Refrigerating system and storage equipment

Abstract

The utility model discloses a refrigerating system and storage equipment, and belongs to the field of refrigeration. The refrigerating system comprises a compressor, a condenser, a capillary tube, an evaporator and a heat dissipation device. An outlet of the compressor is connected with an inlet of the condenser; an outlet of the condenser is connected with an inlet of the capillary tube; an outlet of the capillary tube is connected with an inlet of the evaporator, and an outlet of the evaporator is connected with an inlet of the compressor through a connecting pipeline; the heat dissipation device is used for exchanging heat with the connecting pipeline and the condenser. According to the refrigerating system, heat of the condenser is recycled, the situation that condensation and frosting occur to the connecting pipeline at the inlet of the compressor due to the too low temperature is reduced, meanwhile, the cooling effect of the condenser is improved, and the refrigerating efficiency and the energy-saving effect of the refrigerating system are improved.

Description

Technical Field

[0001] This application belongs to the technical field of refrigeration, and particularly relates to a refrigeration system and a storage device. Background Art

[0002] The refrigeration system is used to transfer the heat in the storage device to the outside of the box to achieve the refrigeration effect of the storage compartment. However, in related technologies, there are problems such as excessive energy consumption and energy waste in the refrigeration system, and it needs to be improved. Utility Model Content

[0003] This application aims to solve at least one of the technical problems existing in the prior art. For this reason, this application provides a refrigeration system and a storage device, which not only realizes the recovery and utilization of the heat of the condenser, but also reduces the condensation and frosting of the connecting pipeline at the compressor inlet due to too low temperature, and at the same time improves the cooling effect of the condenser, and improves the refrigeration efficiency and energy-saving effect of the refrigeration system.

[0004] In a first aspect, this application provides a refrigeration system, including: a compressor, a condenser, a capillary tube, an evaporator, and a heat dissipation device; the outlet of the compressor is connected to the inlet of the condenser; the outlet of the condenser is connected to the inlet of the capillary tube; the outlet of the capillary tube is connected to the inlet of the evaporator, and the outlet of the evaporator is connected to the inlet of the compressor through a connecting pipeline; the heat dissipation device is used to exchange heat with the connecting pipeline and the condenser respectively.

[0005] According to the refrigeration system of this application, by setting the heat dissipation device, the heat dissipation device not only exchanges heat with the condenser to cool the condenser, but also exchanges heat with the connecting pipeline to use the heat of the condenser to heat the connecting pipeline, which not only realizes the recovery and utilization of the heat of the condenser, but also reduces the condensation and frosting of the connecting pipeline at the compressor inlet due to too low temperature, and at the same time improves the cooling effect of the condenser, and improves the refrigeration efficiency and energy-saving effect of the refrigeration system.

[0006] According to an embodiment of this application, the heat dissipation device includes:

[0007] A liquid receiver, at least part of the condenser is located in the liquid receiver, and the liquid receiver is filled with condensate;

[0008] A heat dissipation pipe group, both ends of the heat dissipation pipe group are respectively connected to the inlet and the outlet of the liquid receiver, and the heat dissipation pipe group is used to exchange heat with the connecting pipeline.

[0009] According to an embodiment of this application, the heat dissipation device further includes a pump body, and the pump body is arranged between the liquid receiver and the heat dissipation pipe group.

[0010] According to an embodiment of the present application, at least a part of the connecting pipeline is bent to form a heat dissipation coil, and the heat dissipation pipe group is used for heat exchange with the heat dissipation coil.

[0011] According to an embodiment of the present application, at least a part of the connecting pipeline exchanges heat with the capillary tube.

[0012] In this embodiment, at least a part of the connecting pipeline exchanges heat with the capillary tube. The temperature of the connecting pipeline is higher than that of the capillary tube. Exchanging heat between at least a part of the connecting pipeline and the capillary tube can, on the one hand, increase the temperature of the connecting pipeline and reduce the occurrence of condensation and frosting of the connecting pipeline due to too low temperature. At the same time, it can reduce the temperature of the capillary tube, lower the temperature of the refrigerant entering the evaporator, and improve the refrigeration efficiency of the evaporator.

[0013] According to an embodiment of the present application, the evaporator is a finned evaporator or a tubular evaporator.

[0014] According to an embodiment of the present application, the condenser is an anti-corrosion component.

[0015] According to an embodiment of the present application, the condenser is a liquid-cooled condenser; or,

[0016] There are multiple condensers, and the multiple condensers are connected in series. The condenser located at the end and connected to the outlet of the compressor exchanges heat with the heat dissipation device.

[0017] According to an embodiment of the present application, a drying filter is further included. The inlet of the drying filter is connected to the outlet of the condenser, and the outlet of the drying filter is connected to the inlet of the capillary tube.

[0018] In a second aspect, the present application provides a storage device including the refrigeration system described in any of the above embodiments.

[0019] According to the storage device of the present application, by setting the refrigeration system described in any of the above embodiments, the refrigeration system is provided with a heat dissipation device. The heat dissipation device exchanges heat with the condenser to cool the condenser and exchanges heat with the connecting pipeline to heat the connecting pipeline using the heat of the condenser. It not only realizes the recycling of the heat of the condenser but also reduces the occurrence of condensation and frosting of the connecting pipeline at the inlet of the compressor due to too low temperature. At the same time, it improves the cooling effect of the condenser, the refrigeration efficiency of the refrigeration system, and the energy-saving effect.

[0020] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0021] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, where:

[0022] Figure 1 is one of the schematic structural diagrams of the refrigeration system provided by an embodiment of the present application;

[0023] Figure 2 is another schematic structural diagram of the refrigeration system provided by an embodiment of the present application;

[0024] Figure 3 is still another schematic structural diagram of the refrigeration system provided by an embodiment of the present application;

[0025] Figure 4 is yet another schematic structural diagram of the refrigeration system provided by an embodiment of the present application;

[0026] Figure 5 is one of the schematic structural diagrams of the refrigeration system provided by an embodiment of the present application;

[0027] Figure 6 is another schematic structural diagram of the refrigeration system provided by an embodiment of the present application;

[0028] Figure 7 is still another schematic structural diagram of the refrigeration system provided by an embodiment of the present application;

[0029] Figure 8 is yet another schematic structural diagram of the refrigeration system provided by an embodiment of the present application;

[0030] Figure 9 is the schematic structural diagram of the storage device provided by an embodiment of the present application.

[0031] Reference numerals:

[0032] Compressor 1, condenser 2, capillary tube 3, evaporator 4, dryer filter 5, liquid reservoir 6, heat dissipation tube group 7, pump body 8, connecting pipeline 9, heat dissipation coil 91, storage device 10. Detailed description of the embodiments

[0033] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described by referring to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0034] The following refers to Figures 1-9 describe the refrigeration system and the storage device 10 according to the embodiments of the present application.

[0035] It should be noted that the storage device 10 in this embodiment can be understood as a general refrigeration storage device, including but not limited to refrigerators, freezers, display cabinets, beverage cabinets, wine cabinets, fresh-keeping cabinets, and refrigeration vending machines, etc. The storage device 10 has various structural forms and a wide range of applications.

[0036] The storage device 10 includes a box body and a door body. The box body includes an outer shell, an inner liner, and a heat-insulating layer located between the outer shell and the inner liner. The outer shell covers the inner liner to play a protective role; the heat-insulating layer can be a foamed layer to play a heat-insulating and buffering role; a machine room is formed between the outer shell and the inner liner, and the machine room is used to place machines such as a compressor and a condenser. The inner liner forms a compartment for storing items, and the refrigeration system is used to refrigerate the compartment.

[0037] The refrigeration system provided by the embodiment of the present application is applied to the storage device 10, as Figure 1 shown, the refrigeration system includes: a compressor 1, a condenser 2, a capillary tube 3, an evaporator 4, and a heat dissipation device; the outlet of the compressor 1 is connected to the inlet of the condenser 2; the outlet of the condenser 2 is connected to the inlet of the capillary tube 3; the outlet of the capillary tube 3 is connected to the inlet of the evaporator 4, and the outlet of the evaporator 4 is connected to the inlet of the compressor 1 through a connecting pipeline 9; the heat dissipation device is used to exchange heat with the connecting pipeline 9 and the condenser 2 respectively.

[0038] As Figure 2 and Figure 4 shown, the arrow direction in the figure represents the flow direction of the heat exchange medium. The compressor 1, the condenser 2, the capillary tube 3, and the evaporator 4 are sequentially connected to form a refrigeration cycle. The low-temperature and low-pressure gaseous refrigerant is compressed by the compressor 1 into a high-temperature and high-pressure gaseous refrigerant. Then, the high-temperature and high-pressure gaseous refrigerant gas enters the condenser 2, and the high-temperature and high-pressure gaseous refrigerant exchanges heat with the condensate in the condenser 2. After condensation, the high-temperature and high-pressure gaseous refrigerant becomes a high-pressure two-phase refrigerant; subsequently, the gas-liquid two-phase refrigerant enters the capillary tube 3 and becomes a low-temperature and low-pressure gas-liquid two-phase refrigerant through the throttling effect of the capillary tube 3, and enters the evaporator 4 for refrigeration and then becomes a low-temperature and low-pressure gaseous refrigerant; finally, the low-temperature and low-pressure gaseous refrigerant enters the compressor 1 to complete the cycle.

[0039] Among them, the high-temperature condensate in the condenser 2 exchanges heat with the low-temperature condensate in the heat dissipation device to assist in reducing the temperature of the condenser 2; the high-temperature condensate in the heat dissipation device exchanges heat with the connecting pipeline 9 to utilize the heat of the condenser 2 to increase the temperature of the connecting pipeline 9 and reduce the condensation and frosting of the connecting pipeline 9 due to too low temperature.

[0040] In this embodiment, the heat dissipation device exchanges heat with the condenser 2 to cool the condenser 2, and also exchanges heat with the connecting pipeline 9 to heat the connecting pipeline 9 using the heat of the condenser 2, which not only realizes the recycling of the heat of the condenser 2, but also reduces the condensation and frosting of the connecting pipeline 9 due to too low temperature, and at the same time improves the cooling effect of the condenser 2, the refrigeration efficiency and energy-saving effect of the refrigeration system.

[0041] In this embodiment, the heat dissipation device can at least include the following two structures:

[0042] First, the heat dissipation device can include a heat dissipation part, and this heat dissipation part exchanges heat with the connecting pipeline 9 and the condenser 2 respectively through the heat transfer method of contact conduction.

[0043] Exemplarily, the radiator can include a liquid storage device 6. At least part of the condenser 2 and the connecting pipeline 9 are both located in the liquid storage device 6. The liquid storage device 6 is filled with a condensate. Both the condenser 2 and the connecting pipeline 9 exchange heat with the condensate. The temperature of the refrigerant in the condenser 2 decreases, and the temperature of the refrigerant in the connecting pipeline 9 increases.

[0044] Exemplarily, the radiator can include a heat dissipation pipe group 7. One part of the heat dissipation pipe group 7 is arranged close to or in contact with the condenser 2, and the other part is arranged close to or in contact with the connecting pipeline 9. The condensate reciprocates in the heat dissipation pipe group 7 to bring the heat of the condenser 2 to the connecting pipeline 9, so as to realize the cooling of the condenser 2 and the heating of the connecting pipeline 9.

[0045] Exemplarily, the radiator can include a heat dissipation plate group. One part of the heat dissipation plate group is arranged close to or in contact with the condenser 2, and the other part of the heat dissipation plate group is arranged close to or in contact with the connecting pipeline 9. The condensate reciprocates in the heat dissipation plate group 7 to bring the heat of the condenser 2 to the connecting pipeline 9, so as to realize the cooling of the condenser 2 and the heating of the connecting pipeline 9.

[0046] Second, as Figure 1 and Figure 2 shown, the heat dissipation device can include two heat dissipation parts. The two heat dissipation parts exchange heat with the connecting pipeline 9 and the condenser 2 respectively, and the two heat dissipation parts are connected by a pipeline to realize heat transfer.

[0047] Exemplarily, the radiator can include two liquid storage devices 6. At least part of the condenser 2 and at least part of the connecting pipeline 9 are respectively located in different liquid storage devices 6. The liquid storage device 6 is filled with a condensate. The two liquid storage devices 6 are connected by a pipeline to realize the flow of condensates at different temperatures, so as to bring the heat of the condenser 2 to the connecting pipeline 9, so as to realize the cooling of the condenser 2 and the heating of the connecting pipeline 9.

[0048] Exemplarily, as Figure 1 and Figure 2As shown, the radiator may include a liquid reservoir 6 and a heat dissipation tube group 7. One of the liquid reservoir 6 and the heat dissipation tube group 7 exchanges heat with at least part of the condenser 2, and the other of the liquid reservoir 6 and the heat dissipation tube group 7 exchanges heat with at least part of the connecting pipeline 9. The liquid reservoir 6 and the heat dissipation tube group 7 are connected through a pipeline to enable the flow of condensate at different temperatures, so as to carry the heat of the condenser 2 to the connecting pipeline 9, thereby realizing the cooling of the condenser 2 and the heating of the connecting pipeline 9.

[0049] Exemplarily, the radiator may include a heat dissipation plate group and a heat dissipation tube group 7. One of the heat dissipation plate group and the heat dissipation tube group 7 exchanges heat with at least part of the condenser 2, and the other of the heat dissipation plate group and the heat dissipation tube group 7 exchanges heat with at least part of the connecting pipeline 9. The heat dissipation plate group and the heat dissipation tube group 7 are connected through a pipeline to enable the flow of condensate at different temperatures, so as to carry the heat of the condenser 2 to the connecting pipeline 9, thereby realizing the cooling of the condenser 2 and the heating of the connecting pipeline 9.

[0050] Among them, the condensate can be a heat exchange medium such as ethylene glycol or glycerol. As Figure 9 shown, the heat dissipation tube group 7 can be installed on the back or the left and right sides of the storage device 10.

[0051] According to the refrigeration system provided by the embodiment of the present application, by setting a heat dissipation device, the heat dissipation device exchanges heat with the condenser 2 to cool the condenser 2, and also exchanges heat with the connecting pipeline 9 to heat the connecting pipeline 9 by using the heat of the condenser 2, which not only realizes the recycling of the heat of the condenser 2, but also reduces the condensation and frosting of the connecting pipeline 9 at the inlet of the compressor 1 due to too low temperature. At the same time, it improves the cooling effect of the condenser 2 and the refrigeration efficiency and energy-saving effect of the refrigeration system.

[0052] In some embodiments, as Figure 3 and Figure 5 shown, the evaporator 4 is a finned evaporator or a tube evaporator to be applicable to a direct-cooling storage device 10 or an air-cooling storage device 10.

[0053] In some embodiments, as Figure 1 and Figure 3 shown, the heat dissipation device includes: a liquid reservoir 6 and a heat dissipation tube group 7; at least part of the condenser 2 is located in the liquid reservoir 6, and the liquid reservoir 6 is filled with condensate; both ends of the heat dissipation tube group 7 are respectively connected to the inlet and the outlet of the liquid reservoir 6, and the heat dissipation tube group 7 is used for exchanging heat with the connecting pipeline 9.

[0054] Among them, the liquid reservoir 6 can be a container for containing condensate. The whole or part of the condenser 2 is immersed in the condensate, and the heat in the condenser 2 can be directly transferred to the condensate in the liquid reservoir 6, which helps to improve the heat exchange efficiency. The liquid reservoir 6 at least includes the following structural forms:

[0055] First, the liquid storage device 6 is a closed container. The condenser 2 can be installed inside the liquid storage device 6 by means such as erection, threaded connection, or snap connection. A condensate liquid is filled between the inner wall of the liquid storage device 6 and the outer wall of the condenser 2.

[0056] Second, the liquid storage device 6 is an open container. The condenser 2 can be assembled with the liquid storage device 6 from the open end of the liquid storage device 6. The condenser 2 can be installed inside the liquid storage device 6 by means such as erection, threaded connection, or direct placement. A condensate liquid is filled between the inner wall of the liquid storage device 6 and the outer wall of the condenser 2.

[0057] In some embodiments, the outer shape structures of the liquid storage device 6 and the condenser 2 can be shaped in imitation of each other, or the inner wall of the liquid storage device 6 and the outer wall of the condenser 2 are in clearance fit, so as to facilitate placing the condenser 2 inside the liquid storage device 6.

[0058] Among them, as Figure 4 and Figure 6 shown, the arrow direction in the figure indicates the flow direction of the heat exchange medium. The heat dissipation tube group 7 forms a closed cycle by connecting with the inlet and outlet of the liquid storage device 6. The high-temperature condensate liquid in the liquid storage device 6 can be discharged through the outlet of the liquid storage device 6 to the heat dissipation tube group 7 to increase the temperature of the connecting pipeline 9, and the low-temperature condensate liquid in the heat dissipation tube group 7 can flow into the liquid storage device 6 through the inlet of the liquid storage device 6 to reduce the temperature of the condenser 2.

[0059] As Figure 6 and Figure 7 shown, the heat dissipation tube group 7 includes multiple pipes arranged in parallel or in a spiral pattern to increase the surface area of the heat dissipation tube group 7, thereby improving the heat exchange efficiency between the heat dissipation tube group 7 and the surrounding environment.

[0060] Part of the heat dissipation tube group 7 can exchange heat by contacting the connecting pipeline 9, and another part of the heat dissipation tube group 7 can exchange heat by convection with the outside gas, thereby improving the heat exchange efficiency; or, all of the heat dissipation tube group 7 contacts the connecting pipeline 9 to exchange heat, improving the heat exchange efficiency, reducing the volume of the heat dissipation tube group 7, and reducing the occupation of the effective volume of the storage device 10.

[0061] In some embodiments, the condenser 2 is an anti-corrosion component.

[0062] Among them, the condenser 2 can adopt anti-corrosion components such as stainless steel, special alloy, or metal materials coated with an anti-corrosion coating, so as to extend the working life of the condenser 2 under the condition of immersing the condenser 2 in the condensate liquid and improve the reliability of the storage device 10.

[0063] In some embodiments, the condenser 2 is a liquid-cooled condenser.

[0064] Among them, the liquid-cooled condenser uses a liquid as a cooling medium to absorb and transfer the heat released by the refrigerant, thereby reducing the space occupied by the condenser 2, compared with using forced.

[0065] In the related art, a combination of a condenser and a fan is generally adopted for a storage device. The condenser needs to use the fan to perform forced heat dissipation, and the fan generates a large amount of noise, resulting in a relatively large noise of the whole machine.

[0066] In this embodiment, by adopting a liquid-cooled condenser, the liquid-cooled condenser can be cooled by the condensate immersed in the liquid storage device 6, so that the fan structure can be omitted, and further the noise of the whole machine can be reduced; at the same time, the liquid-cooled condenser can reduce the exhaust pressure of the compressor 1 to a lower level, thereby further reducing the noise of the whole machine.

[0067] In some embodiments, as Figure 3 and Figure 7 shown, a plurality of condensers 2 are included. The plurality of condensers 2 are connected in series, and the condenser 2 located at the end and connected to the outlet of the compressor 1 among the plurality of condensers 2 exchanges heat with the heat dissipation device.

[0068] It should be noted that the condenser 2 connected to the outlet of the compressor 1 has the highest temperature. Exchanging heat between this condenser 2 and the heat dissipation device can improve the heat dissipation effect of this condenser 2, and at the same time can effectively heat up the connecting pipeline 9, realizing both the recovery and utilization of the heat of the condenser 2 and reducing the condensation and frosting of the connecting pipeline 9 at the inlet of the compressor 1 due to too low temperature.

[0069] In this embodiment, by providing a plurality of condensers 2, the cooling effect can be increased.

[0070] Among them, except for the condenser 2 connected to the outlet of the compressor 1 among the plurality of condensers 2, the remaining condensers 2 can exchange heat with the heat dissipation device or can exchange heat with the outside air, both of which can improve the refrigeration efficiency of the refrigeration system.

[0071] Among them, as Figure 4 and Figure 8 shown, the types of the plurality of condensers 2 can be the same or different. For example, the condenser 2 connected to the outlet of the compressor 1 is a liquid-cooled condenser, and the other condensers 2 can be finned condensers.

[0072] In some embodiments, as Figure 1 and Figure 2 shown, at least part of the connecting pipeline 9 is bent to form a heat dissipation coil 91, and the heat dissipation tube group 7 is used to exchange heat with the heat dissipation coil 91.

[0073] In this embodiment, the connecting pipeline 9 forms a heat dissipation coil 91 by bending to form a spiral or disk-shaped structure. The heat dissipation coil 91 increases the flow path and surface area of the fluid in the connecting pipeline 9, so that more heat can be exchanged with the heat dissipation tube group 7 to improve the heat exchange efficiency.

[0074] Among them, the heat dissipation coil 91 and the heat dissipation tube group 7 can be connected by contact or both are arranged in the same space, and the heat exchange between the heat dissipation coil 91 and the heat dissipation tube group 7 can be realized by two main ways: conduction heat transfer or convective heat transfer.

[0075] In some embodiments, such as Figure 1 and Figure 2 shown, the heat dissipation device further includes a pump body 8, and the pump body 8 is arranged between the liquid storage device 6 and the heat dissipation tube group 7 to provide power for the flow of the condensate between the liquid storage device 6 and the heat dissipation tube group 7.

[0076] Among them, the pump body 8 can be an impeller pump, a positive displacement pump, an electromagnetic pump, etc.

[0077] In some embodiments, the pump body 8 can be a variable frequency pump, and the heat dissipation device further includes a temperature acquisition device and a controller. The temperature acquisition device is arranged at the outlet of the condenser 2, and the controller is configured to control the rotation speed of the variable frequency pump based on the data acquired by the temperature acquisition device.

[0078] Among them, the temperature acquisition device is used to acquire the temperature at the outlet of the condenser 2, and the controller is electrically connected to the temperature acquisition device and the variable frequency pump respectively.

[0079] In this embodiment, the controller can control the rotation speed of the variable frequency pump based on the temperature at the outlet of the condenser 2. When the temperature at the outlet of the condenser 2 is relatively high, the rotation speed of the variable frequency pump can be increased to achieve the purpose of rapid heat dissipation; when the temperature at the outlet of the condenser 2 is relatively low, the rotation speed of the variable frequency pump can be decreased, which can not only achieve rapid heat dissipation but also achieve the effect of energy conservation and consumption reduction.

[0080] In some embodiments, such as Figure 1 and Figure 2 shown, at least part of the connecting pipeline 9 exchanges heat with the capillary tube 3, that is, at least part of the pipeline between the outlet of the evaporator 4 and the inlet of the compressor 1 exchanges heat with the capillary tube 3.

[0081] In this embodiment, such as Figure 2 and Figure 4 shown, at least part of the connecting pipeline 9 exchanges heat with the capillary tube 3. The temperature of the connecting pipeline 9 is higher than that of the capillary tube 3. Exchanging heat between at least part of the connecting pipeline 9 and the capillary tube 3 can, on the one hand, increase the temperature of the connecting pipeline 9 and reduce the condensation and frosting of the connecting pipeline 9 due to too low temperature. At the same time, it can reduce the temperature of the capillary tube 3, reduce the temperature of the refrigerant entering the evaporator 4, and improve the refrigeration efficiency of the evaporator 4.

[0082] Among them, the connecting pipeline 9 and the capillary tube 3 can be arranged in the same space to realize heat exchange through air convection; or at least part of the connecting pipeline 9 can be arranged in contact with the capillary tube 3 to realize heat exchange through conduction heat transfer.

[0083] In some embodiments, as Figure 2 and Figure 4 shown, the refrigeration system further includes a dryer filter 5. The inlet of the dryer filter 5 is connected to the outlet of the condenser 2, and the outlet of the dryer filter 5 is connected to the inlet of the capillary tube 3.

[0084] Among them, the dryer filter 5 is arranged between the condenser 2 and the capillary tube 3. The high-pressure two-phase refrigerant filters moisture and impurities through the dryer filter 5 to reduce the impurities entering the capillary tube 3 and improve the service life of the capillary tube 3.

[0085] Combined with Figure 1 and Figure 2 to illustrate the complete heat exchange cycle of the refrigeration system of the present application, the arrow direction in the figure indicates the flow direction of the heat exchange medium.

[0086] The compressor 1, the condenser 2, the capillary tube 3 and the evaporator 4 are connected in sequence to form a refrigeration circuit. The low-temperature and low-pressure gaseous refrigerant is compressed into a high-temperature and high-pressure gaseous refrigerant by the compressor 1. Then, the high-temperature and high-pressure gaseous refrigerant enters the condenser 2, and the high-temperature and high-pressure gaseous refrigerant exchanges heat with the condensate in the condenser 2. After condensation, the high-temperature and high-pressure gaseous refrigerant becomes a high-pressure two-phase refrigerant; the high-pressure two-phase refrigerant filters moisture and impurities through the dryer filter 5; subsequently, the gas-liquid two-phase refrigerant enters the capillary tube 3 and becomes a low-temperature and low-pressure gas-liquid two-phase refrigerant through the throttling effect of the capillary tube 3, and enters the evaporator 4 for refrigeration and then becomes a low-temperature and low-pressure gaseous refrigerant; the low-temperature and low-pressure gaseous refrigerant finally enters the compressor 1 to complete the cycle.

[0087] The heat exchange cycle of the condenser 2, the connecting pipeline 9 and the heat dissipation device of the present application is described below:

[0088] As Figure 4 and Figure 6 shown, the arrow direction in the figure indicates the flow direction of the heat exchange medium. The high-temperature condensate in the condenser 2 after absorbing heat exchanges heat with the low-temperature condensate in the liquid receiver 6 to assist in reducing the temperature of the condenser 2. The high-temperature condensate in the liquid receiver 6 after absorbing heat is transported to the heat dissipation tube group 7 under the action of the pump body 8; the high-temperature condensate in the heat dissipation tube group 7 exchanges heat with the low-temperature refrigerant in the connecting pipeline 9 to utilize the heat of the condenser 2 to increase the temperature of the connecting pipeline 9 and reduce the condensation and frosting of the connecting pipeline 9 due to too low temperature; among them, the controller can control the rotation speed of the pump body 8 based on the outlet temperature of the condenser 2 connected to the outlet of the compressor 1 to achieve the effects of rapid cooling and energy saving and emission reduction.

[0089] Second, as Figure 9 shown, the embodiment of the present application further provides a storage device 10, including the refrigeration system in any of the above embodiments.

[0090] According to the storage device 10 provided by the embodiments of the present application, by setting the refrigeration system in any of the above embodiments, the refrigeration system is provided with a heat dissipation device. The heat dissipation device exchanges heat with the condenser 2 to cool the condenser 2, and also exchanges heat with the connecting pipeline 9 to heat the connecting pipeline 9 by using the heat of the condenser 2. It not only realizes the recycling of the heat of the condenser 2, but also reduces the condensation and frosting of the connecting pipeline 9 at the inlet of the compressor 1 due to too low temperature. At the same time, it improves the cooling effect of the condenser 2 and the refrigeration efficiency and energy-saving effect of the refrigeration system.

[0091] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means that the related objects before and after are in an "or" relationship.

[0092] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0093] In the description of the present application, the "first feature" and "second feature" may include one or more of such features.

[0094] In the description of the present application, the meaning of "a plurality" is two or more.

[0095] In the description of the present application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween.

[0096] In the description of the present application, "above", "over" and "on" of a first feature with respect to a second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature.

[0097] In the description of this specification, descriptions with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0098] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A refrigeration system is applied to a storage device, characterized in that, Comprising: A compressor; A condenser, with the outlet of the compressor connected to the inlet of the condenser; A capillary tube, with the outlet of the condenser connected to the inlet of the capillary tube; An evaporator, with the outlet of the capillary tube connected to the inlet of the evaporator, and the outlet of the evaporator connected to the inlet of the compressor through a connecting pipeline; A heat dissipation device, which is used to exchange heat with the connecting pipeline and the condenser respectively.

2. The refrigeration system according to claim 1, characterized in that, The heat dissipation device includes: A liquid storage device, at least part of the condenser is located inside the liquid storage device, and the liquid storage device contains condensate; A heat dissipation tube group, with both ends of the heat dissipation tube group connected to the inlet and the outlet of the liquid storage device respectively, and the heat dissipation tube group is used to exchange heat with the connecting pipeline.

3. The refrigeration system according to claim 2, characterized in that, The heat dissipation device further includes a pump body, which is arranged between the liquid storage device and the heat dissipation tube group.

4. The refrigeration system according to claim 2, wherein At least part of the connecting pipeline is bent to form a heat dissipation coil, and the heat dissipation tube group is used to exchange heat with the heat dissipation coil.

5. The refrigeration system according to claim 1, wherein, At least part of the pipeline of the connecting pipeline exchanges heat with the capillary tube.

6. The refrigeration system according to any one of claims 1-5, characterized in that, The evaporator is a finned evaporator or a tubular evaporator.

7. The refrigeration system according to any one of claims 1-5, characterized in that, The condenser is an anti-corrosion component.

8. The refrigeration system according to any one of claims 1-5, characterized in that, The condenser is a liquid-cooled condenser; or, There are multiple condensers, the multiple condensers are connected in series, and the condenser at the end and connected to the outlet of the compressor among the multiple condensers exchanges heat with the heat dissipation device.

9. The refrigeration system according to any one of claims 1-5, characterized in that, It further includes a dryer filter, the inlet of the dryer filter is connected to the outlet of the condenser, and the outlet of the dryer filter is connected to the inlet of the capillary tube.

10. A storage device, characterized in that, It includes the refrigeration system according to any one of claims 1-9.

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