LED lamp bead packaging processing device with accurate alignment

Abstract

The utility model belongs to the technical field of packaging processing devices, and particularly relates to an LED lamp bead packaging processing device accurate in alignment. The LED lamp bead packaging processing device accurate in alignment comprises a working table, a supporting frame is fixedly installed on the working table, a sliding rail is fixedly installed on the supporting frame, a gluing assembly is installed on the sliding rail, a supporting plate is installed on the sliding rail, and a gluing assembly is installed on the supporting plate. And square plates are symmetrically installed on the supporting plate, square grooves are fixedly formed in the square plates, and driving assemblies are arranged in the square grooves. According to the LED lamp bead packaging processing device, the positions of to-be-packaged LED lamp beads can be conveniently adjusted through the installed push plate and the installed micro motor, the micro motor works to drive the threaded rod to rotate, the threaded rod rotates to enable the position of the threaded barrel to move, then the sliding plate is driven to synchronously move, the push plate moves, and the position of the to-be-packaged LED lamp beads is adjusted. Therefore, the positions of the LED lamp beads are adjusted, alignment adjustment of the positions of the LED lamp beads to be glued and packaged is facilitated, and the gluing assembly can conveniently adjust the LED lamp beads for gluing and packaging.

Description

Technical Field

[0001] The utility model relates to the technical field of encapsulation processing devices, and particularly to an LED lamp bead encapsulation processing device with accurate alignment. Background Technique

[0002] A glue applicator is a device for LED lamp bead encapsulation processing. The glue applicator is usually used to evenly coat adhesives on various materials or components during the manufacturing process. In the process of LED lamp bead encapsulation, the glue applicator can be used to coat encapsulation glue, which is a common application. LED lamp bead encapsulation is a delicate process that involves fixing an LED chip on a substrate and protecting the chip by coating encapsulation glue to ensure its optical performance. The amount of glue used and the coating position are precisely controlled to ensure the quality and reliability of the LED lamp beads.

[0003] However, when the existing LED lamp bead encapsulation processing device performs glue coating and encapsulation on LED lamp beads, it is not convenient to adjust the position of the LED lamp beads for alignment, and manual adjustment is still required, which affects the work efficiency.

[0004] Patent document CN204365564U discloses an encapsulation and dispensing device for LED lamps, "including: a silicone container, a silicone groove, four ceramic valves, four dispensing needles, four silicone pushing rods for squeezing the silicone in the ceramic valves to the dispensing needles, and a driving component for driving the four silicone pushing rods to reciprocate. The four ceramic valves each have a glue inlet, a glue outlet, and a pushing rod insertion hole for the silicone pushing rod to reciprocate. The four ceramic valves are all placed in the silicone groove, and the glue inlets of the four ceramic valves are communicated with the silicone groove so that the silicone in the silicone groove can enter the four ceramic valves. The glue outlets of the four ceramic valves respectively correspond to the glue inlets of the four dispensing needles, and the glue outlet of the dispensing needle is used to align with the dispensing position of the LED lamp. The first ends of the four silicone pushing rods are respectively inserted into the four pushing rod insertion holes and are respectively placed in the four ceramic valves, and the second ends of the four silicone pushing rods are all connected to the driving component, and the driving component is started to make the four silicone pushing rods reciprocate simultaneously". However, the above-mentioned encapsulation and dispensing device for LED lamps in the disclosed document mainly considers that it can perform dispensing on four dispensing positions simultaneously at one time to improve work efficiency, but does not consider the problem of adjusting the position of the glue-coated object. Therefore, it is necessary to research and develop an LED lamp bead encapsulation processing device with accurate alignment. Content of the Utility Model

[0005] The purpose of the utility model is to provide an LED lamp bead encapsulation processing device with accurate alignment to solve the technical problem of inconvenient adjustment of the position of the glue-coated LED lamp beads mentioned in the above background technique.

[0006] To achieve the above object, the present utility model provides the following technical solution: An LED lamp bead encapsulation processing device with precise alignment, including a workbench, on which a support frame is fixedly installed, a slide rail is fixedly installed on the support frame, a glue application component is installed on the slide rail, a guide rail is fixedly installed on the top of the workbench, a support plate is installed on the guide rail, square plates are symmetrically installed on the support plate, a square groove is fixedly installed on the square plate, a driving component is arranged inside the square groove, a sliding plate penetrates through the inside of the square groove, and the driving component is connected to the sliding plate. One end of the sliding plate is fixedly connected to a push plate, and a guiding component is arranged inside the square groove.

[0007] Preferably, the guiding component includes a guiding groove and a guiding plate. The guiding grooves are symmetrically arranged inside the sliding plate. The guiding plate penetrates through the inside of the guiding groove, and one end of the guiding plate is fixedly connected to the inner wall of the square groove.

[0008] Preferably, the driving component includes a threaded cylinder, a threaded rod, and a micro motor. The micro motor is fixedly installed inside the square groove. One end of the threaded rod is fixedly connected to the output end of the micro motor. The threaded cylinder is fixedly installed inside the sliding plate, and the threaded rod is in threaded connection with the threaded cylinder.

[0009] Preferably, an air box is fixedly installed on the top of the square groove.

[0010] Preferably, a filter screen is fixedly installed on the top of the air box, and a blower is fixedly installed inside the air box.

[0011] Preferably, a flow channel is embedded inside the square plate, and the output end of the blower is communicated with the flow channel.

[0012] Preferably, jet nozzles are arranged in an array on the flow channel.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. The present utility model is convenient for the LED lamp bead encapsulation processing device with precise alignment to adjust the position of the LED lamp beads to be encapsulated through the installed push plate and micro motor. When aligning the position of the LED lamp beads with the position of the glue application component, the micro motor works to drive the threaded rod to rotate. The rotation of the threaded rod will cause the position of the threaded cylinder to move, and then drive the sliding plate to move synchronously. When the sliding plate moves, the guiding component will guide the sliding plate to move smoothly. After the sliding plate moves, the push plate will move, and the movement of the push plate will push the position of the substrate to be adjusted, thereby adjusting the position of the LED lamp beads, facilitating the alignment adjustment of the position of the LED lamp beads to be coated and encapsulated, and facilitating the glue application component to adjust the LED lamp beads for glue application and encapsulation;

[0015] 2. The utility model facilitates the cleaning of the LED lamp beads driven by glue coating through the installed fan and jet head in an LED lamp bead encapsulation processing device with accurate alignment. After placing the circuit board to be encapsulated above the support plate, the fan operates to extract the air inside the air box. After the extracted air enters the internal flow groove, the jet head causes the wind force to flow to the surface of the LED lamp beads, thereby cleaning the LED lamp beads. The glue coating assembly operates to apply glue to the LED lamp beads on the circuit board, precisely applying glue or encapsulation material onto the substrate of the LED lamp beads to ensure a uniform glue layer is formed on the surface of the LED lamp beads, thus achieving the encapsulation processing of the LED lamp beads. Brief Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the square groove structure of the utility model;

[0018] Figure 3 It is a schematic diagram of the air box structure of the utility model;

[0019] Figure 4 It is the utility model Figure 1 The enlarged schematic diagram of structure A in it.

[0020] In the figure: 1, workbench; 2, guide rail; 3, support plate; 4, support frame; 5, slide rail; 6, glue coating assembly; 7, square plate; 8, square groove; 9, sliding plate; 10, guide groove; 11, guide plate; 12, push plate; 13, threaded cylinder; 14, threaded rod; 15, micro motor; 16, air box; 17, filter screen; 18, fan; 19, flow groove; 20, jet head. Detailed Embodiment

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figure 1 and Figure 2, A device for encapsulating LED lamp beads with precise alignment, including a workbench 1. A support frame 4 is fixedly installed on the workbench 1. A slide rail 5 is fixedly installed on the support frame 4. A glue application component 6 is installed on the slide rail 5. A guide rail 2 is fixedly installed on the top of the workbench 1. A support plate 3 is installed on the guide rail 2. Square plates 7 are symmetrically installed on the support plate 3. A square groove 8 is fixedly installed on the square plate 7. A driving component is arranged inside the square groove 8. A sliding plate 9 passes through the inside of the square groove 8, and the driving component is connected to the sliding plate 9. One end of the sliding plate 9 is fixedly connected to a push plate 12. A guiding component is arranged inside the square groove 8. When using the device for encapsulating LED lamp beads with precise alignment to encapsulate LED lamp beads, after the LED lamp beads and the circuit board are welded, when the circuit board to be encapsulated is placed above the support plate 3, the glue application component 6 works to apply glue to the LED lamp beads on the circuit board, precisely applying glue or encapsulation material onto the substrate of the LED lamp beads to ensure a uniform glue layer is formed on the surface of the LED lamp beads, thereby achieving the encapsulation process of the LED lamp beads. Before applying glue, when adjusting the alignment of the position of the LED lamp beads and the glue application component 6, operating the driving component will cause the position of the sliding plate 9 to move. When the sliding plate 9 moves, the guiding component will guide the sliding plate 9 to move smoothly. After the sliding plate 9 moves, it will cause the push plate 12 to move. When the push plate 12 moves, it will push the position of the substrate to be adjusted, thereby adjusting the position of the LED lamp beads, facilitating the alignment adjustment of the position of the LED lamp beads to be coated and encapsulated, and facilitating the glue application component 6 to adjust the LED lamp beads for glue application and encapsulation.

[0023] Please refer to Figure 2 , The guiding component includes a guiding groove 10 and a guiding plate 11. The guiding grooves 10 are symmetrically arranged inside the sliding plate 9. The guiding plate 11 passes through the inside of the guiding groove 10, and one end of the guiding plate 11 is fixedly connected to the inner wall of the square groove 8. When the sliding plate 9 moves, it will drive the guiding groove 10 to slide on the guiding plate 11, thereby guiding the sliding plate 9 to move smoothly.

[0024] Please refer to Figure 2 , The driving component includes a threaded cylinder 13, a threaded rod 14, and a micro motor 15. The micro motor 15 is fixedly installed inside the square groove 8. One end of the threaded rod 14 is fixedly connected to the output end of the micro motor 15. The threaded cylinder 13 is fixedly installed inside the sliding plate 9, and the threaded rod 14 is threadedly connected to the threaded cylinder 13. When the driving component works, operating the micro motor 15 will drive the threaded rod 14 to rotate. The rotation of the threaded rod 14 will cause the position of the threaded cylinder 13 to move, thereby driving the sliding plate 9 to move synchronously.

[0025] Please refer to Figure 1 , A wind box 16 is fixedly installed on the top of the square groove 8. The square groove 8 provides an installation space for the wind box 16.

[0026] Please refer to Figure 3 , a filter screen 17 is fixedly installed on the top of the bellows 16, and a blower 18 is fixedly installed inside the bellows 16. When the outside air flows into the inside of the bellows 16, the filter screen 17 will filter and purify the impurities carried in the air.

[0027] Please refer to Figure 1 and Figure 4 , a flow channel 19 is inlaid inside the square plate 7, and the output end of the blower 18 is communicated with the flow channel 19. The flow channel 19 is provided with jet heads 20 in an array. When the blower 18 works to extract the air inside the bellows 16, the extracted air enters the inside of the flow channel 19, and then the wind force flows to the surface of the LED lamp beads through the jet heads 20, so that the LED lamp beads can be cleaned, avoiding dust and impurities from adsorbing on the surface of the LED lamp beads and affecting the encapsulation effect.

[0028] Working principle: First, when using the LED lamp bead encapsulation processing device with accurate alignment to encapsulate the LED lamp beads, after the LED lamp beads and the circuit board are welded, the circuit board to be encapsulated is placed above the support plate 3, and then the blower 18 works to extract the air inside the bellows 16. The extracted air enters the inside of the flow channel 19, and then the wind force flows to the surface of the LED lamp beads through the jet heads 20, so that the LED lamp beads can be cleaned. The glue application assembly 6 works to apply glue to the LED lamp beads on the circuit board, accurately applying glue or encapsulation material on the substrate of the LED lamp beads to ensure a uniform glue layer is formed on the surface of the LED lamp beads, thereby realizing the encapsulation processing of the LED lamp beads. Before applying glue, when adjusting the alignment of the position of the LED lamp beads and the glue application assembly 6, the micro motor 15 works to drive the threaded rod 14 to rotate. The rotation of the threaded rod 14 will cause the position of the threaded barrel 13 to move, and then drive the sliding plate 9 to move synchronously. When the sliding plate 9 moves, the guiding assembly will guide the sliding plate 9 to move smoothly. After the sliding plate 9 moves, the push plate 12 will move. When the push plate 12 moves, it will push the position of the substrate to be adjusted, and then adjust the position of the LED lamp beads, facilitating the alignment adjustment of the position of the LED lamp beads to be glued and encapsulated, and facilitating the glue application assembly 6 to adjust the LED lamp beads for glue application and encapsulation.

[0029] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. An LED lamp bead packaging and processing device with precise alignment, comprising a workbench (1), characterized in that: A support frame (4) is fixedly installed on the workbench (1), a slide rail (5) is fixedly installed on the support frame (4), a glue application assembly (6) is installed on the slide rail (5), a guide rail (2) is fixedly installed on the top of the workbench (1), a support plate (3) is installed on the guide rail (2), square plates (7) are symmetrically installed on the support plate (3), a square groove (8) is fixedly installed on the square plate (7), a driving assembly is arranged inside the square groove (8), a sliding plate (9) is penetrated inside the square groove (8), and the driving assembly is connected with the sliding plate (9). One end of the sliding plate (9) is fixedly connected with a push plate (12), and a guiding assembly is arranged inside the square groove (8).

2. The LED lamp bead encapsulation processing device with precise alignment according to claim 1, characterized in that: The guiding assembly includes a guiding groove (10) and a guiding plate (11). The guiding grooves (10) are symmetrically arranged inside the sliding plate (9). The guiding plate (11) is penetrated inside the guiding groove (10), and one end of the guiding plate (11) is fixedly connected with the inner wall of the square groove (8).

3. The LED lamp bead packaging and processing device with precise alignment according to claim 1, characterized in that: The driving assembly includes a threaded cylinder (13), a threaded rod (14) and a micro motor (15). The micro motor (15) is fixedly installed inside the square groove (8). One end of the threaded rod (14) is fixedly connected with the output end of the micro motor (15). The threaded cylinder (13) is fixedly installed inside the sliding plate (9), and the threaded rod (14) is in threaded connection with the threaded cylinder (13).

4. A device for encapsulating and processing LED lamp beads with precise alignment according to claim 2, characterized in that: An air box (16) is fixedly installed on the top of the square groove (8).

5. The LED lamp bead encapsulation processing device with precise alignment according to claim 4, characterized in that: A filter screen (17) is fixedly installed on the top of the air box (16), and a fan (18) is fixedly installed inside the air box (16).

6. The LED lamp bead packaging processing device with precise alignment according to claim 1, characterized in that: A flow groove (19) is inlaid inside the square plate (7), and the output end of the fan (18) is communicated with the flow groove (19).

7. A device for packaging and processing LED lamp beads with precise alignment as claimed in claim 6, characterized in that: Jet heads (20) are arranged in an array on the flow groove (19).

Images