Sensor pixel unit, signal processing circuit and electronic equipment

Abstract

The embodiment of the utility model discloses a sensor pixel unit, a signal processing circuit and electronic equipment, and the image sensor pixel unit comprises a photodiode and a variable resistance type memory. One end of the photodiode is in signal connection with a power supply, the other end of the photodiode serves as an output end and is connected with the variable resistance type memory, and the photodiode is used for receiving an optical signal within exposure time to generate a voltage signal; and one end of the variable resistance type memory is connected with the photodiode, and the other end of the variable resistance type memory is grounded and is used for controlling an output end to output a voltage signal or resetting the photodiode. The pixel unit provided by the embodiment of the utility model is simple in structure, the variable resistance type memory is arranged in the pixel unit, the area of the pixel unit cannot be increased, the area of the pixel unit is smaller than that of an existing pixel unit, and large-scale integration is facilitated while the signal output rate is guaranteed.

Description

Technical Field

[0001] The present disclosure relates to the technical field of image sensors, and in particular, to a sensor pixel unit, a signal processing circuit, and an electronic device. Background Art

[0002] Image sensors have been widely used in digital cameras, mobile phones, medical, automotive, drones, and machine recognition fields. In particular, the rapid development of complementary metal oxide semiconductor (CMOS) image sensor technology has led to higher requirements for the output image quality of image sensors. CMOS image sensors can be divided into two categories according to the signal acquisition method: one is to set the exposure time of pixels and then measure the change in voltage signals; the second is to set the change in voltage of pixels and then measure the exposure time. Such an image sensor is called a pulse train image sensor. The pixel units in existing image sensors usually have a large occupied area due to the large number of components included, which is not conducive to chip integration. Summary of the Utility Model

[0003] According to one aspect of the embodiments of the present disclosure, a sensor pixel unit is provided, including: a photodiode and a variable resistive memory;

[0004] One end of the photodiode is connected to a power supply signal, and the other end is used as an output end and is connected to the variable resistive memory. The photodiode is configured to receive a light signal within an exposure time to generate a voltage signal;

[0005] One end of the variable resistive memory is connected to the photodiode, and the other end is grounded.

[0006] Optionally, when the variable resistive memory is in a high impedance state, the variable resistive memory disconnects the photodiode from the ground; when the variable resistive memory is in a low impedance state, the variable resistive memory grounds the photodiode.

[0007] Optionally, it further includes: a counter;

[0008] The input end of the counter is connected to the output end of the photodiode, and the output end of the counter outputs a coded signal.

[0009] Optionally, the counter is configured to receive an externally input reset signal and perform a reset process on the counting result accumulated by the counter according to the reset signal.

[0010] Optionally, it further includes: a readout switch;

[0011] One end of the readout switch is connected to the output end of the counter, and is turned on or off according to the received control signal. When the readout switch is turned on, the encoded signal obtained by the counter is output through the other end of the readout switch.

[0012] According to another aspect of the embodiments of the present disclosure, a signal processing circuit is provided, including: a pixel array composed of sensor pixel units as described in any one of the above embodiments with n rows and m columns, a row controller, and a serial-to-parallel conversion and interface circuit; where n and m are integers greater than 1 respectively.

[0013] The pixel array is configured to process the received optical signal to obtain an encoded signal, and output the encoded signal to the serial-to-parallel conversion and interface circuit according to the control of the row controller.

[0014] The row controller is configured to control the sensor pixel units in the pixel array row by row.

[0015] The serial-to-parallel conversion and interface circuit is configured to receive the encoded signal output by the pixel array column by column.

[0016] Optionally, the row controller is configured to output a reset signal and a control signal row by row, and sequentially control the counters in one row of sensor pixel units in the pixel array to perform reset through the reset signal, and control the readout switches in one row of sensor pixel units in the pixel array to be turned on through the control signal.

[0017] Optionally, it further includes: a first chip and a second chip stacked up and down.

[0018] The photodiode and the variable resistor type memory in the pixel unit are integrated in the first chip.

[0019] The counter and the readout switch in the pixel unit, as well as the row controller and the serial-to-parallel conversion and interface circuit, are integrated in the second chip, and signal connection between the first chip and the second chip is performed at the node of the output end of the photodiode of each pixel unit.

[0020] According to yet another aspect of the embodiments of the present disclosure, an electronic device is provided, including: a processor, and a memory communicatively connected to the processor, and further including the sensor pixel unit as described in any one of the above embodiments or the signal processing circuit as described in any one of the above embodiments.

[0021] The memory stores computer execution instructions.

[0022] The processor executes the computer execution instructions stored in the memory to control the sensor pixel unit or the signal processing circuit.

[0023] Optionally, the electronic device is incorporated as any one of the following: an image data acquisition device, an audio / video player, a navigation device, an entertainment device, a communication device, a roadside traffic facility, a device in a motor vehicle, an industrial inspection device, a flight device, a medical device, or a security device.

[0024] Based on the image sensor pixel unit, signal processing circuit, and electronic device provided in the above embodiments of the present disclosure, it includes: a photodiode and a variable resistive memory; one end of the photodiode is connected to a power signal, and the other end serves as an output end and is connected to the variable resistive memory. The photodiode is configured to receive a light signal during an exposure duration to generate a voltage signal; one end of the variable resistive memory is connected to the photodiode, and the other end is grounded, and is configured to control the output end to output a voltage signal or reset the photodiode. The embodiments of the present disclosure determine whether to output a voltage signal based on the variable resistive memory and implement the reset of the photodiode, replacing the comparator in the prior art; since the variable resistive memory has a simple structure, the corresponding pixel unit has a simple structure. Setting the variable resistive memory in the pixel unit does not increase the area of the pixel unit, and the area of the pixel unit is relatively smaller than that of the existing pixel units, making it easy to integrate on a large scale while ensuring the signal output rate.

[0025] The technical solutions of the present disclosure will be further described in detail below with reference to the drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings forming a part of the specification depict embodiments of the present disclosure and, together with the description, are used to explain the principles of the present disclosure.

[0027] Referring to the drawings, the present disclosure can be more clearly understood from the following detailed description, where:

[0028] Figure 1 is a schematic circuit structure diagram of a sensor pixel unit provided by an exemplary embodiment of the present disclosure;

[0029] Figure 2 shows a schematic diagram of the basic electrical characteristics of the variable resistive memory;

[0030] Figure 3 is a schematic diagram of the photoelectric response characteristics of a sensor pixel unit provided by an exemplary embodiment of the present disclosure;

[0031] Figure 4 is a schematic circuit structure diagram of an image sensor pixel unit provided by another exemplary embodiment of the present disclosure;

[0032] Figure 5 is a schematic circuit structure diagram of a signal processing circuit provided by an exemplary embodiment of the present disclosure;

[0033] Figure 6 The block diagram of an electronic device according to an embodiment of the present disclosure is illustrated. Detailed implementation manners

[0034] Hereinafter, exemplary embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments of the present disclosure. It should be understood that the present disclosure is not limited by the exemplary embodiments described herein.

[0035] It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0036] Those skilled in the art can understand that the terms such as "first" and "second" in the embodiments of the present disclosure are only used to distinguish different steps, devices, or modules, etc., and neither represent any specific technical meaning nor indicate an inevitable logical order between them.

[0037] It should also be understood that in the embodiments of the present disclosure, "a plurality of" may refer to two or more, and "at least one" may refer to one, two, or more.

[0038] It should also be understood that for any component, data, or structure mentioned in the embodiments of the present disclosure, unless otherwise clearly defined or given a contrary indication in the context, it can generally be understood as one or more.

[0039] In addition, the term "and / or" in the present disclosure is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in the present disclosure generally represents an "or" relationship between the associated objects before and after. The data referred to in the present disclosure may include unstructured data such as text, images, videos, etc., or may also be structured data.

[0040] It should also be understood that the present disclosure emphasizes the differences between the various embodiments. The same or similar parts can be referred to each other. For the sake of brevity, they will not be described in detail one by one.

[0041] Meanwhile, it should be understood that for the sake of description, the dimensions of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0042] The following description of at least one exemplary embodiment is actually only illustrative and in no way a limitation on the present disclosure and its application or use.

[0043] Known technologies, methods, and devices that are well - known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate circumstances, the said technologies, methods, and devices should be regarded as part of the specification.

[0044] It should be noted that like reference numerals and letters refer to like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0045] In the process of implementing the present disclosure, the inventors found that in a pulse - sequence - type image sensor during continuous exposure, each pixel unit outputs a pulse signal when the optoelectronic signal accumulates to a specific threshold, and resets the pixel unit to re - accumulate the optoelectronic signal. The light intensity at each pixel unit can be expressed by the frequency of its emitted pulses. Usually, inside or outside the pulse pixel, circuit structures such as comparators are needed to determine whether the signal reaches the threshold, so as to decide whether to output a pulse. Compared with the pixel structure, the circuit structure of the comparator is more complex. If the comparator is placed inside each pixel, it will increase the pixel area and the difficulty of large - scale integration; while if the comparator is placed outside the pixel, it will reduce the signal output rate. Therefore, it is difficult for pulse - type pixels based on traditional comparator circuits to simultaneously achieve ultra - large - scale integration and ultra - high speed.

[0046] In view of the above problems, the inventors propose a pixel unit of an image sensor with a novel structure.

[0047] Figure 1 It is a schematic diagram of the circuit structure of a sensor pixel unit provided by an exemplary embodiment of the present disclosure. As Figure 1 shown, the image sensor pixel unit (hereinafter referred to as the pixel unit) provided in this embodiment includes: a photodiode 110 and a variable - resistor - type memory 120;

[0048] One end of the photodiode 110 is connected to the power supply signal Vdd, and the other end is used as an output end and is connected to the variable - resistor - type memory 120. The photodiode 110 is used to receive optical signals during the exposure duration to generate voltage signals.

[0049] A photodiode is a light detector that can convert light into current or voltage signals according to the usage mode. In this embodiment, it is converted into a voltage signal. The die often uses a PN - junction with photosensitive characteristics, which is very sensitive to light changes, has unidirectional conductivity, and its electrical characteristics will change when the light intensity is different. Therefore, the light intensity can be used to change the voltage or current in the circuit.

[0050] One end of the variable resistor memory 120 is connected to the photodiode 110, and the other end of the variable resistor memory 120 is grounded to GND, which is used to control the output voltage signal at the output end or perform a reset on the photodiode 110.

[0051] In this embodiment, the electrical characteristics of the variable resistor memory itself are utilized to achieve a high resistance state when the voltage signal obtained by the photodiode 110 accumulates to a first preset voltage value. At this time, the photodiode is not conductive to the ground terminal GND, and the voltage signal is output through the output end; when the voltage signal drops to a second preset voltage value, a low resistance state is presented. At this time, the photodiode is grounded to GND to achieve the reset of the photodiode.

[0052] The sensor pixel unit provided by the above embodiment of the present disclosure includes: a photodiode and a variable resistor memory; one end of the photodiode is connected to a power signal, and the other end is used as an output end and is connected to the variable resistor memory. The photodiode is used to receive a light signal during an exposure time to generate a voltage signal; one end of the variable resistor memory is connected to the photodiode, and the other end is grounded, which is used to control the output voltage signal at the output end or perform a reset on the photodiode. The embodiment of the present disclosure determines whether to output a voltage signal based on the variable resistor memory and realizes the reset of the photodiode, replacing the comparator in the prior art; since the variable resistor memory has a simple structure, the corresponding pixel unit has a simple structure. Setting the variable resistor memory in the pixel unit will not increase the area of the pixel unit, and the area of the pixel unit is relatively smaller than that of the existing pixel unit, which is easy to integrate on a large scale while ensuring the signal output rate.

[0053] Figure 2 The basic electrical characteristics of the variable resistor memory are shown. Before the voltage across the variable resistor memory gradually increases from 0 to Vth (the first preset voltage value), the current passing through the variable resistor memory is small, and the variable resistor memory exhibits a high resistance state. When the voltage across the variable resistor memory exceeds Vth, the current passing through the variable resistor memory undergoes a sudden change, and the speed at which the current increases with the voltage becomes larger. At this time, the variable resistor memory exhibits a low resistance state. In the case of the low resistance state, the voltage across the variable resistor memory needs to be reduced to Vhold (the second preset voltage value), where Vhold < Vth, and the variable resistor memory will return to the high resistance state. This embodiment does not limit the implementation manner of the variable resistor memory. No matter what material and mechanism are used to implement a device with the above-mentioned resistance change electrical characteristics, it is within the protection scope of this patent.

[0054] Based on the above electrical characteristics, the variable resistive memory 120 provided in this embodiment receives a voltage signal. In response to the voltage signal rising to a first preset voltage value (Vth), the variable resistive memory 120 controls the output terminal to output the voltage signal; in response to the voltage signal decreasing from the first preset voltage value to a second preset voltage value (Vhold), the variable resistive memory 120 controls the photodiode 110 to perform a reset; the second preset voltage value is less than the first preset voltage value.

[0055] In this embodiment, whenever the voltage signal output by the photodiode reaches the first preset voltage value, the variable resistive memory becomes a high-resistance state, and the voltage signal output by the photodiode is output as the output signal; whenever the voltage signal output by the photodiode decreases to the second preset voltage value, the variable resistive memory becomes a low-resistance state, and at this time the photodiode is grounded to realize the reset of the photodiode. In an alternative example, Figure 3 shows the photoelectric response characteristics of the sensor pixel unit. As Figure 3 shown, when the pixel unit receives light, photo-generated charges are generated on the photodiode 110, and a voltage signal is accumulated. When the voltage signal Vs is less than the first preset voltage value Vth, since the variable resistive memory 120 is in a high-resistance state, the photo-generated charges are difficult to flow into the ground terminal. Therefore, they accumulate at the node connecting the photodiode 110 and the variable resistive memory 120, causing the voltage signal Vs to gradually rise. When the voltage signal Vs rises to the first preset voltage value Vth, the variable resistive memory 120 becomes a low-resistance state, and the accumulated photo-generated charges can quickly flow into the ground terminal, causing the voltage signal Vs to rapidly drop. When the voltage signal Vs drops to the second preset voltage value Vhold, the variable resistive memory 120 becomes a high-resistance state again. In this cycle, every time the voltage signal Vs reaches the first preset voltage value Vth, it is regarded as emitting a pulse signal.

[0056] Figure 3 From 0 to t1, the light intensity is strong, and the accumulation speed of photo-generated charges is fast. Therefore, the voltage signal Vs rises fast, and a total of 3 pulse signals are generated from 0 to t1; from t1 to 2*t1, the light intensity is weak, and the accumulation speed of photo-generated charges is slow. Therefore, the voltage signal Vs rises slowly, and a total of 2 pulse signals are generated from t1 to 2*t1. Thus, it can be seen that within a certain time period, the emission frequency of the pulse signal can reflect the light intensity of the optical signal received by the pixel unit. In order to perform encoding processing on the obtained pulse signal, on the basis of the pixel unit shown in Figure 1 it is also possible to add circuit structures for signal conversion (such as converting the pulse signal into an encoded signal, etc.) and / or signal output control. Optionally, the pixel unit provided in the embodiments of the present disclosure may further include: a counter.

[0057] Figure 4It is a schematic circuit diagram of an image sensor pixel unit provided by another exemplary embodiment of the present disclosure. As Figure 4 shown, the pixel unit 130 provided by the embodiment of the present disclosure;

[0058] The input end and the output end of the counter 130 are connected, and the output end of the counter 130 outputs an encoded signal.

[0059] In this embodiment, the counter is used to count the number of output voltage signals within a set time, and the light intensity can be represented by the encoded signal corresponding to the counting result, realizing the function of outputting an encoded signal by a simple circuit structure that can only be achieved by a complex existing circuit structure. Moreover, since the circuit structure is simple, the area of the pixel unit is reduced, and more pixel units can be integrated on the same-sized circuit board, or the size of the circuit board can be reduced, providing a great circuit foundation for circuit integration and sensor volume reduction, and being more convenient for industrial production.

[0060] The counter 130 provided in this embodiment is used to accumulate the number of times the voltage signal reaches the first preset voltage value to obtain a counting result, encode the counting result to obtain an encoded signal, and output it.

[0061] Optionally, the encoded signal in this embodiment can be a digital encoding such as binary encoding or Gray code; for example, encoding Figure 3 the 3 pulse signals obtained from 0 to t1 into binary encoding: 0011. The counter is used to accumulate the number of pulse signals generated within a period of time and encode them into an encoded signal for subsequent signal transmission and processing. In addition, to ensure accurate counting of the counter, the counter is reset every time a preset condition is reached (for example, a preset time period, such as Figure 3 shown from 0 to t1, from t1 to 2*t1, etc.).

[0062] Optionally, the counter 130 is further configured to receive an externally input reset signal and perform a reset process on the counting result according to the reset signal.

[0063] In this embodiment, the counter 130 is reset under the control of an externally input reset signal. The counter 130 only accumulates the number of pulse signals output between two reset signals each time. When the reset signal is sent at a preset time interval, the light intensity within each preset time period (the time period between two intervals) can be reflected by the encoded signal. The larger the result of the encoded signal, the stronger the reflected light intensity.

[0064] The pixel unit provided in this embodiment may further include a circuit structure for signal output control. For example, as Figure 4 shown, the pixel unit provided in this embodiment further includes: a readout switch 140;

[0065] One end of the readout switch 140 is connected to the output end of the counter, and it conducts or disconnects according to the received control signal. When the readout switch 140 conducts, the encoded signal obtained by the counter 130 is output through the other end of the readout switch 140.

[0066] When the readout switch 140 disconnects, the encoded signal of the counter 130 is not output.

[0067] In this embodiment, the encoded signal output by the counter 130 is output to the outside of the pixel unit through the readout switch 140, and the conduction or non - conduction of the readout switch 140 is controlled by the control signal given outside the pixel unit. Under external control, the pixel unit realizes reading and resetting the counter result in a fixed period, and the counting result (encoded signal) read in each period can reflect the light intensity of the optical signal collected by the pixel unit.

[0068] Figure 5 It is a schematic diagram of the circuit structure of the signal processing circuit provided by an exemplary embodiment of the present disclosure. As Figure 5 shown, the signal processing circuit provided by the embodiment of the present disclosure includes: a pixel array 510 composed of sensor pixel units 511 of n rows and m columns provided by any one of the above - mentioned embodiments, a row controller 520, and a serial - to - parallel conversion and interface circuit 530; where n and m are integers greater than 1 respectively;

[0069] The pixel array 510 is used to process the received optical signal to obtain an encoded signal, and output the encoded signal to the serial - to - parallel conversion and interface circuit 530 according to the control of the row controller 520.

[0070] The row controller 520 is used to control the sensor pixel units 511 in the pixel array row by row.

[0071] The serial - to - parallel conversion and interface circuit 530 is used to receive the encoded signals output by the pixel array 510 column by column.

[0072] In this embodiment, an overall architecture of an image sensor chip is implemented by array integration based on the pixel unit provided in the above embodiment. It includes pixel units 511 arranged in n rows and m columns, as well as a corresponding row controller 520 and a serial-to-parallel conversion and interface circuit 530. In the pixel array 510, the control signals and reset signals of the pixel units in the same row are the same, and are sequentially scanned row by row by the peripheral row controller 520; the encoding signals of the pixels in the same column are connected to the same column readout line. During the sequential row scanning, the encoding signals of the pixel units 511 in each row are sequentially read out on one column readout line. All the readout signals are sent to the serial-to-parallel conversion and interface circuit 530 to complete the output of the encoding signals. In this way, the image sensing function can be completed. There are various implementation methods for the involved row controller 520 and serial-to-parallel conversion and interface circuit 530 in the prior art, which will not be elaborated here.

[0073] Optionally, the row controller 520 is configured to output a reset signal and a control signal row by row, sequentially control a counter in a row of sensor pixel units 511 in the pixel array 510 to perform reset through the reset signal, and control a readout switch in a row of sensor pixel units 511 in the pixel array 510 to conduct through the control signal.

[0074] Since the components used in the pixel unit provided in the above embodiment of the present disclosure are few and the structure is simple, it is more convenient to provide a higher integration degree. The above Figure 5 When the signal processing circuit provided in the present disclosure is integrated into a chip, a chip stacking process can be adopted. Multiple chips stacked up and down are used to integrate the signal processing circuit. For example, a photodiode and a variable resistor memory in the pixel unit are fabricated on one chip (the first chip), and a counter and a readout switch in the pixel unit, as well as a row controller and a serial-to-parallel conversion and interface circuit are fabricated on another chip (the second chip). By stacking the two chips and making signal connections between chips at the node of the output end of the photodiode of each pixel unit, the area occupied by the signal processing circuit is further reduced by the chip stacking process, so that the area of the pulse sensor can be further reduced.

[0075] In addition, an embodiment of the present disclosure further provides an electronic device, including: a processor, and a memory communicatively connected to the processor, and further including the sensor pixel unit or the signal processing circuit described in any one of the above;

[0076] The memory stores computer execution instructions;

[0077] The processor executes the computer execution instructions stored in the memory to control the sensor pixel unit or the signal processing circuit.

[0078] The electronic device provided by the present disclosure can be incorporated into any one of the following: an image data acquisition device, an audio / video player, a navigation device, an entertainment device, a communication device, a roadside traffic facility, a device in a motor vehicle, an industrial inspection device, a flight device, a medical device, a security device, etc.

[0079] The electronic device provided by the present disclosure can be applied to any one of the following: an image data acquisition device, an audio / video player, a navigation device, an entertainment device, a communication device, a roadside traffic facility, a device in a motor vehicle, an industrial inspection device, a flight device, a medical device, a security device, etc.

[0080] Figure 6 The block diagram of the electronic device according to an embodiment of the present disclosure is illustrated. Below, reference Figure 6 is made to describe the electronic device according to an embodiment of the present disclosure. The electronic device can be either one or both of the first device and the second device, or a stand-alone device independent of them, and the stand-alone device can communicate with the first device and the second device to receive the input signals collected from them.

[0081] As Figure 6 shown, the electronic device includes one or more processors and a memory.

[0082] The processor can be a central processing unit (CPU) or other forms of processing units with data processing capabilities and / or instruction execution capabilities, and can control other components in the electronic device to perform desired functions.

[0083] The memory can store one or more computer program products. The memory can include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory can include, for example, random access memory (RAM) and / or cache memory, etc. The non-volatile memory can include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program products can be stored on the computer-readable storage medium, and the processor can run the computer program products to implement the image sensor pixel unit, signal processing circuit, and / or other desired functions of the various embodiments of the present disclosure described above.

[0084] In one example, the electronic device can further include: an input device and an output device, and these components are interconnected through a bus system and / or other forms of connection mechanisms (not shown).

[0085] In addition, the input device can further include, for example, a keyboard, a mouse, etc.

[0086] The output device can output various information to the outside, including the determined distance information, direction information, etc. The output device can include, for example, a display, a speaker, a printer, a communication network, and a remote output device connected thereto, etc.

[0087] Of course, for simplicity, Figure 6 only some of the components related to the present disclosure in the electronic device are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, according to specific application scenarios, the electronic device may further include any other appropriate components.

[0088] In addition to the above methods and devices, an embodiment of the present disclosure may also be a computer program product, which includes computer program instructions that, when run by a processor, cause the processor to execute the image sensor pixel unit and the signal processing circuit according to various embodiments of the present disclosure described in the above part of this specification.

[0089] The computer program product can be written in any combination of one or more programming languages for programming code to perform the operations of the embodiments of the present disclosure. The programming languages include object-oriented programming languages such as Java, C++, etc., and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, executed as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0090] Furthermore, an embodiment of the present disclosure may also be a computer-readable storage medium, on which computer program instructions are stored, and when the computer program instructions are run by a processor, the processor is caused to execute the image sensor pixel unit and the signal processing circuit according to various embodiments of the present disclosure described in the above part of this specification.

[0091] The computer-readable storage medium may adopt any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may include, for example, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples (non-exhaustive list) of the readable storage medium include: an electrical connection having one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0092] The basic principles of the present disclosure have been described in conjunction with specific embodiments. However, it should be noted that the advantages, benefits, effects, etc. mentioned in the present disclosure are only examples and not limitations. It cannot be considered that these advantages, benefits, effects, etc. are essential for each embodiment of the present disclosure. Additionally, the specific details disclosed above are only for illustrative and facilitating understanding purposes and not for limitation. The above details do not limit the present disclosure to necessarily adopt the above specific details for implementation.

[0093] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For system embodiments, since they basically correspond to method embodiments, they are described relatively simply. For relevant parts, reference can be made to the partial description of the method embodiments.

[0094] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present disclosure are only illustrative examples and do not intend to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open-ended terms, meaning "including but not limited to", and can be used interchangeably with each other. The word "or" and "and" used herein refer to the word "and / or" and can be used interchangeably with each other, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to" and can be used interchangeably with each other.

[0095] The methods and apparatuses of the present disclosure can be implemented in many ways. For example, the methods and apparatuses of the present disclosure can be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above order of the steps for the method is only for illustration purposes. The steps of the method of the present disclosure are not limited to the above specifically described order, unless otherwise specifically stated in other ways. Additionally, in some embodiments, the present disclosure can also be implemented as a program recorded in a recording medium, and these programs include machine-readable instructions for implementing the methods according to the present disclosure. Therefore, the present disclosure also covers the recording medium storing the programs for executing the methods according to the present disclosure.

[0096] It should also be noted that in the apparatuses, equipment, and methods of the present disclosure, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present disclosure.

[0097] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0098] The above description has been presented for purposes of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although numerous example aspects and embodiments have been discussed above, those skilled in the art will recognize some of their variations, modifications, alterations, additions, and subcombinations.

Claims

1. A sensor pixel unit, characterized in that, Comprising: A photodiode and a resistive random access memory; One end of the photodiode is connected to a power signal, and the other end serves as an output end and is connected to the resistive random access memory. The photodiode is configured to receive an optical signal during an exposure duration to generate a voltage signal; One end of the resistive random access memory is connected to the photodiode, and the other end is grounded.

2. The pixel unit according to claim 1, wherein When the resistive random access memory is in a high resistance state, the resistive random access memory disconnects the photodiode from the ground; when the resistive random access memory is in a low resistance state, the resistive random access memory grounds the photodiode.

3. The pixel unit according to claim 1 or 2, characterized in that Further comprising: A counter; An input end of the counter is connected to an output end of the photodiode, and an output end of the counter outputs a coded signal.

4. The pixel unit according to claim 3, wherein The counter is configured to receive a reset signal input externally, and perform a reset process on a counting result accumulated by the counter according to the reset signal.

5. The pixel unit according to claim 3, wherein Further comprising: A readout switch; One end of the readout switch is connected to an output end of the counter, and is turned on or off according to a received control signal. In response to the readout switch being turned on, the coded signal obtained by the counter is output through the other end of the readout switch.

6. A signal processing circuit, characterized in that, Comprising: A pixel array, a row controller, a serial - to - parallel conversion and interface circuit formed by sensor pixel units as described in any one of claims 1 - 5 in n rows and m columns; n and m are integers greater than 1 respectively; The pixel array is configured to process a received optical signal to obtain a coded signal, and output the coded signal to the serial - to - parallel conversion and interface circuit according to the control of the row controller; The row controller is configured to control the sensor pixel units in the pixel array row by row; The serial - to - parallel conversion and interface circuit is configured to receive the coded signals output by the pixel array column by column.

7. The signal processing circuit according to claim 6, characterized in that, The row controller is configured to output a reset signal and a control signal row by row, and sequentially control counters in sensor pixel units in one row of the pixel array to perform reset through the reset signal, and control readout switches in sensor pixel units in one row of the pixel array to turn on through the control signal.

8. The signal processing circuit according to claim 6 or 7, wherein Further comprising: A first chip and a second chip stacked up and down; Integrating the photodiode and the resistive random access memory in the pixel unit in the first chip; Integrating the counter and the readout switch in the pixel unit, as well as the row controller and the serial - to - parallel conversion and interface circuit in the second chip, and making a signal connection between the first chip and the second chip at a node of an output end of the photodiode in each pixel unit.

9. An electronic device, characterized in that, Comprising: A processor, and a memory communicatively connected to the processor, further comprising the sensor pixel unit as described in any one of claims 1 - 5 or the signal processing circuit as described in claims 6 - 8; The memory stores computer - executable instructions; The processor executes the computer - executable instructions stored in the memory to control the sensor pixel unit or the signal processing circuit.

10. The electronic device according to claim 9, wherein The electronic device is incorporated as any one of the following: an image data acquisition device, an audio / video player, a navigation device, an entertainment device, a communication device, a roadside traffic facility, a device in a motor vehicle, an industrial inspection device, a flight device, a medical device, and a security device.

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