Thickness measuring sensor
By forming the waveguide structure integrally on the sensor base and setting an isolation gap, the problems of unstable coupling and complex assembly of the sensor in extreme environments are solved, and efficient and stable corrosion thickness monitoring of metal equipment is achieved.
Patent Information
- Application Number
- CN202421483171.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-06-26
AI Technical Summary
The coupling performance of the prior art ultrasonic thickness measurement sensor is unstable in environments such as high temperature, low temperature, humidity, condensation and icing, resulting in a decrease in measurement accuracy or a fall off of the sensor. Moreover, the assembly of the hard-coupled sensors is complex and costly, making it difficult to ensure that the waveguide rod or waveguide plate is on the same plane.
The integrated molded base is equipped with a transmitting and receiving waveguide structure, and the isolation gap is processed therebetween to ensure that the waveguide structure is on the same plane as the contact surface of the pipe or container. At the same time, the measurement range and coupling degree are adjusted through the beveled surface and the isolation gap, reducing crosstalk, and using a sealed installation cavity to protect the internal electronic components.
Improves the success rate of ultrasonic coupling, simplifies sensor installation, reduces costs, ensures measurement stability and accuracy, and enhances anti-interference performance.
Smart Images
Figure CN223091257U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of sensors, and in particular, to a thickness measurement sensor. Background Art
[0002] In petroleum, chemical, and power production, metal corrosion is a serious hazard. The corrosion of metal equipment poses a great safety hazard to production. The economic losses caused by corrosion in each industrial country each year account for about 1%-4% of the gross national product. Based on this, it is urgent to monitor the corrosion thickness of refining equipment, pipelines, containers, etc.
[0003] In current technologies, it is common to use piezoelectric ultrasound to measure the thickness of pipelines and evaluate the corrosion situation based on the thickness loss. This technology has the advantages of non-destructive testing and high measurement accuracy. This technology requires coupling ultrasound to the outer surface of the pipeline or container. Therefore, a coupling agent is usually required. For example, epoxy resin is used to bond the probe to the pipeline or container to achieve long-term stable detection. This coupling agent is not suitable for measuring at high temperatures for a long time. In environments such as high temperature, low temperature, humidity, condensation, and icing for a long time, the coupling performance will fail or the sensor will completely fall off. Or a general coupling agent such as glycerol is used. This coupling agent has fluidity, and the unstable thickness of the coupling agent leads to a decrease in measurement accuracy. It is not suitable for long-term detection and can only be measured for a short time. Moreover, there is a problem of inconsistent coupling agent thickness between multiple measurements, resulting in inconsistent measurements.
[0004] Another type of sensor with a hard coupling form is composed of a pair of waveguide rods or waveguide sheets. The two waveguide rods or waveguide sheets are respectively used for transmitting and receiving ultrasound. This can be used for high-temperature measurement for a long time. However, for this assembled sensor, the assembly is complex and the cost is high. Due to assembly or processing errors, it is difficult to control the two waveguide rods or waveguide sheets in the same plane, resulting in difficult installation. It is possible that one waveguide rod or waveguide sheet is in close contact with the surface of the pipeline or container, while the other waveguide rod or waveguide sheet is not pressed tightly against the surface of the pipeline or container, resulting in ultrasonic coupling failure. Summary of the Utility Model
[0005] In order to improve the problem of measurement effect, this application provides a thickness measurement sensor.
[0006] The thickness measurement sensor provided by this application adopts the following technical solution:
[0007] A thickness measurement sensor includes an integrally formed base, a transmitting piezoelectric chip module, and a receiving piezoelectric chip module. There are two ultrasonic waveguide structures on the integrally formed base, and an isolation gap is processed between the two waveguide structures. The isolation gap makes the time for ultrasound to propagate from the transmitting piezoelectric chip through the integrally formed base to reach the receiving piezoelectric chip greater than the echo time for thickness measurement.
[0008] By adopting the above technical solution, by integrally forming two waveguide structures (a transmitting waveguide structure and a receiving waveguide structure) on the same base, it can be ensured that the contact surfaces of the transmitting and receiving waveguide structures with the pipeline or container are on the same plane, the sensor installation is simple, and the success rate of ultrasonic coupling is greatly improved. The sensor assembly is also simple, and the number of structural parts of the entire sensor is greatly reduced, saving costs. However, when the two waveguide structures (the transmitting waveguide structure and the receiving waveguide structure) are integrally formed on the same base, the crosstalk from the transmitting to the receiving through the integrally formed base structure to reach the receiving piezoelectric element is very large, causing difficulties in measurement. Therefore, an isolation gap is processed between the two waveguide structures (the transmitting waveguide structure and the receiving waveguide structure), so that the time for ultrasonic waves to propagate from the transmitting piezoelectric element through the integrally formed base structure to reach the receiving piezoelectric element is greater than the echo time for thickness measurement. The echo time for thickness measurement refers to: the time for the ultrasonic waves emitted by the transmitting piezoelectric element to propagate through the waveguide structure at the installation position of the transmitting piezoelectric element to the surface of the pipeline or container, enter the pipeline or container wall, be reflected back from the inner surface of the pipeline or container to the surface of the pipeline or container, and be coupled to the waveguide structure at the installation position of the receiving piezoelectric element and received by the receiving piezoelectric element. In this way, it can be ensured that after the echo of the ultrasonic wave is received, the crosstalk from the transmitting to the receiving through the integrally formed base structure to reach the receiving piezoelectric element will arrive, ensuring the stability of the measurement.
[0009] Optionally, a groove structure corresponds to the top of the waveguide structure, and a transmitting piezoelectric element module and a receiving piezoelectric element module are installed in the groove structure. The bottom of the waveguide structure is composed of an inclined plane and a plane in contact with the pipeline or container. The inclined plane includes an inclined plane or an arc surface; ultrasonic waves are excited from the transmitting piezoelectric element and propagate to the plane at the bottom of the waveguide structure, and are coupled from the plane to the inside of the pipeline or container wall; the ultrasonic reflection echo from the inner surface of the pipeline or container wall propagates to the plane of the waveguide structure where the receiving piezoelectric element is located and is coupled and propagated to the receiving piezoelectric element.
[0010] The inclined plane of the waveguide structure is used to adjust the width of the plane. The width of the plane and the size of the isolation gap between the two planes are used to adjust the measurement thickness range. At the same time, the inclined plane can reduce the contact area with the pipeline or container, increase the contact surface pressure, and improve the ultrasonic coupling degree.
[0011] By adopting the above technical solution, the setting of the groove structure facilitates the installation of the piezoelectric element module.
[0012] Optionally, the contact surfaces of the two waveguide structures on the base in contact with the pipeline or container are on the same plane, and the two waveguide structures on the base and the pipeline or container are hard-coupled ultrasonically through a pressing method.
[0013] Optionally, there are two through holes on the integrally formed base. The through holes are arranged on the side opposite to the isolation gap between the two waveguide structures. The through holes reduce the coupling between transmission and reception, extend the coupling path between transmission and reception, and reduce the coupling intensity between transmission and reception.
[0014] Optionally, there are two mounting ears on the base for cooperating with screws to mount the base to a pipe or a container.
[0015] Optionally, the sensor further includes a power supply and a main circuit board. The power supply is electrically connected to the receiving piezoelectric element module, the transmitting piezoelectric element module, and the main circuit board.
[0016] Optionally, a mounting housing is connected to the base. The mounting housing is hermetically connected to the base to form a sealed mounting cavity. The power supply, the main circuit board, the receiving piezoelectric element module, and the transmitting piezoelectric element module are all located in the mounting cavity.
[0017] By adopting the above technical solution, the sealed mounting cavity can ensure that it is not affected by the external environment during use and protect the internal electronic components.
[0018] Optionally, the mounting housing includes an upper housing and a lower housing. A sealing ring is arranged between the upper housing and the lower housing. The upper housing and the lower housing are connected by bolts.
[0019] By adopting the above technical solution, by dividing the mounting housing into an upper housing and a lower housing, it is convenient to install the internal electronic components.
[0020] Optionally, a sealing component is arranged between the mounting housing and the base. The sealing component closes the through holes.
[0021] Optionally, both the receiving piezoelectric element module and the transmitting piezoelectric element module include piezoelectric elements, a sub-circuit board, and a temperature sensor. The piezoelectric elements and the temperature sensor are both soldered on the sub-circuit board. The sub-circuit board is electrically connected to the main circuit board. The piezoelectric elements are adhesively bonded to the waveguide structure. The waveguide structure is adhesively bonded. The adhesive includes resin glue, quick-drying glue, etc. that can couple ultrasonic waves.
[0022] By adopting the above technical solution, the sub-circuit board plays a transitional role for connecting the piezoelectric elements, the temperature sensor to the main circuit board. Assembling the piezoelectric elements, the sub-circuit board, and the temperature sensor into a piezoelectric element module can be quickly assembled. The temperature sensor is used to monitor the temperature of the waveguide structure, and the temperature parameter is used for the compensation calculation of the ultrasonic wave velocity.
[0023] Optionally, a convex ring is formed on the groove structure, and a corresponding annular groove is formed in the mounting housing. There is a silica gel ring between the convex ring and the annular groove.
[0024] By adopting the above technical solution, the groove structure between the mounting housing and the base can be better sealed in this way.
[0025] In summary, the present application includes at least one of the following beneficial technical effects:
[0026] 1. By integrally forming two waveguide structures (a transmitting waveguide structure and a receiving waveguide structure) on the same base, it can ensure that the contact surfaces of the transmitting and receiving waveguide structures with the pipeline or container are on the same plane, guaranteeing the product quality and the success rate of installation on the pipeline or container, improving the installation efficiency, and enabling stable and accurate measurement;
[0027] 2. The isolation gap between the two waveguide structures extends the propagation time of crosstalk between transmission and reception, so that the echo of thickness measurement is not interfered by crosstalk, ensuring stable measurement and improving the anti-interference performance;
[0028] 3. The number of product components is reduced, the assembly efficiency is improved, local parts are convenient to replace, and the cost is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present application;
[0030] Figure 2 is Figure 1 an exploded view of
[0031] Figure 3 is a structural diagram of the base;
[0032] Figure 4 is Figure 1 a half-section perspective view of
[0033] Figure 5 is a top view of the base;
[0034] Figure 6 is a structural diagram of the waveguide structure;
[0035] Figure 7 shows a pipeline installation method of the sensor;
[0036] Figure 8 shows another pipeline installation method of the sensor.
[0037] Reference numerals: 1, base; 11, groove; 12, wave guide structure; 121, plane; 122, inclined cutting surface; 13, isolation gap; 14, linear through hole; 15, groove structure; 16, convex ring; 17, mounting ear; 2, mounting housing; 21, upper housing; 22, lower housing; 221, annular groove; 231, long bolt; 232, short bolt; 3, power supply; 4, main circuit board; 51, transmitting piezoelectric element module; 52, receiving piezoelectric element module; 6, silica gel ring; 7, gasket; 8, sealing ring; 9, screw; 91, clamp; 10, pipe. Detailed implementation manners
[0038] The following further describes the present application in conjunction with Figure 1 -8 in further detail.
[0039] An embodiment of the present application discloses a thickness measurement sensor, including a base 1, a mounting housing 2, a power supply 3, a main circuit board 4, a transmitting piezoelectric element module 51, and a receiving piezoelectric element module 52. The power supply 3 is electrically connected to the transmitting piezoelectric element module 51, the receiving piezoelectric element module 52, and the main circuit board 4. The mounting housing 2 is hermetically connected to the base 1 to form a sealed mounting cavity, thereby sealing the power supply 3, the main circuit board 4, the transmitting piezoelectric element module 51, and the receiving piezoelectric element module 52 in the mounting cavity to ensure that they are not affected by moisture.
[0040] The mounting housing 2 includes an upper housing 21 and a lower housing 22. A sealing ring 8 is provided between the upper housing 21 and the lower housing 22. The upper housing 21 and the lower housing 22 are connected by bolts, and the bolts used are long bolts 231.
[0041] The base is formed by machining a material that conducts ultrasonic waves such as a metal material. The metal material includes but is not limited to stainless steel, aluminum alloy, carbon steel, copper, and alloy steel. A groove 11 is formed at the center of the upper surface of the base 1. The bottom of the lower housing 22 is located in the groove 11, and the part of the lower housing 22 inserted into the groove 11 matches the shape and size of the groove 11. The base 1 and the lower housing 22 are connected by short bolts 232.
[0042] Two wave guide structures 12 are integrally formed on the lower surface of the base 1. The contact surfaces of the two wave guide structures 12 for contacting the pipe 10 are on the same plane, and the contact surface is the plane 121. An inclined cutting surface 122 is further provided at the bottom of each wave guide structure 12, and the inclined cutting surface 122 is adjacent to the plane 121. The inclined cutting surface includes an inclined plane or an arc surface. An isolation gap 9 is formed between the two wave guide structures 12, and the isolation gap 9 is such that the time for ultrasonic waves to reach the receiving piezoelectric element from the transmitting piezoelectric element is greater than the echo time for thickness measurement. The inclined cutting surface 122 is used to adjust the width of the plane 121. The width of the plane 121 and the size of the isolation gap 9 between the two planes 121 are used to adjust the measurement range of the thickness of the pipe 10. Specifically, such as Figure 6As shown, the main energy intensity of ultrasonic coupling is at the center of plane 121. Therefore, the included angle between transmission and reception determines the measurement range.
[0043] Specifically, the isolation gap 9 extends and complicates the path for ultrasonic waves to propagate from the transmitting piezoelectric sheet through the integrally formed base structure to the receiving piezoelectric sheet, making the propagation time longer than the echo time of the inner surface of the pipeline 10. The isolation gap 9 is located at the proximal ends of the two waveguide structures 12. The isolation gap 9 is an I-shaped through hole opened on the base 1. Through holes are opened at the distal ends of the two waveguide structures 12 away from each other. The through holes are linear through holes 14. The setting of the through holes further extends the coupling path between transmission and reception and reduces the coupling intensity between transmission and reception.
[0044] A sealing component is provided between the mounting housing 2 and the base 1. The sealing component seals the through holes and the isolation gap.
[0045] Mounting ears 17 are fixed on both sides of the base 1. Each mounting ear 17 has a mounting hole. When the sensor is installed, in one way as shown in Fig. 7, the screw 9 can be welded to the pipeline 10. The screw 9 passes through the mounting hole and is connected to a nut, thereby fixing the base 1 to the pipeline 10. And at this time, hard-coupled ultrasound is realized between the two waveguide structures 12 and the pipeline 10 by a pressing method.
[0046] In another way as shown in Fig. 8, first, two semi-circular clamps 91 are installed on the pipeline 10 through bolts and nuts. Two screws 9 are integrally formed on one of the semi-circular clamps 91. Then the screw 9 passes through the mounting hole and is connected to a nut to fix the base 1 to the pipeline 10.
[0047] Two groove structures 15 are opened at the bottom of the groove 11. The transmitting piezoelectric sheet module 51 and the receiving piezoelectric sheet module 52 are respectively located in the two groove structures 15. The transmitting piezoelectric sheet module 51 and the receiving piezoelectric sheet module 52 respectively correspond to one waveguide structure 12. A convex ring 16 is formed on the groove structure 15, and a ring groove 221 corresponding to the convex ring 16 is formed inside the bottom of the lower housing 22. A silica gel ring 6 is provided between the convex ring 16 and the ring groove 221. The sealing component includes a sealing gasket 7. A notch is opened at the center of the sealing gasket 7. The notch is used to accommodate the two convex rings 16 and the space between the two convex rings 16. The short bolt 232 passes through the lower housing 22, the sealing gasket 7 and is threadedly connected to the base 1. Wherein, two round holes are also provided at the bottom of the lower housing 22. The round holes are located in the ring groove 221. The round holes are opposite to the groove structures 15 and are used for wire connection between the piezoelectric sheet module 5, the main circuit board 4 and the power supply 3.
[0048] The transmitting piezoelectric sheet module 51 and the receiving piezoelectric sheet module 52 are both composite modules, each composed of a piezoelectric sheet, a sub-circuit board, and a temperature sensor. The piezoelectric sheet and the temperature sensor are both soldered onto the sub-circuit board, and the sub-circuit board is electrically connected to the main circuit board 4. The piezoelectric sheet is attached to the waveguide structure 12. Among them, the piezoelectric sheet of the transmitting piezoelectric sheet module 51 is the transmitting piezoelectric sheet, and the piezoelectric sheet of the receiving piezoelectric sheet module 52 is the receiving piezoelectric sheet. The main circuit board 4 is provided with a wireless transmission module, which can transmit the sensor data to the remote monitoring platform. The main circuit board 4 can also perform wired transmission through a data cable.
[0049] The above are all the preferred embodiments of this application. It does not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.
Claims
1. A thickness measurement sensor, comprising an integrally formed base, a transmitting piezoelectric sheet module and a receiving piezoelectric sheet module, characterized in that: There are two ultrasonic guided wave structures on the integrally formed base, and an isolation gap is machined between the two guided wave structures. The isolation gap makes the time for ultrasonic waves to propagate from the transmitting piezoelectric element through the integrally formed base to the receiving piezoelectric element greater than the echo time for thickness measurement.
2. The thickness measurement sensor according to claim 1, characterized in that: There is a groove structure corresponding to the top of the guided wave structure. The transmitting piezoelectric element module and the receiving piezoelectric element module are installed in the groove structure. The bottom of the guided wave structure is composed of an inclined plane and a plane in contact with the pipeline or container. The inclined plane includes an inclined plane or an arc surface; the echo time for thickness measurement is that ultrasonic waves are excited from the transmitting piezoelectric element and propagate to the plane at the bottom of the guided wave structure, and are coupled from the plane to the inside of the pipeline or container wall; the ultrasonic reflection echo from the inner surface of the pipeline or container wall propagates to the plane of the guided wave structure where the receiving piezoelectric element is located for coupling and then propagates to the receiving piezoelectric element; the inclined plane of the guided wave structure is used to adjust the width of the plane, and the width of the plane and the size of the isolation gap between the two planes are used to adjust the measurement thickness range. At the same time, the inclined plane can reduce the contact area with the pipeline or container, increase the contact surface pressure, and improve the ultrasonic coupling degree.
3. The thickness measurement sensor according to claim 1, wherein: The contact surfaces of the two guided wave structures on the base in contact with the pipeline or container are on the same plane, and hard-coupled ultrasound is achieved between the two guided wave structures and the pipeline or container through a pressing method.
4. A thickness measurement sensor according to claim 1, characterized in that: There are two through holes on the integrally formed base, and the two through holes are arranged on the side opposite to the isolation gap between the two guided wave structures. The through holes reduce the coupling between the transmission and reception, extend the coupling path between the transmission and reception, and reduce the coupling intensity between the transmission and reception.
5. A thickness measurement sensor according to claim 1, characterized in that: There are two mounting ears on the base, which are used to cooperate with screws to mount the base to the pipeline or container.
6. The thickness measurement sensor according to claim 4, characterized in that: The sensor further includes a power supply and a main circuit board. The power supply is electrically connected to the receiving piezoelectric element module, the transmitting piezoelectric element module, and the main circuit board.
7. The thickness measurement sensor according to claim 6, wherein: An installation housing is connected to the base. The installation housing is hermetically connected to the base to form a sealed installation cavity. The power supply, the main circuit board, the receiving piezoelectric element module, and the transmitting piezoelectric element module are all located in the installation cavity.
8. The thickness measurement sensor according to claim 7, wherein: The installation housing includes an upper housing and a lower housing. A sealing ring is arranged between the upper housing and the lower housing, and the upper housing and the lower housing are connected by bolts.
9. A thickness measuring sensor according to claim 7, characterized in that: A sealing component is arranged between the installation housing and the base, and the sealing component seals the through holes.
10. A thickness measuring sensor according to claim 6, characterized in that: Both the receiving piezoelectric element module and the transmitting piezoelectric element module include a piezoelectric element, a sub-circuit board, and a temperature sensor. The piezoelectric element and the temperature sensor are both soldered on the sub-circuit board. The sub-circuit board is electrically connected to the main circuit board, and the piezoelectric element is bonded to the guided wave structure using an adhesive.