Heat dissipation device
The proposed heat spreader with a thermally conductive board and fin structure addresses inefficiencies in traditional metal-based heat sinks, achieving significant temperature reductions and improved heat dissipation in compact projection light machines.
Patent Information
- Application Number
- CN202421793568.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-07-26
AI Technical Summary
The existing projection optical radiator cannot meet the efficient heat dissipation needs of closed projection optical machines, especially as the power of LED lamp beads increases, the traditional copper or aluminum plate radiator is slow to dissipate heat, and the thickness increases, resulting in inconvenience in use.
The heat transfer medium is filled with interconnected heat transfer channels in the thermal superconducting plate, combined with the heat dissipation bracket and the heat dissipation fins, and the heat transfer medium is used to transfer heat or phase change to suppress heat transfer to achieve rapid heat conduction, and heat is dissipated to the outside air through the heat dissipation fins.
It improves heat dissipation efficiency, reduces system thermal resistance, reduces material thickness and weight, increases heat exchange area, and extends the service life of the projector.
Smart Images
Figure CN223108243U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat dissipation devices, and particularly to a heat dissipation device. Background Art
[0002] Consumer electronics are accelerating their development towards high power, high integration, thinness, lightness and intelligence. The closed-type projection optical engine has advantages such as reduced brightness loss and small volume. However, due to limited space and compact components, its heat dissipation performance is a very important influencing factor. Existing radiators for projection optical engines can no longer meet their heat dissipation requirements. Utility Model Content
[0003] In view of this, the purpose of this application is to propose a heat dissipation device to solve or partially solve the problems raised in the background art.
[0004] Based on the above purpose, this application provides a heat dissipation device, including:
[0005] A heat superconducting plate, in which a heat transfer channel communicating with each other is formed, a heat transfer medium is filled in the heat transfer channel, and the heat superconducting plate is used to contact the device to be cooled;
[0006] A heat dissipation bracket, connected to the side of the heat superconducting plate facing away from the device to be cooled;
[0007] Heat dissipation fins, connected to the heat dissipation bracket and arranged around the outer periphery of the heat superconducting plate.
[0008] Optionally, the heat dissipation bracket includes a heat dissipation body and at least one heat dissipation tube. Each heat dissipation tube is connected to the heat dissipation body and the heat superconducting plate, and each heat dissipation tube is connected to the heat dissipation fins.
[0009] Optionally, at least one accommodation groove is opened on the side of the heat dissipation body close to the heat superconducting plate. The at least one accommodation groove corresponds to the at least one heat dissipation tube one by one. One end of the heat dissipation tube passes through the corresponding accommodation groove and extends out of the heat dissipation body, and the other end of the heat dissipation tube is connected to the heat dissipation fins.
[0010] Optionally, a plurality of protrusions are provided on the side of the heat dissipation body close to the heat superconducting plate. A heat dissipation gap for the heat dissipation tube to pass through is formed between two adjacent protrusions. One end of the heat dissipation tube passes through the corresponding heat dissipation gap and extends out of the heat dissipation body, and the other end of the heat dissipation tube is connected to the heat dissipation fins.
[0011] Optionally, a heat dissipation through hole for the heat dissipation tube to pass through is opened in the heat dissipation fins, and / or a groove is provided on the heat dissipation fins for the heat dissipation tube to pass through, and / or a notch is provided on the heat superconducting plate so that the heat dissipation tube is connected to the inner wall of the notch.
[0012] Optionally, the heat dissipation fins include a first fin and a second fin, and the first fin and the second fin enclose a heat dissipation space for accommodating the heat dissipation body and the heat superconducting plate.
[0013] Optionally, the first fin includes a first sub-fin, a second sub-fin, and a third sub-fin that are connected in sequence. The first sub-fin and the third sub-fin are disposed opposite to each other, and the second fin is disposed opposite to the second sub-fin.
[0014] Optionally, one end of the heat dissipation tube extends into the third sub-fin, and the other end of the heat dissipation tube sequentially passes through the heat dissipation body and the first sub-fin and then extends into the second fin or the second sub-fin.
[0015] Optionally, the sum of the thicknesses of the heat superconducting plate and the heat dissipation body is less than the thickness of the heat dissipation fins, and the thickness direction is perpendicular to the heat superconducting plate.
[0016] Optionally, it further includes a housing for covering the outer periphery and part of the top surface of the heat dissipation fins, and the surface of the heat superconducting plate for contacting the device to be cooled is flush with the top surface of the housing.
[0017] As can be seen from the above, the heat dissipation device provided in this application includes a heat superconducting plate, a heat dissipation bracket, and heat dissipation fins. Heat transfer channels communicating with each other are formed in the heat superconducting plate, and a heat transfer medium is filled in the heat transfer channels. The heat superconducting plate is used to contact the device to be cooled. Thus, relying on the heat transfer or heat transfer inhibition by the phase change of the heat transfer medium to form the heat superconducting characteristic of rapid heat conduction, the entire heat superconducting plate can quickly dissipate the heat generated by the device to be cooled, and the dissipated heat can be transferred to the peripheral heat dissipation fins through the heat dissipation bracket. The heat dissipation fins can quickly take away the heat conducted by the heat superconducting plate by air and dissipate it. The heat dissipation fins increase the heat exchange area between the heat dissipation device and the air, reduce the system thermal resistance, and further improve the heat dissipation capacity. Description of the Drawings
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0019] Figure 1 It is the first structural schematic diagram of the heat dissipation device in the embodiment of the present application;
[0020] Figure 2 It is the second structural schematic diagram of the heat dissipation device in the embodiment of the present application;
[0021] Figure 3 Exploded structural schematic diagram of the heat dissipation device according to an embodiment of the present application;
[0022] Figure 4 Structural schematic diagram of the heat dissipation device according to an embodiment of the present application after removing the heat superconducting plate;
[0023] Figure 5 Cross-sectional schematic diagram of the heat dissipation device according to an embodiment of the present application;
[0024] Figure 6 Structural schematic diagram of the heat dissipation device according to an embodiment of the present application after removing the heat superconducting plate and the heat dissipation fins;
[0025] Figure 7a Graph of measured temperature data of key parts of the projection optical machine M;
[0026] Figure 7b Graph of measured temperature data of key parts of the projection optical machine N;
[0027] Figure 8 Exemplary structural schematic diagram of the projection optical machine.
[0028] In the figure: 1. Heat superconducting plate; 11. Notch; 2. Heat dissipation bracket; 21. Heat dissipation body; 211. Protrusion; 212. Heat dissipation gap; 213. Accommodating groove; 22. Heat dissipation pipe; 3. Heat dissipation fins; 31. First fin; 311. First sub-fin; 312. Second sub-fin; 313. Third sub-fin; 32. Second fin; 4. Outer shell;
[0029] 001. Focus lens group; 002. High temperature area; 003. Glass convex lens; 004. LED light source; 005. First reflector; 006. First Fresnel lens; 007. Liquid crystal display screen; 008. Heat insulating glass; 009. Second Fresnel lens; 010. Second reflector. Detailed implementation manners
[0030] To make the objectives, technical solutions, and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to specific embodiments and the accompanying drawings.
[0031] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the ordinary meanings understood by those of ordinary skill in the field to which the present application belongs. The "first", "second" and similar terms used in the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0032] The enclosed projection optical machine (also known as a projector) has advantages such as reduced brightness loss and small size. However, due to limited space and compact components, its heat dissipation performance is an important factor affecting its service life. However, traditional LED (Light Emitting Diode Light) radiators for projection optical machines generally add aluminum plates or copper plates behind the LED substrate for heat dissipation, and then use copper tubes connected to the copper plates or aluminum plates to export the heat.
[0033] However, traditional radiators for projection optical machines all use heat-conducting metals such as copper plates, copper tubes or aluminum plates for heat dissipation. The heat dissipation speed of heat-conducting metals is slow, and the heat dissipation efficiency is low. Moreover, in order to achieve better heat dissipation effects, it is necessary to continuously increase the thickness of the copper plates or aluminum plates, resulting in a relatively thick radiator, which causes inconvenience in actual use.
[0034] Moreover, as the market's requirements for the brightness of LED lamp beads in projection optical machines gradually increase, the power of LED lamp beads is also getting higher and higher, resulting in more heat generated during their operation. Traditional radiators can no longer meet their heat dissipation requirements.
[0035] Based on this, referring to Figure 1 and Figure 2 , the present application provides a heat dissipation device that can be applied to a projection optical machine, including:
[0036] A heat superconducting plate 1, in which there are formed heat transfer channels communicating with each other, and a heat transfer medium is filled in the heat transfer channels. The heat superconducting plate 1 is used to contact the device to be cooled;
[0037] A heat dissipation bracket 2, connected to the side of the heat superconducting plate 1 facing away from the device to be cooled;
[0038] Heat dissipation fins 3, connected to the heat dissipation bracket 2 and arranged around the outer periphery of the heat superconducting plate 1.
[0039] Specifically, by way of example, in this embodiment, the device to be cooled may be a projection optical engine, and the heat source of the device to be cooled may be an LED lamp bead. It should be noted that the device to be cooled may also be an electronic device such as a computer or a tablet.
[0040] A heat transfer channel (not shown in the figure) that communicates with each other is formed in the heat superconducting plate 1, and a heat transfer medium is filled in the heat transfer channel. Depending on the phase change heat transfer or phase change suppression heat transfer of the heat transfer medium, the heat superconducting characteristic of rapid heat conduction is formed, so that the entire heat superconducting plate 1 can quickly dissipate the heat generated by the device to be cooled.
[0041] It should be noted that the heat superconducting heat transfer technology includes a heat pipe technology that fills a working medium in a closed and interconnected microchannel system and realizes heat superconducting heat transfer through the evaporation and condensation phase change of the working medium; and a phase change suppression (PCI) heat transfer technology that realizes efficient heat transfer by controlling the microstructure state of the working medium in a closed system, that is, during the heat transfer process, the boiling (or condensation of the gaseous medium) of the liquid medium is suppressed, and on this basis, the consistency of the microstructure of the working medium is achieved. In this embodiment, the heat superconducting plate 1 may be a phase change suppression heat dissipation plate. At this time, the boiling or condensation of the heat transfer medium in the heat superconducting plate 1 is suppressed during the heat transfer process, and on this basis, the consistency of the microstructure of the working medium is achieved to realize heat transfer. In this embodiment, the heat superconducting plate 1 may also be a heat pipe heat transfer plate. At this time, the heat transfer medium in the heat superconducting plate 1 continuously undergoes a phase change cycle of evaporation and heat absorption and condensation and heat release during the heat transfer process to achieve rapid heat transfer.
[0042] Exemplarily, the heat transfer medium is a fluid. Preferably, the heat transfer medium may be a gas or a liquid or a mixture of a gas and a liquid. More preferably, in this embodiment, the heat transfer medium is liquid water.
[0043] During specific implementation, the liquid water in the heat superconducting plate 1 absorbs heat and turns into a gas, and this process of two-phase change takes away the heat. The inner cavity of the vacuum cavity of the heat superconducting plate 1 is provided with a liquid. The bottom end of the vacuum cavity forms an evaporation area with the heat input surface through a columnar structure. The liquid evaporates after absorbing the heat of the LED lamp board and diffuses into the vacuum cavity, and then condenses back into a liquid state. This process of evaporation and condensation quickly circulates in the vacuum cavity, thereby realizing efficient heat dissipation. The thermal conductivity ranges from 10,000 to 100,000 W / mK, which is 20 times that of pure copper and 10 times that of a multi-layer graphite film. Therefore, the heat superconducting plate 1 has the advantages of high thermal conductivity, good temperature uniformity, and reversible heat flow direction, overcoming the problems of small contact area, large thermal resistance, and uneven heat flux density of traditional heat dissipation devices.
[0044] The heat dissipation bracket 2 is connected to the side of the heat superconducting plate 1 facing away from the device to be cooled. In this way, the heat dissipated by the heat superconducting plate 1 can be transferred to the heat dissipation bracket 2.
[0045] The heat dissipation fins 3 are connected to the heat dissipation bracket 2 and are arranged around the outer periphery of the heat superconducting plate 1. In this way, the heat transferred to the heat dissipation bracket 2 can be further transferred to the heat dissipation fins 3, and then transferred to the outside air through the heat dissipation fins 3 after passing through the outer periphery of the heat superconducting plate 1.
[0046] The arrangement of the heat dissipation fins 3 can quickly take away the heat conducted by the heat superconducting plate 1 by air and dissipate it, increasing the heat exchange area between the radiator and the air, reducing the system thermal resistance, further improving the heat dissipation capacity, and then reducing the material thickness of the heat superconducting plate 1, improving the strength, reducing the weight, and lowering the cost on the basis of the same heat dissipation capacity.
[0047] In some embodiments, continue to refer to Figure 1 and Figure 2 The heat dissipation bracket 2 includes a heat dissipation body 21 and at least one heat dissipation tube 22. Each heat dissipation tube 22 is connected to the heat dissipation body 21 and the heat superconducting plate 1, and each heat dissipation tube 22 is connected to the heat dissipation fins 3.
[0048] Specifically, most of the heat transferred from the heat superconducting plate 1 is first transferred to the heat dissipation tube 22, and then transferred to the heat dissipation body 21 and the heat dissipation fins 3 through the heat dissipation tube 22 respectively, and a small part is directly transferred to the heat dissipation body 21 connected to the heat superconducting plate 1.
[0049] The arrangement of the heat dissipation body 21 can be used to fix the heat dissipation tube 22 on the one hand, and on the other hand, the area of the heat dissipation body 21 is large, which can increase the heat dissipation area and dissipate heat quickly.
[0050] The arrangement of the heat dissipation tube 22 can transfer the heat transferred to the heat dissipation tube 22 to the heat dissipation fins 3 arranged around the outer periphery of the heat superconducting plate 1, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.
[0051] In some embodiments, refer to Figure 3 At least one receiving groove 213 is formed on the side of the heat dissipation body 21 close to the heat superconducting plate 1. The at least one receiving groove 213 corresponds to the at least one heat dissipation tube 22 one by one. One end of the heat dissipation tube 22 passes through the corresponding receiving groove 213 and extends out of the heat dissipation body 21, and the other end of the heat dissipation tube 22 is connected to the heat dissipation fins 3.
[0052] Specifically, the inner wall of the accommodation groove 213 is an arc structure, and the arc structure corresponds to the arc of the outer wall of the heat dissipation tube 22. In this way, the inner cavity of the accommodation groove 213 is adapted to the shape of the heat dissipation tube 22 to better accommodate and fix the heat dissipation tube 22.
[0053] On one side of the heat dissipation body 21 close to the heat superconducting plate 1, at least one accommodation groove 213 is opened. The accommodation groove 213 is used to accommodate the heat dissipation tube 22. One end of the heat dissipation tube 22 passes through the corresponding accommodation groove 213 and then extends out of the heat dissipation body 21 to increase the heat dissipation area. The other end of the heat dissipation tube 22 is connected to the heat dissipation fin 3 to transfer heat to the heat dissipation fin 3.
[0054] In this application, the setting of the accommodation groove 213 can facilitate the fixing and accommodation of the heat dissipation tube 22. On the one hand, it ensures the stability of the heat dissipation tube 22 during use, ensuring that the heat dissipation tube 22 will not rotate or move randomly. On the other hand, it reduces the installation space occupied by the heat dissipation tube 22, thereby reducing the thickness of the entire heat dissipation device.
[0055] In some embodiments, referring to Figure 4 and Figure 5 As shown, on one side of the heat dissipation body 21 close to the heat superconducting plate 1, a plurality of protrusions 211 are provided. A heat dissipation gap 212 for the heat dissipation tube 22 to pass through is formed between two adjacent protrusions 211. One end of the heat dissipation tube 22 passes through the corresponding heat dissipation gap 212 and then extends out of the heat dissipation body 21. The other end of the heat dissipation tube 22 is connected to the heat dissipation fin 3.
[0056] Specifically, the side wall of the protrusion 211 close to the heat dissipation tube 22 is an arc structure, and the arc structure corresponds to the arc of the outer wall of the heat dissipation tube 22. In this way, a heat dissipation gap 212 adapted to the shape of the heat dissipation tube 22 can be formed between two adjacent protrusions 211 to better accommodate and fix the heat dissipation tube 22.
[0057] In this application, the setting of the protrusions 211 and the heat dissipation gaps 212 can facilitate the fixing and accommodation of the heat dissipation tube 22. On the one hand, it ensures the stability of the heat dissipation tube 22 during use, ensuring that the heat dissipation tube 22 will not rotate or move randomly. On the other hand, it makes the installation and disassembly of the heat dissipation tube 22 more flexible and convenient for actual use.
[0058] In some embodiments, referring to Figure 4 and Figure 6 As shown, a heat dissipation through hole for the heat dissipation tube 22 to pass through is opened in the heat dissipation fin 3, and / or a groove is opened on the heat dissipation fin 3 for the heat dissipation tube 22 to pass through.
[0059] Specifically, a heat dissipation through-hole for the heat dissipation tube 22 to pass through is formed in the heat dissipation fin 3, and / or a groove is formed in the heat dissipation fin 3 for the heat dissipation tube 22 to pass through. Both the heat dissipation through-hole and the groove are arranged along the length direction of the heat dissipation fin 3 (such as Figure 4 the direction shown by A in
[0060] ). In this way, the heat dissipation tube 22 can penetrate the entire length direction of the heat dissipation fin 3, and thus the heat can be quickly transferred to the entire length direction of the heat dissipation fin 3, improving the heat dissipation efficiency. Figure 4 Further, a plurality of heat dissipation tubes 22 are provided, and the plurality of heat dissipation tubes 22 can be arranged at intervals along the thickness direction of the heat dissipation fin 3 (such as
[0061] the direction shown by B in Figure 5 ). In this way, the plurality of heat dissipation tubes 22 can quickly transfer the heat to the entire thickness direction of the heat dissipation fin 3, thereby improving the heat dissipation efficiency.
[0062] In some embodiments, as shown in
[0063] continuing to refer to
[0064] , a notch 11 is provided on the heat superconducting plate 1 to connect the heat dissipation tube 22 to the inner wall of the notch 11.
[0065] Specifically, the inner wall of the notch 11 is of an arc-shaped structure, and the arc-shaped structure corresponds to the arc of the outer wall of the heat dissipation tube 22. In this way, the cavity formed by the notch 11 is adapted to the shape of the heat dissipation tube 22 to better accommodate and fix the heat dissipation tube 22.
[0066] Further, the groove and the heat dissipation gap 212 or the accommodation cavity can exactly form a circular cavity, and the size of the circular cavity is adapted to the size of the heat dissipation tube 22, which is exactly used to accommodate the heat dissipation tube 22. In this way, on the one hand, the stability of the heat dissipation tube 22 during use is ensured, and it is ensured that the heat dissipation tube 22 will not rotate or move randomly. On the other hand, the installation space occupied by the heat dissipation tube 22 is reduced, and thus the thickness of the entire heat dissipation device is reduced.
[0064] In some embodiments, the heat dissipation fin 3 includes a first fin 31 and a second fin 32, and the first fin 31 and the second fin 32 enclose a heat dissipation space for accommodating the heat dissipation body 21 and the heat superconducting plate 1.
[0065] Specifically, the first fin 31 and the second fin 32 can be connected to each other or not. The first fin 31 and the second fin 32 enclose a heat dissipation space, and both the heat dissipation body 21 and the heat superconducting plate 1 are located in this heat dissipation space. In this way, the first fin 31 and the second fin 32 can quickly transfer the heat transferred to the heat dissipation body 21 and the heat superconducting plate 1 to the periphery of the heat superconducting plate 1 and transfer it to the external air through the periphery, so that the heat dissipation area of the heat dissipation device can be increased and the heat dissipation efficiency can be improved.
[0066] In some embodiments, the first fin 31 includes a first sub-fin 311, a second sub-fin 312, and a third sub-fin 313 that are sequentially connected. The first sub-fin 311 and the third sub-fin 313 are disposed opposite to each other, and the second fin 32 is disposed opposite to the second sub-fin 312. In this way, the first sub-fin 311, the second sub-fin 312, the third sub-fin 313, and the second fin 32 are respectively distributed around the heat superconducting plate 1 to quickly transfer heat to the external air from all around.
[0067] In some embodiments, one end of the heat dissipation tube 22 extends into the third sub-fin 313, and the other end of the heat dissipation tube 22 sequentially passes through the heat dissipation body 21 and the first sub-fin 311 and then extends into the second fin 32 or the second sub-fin 312.
[0068] Specifically, one end of the heat dissipation tube 22 extends into the third sub-fin 313 and is disposed through the third sub-fin 313 to quickly transfer heat to the third sub-fin 313.
[0069] The other end of the heat dissipation tube 22 sequentially passes through the heat dissipation body 21 and the first sub-fin 311, and some of them extend into the second fin 32, and some extend into the second sub-fin 312 to quickly transfer heat to the first sub-fin 311, the second sub-fin 312, and the second fin 32.
[0070] In this way, only through the heat dissipation tube 22, heat can be quickly transferred to the first sub-fin 311, the second sub-fin 312, the third sub-fin 313, and the second fin 32 disposed at different positions. On the one hand, the structure is simple without redundant connecting components. On the other hand, the heat dissipation area of the heat dissipation device can be significantly increased.
[0071] In some embodiments, the sum of the thicknesses of the heat superconducting plate 1 and the heat dissipation body 21 is less than the thickness of the heat dissipation fin 3, and the thickness direction is perpendicular to the heat superconducting plate 1.
[0072] Specifically, the sum of the thicknesses of the heat superconducting plate 1 and the heat dissipation body 21 is less than the thickness of the heat dissipation fin 3, so that the heat dissipation space formed by the enclosure of the first fin 31 and the second fin 32 is not filled by the heat superconducting plate 1 and the heat dissipation body 21, and there is still a part of extra space in the heat dissipation space. This space is used to dissipate the heat on the side of the heat dissipation body 21 away from the heat superconducting plate 1 to further improve the heat dissipation efficiency of the heat dissipation device.
[0073] In some embodiments, it further includes a housing 4. The housing 4 is used to cover the outer periphery and part of the top surface of the heat dissipation fin 3, and the surface of the heat superconducting plate 1 for contacting the device to be cooled is flush with the top surface of the housing 4.
[0074] Specifically, the housing 4 is used to cover the outer periphery and part of the top surface of the heat dissipation fins 3. In this way, the housing 4 can assemble the heat dissipation fins 3, the heat superconducting plate 1 and the heat dissipation bracket 2, which is convenient for carrying.
[0075] The surface of the heat superconducting plate 1 for contacting the device to be cooled is flush with the top surface of the housing 4, so as to provide a relatively large flat surface for stably placing the device to be cooled.
[0076] In some embodiments, the heat superconducting plate 1, the heat dissipation bracket 2 and the heat dissipation fins 3 can all be made of copper material or aluminum material.
[0077] In some embodiments, the heat dissipation effects of the heat dissipation device provided in this application and the heat dissipation device without the heat superconducting plate 1 are tested. For the same projection optical machines M and N (as Figure 8 shown), the heat dissipation device provided in this application is used to dissipate heat from the projection optical machine M, and the heat dissipation device without the heat superconducting plate 1 is used to dissipate heat from the projection optical machine N. The temperatures of the key components of the projection optical machines M and N are tested, and the test results are as Figure 7a and Figure 7b shown.
[0078] Among them, as Figure 7a is the measured data graph of the temperature of the key parts of the projection optical machine M; as Figure 7b is the measured data graph of the temperature of the key parts of the projection optical machine N.
[0079] As shown by Figure 7a and Figure 7b , by comparison, it is obtained that after actual assembly, the average temperature drop of the light incident center point of the liquid crystal display screen 007 of the key component is about 5°C, the average temperature drop of the light incident point of the heat insulation glass 008 is about 8°C, the average temperature drop of the light exit point of the rear Fresnel (i.e., the first Fresnel lens 006) is about 8°C, and the average temperature drop of the copper pipe of the LED light source 004 is about 3°C.
[0080] It can be seen from this that compared with the heat dissipation device without the heat superconducting plate 1, using the heat dissipation device described in this application can significantly reduce the temperature of the projection optical machine, improve its heat dissipation performance, and thus can extend the service life of the projection optical machine.
[0081] Those of ordinary skill in the art should understand that: the discussion of any above embodiment is only exemplary, and is not intended to imply that the scope of this application (including the claims) is limited to these examples; under the idea of this application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of this application as described above, which are not provided in detail for the sake of brevity.
[0082] Embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included within the protection scope of the present application.
Claims
1. A heat dissipation device, characterized in that, include: A thermal superconducting plate, wherein interconnected heat transfer channels are formed in the thermal superconducting plate, wherein the heat transfer channels are filled with a heat transfer medium, and wherein the thermal superconducting plate is used to contact with a device to be cooled; A heat dissipation bracket connected to a side of the thermal superconducting plate facing away from the device to be dissipated; Heat dissipation fins are connected to the heat dissipation bracket and are arranged around the outer periphery of the thermal superconducting plate; The heat dissipation bracket includes a heat dissipation body and at least one heat dissipation pipe, each of the heat dissipation pipes is connected to the heat dissipation body and the thermal superconducting plate, and each of the heat dissipation pipes is connected to the heat dissipation fins.
2. The heat dissipation device according to claim 1, wherein, At least one receiving groove is formed on one side of the heat dissipation body close to the thermal superconducting plate, and the at least one receiving groove corresponds to the at least one heat dissipation tube. One end of the heat dissipation tube passes through the corresponding receiving groove and then extends out of the heat dissipation body, and the other end of the heat dissipation tube is connected to the heat dissipation fin.
3. The heat dissipation device according to claim 1, wherein A plurality of protrusions are provided on one side of the heat dissipation body close to the thermal superconducting plate, and a heat dissipation gap for the heat dissipation pipe to pass through is formed between two adjacent protrusions. One end of the heat dissipation pipe passes through the corresponding heat dissipation gap and then extends out of the heat dissipation body, and the other end of the heat dissipation pipe is connected to the heat dissipation fin.
4. The heat dissipation device according to claim 1, wherein The heat dissipation fins are provided with heat dissipation holes for the heat dissipation pipes to pass through, and / or the heat dissipation fins are provided with grooves for the heat dissipation pipes to pass through, and / or the thermal superconducting plate is provided with notches for connecting the heat dissipation pipes to the inner wall of the notches.
5. The heat dissipation device according to claim 1, wherein The heat dissipation fins include a first fin and a second fin, and the first fin and the second fin together form a heat dissipation space for accommodating the heat dissipation body and the thermal superconducting plate.
6. The heat dissipation device according to claim 5, characterized in that, The first fin includes a first sub-fin, a second sub-fin and a third sub-fin which are connected in sequence. The first sub-fin and the third sub-fin are arranged opposite to each other, and the second fin and the second sub-fin are arranged opposite to each other.
7. The heat dissipation device according to claim 6, characterized in that, One end of the heat dissipation tube extends into the third sub-fin, and the other end of the heat dissipation tube passes through the heat dissipation body and the first sub-fin in sequence and then extends into the second fin or the second sub-fin.
8. The heat dissipation device according to claim 1, wherein The sum of the thicknesses of the thermal superconducting plate and the heat dissipating body is less than the thickness of the heat dissipating fins, and the direction of the thickness is perpendicular to the direction of the thermal superconducting plate.
9. The heat dissipation device according to claim 1, characterized in that, It also includes a shell, which is used to cover the periphery and a part of the top surface of the heat dissipation fins, and the surface of the thermal superconducting plate that is used to contact the heat dissipation device is flush with the top surface of the shell.