Multi-beam power division network component, feed network component, antenna and communication equipment

Abstract

The utility model relates to the field of satellite communication, and discloses a multi-beam power division network component, a feed network component, an antenna and communication equipment, and the multi-beam power division network component comprises N beam power division dielectric substrates and (N-1) interlayer dielectric substrates which are superposed, each interlayer dielectric substrate is located between two adjacent wave beam power division dielectric substrates; n is a natural number greater than or equal to 2; each beam power division dielectric substrate comprises a power division network, and the interlayer dielectric substrate is used for isolating two adjacent power division networks and is respectively used as reference grounds of the two adjacent power division networks. According to the multi-beam power division network component, communication of various beam signals can be realized, so that the frequency band can be widened, the communication efficiency and the network stability can be improved, the communication coverage range can be enlarged, the signal delay can be reduced, the reference ground can be shared by two adjacent power division networks, the setting number of the reference ground can be reduced, and the thickness of the component can be reduced.

Description

Technical Field

[0001] The present application relates to the field of satellite communications, and in particular to a multi-beam power division network component, a multi-beam feeding network component, a multi-beam antenna and a communication device. Background Art

[0002] Satellite communication is the use of artificial satellites as relay stations to forward radio waves, thereby achieving communication between two or more earth stations. When achieving satellite communication, it is necessary to use beams. Currently, one beam is usually used, that is, a single beam is used for communication. When using a single beam for communication, there are the following defects: First, a beam can only serve one area or user at the same time, and the communication efficiency is low; second, a beam can only provide communication services in one direction, resulting in a relatively small coverage range of satellite communication; third, the frequency band of a single beam is relatively narrow; fourth, signals can only be sent in one direction, and the delay time of signal transmission is long; fifth, since only one beam can be used, if the beam is interfered with, the stability and reliability of the network are poor.

[0003] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Utility Model Content

[0004] The purpose of this application is to provide a multi-beam power division network component, a multi-beam feeding network component, a multi-beam antenna and a communication device to widen the frequency band, improve communication efficiency and network stability, increase communication coverage and reduce signal delay.

[0005] In order to solve the above technical problems, the present application provides a multi-beam power division network component, including:

[0006] N stacked beam power splitting dielectric substrates and (N-1) interlayer dielectric substrates; each of the interlayer dielectric substrates is located between two adjacent beam power splitting dielectric substrates; N is a natural number greater than or equal to 2;

[0007] Each of the beam power splitting dielectric substrates includes a power splitting network, and the interlayer dielectric substrate is used to isolate two adjacent power splitting networks and serve as a reference ground for the two adjacent power splitting networks.

[0008] Optionally, the beam power splitting dielectric substrate also includes a shielding structure; the power splitting network is used to transmit beam signals, and the shielding structure includes shielding holes arranged along both sides of the power splitting network, and two adjacent power splitting networks project overlapping parts in the vertical direction and share the shielding holes.

[0009] Optionally, the number of the beam power splitting dielectric substrates is two.

[0010] Optionally, the two beam power splitting dielectric substrates are respectively a first beam power splitting dielectric substrate and a second beam power splitting dielectric substrate;

[0011] The first beam power splitting dielectric substrate includes a first power splitting network and a first shielding structure; the first power splitting network is used for transmitting a first beam signal, the first power splitting network includes a plurality of first strip lines, and the first shielding structure is located around each of the first strip lines;

[0012] The second beam power splitting dielectric substrate includes a second power splitting network and a second shielding structure; the second power splitting network is used for transmitting a second beam signal, the second power splitting network includes a plurality of second strip lines, and the second shielding structure is located around each of the second strip lines.

[0013] Optionally, the first shielding structure includes a first metal frame and first metal ground vias;

[0014] The first metal frame forms a shielding trench, and the first strip line is located in the shielding trench; the first metal ground vias are located on both sides of the shielding trench;

[0015] The second shielding structure includes a second metal frame and second metal ground vias;

[0016] The second metal frame forms a shielding trench, and the second strip line is located in the shielding trench; the second metal ground vias are located on both sides of the shielding trench.

[0017] Optionally, the first metal ground vias are uniformly distributed on both sides of all the shielding trenches;

[0018] The second metal ground vias are uniformly distributed on both sides of all the shielding trenches.

[0019] This application also provides a multi-beam feeding network component, including a total port coaxial hole and any one of the above multi-beam power splitting network components; the number of the total port coaxial holes is N.

[0020] Optionally, when N is equal to 2, the two total port coaxial holes are respectively a first total port coaxial hole and a second total port coaxial hole;

[0021] The first end of the first total port coaxial hole is connected to the total end of the first power splitting network, and the first end of the second total port coaxial hole is connected to the total end of the second power splitting network;

[0022] The second end of the first total port coaxial hole is used for transmitting a first beam signal; the second end of the second total port coaxial hole is used for transmitting a second beam signal.

[0023] The present application also provides a multi-beam antenna, comprising: a radio frequency layer, any one of the above-mentioned multi-beam feeding network components, and an antenna element layer, which are stacked in sequence from bottom to top.

[0024] Optionally, the radio frequency layer includes a first beam signal main port, a second beam signal main port, and a plurality of chips;

[0025] The second end of the coaxial hole of the first main port is located within the first beam signal main port, and the second end of the coaxial hole of the second main port is located within the second beam signal main port;

[0026] Each chip includes a first beam signal port, a second beam signal port, and a signal port;

[0027] The first beam signal port is directly connected to one end of the transition hole or connected to one end of the transition hole through a microstrip line led out, and the other end of the transition hole is connected to the branch end of the first power distribution network;

[0028] The second beam signal port is directly connected to one end of the transition hole or connected to one end of the transition hole through a microstrip line led out, and the other end of the transition hole is connected to the branch end of the second power distribution network;

[0029] A microstrip line is led out from the signal port, and the signal port is connected to one end of the signal hole through the microstrip line, and the other end of the signal hole is connected to the antenna element layer.

[0030] Optionally, it further includes:

[0031] A first shielding hole, which is arranged around each chip;

[0032] And / or, a second shielding hole, which is arranged along the circumferences of the coaxial holes of the first main port and the second main port respectively;

[0033] And / or, a third shielding hole, which is arranged along the circumference of the transition hole;

[0034] And / or, a fourth shielding hole, which is arranged along the circumference of the signal hole.

[0035] Optionally, the antenna element layer includes an antenna element metal enclosure, an antenna array enclosure, and a plurality of antenna radiators. The antenna element metal enclosure is arranged around each antenna radiator, and the antenna element metal enclosure and the plurality of antenna radiators are located within the area of the antenna array enclosure.

[0036] Optionally, it further includes:

[0037] A fifth shielding hole, which is arranged between adjacent antenna radiators.

[0038] The present application further provides a communication device, including the multi-beam power division network component described in any one of the above.

[0039] A multi-beam power division network component provided by the present application includes: N stacked beam power division dielectric substrates and (N - 1) interlayer dielectric substrates; each of the interlayer dielectric substrates is located between two adjacent beam power division dielectric substrates; N is a natural number greater than or equal to 2; each of the beam power division dielectric substrates includes a power division network, and the interlayer dielectric substrate is used to isolate two adjacent power division networks and serves as the reference ground for two adjacent power division networks respectively.

[0040] It can be seen that the power division network component in the present application includes at least two beam power division dielectric substrates, and each beam power division dielectric substrate includes a power division network, which can have the following advantages: First, at least two beams can communicate simultaneously, which can increase the communication network capacity, and then improve the data traffic and user connections processed by the network, and improve the communication efficiency; Second, at least two beam signals can provide services in different directions, increasing the communication coverage; Third, at least two different beam signals can increase the frequency band; Fourth, at least two beam signals can be transmitted in at least two different directions simultaneously, which can shorten the signal transmission path, thereby reducing the communication delay and improving the user experience; Fifth, if one beam signal is interfered, it can be switched to other beam signals to maintain the communication connection, reducing the impact of signal interference, thereby improving the stability and reliability of the network. In addition, since two adjacent power division networks are isolated by an interlayer dielectric substrate, the two adjacent power division networks are independent of each other, and the beam signals in the two adjacent power division networks can be transmitted independently without affecting each other. Moreover, the interlayer dielectric substrate can also serve as the reference ground for two adjacent power division networks, that is, two adjacent power division networks share the reference ground, and there is no need to set a reference ground for each power division network, reducing the number of reference grounds set. Without affecting the layout of the coaxial ports of the power division network, the thickness of the component can be reduced.

[0041] In addition, the present application further provides a multi-beam feeding network component, a multi-beam antenna and a communication device having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0043] Figure 1A top view of a first beam power splitting dielectric substrate provided by an embodiment of the present application;

[0044] Figure 2 A top view of a second beam power splitting dielectric substrate provided by an embodiment of the present application;

[0045] Figure 3 A structural schematic diagram of a dual-beam feeding network component provided by an embodiment of the present application;

[0046] Figure 4 A top view of a radio frequency layer provided by an embodiment of the present application;

[0047] Figure 5 A top view of an antenna element layer provided by an embodiment of the present application;

[0048] In the figure, 1 is the first beam power splitting dielectric substrate, 2 is the first power splitting network, 3 is the second beam power splitting dielectric substrate, 4 is the second power splitting network, 5 is the first total port coaxial hole, 6 is the second total port coaxial hole, 7 is the first metal frame, 8 is the first metal ground via, 9 is the second metal frame, 10 is the second metal ground via, 11 is the radio frequency layer, 12 is the antenna element layer, 13 is the first beam signal total port, 14 is the second beam signal total port, 15 is the chip, 121 is the antenna element metal enclosure, 122 is the antenna array enclosure, 123 is the antenna radiator, 151 is the first beam signal port, 152 is the second beam signal port, 51 is the first end of the first total port coaxial hole, 52 is the second end of the first total port coaxial hole, 61 is the first end of the second total port coaxial hole, and 62 is the second end of the second total port coaxial hole. Detailed implementation manners

[0049] In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0050] Many specific details are set forth in the following description in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0051] As described in the background art section, when using a single beam for satellite communication currently, there are problems such as low communication efficiency, small communication coverage area, narrow frequency band, long communication delay, and poor anti-interference ability.

[0052] In view of this, the present application provides a multi-beam power splitting network component, including:

[0053] N stacked beam power splitting dielectric substrates and (N - 1) interlayer dielectric substrates; each of the interlayer dielectric substrates is located between two adjacent beam power splitting dielectric substrates; N is a natural number greater than or equal to 2;

[0054] Each of the beam power splitting dielectric substrates includes a power splitting network, and the interlayer dielectric substrate is used to isolate two adjacent power splitting networks and serves as the reference ground for two adjacent power splitting networks respectively.

[0055] Among them, the number N of the beam power splitting dielectric substrates can be 2, 3, 4, 5, etc., which is specifically set according to actual needs and is not limited in this embodiment. For example, when N is equal to 2, the multi-beam power splitting network component is a dual-beam power splitting network component; when N is equal to 3, the multi-beam power splitting network component is a triple-beam power splitting network component, and so on.

[0056] The multi-beam power splitting network component can be used for both the transmission and reception of beam signals.

[0057] The power splitting network is used to transmit beam signals. The power splitting network includes strip lines and isolation resistors, and the isolation resistors are located between the branches separated from each line in the strip lines.

[0058] The beam power splitting dielectric substrate includes a dielectric layer and metal layers distributed on the upper and lower surfaces of the dielectric layer. The metal layers are etched as required to form the required structure. For example, the power splitting network can be formed by etching the metal layer on the upper surface of the dielectric layer.

[0059] The interlayer dielectric substrate includes a dielectric layer and metal layers distributed on the upper and lower surfaces of the dielectric layer. The upper and lower metal layers respectively serve as the reference grounds for the two power splitting networks located above and below the interlayer dielectric substrate.

[0060] The dielectric constants of the beam power splitting dielectric substrate and the interlayer dielectric substrate can be between 3.0 and 4.0, which can be specifically selected according to needs and are not limited in this embodiment.

[0061] In the power splitting network component of this embodiment, there are at least two beam power splitting dielectric substrates, and each beam power splitting dielectric substrate includes a power splitting network. The advantages that can be achieved are as follows: First, it can enable at least two beams to communicate simultaneously, which can increase the communication network capacity, thereby enhancing the data traffic processed by the network and user connections, and improving communication efficiency; Second, at least two beam signals can provide services in different directions, increasing the communication coverage range; Third, at least two different beam signals can increase the frequency band; Fourth, at least two beam signals can be transmitted simultaneously in at least two different directions, which can shorten the signal transmission path, thereby reducing communication latency and improving the user experience; Fifth, if one beam signal is interfered with, it can be switched to other beam signals to maintain the communication connection, reducing the impact of signal interference, thereby improving the stability and reliability of the network. In addition, since adjacent two power splitting networks are isolated by an interlayer dielectric substrate, the adjacent two power splitting networks are independent of each other, and the beam signals in the adjacent two power splitting networks can be transmitted independently without mutual influence. Moreover, the interlayer dielectric substrate can also serve as the reference ground for the adjacent two power splitting networks, that is, the adjacent two power splitting networks share the reference ground, without the need to set a reference ground for each power splitting network, reducing the number of reference ground settings. Without affecting the layout of the coaxial ports of the power splitting network, the thickness of the component can be reduced.

[0062] Based on the above embodiment, in an embodiment of the present application, in the multi-beam power splitting network component, the beam power splitting dielectric substrate further includes a shielding structure; the power splitting network is used to transmit beam signals, and the shielding structure includes shielding holes arranged along both sides of the power splitting network. For the overlapping part of the projections of adjacent two power splitting networks in the vertical direction, the shielding holes are shared.

[0063] For the overlapping part of the projections of adjacent two power splitting networks in the vertical direction, the shielding holes are shared, that is, the shielding holes in the overlapping part of the projections of adjacent two power splitting networks in the vertical direction are connected. At this time, when making the shielding holes, only one hole needs to be drilled directly in this overlapping area, reducing the number of vias, reducing the occupied area on the power splitting dielectric substrate, and at the same time simplifying the manufacturing process.

[0064] As Figures 1 to 2 shown, when the number of beam power splitting dielectric substrates is two, based on the above embodiment, in an embodiment of the present application, the two beam power splitting dielectric substrates are respectively the first beam power splitting dielectric substrate 1 and the second beam power splitting dielectric substrate 3;

[0065] The first beam power splitting dielectric substrate 1 includes a first power splitting network 2 and a first shielding structure; the first power splitting network 2 is used to transmit the first beam signal, the first power splitting network 2 includes multiple first strip lines, and the first shielding structure is located around each first strip line;

[0066] The second beam power splitting dielectric substrate 3 includes a second power splitting network 4 and a second shielding structure; the second power splitting network 4 is used for transmitting second beam signals, the second power splitting network 4 includes a plurality of second strip lines, and the second shielding structure is located around each of the second strip lines.

[0067] The first shielding structure can constrain the first beam signal, and the second shielding structure can constrain the second beam signal, ensuring the isolation degree of the transmission channel.

[0068] It should be noted that in this embodiment, the first shielding structure is not limited, as long as it can achieve a shielding effect, and it can be set specifically by itself.

[0069] As an implementable manner, the first shielding structure includes a first metal frame 7 and first metal via holes 8; the first metal frame 7 forms a shielding groove, and the first strip line is located in the shielding groove; the first metal via holes 8 are located on both sides of the shielding groove.

[0070] By providing two shielding components, namely the first metal frame 7 and the first metal via holes 8, the shielding effect of the first shielding structure can be improved.

[0071] The first metal via holes 8 are distributed on both sides of the shielding groove along the extending direction of the first metal frame 7.

[0072] In order to further improve the shielding effect, the first metal via holes 8 are evenly distributed on both sides of all the shielding grooves. The distance between adjacent first metal via holes 8 can be equal.

[0073] It should be noted that in this embodiment, the second shielding structure is not limited, as long as it can achieve a shielding effect, and it can be set specifically by itself.

[0074] As an implementable manner, the second shielding structure includes a second metal frame 9 and second metal via holes 10; the second metal frame 9 forms a shielding groove, and the second strip line is located in the shielding groove; the second metal via holes 10 are located on both sides of the shielding groove.

[0075] By providing two shielding components, namely the second metal frame 9 and the second metal via holes 10, the shielding effect of the second shielding structure can be improved.

[0076] The second metal via holes 10 are distributed on both sides of the shielding groove along the extending direction of the second metal frame 9.

[0077] In order to further improve the shielding effect, the second metal via holes 10 are evenly distributed on both sides of all the shielding grooves. The distance between adjacent second metal via holes 10 can be equal.

[0078] The metal materials of the first shielding structure and the second shielding structure can be copper or the like.

[0079] This application also provides a multi-beam feeding network component, which includes a total port coaxial hole and the multi-beam power splitting network component described in any of the above embodiments; the number of the total port coaxial holes is N.

[0080] The number of the total port coaxial holes is equal to the number of the beam power splitting dielectric substrates, and one total port coaxial hole is connected to the total end of the power splitting network in one beam power splitting dielectric substrate.

[0081] The N total port coaxial holes can be respectively named the first total port coaxial hole, the second total port coaxial hole, the third total port coaxial hole,..., the Nth total port coaxial hole.

[0082] One end of the total port coaxial hole is connected to the total end of the power splitting network, and the other end is located in the total beam signal port for transmitting beam signals.

[0083] The multi-beam feeding network component can be used for receiving beam signals and also for transmitting beam signals.

[0084] When used for transmitting beam signals, the beam signals enter the total port coaxial holes, then enter the power splitting network through the total end of the power splitting network, are split after entering the power splitting network, and then are output from the split ends of the power splitting network.

[0085] When used for receiving beam signals, the beam signals enter the power splitting network from the split ends of the power splitting network, and then are output from the total end of the power splitting network and enter the total port coaxial holes.

[0086] Please refer to Figure 3 , when N is equal to 2, the two total port coaxial holes are respectively the first total port coaxial hole 5 and the second total port coaxial hole 6; the first end 51 of the first total port coaxial hole 5 is connected to the total end of the first power splitting network 2, and the first end 61 of the second total port coaxial hole 6 is connected to the total end of the second power splitting network 4; the second end 52 of the first total port coaxial hole 5 is used for transmitting the first beam signal; the second end 62 of the second total port coaxial hole 6 is used for transmitting the second beam signal.

[0087] The first beam signal and the second beam signal are two different beam signals, and at this time the multi-beam feeding network component is a dual-beam feeding network component.

[0088] This application also provides a multi-beam antenna, which includes: a radio frequency layer 11 stacked layer by layer from bottom to top, the multi-beam feeding network component described in any of the above embodiments, and an antenna element layer 12.

[0089] The multi-beam antenna can be used for receiving beam signals and also for transmitting beam signals.

[0090] The radio frequency layer 11 includes a beam signal general port, a chip, a microstrip line, etc. For details, refer to the introduction of the dual-beam antenna below.

[0091] When the multi-beam antenna is a dual-beam antenna, please refer to Figure 4 , the radio frequency layer 11 includes a first beam signal general port 13, a second beam signal general port 14, and multiple chips 15;

[0092] The second end 52 of the first general port coaxial hole 5 is located inside the first beam signal general port 13, and the second end 62 of the second general port coaxial hole 6 is located inside the second beam signal general port 14;

[0093] Each chip 15 includes a first beam signal port 151, a second beam signal port 152, and a signal port;

[0094] The first beam signal port 151 is directly connected to one end of the transition hole or connected to one end of the transition hole through a lead-out microstrip line, and the other end of the transition hole is connected to a branch end of the first power distribution network 2;

[0095] The second beam signal port 152 is directly connected to one end of the transition hole or connected to one end of the transition hole through a lead-out microstrip line, and the other end of the transition hole is connected to a branch end of the second power distribution network 4;

[0096] A microstrip line is led out from the signal port. The signal port is connected to one end of the signal hole through the microstrip line, and the other end of the signal hole is connected to the antenna element layer 12.

[0097] The second end 52 of the first general port coaxial hole 5 is connected to one end of the first beam signal general port 13, and the other end of the first beam signal general port 13 is electrically connected to an external radio frequency source. The second end 62 of the second general port coaxial hole 6 is connected to one end of the second beam signal general port 14, and the other end of the second beam signal general port 14 is electrically connected to an external radio frequency source.

[0098] When the dual-beam antenna is used to transmit a beam signal, the first beam signal port 151 and the second beam signal port 152 are beam signal inlets, and the signal port is a beam signal outlet; when the dual-beam antenna is used to receive a beam signal, the first beam signal port 151 and the second beam signal port 152 are beam signal outlets, and the signal port is a beam signal inlet.

[0099] When transmitting a beam signal, the first beam signal is taken as an example for introduction. The first beam signal enters the first general port coaxial hole 5 through the first beam signal general port 13, then enters the first power splitting network 2 through the general end of the first power splitting network 2, then enters the transition hole from the splitting end of the first power splitting network 2, and then is directly transmitted to the first beam signal port 151 of the chip 15 through the transition hole or is transmitted to the first beam signal port 151 of the chip 15 through the transition hole and the microstrip line, enters the chip 15 and is output from the chip 15 after being processed by the chip 15, reaches the signal hole through the microstrip line at the signal port, then enters the antenna element layer 12 through the signal hole, and is radiated out by the antenna element layer 12.

[0100] When receiving a signal, the transmission path of the signal is opposite to that of the transmitting signal process, and the specific process is not described in detail here.

[0101] The number of chips 15 is not limited in this embodiment and depends on the situation. Figure 4 In the case where the number of chips 15 is 16, it is shown as an example.

[0102] The number of chips 15 is equal to the number of splitting ends in the power splitting network.

[0103] As an implementable manner, as Figure 5 shown, the antenna element layer 12 includes an antenna element metal enclosure 121, an antenna array enclosure 122, and a plurality of antenna radiators 123. The antenna element metal enclosure 121 is provided around each antenna radiator 123, and the antenna element metal enclosure 121 and the plurality of antenna radiators 123 are located within the area of the antenna array enclosure 122.

[0104] On the basis of the above embodiment, in an embodiment of the present application, the multi-beam antenna may further include:

[0105] A first shielding hole, which is provided around each chip 15.

[0106] The first shielding hole can reduce the coupling between adjacent channels of different chips and increase the isolation degree between adjacent channels of different chips.

[0107] On the basis of the above embodiment, in an embodiment of the present application, the multi-beam antenna may further include:

[0108] A second shielding hole, which is respectively arranged along the circumferences of the first general port coaxial hole 5 and the second general port coaxial hole 6.

[0109] The second shielding hole plays a shielding role when the beam signal is transmitted in the first general port coaxial hole 5 and the second general port coaxial hole 6, avoiding signal leakage.

[0110] Based on the above embodiments, in an embodiment of the present application, the multi-beam antenna may further include:

[0111] A third shielding hole, which is arranged along the circumferential direction of the transition hole to shield the beam signal during transmission through the transition hole and avoid signal leakage.

[0112] Based on the above embodiments, in an embodiment of the present application, the multi-beam antenna may further include:

[0113] A fourth shielding hole, which is arranged along the circumferential direction of the signal hole to shield the beam signal in the signal hole and avoid interference between beam signals.

[0114] Based on the above embodiments, in an embodiment of the present application, the multi-beam antenna may further include:

[0115] A fifth shielding hole, which is arranged between adjacent antenna radiators 123 to increase the isolation between adjacent antenna radiators 123.

[0116] The present application also provides a communication device, including the multi-beam power distribution network component described in any of the above embodiments.

[0117] In the present specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0118] The multi-beam feeding network component and the multi-beam antenna provided by the present application have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the solution and the core idea of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. A multi-beam power distribution network component, characterized in that Comprising: N stacked beam power splitting dielectric substrates and (N - 1) interlayer dielectric substrates; each of the interlayer dielectric substrates is located between two adjacent beam power splitting dielectric substrates; N is a natural number greater than or equal to 2; Each of the beam power splitting dielectric substrates includes a power splitting network, and the interlayer dielectric substrate is used to isolate two adjacent power splitting networks and serves as the reference ground for two adjacent power splitting networks respectively.

2. The multi-beam power splitting network component according to claim 1, wherein The beam power splitting dielectric substrate further includes a shielding structure; the power splitting network is used to transmit beam signals, and the shielding structure includes shielding holes arranged along both sides of the power splitting network, and the overlapping parts of two adjacent power splitting networks in the vertical projection share the shielding holes.

3. The multi-beam power splitting network component according to claim 1, characterized in that The number of the beam power splitting dielectric substrates is two.

4. The multi-beam power splitting network component according to claim 3, wherein The two beam power splitting dielectric substrates are respectively a first beam power splitting dielectric substrate (1) and a second beam power splitting dielectric substrate (3); The first beam power splitting dielectric substrate (1) includes a first power splitting network (2) and a first shielding structure; the first power splitting network (2) is used to transmit a first beam signal, the first power splitting network (2) includes a plurality of first strip lines, and the first shielding structure is located around each of the first strip lines; The second beam power splitting dielectric substrate (3) includes a second power splitting network (4) and a second shielding structure; the second power splitting network (4) is used to transmit a second beam signal, the second power splitting network (4) includes a plurality of second strip lines, and the second shielding structure is located around each of the second strip lines.

5. The multi-beam power splitting network component according to claim 4, characterized in that, The first shielding structure includes a first metal frame (7) and first metal ground vias (8); The first metal frame (7) forms a shielding groove, and the first strip line is located in the shielding groove; the first metal ground vias (8) are located on both sides of the shielding groove; The second shielding structure includes a second metal frame (9) and second metal ground vias (10); The second metal frame (9) forms a shielding groove, and the second strip line is located in the shielding groove; the second metal ground vias (10) are located on both sides of the shielding groove.

6. The multi-beam power splitting network component according to claim 5, characterized in that, The first metal ground vias (8) are uniformly distributed on both sides of all the shielding grooves; The second metal ground vias (10) are uniformly distributed on both sides of all the shielding grooves.

7. A multi-beam feed network component, characterized in that, Comprising a total port coaxial hole and a multi-beam power splitting network component according to any one of claims 1 to 6; the number of the total port coaxial holes is N.

8. The multi-beam feed network component according to claim 7, characterized in that, When N is equal to 2, the two total port coaxial holes are respectively a first total port coaxial hole (5) and a second total port coaxial hole (6); The first end (51) of the first total port coaxial hole (5) is connected to the total end of the first power splitting network (2), and the first end (61) of the second total port coaxial hole (6) is connected to the total end of the second power splitting network (4); The second end (52) of the first total port coaxial hole (5) is used to transmit the first beam signal; the second end (62) of the second total port coaxial hole (6) is used to transmit the second beam signal.

9. A multi-beam antenna, characterized in that, Comprising: A radio frequency layer (11), a multi-beam feeding network component according to claim 7 or 8, and an antenna unit layer (12) stacked in sequence from bottom to top.

10. The multi-beam antenna according to claim 9, characterized in that, The radio frequency layer (11) includes a first beam signal general port (13), a second beam signal general port (14), and a plurality of chips (15); The second end (52) of the first general port coaxial hole (5) is located within the first beam signal general port (13), and the second end (62) of the second general port coaxial hole (6) is located within the second beam signal general port (14); Each of the chips (15) includes a first beam signal port (151), a second beam signal port (152), and a signal port; The first beam signal port (151) is directly connected to one end of the transition hole or connected to one end of the transition hole through a drawn microstrip line, and the other end of the transition hole is connected to a branch end of the first power division network (2); The second beam signal port (152) is directly connected to one end of the transition hole or connected to one end of the transition hole through a drawn microstrip line, and the other end of the transition hole is connected to a branch end of the second power division network (4); A microstrip line is drawn from the signal port, and the signal port is connected to one end of the signal hole through the microstrip line, and the other end of the signal hole is connected to the antenna element layer (12).

11. The multi-beam antenna according to claim 10, characterized in that, It further includes: A first shielding hole provided around each of the chips (15); And / or, a second shielding hole circumferentially provided along the first general port coaxial hole (5) and the second general port coaxial hole (6); And / or, a third shielding hole circumferentially provided along the transition hole; And / or, a fourth shielding hole circumferentially provided along the signal hole.

12. The multi-beam antenna according to any one of claims 9 to 11, characterized in that, The antenna element layer (12) includes an antenna element metal enclosure (121), an antenna array surface enclosure (122), and a plurality of antenna radiators (123). The antenna element metal enclosure (121) is provided around each of the antenna radiators (123), and the antenna element metal enclosure (121) and the plurality of antenna radiators (123) are located within the area of the antenna array surface enclosure (122).

13. The multi-beam antenna according to claim 12, wherein, It further includes: A fifth shielding hole provided between adjacent antenna radiators (123).

14. A communication device, characterized in that, It includes the multi-beam power division network component according to any one of claims 1 to 6.

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