Display module and head-up display device

Abstract

The utility model provides a display module and head-up display equipment, and belongs to the technical field of optical imaging. The display module is applied to the head-up display device. The display module comprises a display panel; the display panel is divided into a display area and a peripheral area located on at least one side of the display area. The display module further comprises a heat conduction assembly which is arranged on the display panel and located in the peripheral area. The heat conduction assembly is configured to conduct out heat generated by the display panel; and the heat dissipation assembly is connected with the heat conduction assembly and is configured to dissipate heat conducted out by the heat conduction assembly.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of optical imaging, and particularly relates to a display module and a head-up display device. Background Art

[0002] Head-up display (HUD) technology refers to the principle of optical reflection, which finally projects the light emitted by the image source onto the imaging window (imaging plate, windshield, etc.), and is reflected by the imaging window into the eye box to form a virtual image. Information such as vehicle speed and other driving-related information can be displayed in the virtual image to avoid distraction caused by the driver looking down at the dashboard during driving, thereby improving the driving safety factor and also bringing a better driving experience.

[0003] The image generation unit (PGU) in the head-up display device includes a backlight source and a display module, etc. Among them, a liquid crystal display screen can be selected as the display module. The inventor found that the main heat sources of the image generation unit are ambient temperature, backlight, and sunlight backflow. In the related art, the heat dissipation of the head-up display device is mainly carried out by means such as reducing brightness and increasing the reflective film, but the heat dissipation effect of these means is limited. The highest temperature at which the liquid crystal display screen is used is about 105°C. When the head-up display device works, the liquid crystal screen is easily heated to 105°C and fails under the combined action of the golden temperature, backlight, and sunlight, thus affecting the display effect of the head-up display device and the user experience. Therefore, it is an urgent technical problem to provide a heat management system with better performance to enable the liquid crystal display screen to work reliably within a safe temperature range. Summary of the Utility Model

[0004] The present utility model aims to at least solve one of the technical problems existing in the prior art, and provides a display module and a head-up display device.

[0005] The embodiments of the present disclosure provide a display module, which is applied to a head-up display device; the display module includes a display panel; the display panel is divided into a display area and a peripheral area located on at least one side of the display area; characterized in that,

[0006] The display module further includes:

[0007] A heat conduction component, which is arranged on the display panel and located in the peripheral area; the heat conduction component is configured to export the heat generated by the display panel;

[0008] A heat dissipation component, which is connected to the heat conduction component and is configured to dissipate the heat exported by the heat conduction component.

[0009] In some examples, the heat dissipation component extends toward a side of the heat conductive component away from the display panel, and an angle between an extension surface of the heat dissipation component and a plane where the display panel is located is 90°±30°.

[0010] In some examples, the heat dissipation component extends toward a side of the heat conductive component close to the display panel, and a distance between the heat dissipation component and a backlight source of the head-up display device is 15±5 mm.

[0011] In some examples, the display module further includes a first connecting member, and the heat conductive component and the display panel are fixedly connected via the first connecting member.

[0012] In some examples, the first connector includes a snap.

[0013] In some examples, a first adhesive layer is disposed between the thermally conductive component and the display panel to fix the thermally conductive component and the display panel.

[0014] In some examples, the material of the first bonding layer includes thermal grease or thermal glue.

[0015] In some examples, the display panel includes a display portion and a protective glass located on a display surface side of the display portion;

[0016] The protective glass comprises a main body and an extension surrounding the main body; the extension does not overlap with the orthographic projection of the display portion on a horizontal plane;

[0017] The heat-conducting component is located on a surface of the extending portion facing away from the display portion or a surface close to the display portion.

[0018] In some examples, the protective glass includes high thermal conductivity glass.

[0019] In some examples, the high thermal conductivity glass includes sapphire glass.

[0020] In some examples, the heat dissipation assembly includes a heat dissipation body and fluff wrapping the heat dissipation body.

[0021] In some examples, the peripheral area surrounds the display area; the peripheral area includes a first sub-area and a second sub-area arranged opposite to each other along a first direction, and a third sub-area and a fourth sub-area arranged opposite to each other along a second direction;

[0022] The lengths of the first sub-region and the second sub-region along the second direction are smaller than the lengths of the third sub-region and the fourth sub-region along the first direction;

[0023] The heat conducting component is arranged at least in the third sub-region and the fourth sub-region.

[0024] In some examples, the heat conducting component includes a thermoelectric cooler.

[0025] An embodiment of the present disclosure provides a head-up display device, which includes any one of the above-mentioned display modules.

[0026] In some examples, the head-up display device further includes a housing, which is located on the light-emitting side of the display module and is disposed around the periphery of the display panel, and the heat dissipation component is in contact with the housing.

[0027] In some examples, the heat conducting component is disposed opposite to the housing, and is connected between the housing and the heat conducting component through a second bonding layer.

[0028] In some examples, the material of the second bonding layer includes thermal grease or thermal glue.

[0029] In some examples, the head-up display device further includes:

[0030] A photosensitive sensor, configured to sense the brightness of the external ambient light;

[0031] A controller, configured to control the heat conducting component at least according to the brightness of the external ambient light sensed by the photosensitive sensor, the lighting rate of the backlight, and the sensed temperature of the thermistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the application of an exemplary head-up display device.

[0033] Figure 2 It is a schematic diagram of a display module according to an embodiment of the present disclosure.

[0034] Figure 3 It is a top view of a protection panel and a heat conducting component according to an embodiment of the present disclosure.

[0035] Figure 4 It is a schematic diagram of another display module according to an embodiment of the present disclosure.

[0036] Figure 5a It is a partial schematic diagram of a perspective view of a head-up display device according to an embodiment of the present disclosure.

[0037] Figure 5b It is a partial schematic diagram of another perspective view of a head-up display device according to an embodiment of the present disclosure.

[0038] Figure 6 It is a schematic diagram of the application of a head-up display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0039] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only a part rather than all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0041] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure shall have the ordinary meaning as understood by those of ordinary skill in the art belonging to the field of the present disclosure. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are only used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items.

[0042] As used herein, "parallel" and "perpendicular" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, and the acceptable deviation range of approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, and the acceptable deviation range of approximate perpendicularity can also be, for example, within 5° deviation.

[0043] In the description of the present disclosure, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present disclosure.

[0044] Unless otherwise clearly defined and limited, terms such as "installation", "connection", "attachment", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0045] Figure 1 FIG. is a schematic diagram of the application of an exemplary head-up display device. The head-up display device can be installed on a vehicle or other means of transportation. As Figure 1 shown, the head-up display device includes an image generation unit 100 for outputting image light. The image generation unit 100 includes a backlight 10 and a display module 20 disposed on the light-emitting side of the backlight 10. For example, the display module 20 is a liquid crystal display module. The display module 20 includes a plurality of pixel units, and each pixel unit includes a plurality of pixels. For example, each pixel unit includes a red pixel, a green pixel, and a blue pixel; or for another example, each pixel unit includes a red pixel, a green pixel, a blue pixel, and a white pixel. The display module 20 is configured to convert the light of the backlight 10 into image light. The windshield 200 of the vehicle is configured to reflect the image light to the eyebox area 300, so that when the observer's eyes are within the eyebox area 300, the observer can see the image formed by the image light. At this time, the image seen by the observer is a virtual image 400 formed by the windshield 200 in a reflection imaging manner. Among them, the observer can be a driver or a passenger. The observer can obtain the required vehicle information, such as driving speed, fuel consumption, etc., in the virtual image 400 in front of the line of sight, or it can be other information, such as the image of a virtual rearview mirror or the image of audio-visual entertainment, etc.

[0046] Among them, the eyebox area 300 of the head-up display device specifically refers to the area where the observer's eyes are located and where the observer can see the image output by the head-up display device. The eyebox area 300 has a certain size. Even if the observer's eyes deviate from the center of the eyebox area 300 by a certain distance, such as deviating by a certain distance in the up-down and left-right directions, as long as they are still within the eyebox area 300, the observer can see the image output by the head-up display device.

[0047] Figure 2 FIG. is a schematic diagram of a display module according to an embodiment of the present disclosure; Figure 3 FIG. is a top view of a protection panel and a heat conduction component 202 according to an embodiment of the present disclosure; As Figure 2 and 3As shown in the figure, the display module in the embodiments of the present disclosure includes a display panel 201, a heat conduction component 202, and a heat dissipation component 203. Among them, the display panel 201 is divided into a display area Q1 and a peripheral area Q2 located on at least one side of the display area Q1. The heat conduction component 202 is disposed on the display panel 201 and is located in the peripheral area Q2; the heat dissipation component 203 is connected to the heat conduction component 202. The heat conduction component 202 is configured to export the heat generated by the display panel 201; the heat dissipation component 203 is configured to dissipate the heat exported by the heat conduction component 202.

[0048] In the embodiments of the present disclosure, by disposing the heat conduction component 202 and the heat dissipation component 203 in the peripheral area Q2 of the display panel 201, the display panel 201 is cooled, so as to ensure that the display panel 201 can work within a safe operating range, making the display more reliable.

[0049] In some examples, the heat conduction component 202 in the embodiments of the present disclosure may employ a thermoelectric cooler. A thermoelectric cooler, also called a Peltier cooler, is a heat pump. Its advantage is that it has no moving parts and is applied to some occasions where space is limited, reliability requirements are high, and there is no refrigerant pollution. The thermoelectric cooler is composed of many particles of N-type semiconductors and P-type semiconductors arranged in a row, and between the N-type semiconductors and P-type semiconductors is connected by a general conductor to form a complete circuit. The conductor is usually copper, aluminum or other metal conductors, and finally, two ceramic sheets are sandwiched together like a sandwich cookie. The thermoelectric cooler utilizes the Peltier effect of semiconductor materials. When direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the electric couple respectively, and the purpose of refrigeration can be achieved. It is a refrigeration technology that generates negative thermal resistance, and its characteristics are that it has no moving parts and relatively high reliability.

[0050] In a specific example, continue to refer to Figure 3 , the periphery of the display panel 201 may be arranged to surround the display area Q1. Taking the display area Q1 as a rectangle as an example, the peripheral area Q2 may be in the shape of a rectangular ring. In this case, the peripheral area Q2 may include a first sub-region and a second sub-region oppositely arranged in a first direction, and a third sub-region and a fourth sub-region oppositely arranged in a second direction. Among them, the length of the first sub-region and the second sub-region in the second direction is greater than the length of the third sub-region and the fourth sub-region in the first direction. In this case, the heat conduction component 202 may be disposed in any one of the first sub-region, the second sub-region, the third sub-region, and the fourth sub-region. In one example, since the first sub-region and the second sub-region are longer and have a larger area than the third sub-region and the fourth sub-region, sufficient accommodation space can be provided for the heat conduction component 202. Therefore, in the embodiments of the present disclosure, the heat conduction component 202 may be selectively disposed in the third sub-region and the fourth sub-region.

[0051] Furthermore, the number of the heat conducting components 202 can be one or more. When the number of the heat conducting components 202 is more than one, the heat conducting components 202 are arranged at intervals, so as to reserve a certain heat release space.

[0052] In some examples, with continued reference to Figure 2 , the display panel 201 can include a display portion 2011 for display, and a protective glass 2012 located on the light-emitting surface side of the display portion 2011 and used for protecting the display portion 2011. Wherein, the protective glass 2012 includes a main body portion and an extension portion surrounding the main body portion. The positive projection of the display portion 2011 and the extension portion on the horizontal plane do not overlap. The heat conducting component 202 is arranged on the extension portion of the protective glass 2012. Through this arrangement, while the heat conducting component 202 dissipates the heat generated by the display portion 2011, the heat conducted out is prevented from acting on the display portion 2011 again to affect the display effect. It should be noted that the main body portion of the protective glass 2012 can coincide with the positive projection of the display portion 2011 on the horizontal plane, or the positive projection of the main body portion of the protective glass 2012 on the horizontal plane can be slightly larger than the positive projection of the display portion 2011 on the horizontal plane.

[0053] Furthermore, the heat conducting component 202 can be arranged on the side of the extension portion of the protective glass 2012 close to the display portion 2011, or can be arranged on the side of the extension portion of the protective glass 2012 away from the display portion 2011. The embodiments of the present disclosure do not limit this.

[0054] Furthermore, the protective glass 2012 is made of high heat conducting glass, and the high heat conducting glass includes but is not limited to sapphire glass. Of course, the protective glass 2012 can also be made of low heat conducting glass such as BK7, K9 and ultra-clear glass. Among them, the sapphire glass has better heat dissipation effect, and it is preferred that the protective glass 2012 is made of sapphire glass.

[0055] In some examples, the heat conducting component 202 and the display panel 201 can be fixed by mechanical fixing, that is, the heat conducting component 202 and the display panel 201 are fixed by a first connecting member. Wherein, the first connecting member includes but is not limited to a buckle. By fixing the heat conducting component 202 and the display panel 201 in this way, it is convenient for installation and replacement when the heat conducting component 202 fails.

[0056] In some examples, the heat-conducting component 202 and the display panel 201 can also be fixed by a first bonding layer, and the first bonding layer includes but is not limited to heat-conducting silicone grease or heat-conducting glue. Fixing with heat-conducting silicone grease or heat-conducting glue can make the heat distribution between the display panel 201 and the heat-conducting component 202 uniform, and can buffer the frictional force between the display panel 201 and the heat-conducting component 202, thereby avoiding damage to the heat-conducting component 202.

[0057] In some examples, the heat dissipation component 203 in the embodiments of the present disclosure can be composed of a heat dissipation body and fluff wrapped on the heat dissipation body. Among them, the fluff can be formed on the outer surface of the heat dissipation body by a flocking process to protect the heat dissipation body. The heat dissipation body in the embodiments of the present disclosure can be made of materials with better heat dissipation capabilities, such as metals, alloys, etc. For example, the material of the heat dissipation body can be selected as aluminum alloy.

[0058] In some examples, heat-conducting silicone grease or heat-conducting glue can also be selected to fix between the heat dissipation component 203 and the heat-conducting component 202. Fixing with heat-conducting silicone grease or heat-conducting glue can make the heat distribution between the heat dissipation component 203 and the heat-conducting component 202 uniform, and can buffer the frictional force between the heat dissipation component 203 and the heat-conducting component 202, thereby avoiding damage to the heat-conducting component 202.

[0059] In some examples, continue to refer to Figure 2 , the heat dissipation component 203 extends toward the side of the heat-conducting component 202 away from the display panel 201. For example, the heat-conducting component 202 is disposed on the side of the protective glass 2012 away from the display portion 2011, and the heat dissipation component 203 extends toward the side of the heat-conducting component 202 away from the protective glass 2012. In this case, the heat dissipation component 203 is located on the display surface side of the display module. In order to avoid the heat dissipation component 203 affecting the optical path of the display module, the heat dissipation component 203 should avoid the optical path of the line panel. Therefore, in the embodiments of the present disclosure, the included angle between the extension surface of the heat dissipation component 203 and the plane where the display panel 201 is located is 90° ± 30°, and preferably the included angle between the extension surface of the heat dissipation component 203 and the plane where the display panel 201 is located is about 90° to 120°.

[0060] In some examples, Figure 4 is a schematic diagram of another display module according to an embodiment of the present disclosure; as Figure 4As shown, the heat dissipation component 203 extends towards the side of the heat conduction component 202 close to the display panel 201. When the heat conduction component 202 is arranged on the side of the protective glass 2012 away from the display part 2011, at this time, the heat dissipation component 203 can be connected to the heat conduction component 202 through a connecting part, so as to facilitate the heat dissipation component 203 to extend towards the side of the heat conduction component 202 close to the display panel 201. Since the backlight source 10 of the head-up display device is arranged on the backlight surface side of the display panel 201, in order to prevent the heat generated by the heat dissipation component 203 from being conducted to the backlight source 10, in the embodiment of the present disclosure, the distance between the heat dissipation component 203 and the backlight source 10 of the head-up display device is 15±5 mm. In this case, the included angle between the extension surface of the heat dissipation component 203 and the plane where the display panel 201 is located can be 90°, or slightly less than or slightly greater than 90°, as long as there is a certain distance between the heat dissipation component 203 and the backlight source 10 of the head-up display device is ensured.

[0061] The embodiment of the present disclosure also provides a head-up display device, which includes an image generation unit. The image generation unit includes the above-mentioned display module, and of course also includes the backlight source 10 located on the backlight side of the display module. Among them, the backlight source 10 is used to provide light for the display module.

[0062] In some examples, Figure 5a is a partial schematic diagram of a perspective of the head-up display device according to the embodiment of the present disclosure; Figure 5b is a partial schematic diagram of another perspective of the head-up display device according to the embodiment of the present disclosure; As Figure 5a and Figure 5b shown, the head-up display device further includes a housing 500. The housing 500 is located on the light-emitting side of the display module, and is arranged around the periphery of the display panel 201, and the heat dissipation component 203 is in contact with the housing 500. Preferably, the heat dissipation component 203 is arranged on the side of the housing 500 away from the light-emitting surface. Since the housing usually uses materials with good heat conduction performance such as metal, therefore, contacting the heat dissipation component 203 with the housing can release the heat generated by the display panel 201 well.

[0063] Furthermore, the heat conduction component 202 is opposed to the housing, and is connected between the housing and the heat conduction component 202 through a second bonding layer. The heat dissipation component 203 extends towards the display surface side of the display panel 201, so as to be in contact with the housing. Among them, the second bonding layer is selected to be fixed with thermal grease or thermal glue. Fixing with thermal grease or thermal glue can make the heat between the housing and the heat conduction component 202 evenly distributed, and can buffer the friction force between the housing and the heat conduction component 202, thereby preventing the heat conduction component 202 from being damaged.

[0064] In some examples, the head-up display device may further include a photosensitive sensor, a controller, etc. The photosensitive sensor is configured to sense the ambient light brightness; the controller is configured to control the heat conduction component 202 at least according to the ambient light brightness sensed by the photosensitive sensor, the lighting rate of the backlight 10, and the sensed temperature of the thermistor NTC. In this way, the controller can control the operating power consumption of the heat conduction component 202 according to the current environment and the influence of the display module itself on the temperature, thereby reducing the power consumption of the head-up display device and extending the cruising range of the whole vehicle.

[0065] In some examples, the backlight 10 may include light-emitting devices arranged in an array. The light-emitting devices may specifically be electroluminescent elements, such as light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), mini light-emitting diodes (MiniLEDs), micro light-emitting diodes (MicroLEDs), cold cathode fluorescent lamps (CCFLs), electroluminescent displays (ELDs), cold LED lights (CLLs), electro-luminescence (EL), field emission displays (FEDs), tungsten halogen lamps, or metal halide lamps, etc. This common embodiment does not limit this.

[0066] In some examples, the display panel 201 is disposed on the light-emitting side of the backlight 10 and is configured to convert the light of the backlight 10 into image light and then output it to the eyebox area. The display panel 201 includes a plurality of pixel units, and each pixel unit may include a plurality of pixels. For example, each pixel unit includes a red pixel, a green pixel, and a blue pixel.

[0067] The display panel 201 may include an array substrate and a color filter substrate disposed opposite to each other, and a liquid crystal layer therebetween. The color filter substrate may include a plurality of color filter portions, and each color filter portion corresponds to a pixel. For example, the plurality of color filter portions include a red filter portion corresponding to the red pixel, a green filter portion corresponding to the green pixel, and a blue filter portion corresponding to the blue pixel. In some embodiments, the spectrum of the backlight matches the transmission spectrum of the color filter substrate, so that more light in the backlight can pass through the display panel 201 and be converted into image light, improving the transmittance of the backlight, reducing the proportion of the backlight converted into heat energy by the display panel 201, reducing the temperature rise of the display panel 201, and further extending the service life of the display panel 201.

[0068] It should be noted that the matching of the backlight spectrum and the transmittance spectrum of the color film substrate means that the peaks in the emission spectrum of the backlight correspond one by one to the peaks in the transmittance spectrum of the color film substrate, and the wavelength bands where the corresponding two peaks are located are the same or substantially the same. For example, the red filter portion is used to transmit light in the wavelength range of 625 - 740 nm, the green filter portion is used to transmit light in the wavelength range of 492 nm - 577 nm, and the blue filter portion is used to transmit light in the wavelength range of 440 - 475 nm. That is, the transmittance spectrum of the color film substrate has three first peaks, and the three first peaks are respectively in the wavelength bands of 625 - 740 nm, 492 nm - 577 nm, and 440 - 475 nm. In this case, the emission spectrum of the backlight also includes three second peaks, and the wavelength bands where the three second peaks are located are the same as the above three bands, or at least 70% overlap.

[0069] In some examples, Figure 6 is an application schematic diagram of the head-up display device according to an embodiment of the present disclosure; as Figure 6 shown, the head-up display device may further include a reflection imaging element 500, which is located in the housing 600, so as to protect the image generation unit 100 and the reflection imaging element 500. The housing 600 has an opening 601, so that the image light can be emitted from the opening 601.

[0070] In some embodiments, the reflection imaging element 500 may include a magnification element 501, and the magnification element 501 can enable the head-up display device to have a longer imaging distance and a larger imaging size. For example, the imaging distance and the imaging size can be changed by changing the magnification ratio of the magnification element 501. The magnification ratio can be changed by adjusting parameters such as the curvature of the magnification element 501.

[0071] In some embodiments, the magnification element 501 may be a curved mirror. Optionally, the curved mirror is a concave mirror, that is, a mirror with a concave reflecting surface. In the case where the curved mirror is a concave mirror, if the optical distance between the image generation unit 100 and the concave mirror is less than the focal length of the concave mirror, the concave mirror forms an upright and magnified virtual image based on the image output by the image generation unit 100. For example, according to the imaging properties of the concave mirror, when the optical distance between the image generation unit 100 and the concave mirror is less than the focal length of the concave mirror (that is, the image generation unit 100 is within one focal length of the concave mirror), the image distance of the concave mirror increases as the optical distance between the image generation unit 100 and the concave mirror increases. That is, the greater the optical distance between the image generation unit 100 and the concave mirror, the greater the distance between the observer and the virtual image 400 he observes.

[0072] Optionally, the curved mirror is a free-form mirror, that is, a mirror with a free-form reflecting surface, or a reflecting surface without rotational symmetry, so as to improve the imaging quality of the head-up display device.

[0073] In some other alternative embodiments, the magnifying element 501 can be an optical waveguide or a holographic optical element.

[0074] As Figure 6 shown, the reflection imaging element 500 is not limited to only including the magnifying element 501, and can also include a planar mirror 502, through which the optical path of the image light propagation is adjusted, thereby reducing the volume of the head-up display device.

[0075] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A display module is applied to a head-up display device; the display module includes a display panel; the display panel is divided into a display area and a peripheral area located on at least one side of the display area; characterized in that, The display module further includes: A heat conduction component, disposed on the display panel and located in the peripheral area; the heat conduction component is configured to export the heat generated by the display panel; A heat dissipation component, connected to the heat conduction component and configured to dissipate the heat exported by the heat conduction component.

2. The display module according to claim 1, wherein The heat dissipation component extends toward the side of the heat conduction component away from the display panel, and the extension surface of the heat dissipation component forms an angle of 90° ± 30° with the plane where the display panel is located.

3. The display module according to claim 1, characterized in that The heat dissipation component extends toward the side of the heat conduction component close to the display panel, and the distance between the heat dissipation component and the backlight source of the head-up display device is 15 ± 5 mm.

4. The display module according to claim 1, wherein It further includes a first connecting member, and the heat conduction component and the display panel are fixedly connected through the first connecting member.

5. The display module according to claim 4, wherein, The first connecting member includes a buckle.

6. The display module according to claim 1, characterized in that, A first bonding layer is provided between the heat conduction component and the display panel for fixing the heat conduction component and the display panel.

7. The display module according to claim 6, wherein The material of the first bonding layer includes thermal conductive silicone grease or thermal conductive glue.

8. The display module according to any one of claims 1-7, characterized in that, The display panel includes a display portion and a protective glass on the display surface side of the display portion; The protective glass includes a main body portion and an extending portion surrounding the main body portion; the extending portion has no overlap with the projection of the display portion on the horizontal plane; The heat conduction component is located on the surface of the extending portion away from the display portion or on the surface close to the display portion.

9. The display module according to claim 8, wherein The protective glass includes high thermal conductivity glass.

10. The display module according to claim 9, wherein The high thermal conductivity glass includes sapphire glass.

11. The display module according to any one of claims 1-7, characterized in that, The heat dissipation component includes a heat dissipation body and fluff wrapping the heat dissipation body.

12. The display module according to any one of claims 1-7, characterized in that, The peripheral area surrounds the display area; the peripheral area includes a first sub-area and a second sub-area oppositely arranged in a first direction, and a third sub-area and a fourth sub-area oppositely arranged in a second direction; The length of the first sub-area and the second sub-area in the second direction is less than the length of the third sub-area and the fourth sub-area in the first direction; The heat conduction component is provided at least in the third sub-area and the fourth sub-area.

13. The display module according to any one of claims 1-7, characterized in that, The heat conduction component includes a semiconductor refrigeration chip.

14. A head-up display device, characterized in that, Including the display module according to any one of claims 1-13.

15. The head-up display device according to claim 14, wherein It further includes a housing, the housing is located on the light-emitting side of the display module and is arranged around the periphery of the display panel, and the heat dissipation component is in contact with the housing.

16. The head-up display device according to claim 15, wherein The heat conduction component is opposed to the housing, and is connected by a second bonding layer between the housing and the heat conduction component.

17. The head-up display device according to claim 16, wherein, The material of the second bonding layer includes thermal conductive silicone grease or thermal conductive glue.

18. The head-up display device according to any one of claims 14-17, characterized in that, It further includes: A photosensitive sensor, configured to sense the ambient light brightness; A controller, configured to control the heat conduction component at least according to the ambient light brightness sensed by the photosensitive sensor, the lighting rate of the backlight source, and the sensed temperature of the thermistor.

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