Intelligent uniform-temperature embedded oven

Abstract

The utility model discloses an intelligent uniform-temperature embedded oven, which relates to the technical field of kitchen supplies and comprises an oven body and a door body arranged at the front end of the oven body. The door body comprises a door frame, inner-layer glass, middle-layer glass and outer-layer glass, the inner-layer glass, the middle-layer glass and the outer-layer glass are located in the door frame and arranged at intervals from inside to outside, the inner-layer glass and the middle-layer glass are sealed, and a compensation element is arranged between the inner-layer glass and the middle-layer glass. According to the intelligent uniform-temperature embedded oven, in the scheme, the door body is still made of three layers of glass, the inner layer of glass close to the inner container and the middle layer of glass are peripherally sealed through the compensation element, and local sealing is formed between the innermost layer of glass and the middle layer of glass. Therefore, temperature compensation of heat loss at the door body in the oven is carried out. By arranging the compensation element, the temperature close to the door body is prevented from being lower than the temperature of other positions on the baking tray, and the temperature is not uniform, so that the temperature uniformity of the oven is improved.

Description

Technical Field

[0001] The utility model relates to the field of kitchen electrical appliances, in particular to an intelligent temperature-uniform embedded oven. Background Art

[0002] An oven is a common cooking device in modern kitchens. When the oven is working, the temperature inside the oven cavity is relatively high. Since the oven cavity is surrounded by heat-insulating materials, which have a heat-insulating effect, the temperature of the oven body is generally acceptable. However, since the door needs to maintain transparency, heat-insulating materials are usually not provided at the door, so the direct external contact temperature at the door is generally relatively high. When a user approaches the door, they are likely to be scalded. The first problem to be solved in this solution is a new anti-scalding technology at the oven door.

[0003] In the current anti-scalding solutions for the oven door of an embedded oven, the oven door can be composed of multiple layers of glass such as an outer layer of glass, a middle layer of glass, and an inner layer of glass. There is an air duct left between the multiple layers of glass of the door. Inside the oven, there are corresponding fans and air ducts. When the fan works, it drives the air flow through the air duct inside the oven door, and the heat dissipation effect at the door is achieved through convective heat transfer, reducing the contact temperature at the door.

[0004] As the number of oven products on the market gradually increases, after the oven meets the basic baking ability, how to make the baking of the oven more uniform is one of the future development directions of oven products. Currently, when food is baked, some areas are already burnt, while some areas are not yet cooked. Therefore, it is necessary to improve the baking uniformity of the oven. In addition, since there is no heat-insulating material surrounding the door compared to other parts of the oven body, the heat loss is relatively fast. In the experiment, the temperature near the door is lower than the temperature at other positions on the baking tray, and the temperature is uneven.

[0005] In the current oven heating solutions, there are solutions such as installing heating wires on the upper part of the inner cavity, installing heating wires on the bottom of the inner cavity, and installing heating wires on the back of the inner cavity. The heating wires at different positions can work independently for temperature control. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is to provide an intelligent temperature-uniform embedded oven with good temperature uniformity inside the box and temperature compensation near the door.

[0007] The technical solution adopted by the utility model to solve its technical problem is: the intelligent temperature-uniform embedded oven includes a box body and a door body arranged at the front end of the box body;

[0008] The door body includes a door frame, an inner layer of glass, a middle layer of glass, and an outer layer of glass which are arranged at intervals from the inside to the outside within the door frame. The inner layer of glass and the middle layer of glass are sealed, and a compensation element is arranged between them.

[0009] Further, the compensation element is a semiconductor module group disposed between the inner layer of glass and the middle layer of glass.

[0010] Further, the semiconductor module group includes a refrigerating surface facing the middle layer of glass for cooling the middle layer of glass and a heating surface facing the inner layer of glass for heating the inner layer of glass.

[0011] Further, a heat conducting sheet is also disposed on the middle layer of glass, one end of the heat conducting sheet is connected to the refrigerating surface, and the other end is connected to the door handle.

[0012] Further, the compensation element is a first electric heating wire, a top heat dissipation mechanism is disposed on the box body, and a first air duct for communicating with the top heat dissipation mechanism is disposed between the middle layer of glass and the outer layer of glass.

[0013] Further, a first temperature sensor for detecting the temperature of the door handle and a second temperature sensor for detecting the inner layer of glass of the door body are also disposed on the door body, and the first temperature sensor and the second temperature sensor are respectively electrically connected to the top heat dissipation mechanism and the compensation element.

[0014] Further, a second electric heating wire is also disposed below the tray.

[0015] Further, a second electric heating wire is respectively disposed below each of the trays, each second electric heating wire is independently disposed, and each tray is also respectively provided with a third temperature sensor.

[0016] Further, a door body detection switch is disposed on the door body, and the door body detection switch is electrically connected to each second electric heating wire.

[0017] Further, it also includes a second air duct disposed on the back of the box body, a heating element and a forward and reverse blower disposed in the second air duct, and the second air duct communicates with the inside of the box body.

[0018] In this solution of the intelligent temperature-equalizing built-in oven, the door body still adopts three layers of glass. Among them, a compensation element is added between the inner layer of glass close to the inner container and the middle layer of glass for surrounding sealing, so that a partial seal is formed between the innermost layer of glass and the middle layer of glass, thereby performing temperature compensation for the heat loss at the door body of the oven. By setting the compensation element, the present invention avoids the temperature at the position close to the door body being lower than the temperature at other positions on the baking tray, and the temperature is uneven, thereby improving the temperature uniformity of the oven. Description of the Drawings

[0019] The following will further illustrate the present invention in conjunction with the drawings. In the drawings:

[0020] Figure 1 is a schematic structural diagram of the intelligent temperature-equalizing built-in oven according to the embodiment of the present invention;

[0021] Figure 2 It is a side view of the intelligent temperature - equalizing built - in oven according to the embodiment of the present utility model;

[0022] Figure 3 is Figure 2 a sectional view along A - A;

[0023] Figure 4 It is a partial structural schematic diagram of the intelligent temperature - equalizing built - in oven according to the embodiment of the present utility model;

[0024] Figure 5 It is a partial structural schematic diagram of the intelligent temperature - equalizing built - in oven according to the embodiment of the present utility model;

[0025] Figure 6 It is a structural schematic diagram of the second electric heating wire and the tray according to the embodiment of the present utility model.

[0026] Explanation of reference numerals:

[0027] 1, box body; 2, door body; 21, inner - layer glass; 22, middle - layer glass; 23, outer - layer glass; 24, first air duct; 3, compensation element; 4, top heat - dissipation mechanism; 5, second electric heating wire; 6, third temperature sensor; 7, second air duct; 8, heating element; 9, forward - reverse blower. Detailed implementation manners

[0028] For a clearer understanding of the technical features, purposes and effects of the present utility model, the detailed implementation manners of the present utility model will now be described in detail with reference to the accompanying drawings.

[0029] As Figures 1-6 shown, the intelligent temperature - equalizing built - in oven includes a box body 1 and a door body 2 provided at the front end of the box body 1;

[0030] The door body 2 includes a door frame, an inner - layer glass 21, a middle - layer glass 22 and an outer - layer glass 23 which are arranged at intervals from the inside to the outside within the door frame. The inner - layer glass 21 and the middle - layer glass 22 are sealed, and a compensation element 3 is arranged between them.

[0031] In this intelligent temperature - equalizing built - in oven, in this solution, the door body 2 still adopts three - layer glass. The inner - layer glass 21 close to the inner container and the middle - layer glass are hermetically sealed around by adding a compensation element 3, so that a local enclosure is formed between the innermost - layer glass 21 and the middle - layer glass, thereby compensating for the temperature loss at the door body 2 in the oven. By setting the compensation element 3, the present utility model avoids the temperature at the position close to the door body 2 being lower than the temperature at other positions on the baking tray, resulting in uneven temperature, and thus improves the temperature uniformity of the oven.

[0032] The compensation element 3 is a semiconductor module group disposed between the inner layer glass 21 and the middle layer glass 22. In this embodiment, the semiconductor module group includes a refrigerating surface facing the middle layer glass 22 for cooling the middle layer glass 22 and a heating surface facing the inner layer glass 21 for heating the inner layer glass 21.

[0033] After being powered on, the semiconductor module group cools on one side and heats on the other side. The hot and cold ends are respectively composed of two ceramic chips. The heating capacity of the semiconductor module group is higher than its refrigerating capacity, which results in some limitations in its applications in semiconductor refrigerators and semiconductor air conditioners. However, it has characteristics such as high energy density, no noise, and small volume. In this solution, by utilizing the characteristic that it cools on one side and heats on the other side after being powered on, the semiconductor module group is installed in the multi-layer door body 2. The inner layer and the middle layer of the door body 2 are sealed. By using the characteristics of the semiconductor module group, it performs temperature compensation for warming on one side and anti-scalding heat dissipation on the other side.

[0034] To further improve the heat conduction effect, a heat conducting sheet is also provided on the middle layer glass 22. One end of the heat conducting sheet is connected to the refrigerating surface and the other end is connected to the door handle. A heat conducting sheet can be added on the middle layer glass 22. One end of the heat conducting sheet is connected to the refrigerating surface of the semiconductor refrigerating chip, and the other end can be connected to the door handle assembly structure to transfer the cold end effect. There is a certain distance gap between the middle layer glass 22 and the inner layer glass 21 of the door body 2. The periphery is sealed by a sheet-shaped semiconductor module group. After the semiconductor module group is limited by the door body 2 structure, it can be bonded through heat conducting silica gel, or heat conducting fins can be added and then connected to the door body 2 to increase the heat exchange area and enhance the heat conduction effect. The layout position of the semiconductor module group should avoid the observation window on the door body 2 to ensure the user's observation effect.

[0035] In some other embodiments, the compensation element 3 is a first electric heating wire. A top heat dissipation mechanism 4 is provided on the box body 1, and a first air duct 24 for communicating with the top heat dissipation mechanism 4 is provided between the middle layer glass 22 and the outer layer glass 23.

[0036] A first temperature sensor for detecting the temperature of the door handle and a second temperature sensor for detecting the inner layer glass 21 of the door body 2 are also provided on the door body 2. The first temperature sensor and the second temperature sensor are electrically connected to the top heat dissipation mechanism 4 and the compensation element 3 respectively.

[0037] Optionally, in order to save energy consumption, two groups of temperature sensors can be added to the door body 2. Usually, the heat dissipation of the door body 2 is carried out by the convective heat transfer of the upper blower. When the temperature value of the door body 2 is higher than the set value, the semiconductor refrigeration module works to cool down; at the same time, the temperature at the inner liner of the door body 2 can be monitored. When the temperature at the inner liner of the door body 2 is lower than the temperature of the baking tray by a certain value, the semiconductor module works to perform temperature compensation for the door body 2.

[0038] It also includes a second electric heating wire disposed below the tray. Preferably, a second electric heating wire is respectively disposed below each tray, and each second electric heating wire is independently arranged and a third temperature sensor 6 is also respectively disposed on each tray.

[0039] Several independent heating units are integrated on the bracket below the baking tray and are equipped with a third temperature sensor 6. During the operation of the oven, the temperature distribution on the baking tray is monitored. When the temperature difference collected is greater than a certain value, the second electric heating wire 5 in the corresponding area is turned on to perform local temperature compensation. When the temperature difference is less than a certain degree, the second electric heating wire 5 is powered off.

[0040] Since the heating wire is close to the baking tray, there is a risk of accidental touch when the user opens the door to take the baking tray. A door closing detection switch should be added to the circuit of the second electric heating wire 5. When the oven door 2 is opened, the second electric heating wire 5 is automatically powered off to ensure safety, that is, a door detection switch is provided on the door 2, and the door detection switch is electrically connected to each second electric heating wire.

[0041] To further improve the temperature uniformity, it also includes a second air duct 7 disposed on the back of the box body 1, a heating element 8 disposed in the second air duct 7, and a forward and reverse fan 9. The second air duct 7 is communicated with the inside of the box body 1. A heating element 8 is installed on the back of the inner tank of the box body 1 and is equipped with a forward and reverse fan 9. When the heating element 8 is heated, the forward and reverse fan 9 periodically switches between forward and reverse rotations to improve the uniformity of the flow field and temperature field inside the box body 1. In this solution, the oven is provided with two sets of air ducts and two fans. The upper fan and its air duct of the top heat dissipation mechanism 4 are connected to the air duct between the outer glass 23 and the middle glass 22 of the door 2. When the fan works, it guides the air flow through the air duct between the outer glass 23 and the middle glass 22 of the door 2 to take away the heat.

[0042] Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without more limitations, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0043] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or alterations can be made based on the above description. It is not necessary and impossible to enumerate all implementation manners here. And the obvious changes or alterations derived therefrom still fall within the protection scope of the utility model.

Claims

1. An intelligent temperature-equalizing embedded oven, characterized in that, It includes a box body (1) and a door body (2) arranged at the front end of the box body (1); The door body (2) includes a door frame, an inner layer glass (21), a middle layer glass (22) and an outer layer glass (23) which are arranged at intervals from inside to outside within the door frame. The inner layer glass (21) and the middle layer glass (22) are sealed and a compensation element (3) is arranged between them.

2. The intelligent temperature-equalizing embedded oven according to claim 1, wherein The compensation element (3) is a semiconductor module group arranged between the inner layer glass (21) and the middle layer glass (22).

3. The intelligent temperature-equalizing built-in oven according to claim 2, wherein The semiconductor module group includes a refrigerating surface facing the middle layer glass (22) for cooling the middle layer glass (22) and a heating surface facing the inner layer glass (21) for heating the inner layer glass (21).

4. The intelligent temperature-equalizing built-in oven according to claim 3, characterized in that A heat conducting sheet is further arranged on the middle layer glass (22). One end of the heat conducting sheet is connected to the refrigerating surface and the other end is connected to the door handle.

5. The intelligent temperature-equalizing built-in oven according to claim 1, wherein The compensation element (3) is a first electric heating wire. A top heat dissipation mechanism (4) is arranged on the box body (1). A first air duct (24) for communicating with the top heat dissipation mechanism (4) is arranged between the middle layer glass (22) and the outer layer glass (23).

6. The intelligent temperature-equalizing built-in oven according to claim 5, wherein, A first temperature sensor for detecting the temperature of the door handle and a second temperature sensor for detecting the inner layer glass (21) of the door body (2) are further arranged on the door body (2). The first temperature sensor and the second temperature sensor are respectively electrically connected to the top heat dissipation mechanism (4) and the compensation element (3).

7. The intelligent temperature-equalizing embedded oven according to any one of claims 1-6, characterized in that, It further includes a second electric heating wire arranged below the tray.

8. The intelligent temperature-equalizing built-in oven according to claim 7, wherein A second electric heating wire is respectively arranged below each of the trays. Each second electric heating wire is independently arranged and a third temperature sensor (6) is further arranged on each tray respectively.

9. The intelligent temperature-equalizing built-in oven according to claim 8, wherein A door body detection switch is arranged on the door body (2). The door body detection switch is electrically connected to each second electric heating wire.

10. The intelligent temperature-equalizing built-in oven according to any one of claims 1-6, characterized in that It further includes a second air duct (7) arranged at the back of the box body (1), a heating element (8) and a forward and reverse blower (9) arranged in the second air duct (7). The second air duct (7) is communicated with the inside of the box body (1).

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