Electrodeposition device for preparing Ni-63 radioactive source

Abstract

The utility model discloses an electro-deposition device for preparing a Ni-63 radioactive source, which is characterized in that a groove body is provided with a cavity for accommodating electro-deposition liquid, and the groove body is provided with a first fixing hole, a second fixing hole, a first stepped hole, a second stepped hole and an air exhaust hole which are communicated with the cavity; the deposition source piece fixing frame is fixed to the first fixing hole, and a deposition source piece is installed on the deposition source piece fixing frame and immersed in the electro-deposition liquid; the deposition source sheet fixing plug screw is fixed on the first stepped hole, and the end part of the deposition source sheet fixing plug screw abuts against the deposition source sheet; the electrode wire fixing frame is fixed to the second fixing hole, an anode wire is installed on the electrode wire fixing frame and immersed in the electro-deposition liquid, and the anode wire and the deposition source piece are arranged in parallel and opposite; and the heating sheet fixing screw plug is fixed on the second stepped hole so as to fix the heating sheet. According to the device, the Ni-63 radioactive source with a uniform, compact and bright coating can be prepared, the temperature of electro-deposition liquid can be controlled to be constant, and hydrogen generated by side reaction can be timely repelled.

Description

Technical Field

[0001] The utility model relates to the technical field of electrodeposition, and particularly relates to an electrodeposition device for preparing a Ni-63 radiation source. Background Art

[0002] The Ni-63 radiation source is to uniformly fix high-purity Ni-63 on a metal substrate to form a dense and uniform pure β radiation source. The Ni-63 radiation source is one of the most widely used low-energy β radiation sources in the world at present and has important and extensive application prospects. In particular, at present, there is an urgent need for Ni-63 pure β radiation sources in many application fields such as the development and application of new energy nuclear batteries, electron capture detectors for gas chromatography analysis and liquid chromatography analysis, explosive substance spectrometers for customs, and highly sensitive leak detectors. Since the range of β particles is short, the self-absorption of the source must be considered when preparing a β radiation source. Generally, the main method for a Ni-63 pure β radiation source is the electrodeposition method.

[0003] The China Institute of Atomic Energy filed a patent application named "Deposition Device for Preparing High-Resolution α Radiation Source by Magnetohydrodynamic Electrodeposition Method", with the application number 201710284564.6. The structure of the deposition device disclosed in this application is that a permanent magnet is arranged outside the deposition tank body, the anode wire extends from the top of the deposition tank body into the deposition solution, the bottom of the deposition tank body is sealed by a threaded bottom cover, a central hole is opened in the threaded bottom cover, a cathode lead-out gasket and a cathode deposition source sheet are sequentially arranged from bottom to top inside the threaded bottom cover at the bottom of the deposition tank body, a cathode lead-out wire is connected to the bottom of the cathode lead-out gasket, and the cathode lead-out wire is led out from the hole in the threaded bottom cover and connected to the negative pole of the power supply. If this device is used for the preparation of the Ni-63 radiation source, the following problems exist:

[0004] 1. There is a magnetic field device outside the deposition tank, and this device is not required for the preparation of the Ni-63 radiation source.

[0005] 2. The temperature of the electrodeposition solution cannot be controlled within a constant range because the temperature of the electrodeposition solution has a significant impact on the deposition reaction of the Ni-63 radiation source. The best temperature range is 40°C to 50°C, and the electrodeposition time generally needs to be between several minutes and half an hour. During the long-term electrodeposition process, the temperature will tend to room temperature, resulting in the surface of the radiation source turning black.

[0006] 3. Hydrogen cannot be removed in time because serious side reactions occur during the electrodeposition of the Ni-63 radiation source, generating hydrogen that accumulates on the deposition source sheet and the platinum electrode mesh, interfering with the deposition of nickel metal crystals on the deposition source sheet, making the combination of nickel metal and the deposition source sheet not firm, and there are black spots on the surface of the source sheet.

[0007] 4. When electroplating deposition source wafers of different sizes, different electroplating tanks need to be replaced, which increases the economic cost and the risk of radioactive pollution spread. Summary of the Invention

[0008] Aiming at the deficiencies existing in the prior art, the present utility model provides an electroplating device for preparing Ni-63 radiation sources.

[0009] The present utility model discloses an electroplating device for preparing Ni-63 radiation sources, including: a tank body, a deposition source wafer fixing rack, a deposition source wafer fixing plug, an electrode wire fixing rack, and a heating sheet fixing plug;

[0010] The tank body has a cavity for accommodating electroplating solution. The top of the tank body is provided with a first fixing hole and a second fixing hole communicating with the cavity. The tank body is provided with a first stepped hole, a second stepped hole, and an air extraction hole communicating with the cavity. The first stepped hole is arranged on the end face of the tank body close to the first fixing hole;

[0011] The deposition source wafer fixing rack is fixed on the first fixing hole. A deposition source wafer is installed on the deposition source wafer fixing rack and the deposition source wafer is immersed in the electroplating solution. The deposition source wafer is connected to the negative pole of the power supply. The deposition source wafer fixing plug is fixed on the first stepped hole and the end of the deposition source wafer fixing plug abuts against the deposition source wafer;

[0012] The electrode wire fixing rack is fixed on the second fixing hole. An anode wire is installed on the electrode wire fixing rack and the anode wire is immersed in the electroplating solution. The anode wire is parallel and opposite to the deposition source wafer. The anode wire is connected to the positive pole of the power supply;

[0013] The second stepped hole is a hole with a large outer part and a small inner part. A heating sheet is provided at the step of the second stepped hole. The heating sheet fixing plug is fixed on the second stepped hole to fix the heating sheet.

[0014] As a further improvement of the present utility model, an air extraction device is connected to the air extraction hole for removing the gas generated by side reactions. The opening height of the air extraction hole is higher than the liquid level of the electroplating solution.

[0015] As a further improvement of the present utility model, the deposition source wafer fixing rack and the electrode wire fixing rack are T-shaped racks. The vertical section of the deposition source wafer fixing rack or the electrode wire fixing rack is placed in the first fixing hole or the second fixing hole, and the horizontal section of the deposition source wafer fixing rack or the electrode wire fixing rack is placed outside the first fixing hole or the second fixing hole.

[0016] As a further improvement of the present utility model, a third stepped hole is provided on the vertical section of the deposition source wafer fixing bracket. The side of the third stepped hole close to the first stepped hole is a large hole, and the side close to the anode wire is a small hole. The deposition source wafer is placed at the step of the third stepped hole, and the deposition source wafer is axially pressed by the deposition source wafer fixing plug.

[0017] As a further improvement of the present utility model, a rubber washer is provided between the deposition source wafer and the step of the third stepped hole. The rubber washer is provided with a central hole for the deposition source wafer to contact the electroplating solution. The deposition source wafer fixing plug is screwed onto the first stepped hole with internal threads. The deposition source wafer fixing bracket is a metal bracket, preferably made of red copper. The deposition source wafer is electrically connected and fixed to the deposition source wafer fixing bracket through conductive glue, and the deposition source wafer fixing bracket is connected to the negative pole of the power supply.

[0018] As a further improvement of the present utility model, a fourth stepped hole is provided on the vertical section of the electrode wire fixing bracket. The side of the fourth stepped hole close to the deposition source wafer is a large hole, and the other side is a small hole. The anode wire is fixed at the step of the fourth stepped hole through glue. The electrode wire fixing bracket is also provided with a first wire passing hole for leading out the wire of the anode wire.

[0019] As a further improvement of the present utility model, a first mounting hole is provided on the horizontal section of the deposition source wafer fixing bracket, and a vibrator is installed in the first mounting hole. A second mounting hole is provided on the horizontal section of the electrode wire fixing bracket, and a vibrator is installed in the second mounting hole. By vibrating the deposition source wafer fixing bracket and the electrode wire fixing bracket through the vibrator, hydrogen accumulation on the deposition source wafer and the anode wire can be avoided.

[0020] As a further improvement of the present utility model, the power supply is a DC regulated power supply. The anode wire is a platinum wire and is in the shape of a spiral incense. The materials of the tank body, the deposition source wafer fixing plug, the electrode wire fixing bracket, and the heating sheet fixing plug are organic glass.

[0021] As a further improvement of the present utility model, the second stepped hole and the air extraction hole are provided on the other end surface of the tank body opposite to the first stepped hole.

[0022] As a further improvement of the present utility model, a rubber gasket is provided between the heating sheet and the step of the fourth stepped hole. The rubber gasket is provided with a central hole for the heating sheet to contact the electroplating solution. The heating sheet fixing plug is screwed onto the second stepped hole with internal threads to press the heating sheet. The heating sheet fixing plug is provided with a second wire passing hole for leading out the wire of the heating sheet.

[0023] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0024] The electroplating device of the present utility model can prepare a Ni-63 radiation source with a uniform, dense and bright coating;

[0025] The electroplating device of the present utility model can control the temperature of the electroplating solution to be constant, and at the same time, the hydrogen gas generated by side reactions can be promptly removed;

[0026] The electroplating tank of the present utility model is designed modularly. One electroplating tank can produce electroplated source wafers of different sizes, solving the pain points in applications and meeting the growing social demand for Ni-63 radiation sources. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram in the positive direction of the tank body of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0028] Figure 2 It is a schematic structural diagram in the reverse direction of the tank body of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0029] Figure 3 It is a schematic structural diagram in the positive direction of the deposition source wafer fixing rack of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0030] Figure 4 It is a schematic structural diagram in the reverse direction of the deposition source wafer fixing rack of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0031] Figure 5 It is a schematic structural diagram in the positive direction of the deposition source wafer fixing plug of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0032] Figure 6 It is a schematic structural diagram in the reverse direction of the deposition source wafer fixing plug of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0033] Figure 7 It is a schematic structural diagram in the positive direction of the electrode wire fixing rack of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0034] Figure 8 It is a schematic structural diagram in the reverse direction of the electrode wire fixing rack of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0035] Figure 9 It is a schematic structural diagram in the positive direction of the heating sheet fixing plug of the electroplating device for preparing Ni-63 radiation source disclosed by the present utility model;

[0036] Figure 10 Schematic diagram of the reverse direction of the heating sheet fixing plug of the electroplating device for preparing Ni-63 radiation source disclosed by the utility model.

[0037] Symbol description:

[0038] 10. Tank body; 11. First fixing hole; 12. Second fixing hole; 13. First stepped hole; 14. Second stepped hole; 15. Air extraction hole

[0039] 20. Deposition source sheet fixing bracket; 21. Third stepped hole; 22. First installation hole

[0040] 30. Deposition source sheet fixing plug

[0041] 40. Electrode wire fixing bracket; 41. Fourth stepped hole; 42. First wire passing hole; 43. Second installation hole

[0042] 50. Heating sheet fixing plug; 51. Second wire passing hole Detailed implementation mode

[0043] For the purpose of making the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, rather than all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0044] The following further describes the present utility model in detail with reference to the accompanying drawings:

[0045] As Figures 1 to 10 shown, the present utility model provides an electroplating device for preparing Ni-63 radiation source, including: a tank body 10, a deposition source sheet fixing bracket 20, a deposition source sheet fixing plug 30, an electrode wire fixing bracket 40, and a heating sheet fixing plug 50; wherein,

[0046] As Figure 1 , 2As shown in the figure, the tank body 10 of the present utility model is preferably a square structure, and the tank body 10 has a cavity for accommodating the electroplating solution; a first fixing hole 11 and a second fixing hole 12 communicating with the cavity are provided at the top of the tank body. The first fixing hole 11 is used for installing the deposition source sheet fixing bracket 20, and the second fixing hole 12 is used for installing the electrode wire fixing bracket 40; a first stepped hole 13, a second stepped hole 14 and an air extraction hole 15 communicating with the cavity are provided on the tank body 10. Both the first stepped hole 13 and the second stepped hole 14 are holes with a large outer diameter and a small inner diameter, and at least part of the hole segments of the first stepped hole 13 and the second stepped hole 14 are internal threads. The first stepped hole 13 is used for installing the deposition source sheet fixing plug 30, the second stepped hole 14 is used for installing the heating sheet fixing plug 50, and an air extraction device is connected to the air extraction hole 15 for removing the gas generated by side reactions; the first stepped hole 15 is provided on the left end face of the tank body close to the first fixing hole, and the second stepped hole 14 and the air extraction hole 15 are preferably provided on the right end face of the tank body 10. The opening height of the air extraction hole 15 is higher than the liquid level of the electroplating solution.

[0047] As Figure 3 , 4 shown in the figure, the deposition source sheet fixing bracket 20 of the present utility model is fixed on the first fixing hole 11. Preferably, the deposition source sheet fixing bracket 20 is a T-shaped bracket. The vertical section of the deposition source sheet fixing bracket 20 is placed inside the first fixing hole 11, and the horizontal section of the deposition source sheet fixing bracket 20 is placed outside the first fixing hole 11. A deposition source sheet (not shown in the figure) is installed on the deposition source sheet fixing bracket 20 and the deposition source sheet is immersed in the electroplating solution in the tank body 1. The deposition source sheet is connected to the negative pole of the DC regulated power supply. Specifically: a third stepped hole 21 is provided on the vertical section of the deposition source sheet fixing bracket 20. The side of the third stepped hole 21 close to the first stepped hole 13 is a large hole, and the side close to the anode wire is a small hole; the deposition source sheet is placed at the step of the third stepped hole. A rubber washer (not shown in the figure) is provided between the deposition source sheet and the step of the third stepped hole 21. The rubber washer is provided with a central hole for the deposition source sheet to contact the electroplating solution; the deposition source sheet is electrically connected and fixed to the deposition source sheet fixing bracket 20 through a conductive adhesive. The deposition source sheet fixing bracket 20 is a metal bracket, preferably made of red copper; the deposition source sheet fixing bracket 20 is connected to the negative pole of the power supply. Among them, the conductive adhesive plays two roles. One is to fix the deposition source sheet and provide conductivity; the other is to innovatively modularize the electroplating tank, and the deposition source sheet fixing bracket can be made according to the size of the deposition source sheet and the size of the active area, without making a deposition device for each size of deposition source sheet, which solves the pain points in the application.

[0048] As Figure 5 , 6As shown in the figure, the deposition source wafer fixing plug 30 of the present utility model is screwed onto the first stepped hole 13 with internal threads, and the end of the deposition source wafer fixing plug 30 abuts against the deposition source wafer; the deposition source wafer is axially pressed by the deposition source wafer fixing plug 30 to form an arrangement of the deposition source wafer fixing plug 30, the deposition source wafer, and the rubber washer from outside to inside in sequence.

[0049] As Figure 7 , 8 shown in the figure, the electrode wire fixing bracket 40 of the present utility model is fixed on the second fixing hole 12. Preferably, the electrode wire fixing bracket 40 is a T-shaped bracket. The vertical section of the electrode wire fixing bracket 40 is placed inside the second fixing hole 12, and the horizontal section of the electrode wire fixing bracket 40 is placed outside the second fixing hole 12. An anode wire (not shown in the figure) is installed on the electrode wire fixing bracket 40 and the anode wire is immersed in the electroplating solution in the tank body 1. The anode wire is parallel and opposite to the deposition source wafer, and the anode wire is connected to the positive pole of the DC regulated power supply. Specifically: a fourth stepped hole 41 is provided on the vertical section of the electrode wire fixing bracket 40. The side of the fourth stepped hole 41 close to the deposition source wafer is a large hole, and the other side is a small hole; the anode wire is fixed at the step of the fourth stepped hole 41 by glue; a first wire passing hole 42 for leading out the wire of the anode wire is also provided on the electrode wire fixing bracket 40.

[0050] As Figure 1 , 2 shown in Figures 9 and 10, a heating sheet (not shown in the figure) is provided at the step of the second stepped hole 14 of the present utility model. A rubber gasket is provided between the step of the heating sheet and the step of the fourth stepped hole 14. A central hole for the heating sheet to contact the electroplating solution is provided on the rubber gasket. The heating sheet fixing plug 50 is screwed onto the second stepped hole 14 with internal threads to press the heating sheet, forming an arrangement of the heating sheet fixing plug 50, the heating sheet, and the rubber gasket from outside to inside in sequence; a second wire passing hole 51 for leading out the wire of the heating sheet is provided on the heating sheet fixing plug 50, and the wire connected to the heating sheet passes through the middle.

[0051] Furthermore, as Figure 3 , 8 shown in the figure, a first mounting hole 22 is provided on the horizontal section of the deposition source wafer fixing bracket 20, and a vibrator is installed in the first mounting hole 22; a second mounting hole 43 is provided on the horizontal section of the electrode wire fixing bracket 40, and a vibrator is installed in the second mounting hole 43; by vibrating the deposition source wafer fixing bracket 20 and the electrode wire fixing bracket 40, the accumulation of hydrogen on the deposition source wafer and the anode wire can be avoided.

[0052] Furthermore, the anode wire is a platinum wire and its shape is a spiral shape, and the materials of the tank body 10, the deposition source wafer fixing plug 30, the electrode wire fixing bracket 40, and the heating sheet fixing plug 50 are organic glass.

[0053] The usage method of the present utility model is as follows:

[0054] Install the heating sheet fixing plug 50 for fixing the heating sheet, the deposition source sheet fixing bracket 20 with the deposition source sheet installed, and the electrode wire fixing bracket 40 with the anode wire installed on the tank body 10. Tighten the deposition source sheet fixing plug 30 and connect the vacuum pumping device. Subsequently, the electroplating reaction starts. After the electroplating reaction ends, open the deposition source sheet plug and remove the deposition source sheet fixing bracket from the tank body, and the electroplating ends.

[0055] The advantages of the present utility model are as follows:

[0056] The electroplating device of the present utility model can prepare a Ni-63 radiation source with a uniform, dense and bright coating;

[0057] The electroplating device of the present utility model can control the temperature of the electroplating solution to be constant, and at the same time, the hydrogen gas generated by side reactions can be promptly removed;

[0058] The electroplating tank of the present utility model is designed modularly. One electroplating tank can produce electroplating source sheets of different sizes, solving the pain points in applications and meeting the growing social demand for Ni-63 radiation sources.

[0059] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An electrodeposition device for preparing a Ni-63 radiation source, characterized in that, Including: A tank body, a deposition source plate fixing bracket, a deposition source plate fixing plug, an electrode wire fixing bracket, and a heating sheet fixing plug; The tank body has a cavity for accommodating an electroplating solution. The top of the tank body is provided with a first fixing hole and a second fixing hole communicating with the cavity. The tank body is provided with a first stepped hole, a second stepped hole, and an air extraction hole communicating with the cavity. The first stepped hole is arranged on the end face of the tank body close to the first fixing hole; The deposition source plate fixing bracket is fixed on the first fixing hole. A deposition source plate is installed on the deposition source plate fixing bracket and the deposition source plate is immersed in the electroplating solution. The deposition source plate is connected to the negative pole of the power supply. The deposition source plate fixing plug is fixed on the first stepped hole and the end of the deposition source plate fixing plug abuts against the deposition source plate; The electrode wire fixing bracket is fixed on the second fixing hole. An anode wire is installed on the electrode wire fixing bracket and the anode wire is immersed in the electroplating solution. The anode wire is parallel and opposite to the deposition source plate. The anode wire is connected to the positive pole of the power supply; The second stepped hole is a hole with a large outer diameter and a small inner diameter. A heating sheet is provided at the step of the second stepped hole. The heating sheet fixing plug is fixed on the second stepped hole to fix the heating sheet; 2. The electrodeposition device according to claim 1, characterized in that, An air extraction device is connected to the air extraction hole for removing the gas generated by side reactions. The opening height of the air extraction hole is higher than the liquid level of the electroplating solution; 3. The electrodeposition device according to claim 1, characterized in that, The deposition source plate fixing bracket and the electrode wire fixing bracket are T-shaped brackets. The vertical section of the deposition source plate fixing bracket or the electrode wire fixing bracket is placed in the first fixing hole or the second fixing hole, and the horizontal section of the deposition source plate fixing bracket or the electrode wire fixing bracket is placed outside the first fixing hole or the second fixing hole; 4. The electrodeposition apparatus according to claim 3, wherein, A third stepped hole is provided on the vertical section of the deposition source plate fixing bracket. The side of the third stepped hole close to the first stepped hole is a large hole, and the side close to the anode wire is a small hole. The deposition source plate is placed at the step of the third stepped hole, and the deposition source plate is axially pressed by the deposition source plate fixing plug; 5. The electrodeposition device according to claim 4, wherein A rubber gasket is provided between the deposition source plate and the step of the third stepped hole. The rubber gasket is provided with a central hole for the deposition source plate to contact the electroplating solution. The deposition source plate fixing plug is screwed on the first stepped hole with internal threads. The deposition source plate fixing bracket is a metal bracket. The deposition source plate is electrically connected and fixed to the deposition source plate fixing bracket through a conductive adhesive. The deposition source plate fixing bracket is connected to the negative pole of the power supply; 6. The electrodeposition apparatus according to claim 4, characterized in that A fourth stepped hole is provided on the vertical section of the electrode wire fixing bracket. The side of the fourth stepped hole close to the deposition source plate is a large hole, and the other side is a small hole. The anode wire is fixed at the step of the fourth stepped hole by glue. The electrode wire fixing bracket is also provided with a first wire passing hole for leading out the wire of the anode wire; 7. The electrodeposition apparatus according to claim 3, characterized in that A first mounting hole is provided on the horizontal section of the deposition source plate fixing bracket, and a vibrator is installed in the first mounting hole. A second mounting hole is provided on the horizontal section of the electrode wire fixing bracket, and a vibrator is installed in the second mounting hole.

8. The electroplating apparatus according to claim 1, wherein The power supply is a DC regulated power supply. The anode wire is a platinum wire and is in the shape of a coil. The materials of the trough body, the deposition source sheet fixing plug, the electrode wire fixing bracket, and the heating sheet fixing plug are plexiglass.

9. The electrodeposition apparatus according to claim 1, wherein The second stepped hole and the air extraction hole are provided on the other end surface of the trough body opposite to the first stepped hole.

10. The electrodeposition apparatus according to claim 1, wherein, A rubber gasket is provided between the heating sheet and the step of the fourth stepped hole. A central hole for the heating sheet to contact the electroplating solution is provided on the rubber gasket. The heating sheet fixing plug is screwed onto the second stepped hole with internal threads to press the heating sheet. A second wire passing hole for leading out the wire of the heating sheet is provided on the heating sheet fixing plug.

Images