, a solder paste stencil for the solder paste 13 is provided on the conductive pad 11, and a layer of solder paste 13 for welding the LED chip 3 is printed on the solder paste stencil for the solder paste 13.

[0036] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0037] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0038] Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

Claims

1. A ceramic substrate LED lamp, characterized in that, It includes a ceramic substrate (1), an ITO thin film (2), heat conducting bars (6), a heat sink (7), and a number of LDE chips; The ITO thin film (2) is provided on the upper end of the ceramic substrate (1). Circuit lines are etched on the ITO thin film (2). A number of holes are formed in the ITO thin film (2), and conductive pads (11) connected to the upper end of the ceramic substrate (1) are installed in the holes. The conductive pads (11) are electrically connected to the circuit lines on the ITO thin film (2). A number of LED chips (3) are respectively welded to the upper ends of the number of conductive pads (11); On one side of the ceramic substrate (1), a number of heat dissipation through holes (4) are formed and extend towards the other side. An opening (5) penetrating downwards is formed at the lower end of the heat dissipation through hole (4), and the opening (5) penetrates from one side of the ceramic substrate (1) to the other side; The heat sink (7) is mounted on the lower end of the ceramic substrate (1). The heat conducting bars (6) are inserted into the heat dissipation through holes (4) in a matching manner. The lower end of the heat conducting bar (6) protrudes into the opening (5) and is fixedly connected to the upper end of the heat sink (7).

2. The ceramic substrate LED lamp according to claim 1, characterized in that, The cross-sectional shape of the heat dissipation through hole (4) is circular or triangular with the apex facing upwards.

3. The ceramic substrate LED lamp according to claim 1, wherein On the lower end of the heat sink (7), a number of grooves (8) are formed from one side of the ceramic substrate (1) towards the other side.

4. The ceramic substrate LED lamp according to claim 1, characterized in that, The number of heat conducting bars (6) and the heat sink (7) are integrally formed.

5. The ceramic substrate LED lamp according to claim 1, characterized in that, On the upper end of the ITO thin film (2), a SiO2 protective layer (9) is provided. A number of through holes (10) for welding the LED chips (3) are formed in the SiO2 protective layer (9).

6. The ceramic substrate LED lamp according to claim 1, wherein On the conductive pad (11), a solder paste (13) stencil is provided, and a layer of solder paste (13) for welding the LED chips (3) is printed on the solder paste (13) stencil.

Images