Radio frequency board and communication equipment

Abstract

The utility model discloses a radio frequency board and communication equipment, which are applied to the technical field of communication. According to the utility model, the first shielding holes are arranged between the adjacent antenna units, so that the isolation between the adjacent antenna units can be increased, and the coupling between the adjacent antenna units is reduced; the second shielding holes are formed between the adjacent chips, so that the isolation degree of adjacent channels of different chips can be increased, and the coupling between the adjacent channels of the different chips is reduced; the third shielding holes are formed between the adjacent microstrip lines in the same chip, radio frequency signals in the microstrip lines can be restrained, the isolation degree of adjacent channels in the same chip is increased, and therefore coupling between the adjacent channels in the same chip is reduced; the fourth shielding holes are formed in the two sides of the transmission lines in the feed network in the extension direction of the transmission lines, the isolation degree between the transmission lines in the feed network can be increased, and therefore coupling between the transmission lines in the feed network is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of communications, and particularly relates to a radio frequency board and a communication device. Background Art

[0002] In a phased array antenna array, the larger the spacing between antenna elements, the easier it is to place the antenna elements and perform layout design. When the spacing between antenna elements is small, the distance between two elements is close, making it difficult to route the feeder lines. The adjacent feed ports of the same element being too close easily causes signal coupling, and the adjacent feed ports of adjacent elements being too close also easily causes signal coupling. The chips of adjacent elements also generate strong coupling due to the close distance, making it difficult to detect the parameter performance and difficult to perform phase and amplitude value selection. In order to increase the scanning angle, the prior art usually reduces the spacing between antenna elements in the antenna array to reduce the array surface size. However, with the reduction of the spacing between antenna elements, the layout design becomes more difficult and the coupling between channels becomes more serious. Therefore, technical means are needed to reduce the coupling between channels. Summary of the Utility Model

[0003] In view of this, the purpose of the utility model is to provide a radio frequency board and a communication device, which can increase the isolation degree between channels through the simultaneous setting of four types of shielding holes, thereby reducing the coupling between channels.

[0004] To solve the above technical problems, the utility model provides a radio frequency board, including: a radio frequency part and an antenna part arranged in sequence along the thickness direction; the antenna part is provided with an antenna element array; the radio frequency part is provided with a chip array; each chip includes a first radio frequency port and a second radio frequency port;

[0005] The total radio frequency port of the radio frequency board is electrically connected to the first radio frequency port through a feeding network, the second radio frequency port is electrically connected to a signal hole through a first microstrip line, and the signal hole is electrically connected to the antenna part;

[0006] A first shielding hole is arranged between adjacent antenna elements;

[0007] A second shielding hole is arranged between adjacent chips;

[0008] A third shielding hole is arranged between adjacent first microstrip lines;

[0009] Fourth shielding holes are arranged on both sides of the transmission line in the feeding network along the extending direction of the transmission line.

[0010] Optionally, fifth shielding holes are arranged around the signal hole along the circumferential direction of the signal hole.

[0011] Optionally, the fifth shielding holes completely surround the signal hole.

[0012] Optionally, the fifth shielding hole is located on a side of the signal hole close to the signal hole in the adjacent antenna element.

[0013] Optionally, the fifth shielding hole at least penetrates through the RF part and a part of the antenna part.

[0014] Optionally, the first shielding hole, and / or the second shielding hole, and / or the third shielding hole, and / or the fourth shielding hole, and / or the fifth shielding hole is a via with a conductive layer provided on an inner wall, and a dielectric material is filled in a center of the conductive layer, and the conductive layer is electrically connected to a ground wire layer.

[0015] Optionally, the second shielding hole penetrates through the antenna part; and / or the second shielding hole penetrates through the RF part and the antenna part.

[0016] Optionally, the RF board includes: at least two layers of the third shielding holes; and / or at least two layers of the fourth shielding holes.

[0017] Optionally, a size of the antenna element is less than half of a dielectric wavelength.

[0018] Optionally, the feeding network includes: a transition hole, an RF splitter, a sixth shielding hole, a seventh shielding hole, and the transmission line; the transmission line includes a second microstrip line and a strip line forming a power splitting network; the second microstrip line is located on an RF layer, and the strip line is located on a power splitting network layer;

[0019] The sixth shielding hole is provided on an outer periphery of the transition hole, and the seventh shielding hole is provided on an outer periphery of the RF splitter;

[0020] The RF main port and the transition hole are coaxial; one end of the RF main port is used for being electrically connected to an external RF source, the other end of the RF main port is electrically connected to one end of the transition hole, the other end of the transition hole is electrically connected to a main end of the power splitting network, each branch end of the power splitting network is electrically connected to one end of the RF splitter, and the other end of the RF splitter is directly electrically connected to the first RF port or is electrically connected to the first RF port through the second microstrip line;

[0021] Or, the feeding network further includes: an eighth shielding hole and a third microstrip line; the third microstrip line is located on the RF layer; the eighth shielding hole is provided on an outer periphery of the RF main port;

[0022] The RF main port and the transition hole are non-coaxial; one end of the RF main port is used for electrical connection with the external RF source, the other end of the RF main port is electrically connected to one end of the transition hole through the third microstrip line, the other end of the transition hole is electrically connected to the main end of the power distribution network, each branch end of the power distribution network is electrically connected to one end of the RF branch port, and the other end of the RF branch port is directly electrically connected to the first RF port or electrically connected to the first RF port through the second microstrip line.

[0023] Optionally, the sixth shielding hole, the seventh shielding hole, the eighth shielding hole, the RF branch port, the transition hole, and the fourth shielding hole have the same depth.

[0024] To solve the above technical problems, the present utility model provides a communication device, including: the RF board as described above.

[0025] It can be seen that the present utility model can increase the isolation degree between adjacent antenna units by arranging the first shielding hole between adjacent antenna units, thereby reducing the coupling between adjacent antenna units; by arranging the second shielding hole between adjacent chips, the isolation degree between adjacent channels of different chips can be increased, thereby reducing the coupling between adjacent channels of different chips; by arranging the third shielding hole between adjacent microstrip lines within the same chip, the RF signals in the microstrip lines can be restricted, and the isolation degree between adjacent channels within the same chip can be increased, thereby reducing the coupling between adjacent channels within the same chip; by arranging the fourth shielding hole along the extending direction of the transmission line on both sides of the transmission line in the feeding network, the isolation degree between the transmission lines in the feeding network can be increased, thereby reducing the coupling between the transmission lines in the feeding network. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0027] Figure 1 A schematic structural diagram of a transmitting RF board provided by an embodiment of the present utility model;

[0028] Figure 2 A schematic structural diagram of a receiving RF board provided by an embodiment of the present utility model;

[0029] Figure 3 A schematic cross-sectional view of an RF board provided by an embodiment of the present utility model.

[0030] The description of the reference numerals is as follows:

[0031] 01 - RF section; 02 - antenna section;

[0032] 1 - antenna patch; 2 - first RF port; 3 - second RF port; 4 - feed network; 5 - RF main port; 6 - first microstrip line; 7 - signal hole; 8 - first shielding hole; 9 - second shielding hole; 10 - third shielding hole; 11 - fourth shielding hole; 12 - fifth shielding hole 12;

[0033] 011 - RF layer; 012 - first dielectric layer; 013 - first ground layer; 014 - second dielectric layer; 015 - power division network layer; 016 - third dielectric layer; 017 - second ground layer; 018 - signal trace section;

[0034] 021 - feeder layer; 022 - slot layer; 023 - radiation layer;

[0035] 31 - first via; 32 - second via; 33 - third via; 34 - fourth via; 35 - fifth via. Detailed implementation manners

[0036] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are only a part rather than all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0037] Please refer to Figures 1 to 3 , a RF board provided by an embodiment of the present utility model may include: a RF section 01 and an antenna section 02 arranged in sequence along the thickness direction; the antenna section 02 is provided with an antenna element array; the RF section 01 is provided with a chip array; each chip includes a first RF port 2 and a second RF port 3;

[0038] The RF main port 5 of the RF board is electrically connected to the first RF port 2 through the feed network 4, the second RF port 3 is electrically connected to the signal hole 7 through the first microstrip line 6, and the signal hole 7 is electrically connected to the antenna section 02;

[0039] A first shielding hole 8 is arranged between adjacent antenna elements;

[0040] A second shielding hole 9 is arranged between adjacent chips;

[0041] A third shielding hole 10 is arranged between adjacent first microstrip lines 6;

[0042] Fourth shielding holes 11 are arranged on both sides of the transmission line in the feed network 4 along the extension direction of the transmission line.

[0043] It should be noted that the RF board in this embodiment is a stacked structure composed of an RF part 01 and an antenna part 02. The specific structures of the RF part 01 or the antenna part 02 are not limited in this embodiment, and may include, but are not limited to, multiple dielectric substrates arranged in sequence along the thickness direction. For example, Figure 3 as shown, the RF part 01 may include an RF layer 011, a first dielectric layer 012, a first ground layer 013, a second dielectric layer 014, a power distribution network layer 015, a third dielectric layer 016, a second ground layer 017, and a signal trace part 018 arranged in sequence along the thickness direction. The RF layer 011 includes a chip array and microstrip lines (such as a first microstrip line 6, a second microstrip line, and a third microstrip line); the antenna part 02 may include a feeder layer 021, a slot layer 022, and a radiation layer 023 arranged in sequence along the thickness direction. The radiation layer 023 includes a plurality of antenna patches 1 arranged in an array; each antenna patch 1 and the feeder layer 021 and slot layer 022 in its area form an antenna unit.

[0044] The specific depth of the signal hole 7 is not limited in this embodiment, and may include, but are not limited to, the signal hole 7 penetrating at least the RF part 01 and part of the antenna part 02 (such as the corresponding 3 in the figure penetrating the RF part 01 and the feeder layer 021; or corresponding to Figure 3 the first via 31 in the figure penetrating the RF part 01 and the antenna part 02).

[0045] It should be noted that the RF board in this embodiment can be used as a transmitting RF board or a receiving RF board.

[0046] When the RF board is used to transmit signals, the first RF port 2 serves as the RF inlet, the second RF port 3 serves as the RF outlet, the RF total port 5 of the RF board is electrically connected to the RF inlet 2 through a feeding network 4, the RF outlet 3 is electrically connected to the signal hole 7 through the first microstrip line 6, and the signal hole 7 is electrically connected to the antenna part 02.

[0047] When the RF board is used to receive signals, the first RF port 2 serves as the RF outlet, the second RF port 3 serves as the RF inlet, the RF total port 5 is electrically connected to the RF outlet 2 through a feeding network 4, the RF inlet 3 is electrically connected to the signal hole 7 through the first microstrip line 6, and the signal hole 7 is electrically connected to the antenna part 02.

[0048] The specific type of the chip is not limited in this embodiment, and the specific type of the chip can be determined according to the implementation requirements. For example, when the RF board is used as a transmitting RF board, a power amplifier circuit can be integrated in the chip, and the chip can have eight RF outlets, which are respectively composed of four vertically polarized outlets and horizontally polarized outlets;

[0049] When the RF board is used as a receiving RF board, a low noise amplifier circuit may be integrated in the chip, and the chip may have eight RF inlets 3, each consisting of four vertical polarization inlets and one horizontal polarization inlet. This embodiment does not limit the specific number and arrangement of the chips, and the specific number and arrangement of the chips may be determined according to actual needs.

[0050] This embodiment does not limit the specific number of antenna units, and the specific number of antenna units can be determined according to the number of RF inputs or RF outputs of an actual chip, for example Figure 1 The chip shown has eight radio frequency outlets 3, wherein an adjacent vertical polarization outlet and a horizontal polarization outlet correspond to an antenna unit, and each chip corresponds to four antenna units; Figure 2 The chip shown has eight RF inputs 3, wherein one adjacent vertical polarization input and one adjacent horizontal polarization input correspond to one antenna unit, and each chip corresponds to four antenna units. This embodiment does not limit the specific shape of the antenna patch 1 in the antenna unit, including but not limited to a circular antenna patch or a rectangular antenna patch.

[0051] like Figure 1 As shown, the RF board in this embodiment is used as a transmitting RF board, and the RF inlet 2 is connected to the RF board through the feeding network 4 and the RF main port 5 (such as the corresponding Figure 3 The RF outlet 3 is electrically connected to the fourth via hole 34 in the RF outlet 3 through the first microstrip line 6 (such as Figure 3 The microstrip line in the RF layer 011 shown) and the signal hole 7 (as corresponding to Figure 3 The first via hole 31 in the RF board is electrically connected, the signal hole 7 is electrically connected to the antenna unit 02, and the antenna unit is used as a transmitting antenna. The transmission path of the signal in the transmitting RF board is: the signal enters from the RF main port 5; and then the feed network 4 evenly distributes the power to each chip (such as Figure 3 The chip has an RF input 2 of the RF layer 011 shown in the figure; the chip has eight RF outputs 3, each of which is composed of four vertical polarization outputs and a horizontal polarization output. After the signal passes through the power amplifier circuit integrated in the chip, the power signal is output from each RF output 3; the output signal is transmitted to the signal hole 7 through the first microstrip line 6 of the RF layer 011; and then transmitted from the signal hole 7 to the feeder layer 021 of the transmitting antenna (as shown in the figure). Figure 3 The feed line of the transmitting antenna then passes through the slot layer 022 of the transmitting antenna (as shown in Figure 3 ) coupled to the radiating layer 023 of the transmitting antenna (as shown Figure 3 As shown); finally, the signal is radiated by the transmitting antenna. The band of the radio frequency signal may be the KA band.

[0052] like Figure 2 As shown, the RF board in this embodiment is used as a receiving RF board, and the RF outlet 2 is connected to the feeding network 4 and the RF main port 5 (such as the correspondingFigure 3 is electrically connected to the fourth via 34), and the RF input 3 is electrically connected through the first microstrip line 6 (such as the microstrip line in the RF layer 011 shown in Figure 3 ) and the signal via 7 (such as the first via 31 corresponding to Figure 3 ). The signal via 7 is electrically connected to the antenna part 02, and the antenna unit serves as a receiving antenna. The signal transmission path in this receiving RF board is as follows: The signal passes through the receiving antenna and enters the radiation layer 023 (such as Figure 3 shown); then it passes through the slot layer 022 of the receiving antenna (such as Figure 3 shown) and is coupled to the feeder layer 021 of the receiving antenna (such as Figure 3 shown); the received signal then passes through the signal via 7 (such as the first via 31 corresponding to Figure 3 ) and is transmitted to the first microstrip line 6 in the RF layer 011 (such as Figure 3 shown); then it passes through the first microstrip line 6 to the RF input 3 of each chip. Each chip has eight RF inputs 3, which are respectively composed of four vertically polarized inputs and four horizontally polarized inputs. The signal is output to the feeding network 4 through the RF output 2 of each chip after passing through the low-noise amplification circuit integrated in the chip; finally, the signal is output from the RF main port 5 through the feeding network 4. Among them, the frequency band of the RF signal can be the KU band.

[0053] This embodiment does not limit the specific structure of the shielding via, as long as it can isolate the signals between adjacent channels. For example, the first shielding via 8, and / or the second shielding via 9, and / or the third shielding via 10, and / or the fourth shielding via 11, and / or the fifth shielding via 12 described below can be a via with a conductive layer on its inner wall, and the center of the conductive layer is filled with a dielectric material, and the conductive layer is electrically connected to the ground layer. The conductive layer can include but is not limited to a metal layer. It should be noted that such a shielding via realizes the shielding effect by grounding the conductive layer, and the filled dielectric material is used to protect the hollow conductive layer structure.

[0054] In this embodiment, the first shielding via 8 is arranged between adjacent antenna units, which can increase the isolation degree between adjacent antenna units, thereby reducing the coupling between adjacent antenna units. This embodiment does not limit the specific number of the first shielding vias 8, and one layer of the first shielding vias 8 or at least two layers of the first shielding vias 8 can be set according to actual needs. This embodiment does not limit the specific depth of the first shielding via 8, and the specific number of layers that the first shielding via 8 penetrates can be determined according to actual needs.

[0055] In this embodiment, a second shielding hole 9 is provided between adjacent chips, which can increase the isolation degree of adjacent channels of different chips, thereby reducing the coupling between adjacent channels of different chips. The specific number of the second shielding holes 9 is not limited in this embodiment, and one layer of the second shielding holes 9 or at least two layers of the second shielding holes 9 can be provided according to actual requirements. The specific depth of the second shielding hole 9 is not limited in this embodiment. For example, the second shielding hole 9 can penetrate through the antenna portion 02 (such as the third via 33 corresponding to Figure 3 ); and / or the second shielding hole 9 can penetrate through the RF portion 01 and the antenna portion 02 (such as the fifth via 35 corresponding to Figure 3 ). Among them, when the antenna and RF vias are affected, the former second shielding hole 9 can be used; when the antenna and RF vias are not affected, the latter second shielding hole 9 can be used.

[0056] At the RF inlet or outlet of the chip, a microstrip line is led out and electrically connected to the signal hole 7. In this embodiment, a third shielding hole 10 is provided between adjacent microstrip lines in the same chip. The third shielding hole 10 is specifically provided on both sides of each first microstrip line 6 and is arranged along the extending direction of the first microstrip line 6, which can restrict the RF signal in the microstrip line and increase the isolation degree of adjacent channels in the same chip, thereby reducing the coupling between adjacent channels in the same chip. Further, as shown in Figure 1 and Figure 2 , in this embodiment, the third shielding hole 10 can surround the overall structure formed by the connection of the first microstrip line 6 and the signal hole 7. On the one hand, it restricts the RF signal in the microstrip line, and on the other hand, it restricts the RF signal in the signal hole 7. The specific number of the third shielding holes 10 is not limited in this embodiment, and one layer of the third shielding holes 10 or at least two layers of the third shielding holes 10 can be provided according to actual requirements to further increase the isolation degree of adjacent channels in the same chip. The specific depth of the third shielding hole 10 is not limited in this embodiment and can include but is not limited to penetrating through part of the RF portion 01. For example, the third shielding hole 10 (such as the fourth via 34 corresponding to Figure 3 ) can penetrate through the first dielectric layer 012, the first ground layer 013, the second dielectric layer 014, the power distribution network layer 015, the third dielectric layer 016 and the second ground layer 017.

[0057] There will also be coupling between the transmission lines in the feed network 4. In this embodiment, fourth shielding holes 11 are arranged on both sides of the transmission lines in the feed network 4 along the extending direction of the transmission lines, which can increase the isolation between the transmission lines in the feed network 4, thereby reducing the coupling between the transmission lines in the feed network 4. The specific number of the fourth shielding holes 11 in this embodiment is not limited, and one layer of the fourth shielding holes 11 or at least two layers of the fourth shielding holes 11 can be set according to actual requirements to further increase the isolation between the transmission lines in the feed network 4. The specific depth of the fourth shielding holes 11 in this embodiment is not limited, and it can include but is not limited to penetrating part of the radio frequency part 01. For example, the fourth shielding hole 11 (such as the corresponding Figure 3 the fourth via hole 34 in) can penetrate the first dielectric layer 012, the first ground wire layer 013, the second dielectric layer 014, the power splitting network layer 015, the third dielectric layer 016 and the second ground wire layer 017.

[0058] Furthermore, in this embodiment, the feed network 4 may include: transition holes, radio frequency split ports, sixth shielding holes, seventh shielding holes and transmission lines; the transmission lines include second microstrip lines and strip lines forming a power splitting network; the second microstrip lines are located in the radio frequency layer 011, and the strip lines are located in the power splitting network layer 015;

[0059] The sixth shielding holes are arranged on the outer periphery of the transition holes, and the seventh shielding holes are arranged on the outer periphery of the radio frequency split ports;

[0060] The radio frequency total port 5 and the transition hole are coaxial; one end of the radio frequency total port 5 is used for electrical connection with an external radio frequency source, the other end of the radio frequency total port 5 is electrically connected to one end of the transition hole, the other end of the transition hole is electrically connected to the total end of the power splitting network, each branch end of the power splitting network is electrically connected to one end of the radio frequency split port, and the other end of the radio frequency split port is directly electrically connected to the first radio frequency port 2 or is electrically connected to the first radio frequency port 2 through a second microstrip line;

[0061] Or, the feed network 4 may further include: an eighth shielding hole and a third microstrip line; the third microstrip line is located in the radio frequency layer 011; the eighth shielding hole is arranged on the outer periphery of the radio frequency total port 5;

[0062] The radio frequency total port 5 and the transition hole are not coaxial; one end of the radio frequency total port 5 is used for electrical connection with an external radio frequency source, the other end of the radio frequency total port 5 is electrically connected to one end of the transition hole through a third microstrip line, the other end of the transition hole is electrically connected to the total end of the power splitting network, each branch end of the power splitting network is electrically connected to one end of the radio frequency split port, and the other end of the radio frequency split port is directly electrically connected to the first radio frequency port 2 or is electrically connected to the first radio frequency port 2 through a second microstrip line.

[0063] The signal transmission path in the feed network 4 is: taking Figure 1 the shown transmitting radio frequency board as an example, during the process of the radio frequency signal reaching the chip radio frequency inlet 2, first through the third microstrip line at the radio frequency total port 5 (such as Figure 3The microstrip line in the radio frequency layer 011 shown), and then through a transition hole that is not coaxial with the radio frequency main port 5 (such as the fourth via hole 34 corresponding to Figure 3 ), the microstrip line is transferred into a stripline (such as the stripline in the power distribution network layer 015 shown in Figure 3 ), and then the stripline is transferred into a microstrip line by the radio frequency branch port. Finally, the signal enters the chip radio frequency inlet 2 through the second microstrip line (such as the microstrip line in the radio frequency layer 011 shown in Figure 3 ). It should be noted that, compared with using an overall microstrip line for feeding, in this embodiment, a feeding network 4 that converts a microstrip line to a stripline and then converts the stripline back to a microstrip line is adopted. The good shielding effect generated by the stripline design avoids the signal radiated by the antenna from re-entering the amplification link; moreover, most of the signal transmission path passes through the stripline, which can also reduce the loss and interference brought by the signal during the transmission through the microstrip line.

[0064] Furthermore, in this embodiment, the depths of the sixth shielding hole, the seventh shielding hole, the eighth shielding hole, the radio frequency branch port, the transition hole, and the fourth shielding hole 11 can be the same, such as all using the via hole like the fourth via hole 34 in Figure 3 . It should be noted that in this embodiment, the sixth shielding hole, the seventh shielding hole, the eighth shielding hole, the radio frequency branch port, the transition hole, and the fourth shielding hole 11 in the feeding network 4 adopt the same type of via hole, which can reduce the processing difficulty of the process of the plate-making factory and can also save the cost of making the board.

[0065] Furthermore, in this embodiment, a fifth shielding hole 12 can be arranged around the signal hole 7 along the circumferential direction of the signal hole 7. It should be noted that the radio frequency signal passes from the surface layer through the signal hole 7 to the feeder layer 021. By arranging the fifth shielding hole 12 around the signal hole 7, the radio frequency signal can be constrained and the coupling between adjacent signal holes 7 can be reduced.

[0066] This embodiment does not limit the specific arrangement manner of the fifth shielding hole 12. For example, Figure 1 the fifth shielding hole 12 shown can completely surround the signal hole 7; or Figure 2 the fifth shielding hole 12 shown is located on one side of the signal hole 7 close to the signal hole 7 in the adjacent antenna unit. It should be noted that the former adopts a plum blossom pile arrangement manner, which ensures the isolation degree between adjacent signal holes 7 while meeting the processing technology of the board factory; the latter takes into account the situation that Figure 2 the signal hole 7 shown is farther away from other signal holes 7 in the antenna unit where it is located, but closer to the signal hole 7 in the adjacent antenna unit. Therefore, the fifth shielding hole 12 can be specifically arranged on one side of the signal hole 7. This embodiment does not limit the specific depth of the fifth shielding hole 12, and it can include but is not limited to that the fifth shielding hole 12 penetrates at least through the radio frequency part 01 and part of the antenna part 02 (such as corresponding to 3 in the figure penetrating through the radio frequency part 01, the feeder layer 021, and the slot layer 022; or corresponding to Figure 3The second via hole 32 that penetrates the radio frequency part 01 and the antenna part 02 in

[0067] Furthermore, in order to increase the array scanning angle, in this embodiment, the size of the antenna element can be less than half of the dielectric wavelength to ensure that grating lobes no longer appear during array scanning. Here, the dielectric wavelength refers to the wavelength when the signal propagates in the dielectric layer of the radio frequency board. By using antenna elements of this size, during the scanning process of a large array antenna, the scanning angle can be increased to 70°, and even increased to 75°. Compared with the scanning angle of 60° of the traditional phased array antenna, this scanning angle is greatly increased.

[0068] By applying the radio frequency board provided by the embodiment of the present invention, by arranging the first shielding holes 8 between adjacent antenna elements, the isolation between adjacent antenna elements can be increased, thereby reducing the coupling between adjacent antenna elements; by arranging the second shielding holes 9 between adjacent chips, the isolation between adjacent channels of different chips can be increased, thereby reducing the coupling between adjacent channels of different chips; by arranging the third shielding holes 10 between adjacent microstrip lines within the same chip, the radio frequency signals in the microstrip lines can be restricted, increasing the isolation between adjacent channels within the same chip, thereby reducing the coupling between adjacent channels within the same chip; by arranging the fourth shielding holes 11 along the extension direction of the transmission line on both sides of the transmission line in the feeding network 4, the isolation between the transmission lines in the feeding network 4 can be increased, thereby reducing the coupling between the transmission lines in the feeding network 4.

[0069] A communication device provided by an embodiment of the present invention may include: the radio frequency board as described above.

[0070] By applying the communication device provided by the embodiment of the present invention, due to the adoption of the radio frequency board as described above, it also has the above-mentioned beneficial effects.

[0071] The above has introduced in detail a radio frequency board and a communication device provided by the present invention. For those of ordinary skill in the art, according to the idea of the embodiment of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A radio frequency board, characterized in that, Comprising: A radio frequency part (01) and an antenna part (02) arranged in sequence along the thickness direction; the antenna part (02) is provided with an antenna element array; the radio frequency part (01) is provided with a chip array; each chip includes a first radio frequency port (2) and a second radio frequency port (3); The radio frequency total port (5) of the radio frequency board is electrically connected to the first radio frequency port (2) through a feeding network (4), the second radio frequency port (3) is electrically connected to a signal hole (7) through a first microstrip line (6), and the signal hole (7) is electrically connected to the antenna part (02); A first shielding hole (8) is arranged between adjacent antenna elements; A second shielding hole (9) is arranged between adjacent chips; A third shielding hole (10) is arranged between adjacent first microstrip lines (6); On both sides of the transmission line in the feeding network (4), fourth shielding holes (11) are arranged along the extending direction of the transmission line.

2. The radio frequency board according to claim 1, characterized in that, Fifth shielding holes (12) are arranged around the signal hole (7) along the circumferential direction of the signal hole (7).

3. The RF board according to claim 2, wherein The fifth shielding holes (12) completely surround the signal hole (7).

4. The RF board according to claim 2, wherein The fifth shielding holes (12) are located on one side of the signal hole (7) close to the signal hole (7) in the adjacent antenna elements.

5. The RF board according to claim 2, wherein The fifth shielding holes (12) at least penetrate through the radio frequency part (01) and part of the antenna part (02).

6. The RF board according to claim 2, characterized in that, The first shielding hole (8), and / or the second shielding hole (9), and / or the third shielding hole (10), and / or the fourth shielding hole (11), and / or the fifth shielding hole (12) are vias with a conductive layer arranged on the inner wall, and a dielectric material is filled in the center of the conductive layer, and the conductive layer is electrically connected to the ground wire layer.

7. The radio frequency board according to claim 1, wherein The second shielding hole (9) penetrates through the antenna part (02); and / or the second shielding hole (9) penetrates through the radio frequency part (01) and the antenna part (02).

8. The RF board according to claim 1, characterized in that, Comprising: At least two layers of the third shielding holes (10); and / or at least two layers of the fourth shielding holes (11).

9. The radio frequency board according to claim 1, characterized in that, The size of the antenna element is less than half of the medium wavelength.

10. The radio frequency board according to any one of claims 1 to 9, characterized in that, The feeding network (4) includes: transition holes, radio frequency branch ports, sixth shielding holes, seventh shielding holes and the transmission line; the transmission line includes a second microstrip line and a strip line forming a power distribution network; the second microstrip line is located in a radio frequency layer (011), and the strip line is located in a power distribution network layer (015); The sixth shielding holes are arranged on the outer periphery of the transition holes, and the seventh shielding holes are arranged on the outer periphery of the radio frequency branch ports; The radio frequency total port (5) is coaxial with the transition hole; one end of the radio frequency total port (5) is used for electrically connecting to an external radio frequency source, the other end of the radio frequency total port (5) is electrically connected to one end of the transition hole, the other end of the transition hole is electrically connected to the total end of the power distribution network, each branch end of the power distribution network is electrically connected to one end of the radio frequency branch port, and the other end of the radio frequency branch port is directly electrically connected to the first radio frequency port (2), or is electrically connected to the first radio frequency port (2) through the second microstrip line; Alternatively, the feeding network (4) further includes: an eighth shielding hole and a third microstrip line; the third microstrip line is located in the radio frequency layer (011); the eighth shielding hole is provided on the outer periphery of the radio frequency total port (5). The radio frequency total port (5) and the transition hole are non-coaxial; one end of the radio frequency total port (5) is used for electrical connection with the external radio frequency source, the other end of the radio frequency total port (5) is electrically connected to one end of the transition hole through the third microstrip line, the other end of the transition hole is electrically connected to the total end of the power distribution network, each branch end of the power distribution network is electrically connected to one end of the radio frequency branch port, and the other end of the radio frequency branch port is directly electrically connected to the first radio frequency port (2), or is electrically connected to the first radio frequency port (2) through the second microstrip line.

11. The RF board according to claim 10, wherein, The sixth shielding hole, the seventh shielding hole, the eighth shielding hole, the radio frequency branch port, the transition hole and the fourth shielding hole (11) have the same depth.

12. A communication device, characterized in that, Comprising: The radio frequency board according to any one of claims 1 to 11.

Images