Liquid storage tank and silicon wafer cleaning machine

Abstract

The utility model discloses a liquid storage tank and a silicon wafer cleaning machine, the liquid storage tank comprises a tank body, a liquid storage cavity is formed in the tank body, a separation part is arranged in the liquid storage cavity, the separation part extends along the first direction of the liquid storage cavity, the liquid storage cavity is divided into a plurality of sub liquid storage cavities by the separation part, and the plurality of sub liquid storage cavities are sequentially arranged along the second direction of the liquid storage cavity. The sub-liquid storage cavity located at the first end of the tank body is a head cavity, the sub-liquid storage cavity located at the second end of the tank body is a tail cavity, a gap is formed between the separation part and the tank body, liquid flows between the two adjacent sub-liquid storage cavities through the gap, a heating part is arranged in any sub-liquid storage cavity, and a liquid inlet, a liquid outlet and an overflow port are formed in the tank body. The liquid inlet is communicated with the first cavity, and a distance exists between the liquid inlet and the gap communicated with the first cavity in the first direction of the liquid storage cavity. The liquid outlet and the overflow port are communicated with the tail cavity, and the overflow port is higher than the liquid outlet. According to the scheme, liquid in the liquid storage tank can be fully heated, and the silicon wafer cleaning effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a liquid storage tank and a silicon wafer cleaning machine. Background Art

[0002] A silicon wafer cleaning machine includes a liquid storage tank, a cleaning tank, etc. The liquid storage tank is configured to supply water to the cleaning tank, and the cleaning tank is configured to clean the silicon wafers. The liquid storage tank provides a liquid with a certain temperature to the cleaning tank to ensure the cleaning effect of the silicon wafers. There is a process in the silicon wafer cleaning process called fast-drain cleaning, which is to spray a liquid with a certain temperature into the cleaning tank quickly within a short time to defoam, and at the same time, continuously overflow and change the water in the cleaning tank.

[0003] The existing liquid storage tank has a liquid storage cavity, a heating pipe is arranged in the liquid storage cavity, and a liquid inlet and a liquid outlet are arranged on the liquid storage tank. Since the liquid storage tank needs to supply water and drain water at the same time, there is a situation where the newly introduced liquid is discharged through the liquid outlet before being fully heated by the heating pipe, which affects the cleaning effect of the silicon wafers.

[0004] The above information disclosed in this background art is only used to increase the understanding of the background art of this application. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Invention

[0005] In view of the problems pointed out in the background art, the utility model provides a liquid storage tank and a silicon wafer cleaning machine to ensure that the liquid in the liquid storage tank is fully heated and improve the cleaning effect of the silicon wafers.

[0006] To achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:

[0007] In some embodiments, a liquid storage tank is provided, including:

[0008] A tank body, with a liquid storage cavity formed inside;

[0009] A partition part, the partition part is arranged in the liquid storage cavity, the partition part extends along a first direction of the liquid storage cavity, the partition part divides the liquid storage cavity into a plurality of sub-liquid storage cavities, the plurality of sub-liquid storage cavities are arranged in sequence along a second direction of the liquid storage cavity, the sub-liquid storage cavity located at the first end of the tank body is the first cavity, the sub-liquid storage cavity located at the second end of the tank body is the last cavity, there is a gap between the partition part and the tank body, and the liquid flows between adjacent two sub-liquid storage cavities through the gap;

[0010] A heating part, the heating part is arranged in any one of the sub-liquid storage cavities, and the heating part is configured to heat the liquid flowing through the sub-liquid storage cavity;

[0011] A liquid inlet, which is arranged on the tank body, is communicated with the first chamber, and there is a distance between the liquid inlet and the gap communicated with the first chamber in a first direction along the liquid storage chamber;

[0012] A liquid outlet, which is arranged on the tank body, is communicated with the last chamber;

[0013] An overflow port, which is arranged on the tank body, is communicated with the last chamber, and the setting position of the overflow port is higher than that of the liquid outlet.

[0014] In some embodiments, a plurality of partition parts are arranged, the plurality of partition parts are arranged at intervals in a second direction along the tank body, there is the gap between any one of the partition parts and the tank body, and two adjacent gaps are located on opposite sides of the tank body.

[0015] In some embodiments, the setting position of the liquid outlet is higher than that of the heating part.

[0016] In some embodiments, the liquid inlet is arranged at the bottom of the tank body.

[0017] In some embodiments, a shielding part is arranged in the first chamber, the shielding part is located above the liquid inlet, and there is a distance between the shielding part and the liquid inlet.

[0018] In some embodiments, a first liquid level switch and a second liquid level switch are further included, the setting position of the first liquid level switch is higher than that of the second liquid level switch, and the first liquid level switch and the second liquid level switch are configured to detect the liquid level in the last chamber.

[0019] In some embodiments, a water level gauge is further included, the water level gauge includes a transparent tube, the transparent tube extends along the height direction of the liquid storage chamber, and the transparent tube is communicated with the last chamber.

[0020] In some embodiments, the heating part includes a heating tube, and the heating tube extends along the first direction of the liquid storage chamber.

[0021] In some embodiments, a temperature sensor is further included, and the temperature sensor is configured to detect the temperature of the liquid in the last chamber.

[0022] In some embodiments, a wafer cleaning machine is provided, including:

[0023] A cleaning tank, which is configured to clean wafers;

[0024] Characterized in that the wafer cleaning machine further includes:

[0025] A liquid storage tank, which is the liquid storage tank as described above, and the liquid storage tank is configured to supply water to the cleaning tank.

[0026] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0027] In the liquid storage tank disclosed in the present disclosure, the liquid storage cavity is divided into a plurality of sequentially arranged sub-liquid storage cavities by a partition portion, and adjacent two sub-liquid storage cavities are communicated through a gap. The flow path of the partition portion in the plurality of sub-liquid storage cavities is in an S shape, which increases the flow path of the liquid in the liquid storage cavity, increases the flow time of the liquid in the liquid storage cavity, and increases the acting time of the liquid in the liquid storage cavity with the heating portion, thereby improving the heating effect of the liquid in the liquid storage cavity, enabling the temperature of the liquid flowing into the cleaning tank to meet the requirements for silicon wafer cleaning, and further improving the silicon wafer cleaning effect.

[0028] After reading the specific embodiments of the present utility model in conjunction with the accompanying drawings, other features and advantages of the present utility model will become clearer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other accompanying drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 FIG. 1 is a structural diagram of a liquid storage tank according to some embodiments;

[0031] Figure 2 FIG. 2 is another structural diagram of a liquid storage tank according to some embodiments;

[0032] Figure 3 FIG. 3 is yet another structural diagram of a liquid storage tank according to some embodiments;

[0033] Figure 4 FIG. 4 is a top view of a liquid storage tank according to some embodiments;

[0034] Figure 5 FIG. 5 is a top view of a liquid storage tank according to some other embodiments;

[0035] Reference numerals:

[0036] 100, tank body; 110, liquid storage cavity; 111, sub-liquid storage cavity; 112, first cavity; 113, last cavity;

[0037] 200, cover body;

[0038] 300, partition portion; 310, gap;

[0039] 400, heating portion;

[0040] 510, liquid inlet; 520, liquid outlet; 530, overflow port;

[0041] 610, first liquid level switch; 620, second liquid level switch;

[0042] 700, water level gauge; 710, transparent tube;

[0043] 800, temperature sensor;

[0044] 900, shielding part. Detailed implementation manners

[0045] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0046] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0047] The terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0048] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0049] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include indirect contact between the first and second features through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0050] The following disclosure provides many different embodiments or examples for implementing different structures of the present utility model. To simplify the disclosure of the present utility model, components and arrangements of specific examples are described hereinafter. Of course, they are merely examples and are not intended to limit the present utility model. In addition, the present utility model may repeat reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between various embodiments and / or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0051] The present disclosure provides a wafer cleaning machine, including a cleaning tank configured to clean wafers.

[0052] The wafer cleaning machine includes a liquid storage tank configured to supply water to the cleaning tank. The liquid storage tank supplies a liquid with a certain temperature into the cleaning tank to ensure the wafer cleaning effect.

[0053] In some embodiments, the liquid storage tank is as Figures 1 to 5 shown Figure 1 a structural diagram of the liquid storage tank observed from the top, Figure 2 a structural diagram of the liquid storage tank observed from the bottom, Figure 3 a structural diagram of the liquid storage tank after omitting the top cover 200, Figure 4 a top view of the liquid storage tank of one embodiment, Figure 5 a top view of the liquid storage tank of another embodiment.

[0054] The liquid storage tank includes a tank body 100, and a liquid storage cavity 110 is formed inside the tank body 100.

[0055] The liquid storage tank includes a cover body 200, the cover body 200 is arranged at the top opening of the tank body 100, and the cover body 200 is configured to open or close the liquid storage cavity 110.

[0056] The liquid storage tank includes a partition portion 300 disposed within the liquid storage cavity 110. The partition portion 300 extends along a first direction of the liquid storage cavity 110, and the partition portion 300 divides the liquid storage cavity 110 into a plurality of sub-liquid storage cavities 111. The plurality of sub-liquid storage cavities 111 are arranged in sequence along a second direction of the liquid storage cavity 110. The sub-liquid storage cavity 111 located at the first end portion of the tank body 100 is the first cavity 112, and the sub-liquid storage cavity 111 located at the second end portion of the tank body 100 is the last cavity 113.

[0057] For example, the first direction is the width direction of the liquid storage cavity 110, the second direction is the length direction of the liquid storage cavity 110, the partition portion 300 extends along the width direction of the liquid storage cavity 110, and the plurality of sub-liquid storage cavities 111 are arranged in sequence along the length direction of the liquid storage cavity 110. The first cavity 112 and the last cavity 113 are located at opposite ends in the length direction of the liquid storage cavity 110.

[0058] There is a gap 310 between the partition portion 300 and the tank body 100, and liquid flows between adjacent two sub-liquid storage cavities 111 via the gap 310. Along the liquid flow direction, the liquid in the upstream sub-liquid storage cavity 111 flows into the downstream sub-liquid storage cavity 111 through the gap 310.

[0059] The liquid storage tank includes a heating portion 400. A heating portion 400 is disposed within any one of the sub-liquid storage cavities 111, and the heating portion 400 is configured to heat the liquid flowing through the sub-liquid storage cavity 111.

[0060] The liquid storage tank includes a liquid inlet 510. The liquid inlet 510 is disposed on the tank body 100, and the liquid inlet 510 is in communication with the first cavity 112. External liquid flows into the liquid storage tank through the liquid inlet 510 and first flows into the first cavity 112, and the liquid starts to flow sequentially to the downstream sub-liquid storage cavities 111 from the first cavity 112.

[0061] The liquid storage tank includes a liquid outlet 520. The liquid outlet 520 is disposed on the tank body 100, and the liquid outlet 520 is in communication with the last cavity 113. The liquid starts from the first cavity 112 and sequentially flows through each sub-liquid storage cavity 111 and each gap 310 to reach the last cavity 113 at the most downstream, and then is discharged through the liquid outlet 520. The liquid outlet 520 is connected to a cleaning tank through a pipeline to provide spraying water for the cleaning tank.

[0062] The liquid storage tank includes an overflow port 530. The overflow port 530 is disposed on the tank body 100, and the overflow port 530 is in communication with the last cavity 113. The setting position of the overflow port 530 is higher than that of the liquid outlet 520. When the liquid level in the last cavity 113 reaches the overflow port 530, the liquid in the last cavity 113 is discharged through the overflow port 530. The overflow port 530 is connected to a cleaning tank through a pipeline to provide water required for changing water for the cleaning tank.

[0063] Refer to Figure 4 or Figure 5, the liquid inlet 510 and the gap 310 communicating with the first chamber 112 have a distance in the first direction along the liquid storage chamber 110. For example, the liquid inlet 510 and the gap 310 communicating with the first chamber 112 have a distance in the width direction of the liquid storage chamber 110.

[0064] External liquid flows into the first chamber 112 from one end through the liquid inlet 510, and the liquid flows in the first chamber 112 in the first direction along the liquid storage chamber 110 towards the gap 310 located at the other end. For example, the liquid flows in the first chamber 112 in the width direction of the liquid storage chamber 110, increasing the flow path of the liquid in the first chamber 112, increasing the flow time of the liquid in the first chamber 112, increasing the action time of the liquid in the first chamber 112 with the heating part 400, and improving the heating effect of the liquid in the first chamber 112.

[0065] The liquid heated by the heating part 400 in the first chamber 112 then flows into the downstream sub-liquid storage chamber 111 through the gap 310. The liquid is heated by the heating part 400 when flowing through each sub-liquid storage chamber 111 until the liquid flows to the last chamber 113, and then is discharged through the liquid discharge port 520 and / or the overflow port 530.

[0066] In the liquid storage tank of the present disclosure, the liquid storage chamber 110 is divided into a plurality of sub-liquid storage chambers 111 arranged in sequence by the partition part 300. Adjacent two sub-liquid storage chambers 111 are communicated through the gap 310. The flow path of the partition part 300 in the plurality of sub-liquid storage chambers 111 is in an S shape, increasing the flow path of the liquid in the liquid storage chamber 110, increasing the flow time of the liquid in the liquid storage chamber 110, increasing the action time of the liquid in the liquid storage chamber 110 with the heating part 400, thereby improving the heating effect of the liquid in the liquid storage chamber 110, making the temperature of the liquid flowing into the cleaning tank meet the requirements for silicon wafer cleaning, and further improving the silicon wafer cleaning effect.

[0067] In some embodiments, the liquid discharge port 520 and the gap 310 communicating with the last chamber 113 have a distance in the first direction along the liquid storage chamber 110. For example, the liquid discharge port 520 and the gap 310 communicating with the last chamber 113 have a distance in the width direction of the liquid storage chamber 110.

[0068] The overflow port 530 and the gap 310 communicating with the last chamber 113 have a distance in the first direction along the liquid storage chamber 110. For example, the overflow port 530 and the gap 310 communicating with the last chamber 113 have a distance in the width direction of the liquid storage chamber 110.

[0069] The liquid in the upstream sub-liquid storage cavity 111 flows into the final cavity 113 through the gap 310. The liquid flows in the first direction of the liquid storage cavity 110 in the final cavity 113 from one end of the final cavity 113 to the other end, increasing the flow path of the liquid in the final cavity 113, increasing the flow time of the liquid in the final cavity 113, increasing the action time of the liquid in the final cavity 113 with the heating part 400, improving the heating effect of the liquid in the final cavity 113, and the liquid heated by the heating part 400 in the final cavity 113 is then discharged through the liquid discharge port 520 and / or the overflow port 530.

[0070] In some embodiments, referring to Figure 5 , a partition 300 is provided in the liquid storage cavity 110. The partition 300 divides the liquid storage cavity 110 into two sub-liquid storage cavities 111, which are the first cavity 112 and the final cavity 113 respectively. The two sub-liquid storage cavities 111 are communicated through the gap 310. A heating part 400 is provided in each sub-liquid storage cavity 111. Figure 5 The black arrow in

[0071] In some embodiments, referring to Figure 4 , a plurality of partitions 300 are provided. The plurality of partitions 300 are arranged at intervals in the second direction of the tank body 100. The plurality of partitions 300 divide the liquid storage cavity 110 into a plurality of sub-liquid storage cavities 111. There is a gap 310 between any partition 300 and the tank body 100, and the adjacent two gaps 310 are located on the opposite sides of the tank body 100.

[0072] Figure 4 The black arrow in

[0073] In some embodiments, the heating part 400 includes a heating tube, and the heating tube extends along the first direction of the liquid storage cavity 110. For example, the heating tube extends along the width direction of the liquid storage cavity 110.

[0074] During the process of the liquid flowing from one end to the other end in the sub-liquid storage cavity 111, the liquid fully contacts the heating tube, improving the heating effect.

[0075] In some embodiments, the setting position of the liquid discharge port 520 is higher than the heating part 400, avoiding dry burning of the heating part 400 due to the liquid in the liquid storage cavity 110 being emptied, and protecting the heating device.

[0076] In some embodiments, the liquid inlet 510 is provided at the bottom of the tank body 100. External liquid flows into the first cavity 112 from the bottom of the tank body 100.

[0077] In some embodiments, referring to Figure 3 , a shielding portion 900 is disposed in the first chamber 112. The shielding portion 900 is a plate-like structure. One end of the shielding portion 900 is fixedly connected to the inside of the tank body 100, and the other end of the shielding portion 900 is fixedly connected to the partitioning portion 300.

[0078] The shielding portion 900 is located above the liquid inlet 510, and there is a distance between the shielding portion 900 and the liquid inlet 510. When the liquid flows in from the bottom liquid inlet 510, the shielding portion 900 plays a role in blocking the incoming liquid, preventing the incoming liquid from spraying upward.

[0079] In some embodiments, referring to Figure 1 , the liquid storage tank further includes a first liquid level switch 610 and a second liquid level switch 620. The setting position of the first liquid level switch 610 is higher than that of the second liquid level switch 620. The first liquid level switch 610 and the second liquid level switch 620 are configured to detect the liquid level of the last chamber 113.

[0080] The setting position of the first liquid level switch 610 is higher than that of the overflow port 530. When the liquid level in the last chamber 113 reaches the first liquid level switch 610, the liquid inlet 510 stops supplying water, preventing the liquid in the liquid storage chamber 110 from overflowing.

[0081] The setting position of the second liquid level switch 620 is higher than that of the drain port 520. When the liquid level in the last chamber 113 reaches the second liquid level switch 620, the heating portion 400 and the drain pump stop working, protecting the heating portion 400 and the drain pump.

[0082] In some embodiments, referring to Figure 1 , the liquid storage tank further includes a water level gauge 700. The water level gauge 700 includes a transparent tube 710. The transparent tube 710 extends along the height direction of the liquid storage chamber 110, and the transparent tube 710 communicates with the last chamber 113.

[0083] Scales are provided on the transparent tube 710, facilitating viewing of the liquid level height in the liquid storage chamber 110 through the transparent tube 710.

[0084] In some embodiments, referring to Figure 1 , the liquid storage tank further includes a temperature sensor 800. The temperature sensor 800 is configured to detect the temperature of the liquid in the last chamber 113. The heating power of the heating portion 400 is adjusted according to the detection data of the temperature sensor 800 to ensure that the liquid reaches the temperature requirement for wafer cleaning and ensure the wafer cleaning effect.

[0085] In the description of the above embodiments, the specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0086] The above are only the specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A liquid storage tank, characterized in that, Comprising: A tank body with a liquid storage cavity formed inside; A partition part, which is arranged in the liquid storage cavity. The partition part extends along a first direction of the liquid storage cavity, and the partition part divides the liquid storage cavity into multiple sub-liquid storage cavities. The multiple sub-liquid storage cavities are arranged in sequence along a second direction of the liquid storage cavity. The sub-liquid storage cavity located at a first end of the tank body is the first cavity, and the sub-liquid storage cavity located at a second end of the tank body is the last cavity. There is a gap between the partition part and the tank body, and liquid flows between adjacent two sub-liquid storage cavities through the gap; A heating part, which is arranged in any one of the sub-liquid storage cavities, and the heating part is configured to heat the liquid flowing through the sub-liquid storage cavity; A liquid inlet, which is arranged on the tank body. The liquid inlet is communicated with the first cavity, and there is a distance between the liquid inlet and the gap communicated with the first cavity along the first direction of the liquid storage cavity; A liquid outlet, which is arranged on the tank body. The liquid outlet is communicated with the last cavity; An overflow port, which is arranged on the tank body. The overflow port is communicated with the last cavity, and the setting position of the overflow port is higher than that of the liquid outlet.

2. The liquid storage tank according to claim 1, characterized in that There are multiple partition parts, and the multiple partition parts are arranged at intervals along the second direction of the tank body. There is the gap between any one of the partition parts and the tank body, and adjacent two gaps are located on opposite sides of the tank body.

3. The liquid storage tank according to claim 1, characterized in that The setting position of the liquid outlet is higher than that of the heating part.

4. The liquid storage tank according to claim 1, characterized in that The liquid inlet is arranged at the bottom of the tank body.

5. The liquid storage tank according to claim 4, characterized in that A shielding part is arranged in the first cavity, the shielding part is located above the liquid inlet, and there is a distance between the shielding part and the liquid inlet.

6. The liquid storage tank according to any one of claims 1 to 5, characterized in that It further includes a first liquid level switch and a second liquid level switch. The setting position of the first liquid level switch is higher than that of the second liquid level switch, and the first liquid level switch and the second liquid level switch are configured to detect the liquid level of the last cavity.

7. The liquid storage tank according to any one of claims 1 to 5, characterized in that It further includes a water level gauge, and the water level gauge includes a transparent tube. The transparent tube extends along the height direction of the liquid storage cavity, and the transparent tube is communicated with the last cavity.

8. The liquid storage tank according to any one of claims 1 to 5, characterized in that The heating part includes a heating tube, and the heating tube extends along the first direction of the liquid storage cavity.

9. The liquid storage tank according to any one of claims 1 to 5, characterized in that It further includes a temperature sensor, and the temperature sensor is configured to detect the temperature of the liquid in the last cavity.

10. A silicon wafer cleaning machine, comprising: A cleaning tank configured to clean silicon wafers; Characterized in that the silicon wafer cleaning machine further includes: A liquid storage tank, which is the liquid storage tank according to any one of claims 1 to 9, and the liquid storage tank is configured to supply water to the cleaning tank.

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