Computer heat dissipation equipment
A combined wind and water cooling system with a stabilizing frame addresses inefficiencies in computer cooling by securing the device and enhancing heat dissipation, preventing sliding and improving stability and cooling performance.
Patent Information
- Application Number
- CN202422263829.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-15
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-15
AI Technical Summary
The heat dissipation board of existing computer equipment cannot effectively and quickly dissipate heat, resulting in high temperature alarms and slow operation. At the same time, the computer equipment is easy to slip off on the heat dissipation board, which is inconvenient to use.
A computer cooling device is designed, using a limit frame to stabilize the computer, combining air-cooling and water-cooling components, including pallets, limit frames, water-cooling components and air-cooling components, and using snake-shaped cooling pipes and heat-cooling fins to achieve the combined heat dissipation effect of air-cooling and water-cooling.
The computer is placed stably, avoids slippage, and the heat dissipation efficiency is improved through the combination of air-cooling and water-cooling, and the heat dissipation effect of the computer is enhanced.
Smart Images

Figure CN223108338U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of construction beam installation, and more specifically, to a computer cooling device. Background Art
[0002] Computer devices are commonly used office equipment. When computer devices operate for a long time and under load, they will emit a large amount of heat energy. After the computer devices have been used for a certain number of years, the built-in fans of the computer devices cannot meet the heat dissipation requirements, resulting in the heat emitted by the computer devices not being effectively and quickly discharged, causing the computer devices to issue high-temperature alarms and operate slowly. Therefore, a heat dissipation plate device is usually placed and installed at the bottom of the computer device. By installing a fan device on the heat dissipation plate device, the purpose of accelerating the heat dissipation of the computer device by air cooling is achieved. However, the added heat dissipation plate only relies on ordinary air cooling and cannot well meet the heat dissipation requirements, and there will still be a slow heat dissipation phenomenon. Moreover, the computer device is directly placed on the surface of the heat dissipation plate, and the computer device cannot be limited. During the operation of the computer device, the computer device is prone to slipping off the heat dissipation plate, which is inconvenient to use. In view of this, we propose a computer cooling device. Summary of the Utility Model
[0003] 1. Technical Problems to be Solved
[0004] The purpose of this application is to provide a computer cooling device, which solves the technical problems in the above background art, and realizes the technical effect that the cooling device can use the limiting frame to stably place the computer on the tray, avoid the phenomenon that the computer slips off the cooling device during operation, has a novel overall structural design, is convenient for assembly, and has a heat dissipation effect of combining air cooling and water cooling, greatly increasing the heat dissipation efficiency of the computer.
[0005] 2. Technical Solutions
[0006] The technical solution of this application provides a computer cooling device, including: a tray, a limiting frame is fixedly arranged along the edge of the upper surface of the tray, a rectangular through groove is opened on the tray, a water cooling component is installed at the position of the rectangular through groove on the tray, and a heat dissipation fin is snap-fitted and installed, a chassis is threadedly connected to the bottom of the tray, and an air cooling component is installed on the chassis;
[0007] The water cooling component includes a cooling water tank, a circulating water pump and a serpentine cooling pipe. The cooling water tank, the circulating water pump and the serpentine cooling pipe are connected through pipelines. The cooling water tank and the circulating water pump are threadedly installed on the chassis by screws, and the serpentine cooling pipe is installed in a limited manner between the tray and the heat dissipation fin;
[0008] The air cooling component includes two fans. The fans are electrically connected to a power supply device, and the power supply device is electrically connected to the computer device.
[0009] Optionally, serpentine card slots are provided on both sides of the tray at the rectangular through slots, and a serpentine cooling pipe is snap-fitted and installed in the serpentine card slots. Rectangular card slots are provided on the other two sides of the tray at the rectangular through slots, and heat dissipation fins are snap-fitted and installed in the rectangular card slots.
[0010] Optionally, the heat dissipation fins include a plurality of concave strips arranged in parallel. Both ends of the concave strips are snap-fitted and installed in the rectangular card slots, and a plurality of heat dissipation fins are fixedly arranged in a matrix between the concave strips.
[0011] Optionally, the housing of the blower and the power supply device are fixedly connected, and both are threadedly installed on the upper surface of the chassis through screws. The power supply device is electrically connected to a power cord, and the power cord is electrically connected to a USB plug.
[0012] Optionally, an L-shaped block is fixedly provided at each of the four corners of the chassis. A screw is threadedly installed on the L-shaped block. A screw hole is provided at each of the four corners of the tray, and the screw is threadedly installed in the screw hole. A plurality of elliptical slots are provided on the chassis.
[0013] Optionally, a water suction pipe is detachably connected between the circulating water pump and the cooling water tank. The serpentine cooling pipe is provided with two pipe interfaces, and hoses are detachably connected between the cooling water tank and the circulating water pump respectively.
[0014] 3. Beneficial effects
[0015] One or more technical solutions provided in the technical solution of the present application have at least the following technical effects or advantages:
[0016] 1. The heat dissipation device can use the limiting frame to stably place the computer on the tray, avoiding the phenomenon that the computer slides off the heat dissipation device during operation;
[0017] 2. The overall structure of the heat dissipation device is novel in design, convenient for assembly, and has a heat dissipation effect of combining air cooling and water cooling, greatly increasing the heat dissipation efficiency of the computer. Description of the drawings
[0018] Figure 1 It is a schematic diagram of the overall structure of a computer heat dissipation device disclosed in a preferred embodiment of the present application;
[0019] Figure 2 It is a schematic diagram of the overall exploded structure of a computer heat dissipation device disclosed in a preferred embodiment of the present application;
[0020] Figure 3 It is a schematic diagram of the air cooling component and water cooling component structures of a computer heat dissipation device disclosed in a preferred embodiment of the present application;
[0021] Description of reference numerals in the figure: 1. Tray; 11. Limit frame; 12. Rectangular through groove; 13. Serpentine card slot; 14. Rectangular card slot; 15. Screw hole; 2. Heat dissipation fin; 21. Concave strip; 22. Heat dissipation fin; 3. Air cooling component; 31. Fan; 32. Power supply device; 33. Power cord; 34. USB plug; 4. Chassis; 41. L-shaped block; 42. Screw; 43. Oval groove; 5. Water cooling component; 51. Cooling water tank; 52. Circulating water pump; 53. Serpentine cooling pipe; 531. Hose; 54. Water suction pipe. Specific implementation mode
[0022] The present application will be further described in detail below with reference to the accompanying drawings of the specification.
[0023] Refer to Figures 1 to 3 As shown in the figure, an embodiment of the present application provides a computer heat dissipation device, including: a tray 1, a limit frame 11 is fixedly arranged along the edge of the upper surface of the tray 1, a rectangular through groove 12 is formed in the tray 1, a water cooling component 5 is installed at the position of the rectangular through groove 12 of the tray 1, and a heat dissipation fin 2 is snap-fitted and installed, a chassis 4 is threadedly connected to the bottom of the tray 1, and an air cooling component 3 is installed on the chassis 4;
[0024] The water cooling component 5 includes a cooling water tank 51, a circulating water pump 52 and a serpentine cooling pipe 53. The cooling water tank 51, the circulating water pump 52 and the serpentine cooling pipe 53 are connected through pipelines. The cooling water tank 51 and the circulating water pump 52 are threadedly installed on the chassis 4 through screws, and the serpentine cooling pipe 53 is installed in a limited manner between the tray 1 and the heat dissipation fin 2;
[0025] The air cooling component 3 includes two fans 31. The fans 31 are electrically connected to a power supply device 32, and the power supply device 32 is electrically connected to a computer device.
[0026] By adopting the above technical solution, the computer device is placed on the tray 1, and the limit frame 11 can stably place the computer device on the tray 1, which can avoid the phenomenon that the computer device slides off the tray 1 during operation. The tray 1, the chassis 4 and the heat dissipation fin 2 can be assembled. The overall structure design is novel. And the cooling water tank 51, the circulating water pump 52 and the fan 31 are installed on the chassis 4. The circulating water pump 52 is connected to the serpentine cooling pipe 53 and the cooling water tank 51 through pipelines to achieve the water cooling effect. The fan 31 cooperates with the heat dissipation fin 2 to quickly exhaust the heat dissipated by the serpentine cooling pipe 53 and the computer device, thereby realizing the heat dissipation effect of the combination of air cooling and water cooling, and greatly increasing the computer heat dissipation efficiency.
[0027] Refer to Figure 2 And Figure 3, on both sides of the rectangular through groove 12 of the tray 1, serpentine card slots 13 are provided, and a serpentine cooling pipe 53 is snap-fitted and installed in the serpentine card slots 13. On the other two sides of the tray 1 located at the rectangular through groove 12, rectangular card slots 14 are provided, and heat dissipation fins 2 are snap-fitted and installed in the rectangular card slots 14.
[0028] By adopting the above technical solution, during installation, first, the serpentine cooling pipe 53 is press-fitted and installed in the serpentine card slots 13 provided on the tray 1. Then, the heat dissipation fins 2 are press-fitted and installed in the rectangular card slots 14 provided on the tray 1. Subsequently, the heat dissipation fins 2 can limit the serpentine cooling pipe 53.
[0029] Refer to Figure 1 and Figure 2 , the heat dissipation fins 2 include a plurality of concave strips 21 arranged in parallel. Both ends of the concave strips 21 are snap-fitted and installed in the rectangular card slots 14, and a plurality of heat dissipation fins 22 are fixedly arranged in a matrix between the concave strips 21.
[0030] By adopting the above technical solution, the heat dissipation fins 2 use the plurality of heat dissipation fins 22 to dissipate the heat dissipated by the computer device, and the ends of the concave strips 21 can be snap-fitted and installed in the rectangular card slots 14, which is convenient for installation.
[0031] Refer to Figure 2 and Figure 3 , the housing of the fan 31 and the power supply device 32 are fixedly connected, and both are threadedly installed on the upper surface of the chassis 4 by screws. The power supply device 32 is electrically connected to a power cord 33, and the power cord 33 is electrically connected to a USB plug 34.
[0032] By adopting the above technical solution, the USB plug 34 connected by the power cord 33 of the power supply device 32 is plugged and installed at the USB socket of the computer device. Subsequently, the computer device provides power support for the power supply device 32, and the power supply device 32 can provide power support for the fan 31 and the circulation water pump 52.
[0033] Refer to Figure 2 and Figure 3 , at the four corners of the chassis 4, an L-shaped block 41 is fixedly provided. A screw rod 42 is threadedly installed on the L-shaped block 41. At the four corners of the tray 1, screw holes 15 are provided. The screw rod 42 is threadedly installed in the screw holes 15, and a plurality of elliptical grooves 43 are provided on the chassis 4.
[0034] By adopting the above technical solution, the chassis 4 is embedded at the bottom of the tray 1 through the L-shaped block 41, and the screw rod 42 is used for threaded fixation, realizing the purpose of assembling the chassis 4 and the tray 1 in a modular way.
[0035] Refer to Figure 2 and Figure 3, a water suction pipe 54 is detachably connected between the circulating water pump 52 and the cooling water tank 51. The serpentine cooling pipe 53 is provided with two pipe interfaces, and flexible hoses 531 are detachably connected between the cooling water tank 51 and the circulating water pump 52 respectively.
[0036] By adopting the above technical solution, the cooling water tank 51 has good sealing performance to avoid water seepage. The cooling water in the cooling water tank 51 can flow cyclically to the serpentine cooling pipe 53 through the circulating water pump 52, and can cooperate with the heat dissipation fins 2 and the fan 31 to achieve the combined heat dissipation function of water cooling and air cooling.
[0037] Working principle: Place the computer device on the tray 1, and use the limit frame 11 to stably place the computer device on the tray 1, which can avoid the phenomenon that the computer device slides off the tray 1 during operation. The tray 1, the chassis 4 and the heat dissipation fins 2 can be assembled. The overall structure design is novel. And on the chassis 4, the cooling water tank 51, the circulating water pump 52 and the fan 31 are installed. The circulating water pump 52 is connected to the serpentine cooling pipe 53 and the cooling water tank 51 through pipelines, so that the cooling water in the cooling water tank 51 can flow cyclically to the serpentine cooling pipe 53 through the circulating water pump 52, and the fan 31 cooperates with the heat dissipation fins 2 to achieve the function of quickly exhausting the heat dissipated by the serpentine cooling pipe 53 and the computer device, thereby achieving the combined heat dissipation effect of air cooling and water cooling, and greatly increasing the computer heat dissipation efficiency.
Claims
1. A computer cooling device, characterized in that: Comprising: a tray (1), a limiting frame (11) is fixedly arranged along the edge of the upper surface of the tray (1), a rectangular through groove (12) is formed in the tray (1), a water cooling component (5) is installed at the rectangular through groove (12) of the tray (1), and a heat dissipation fin (2) is clamped and installed, a chassis (4) is threadedly connected to the bottom of the tray (1), and an air cooling component (3) is installed on the chassis (4); The water cooling component (5) includes a cooling water tank (51), a circulating water pump (52) and a serpentine cooling pipe (53), the cooling water tank (51), the circulating water pump (52) and the serpentine cooling pipe (53) are communicated through pipes, the cooling water tank (51) and the circulating water pump (52) are threadedly installed on the chassis (4) by screws, and the serpentine cooling pipe (53) is limitedly installed between the tray (1) and the heat dissipation fin (2); The air cooling component (3) includes two fans (31), the fans (31) are electrically connected to a power supply device (32), and the power supply device (32) is electrically connected to a computer device.
2. The computer heat dissipation device according to claim 1, characterized in that: Serpentine card slots (13) are formed on both sides of the tray (1) at the rectangular through groove (12), the serpentine cooling pipe (53) is clamped and installed in the serpentine card slots (13), rectangular card slots (14) are formed on the other two sides of the tray (1) at the rectangular through groove (12), and the heat dissipation fin (2) is clamped and installed in the rectangular card slots (14).
3. A computer heat dissipation device according to claim 2, characterized in that: The heat dissipation fin (2) includes a plurality of concave strips (21) arranged in parallel, both ends of the concave strip (21) are clamped and installed in the rectangular card slots (14), and a plurality of heat dissipation fins (22) are fixedly arranged in a matrix between the concave strips (21).
4. A computer heat dissipation device according to claim 1, characterized in that: The housings of the fans (31) and the power supply device (32) are fixedly connected and are both threadedly installed on the upper surface of the chassis (4) by screws, the power supply device (32) is electrically connected to a power cord (33), and the power cord (33) is electrically connected to a USB plug (34).
5. A computer cooling device according to claim 1, characterized in that: An L-shaped block (41) is fixedly arranged at each of the four corners of the chassis (4), a screw rod (42) is threadedly installed on the L-shaped block (41), screw holes (15) are formed at each of the four corners of the tray (1), the screw rod (42) is threadedly installed in the screw holes (15), and a plurality of elliptical grooves (43) are formed on the chassis (4).
6. A computer heat dissipation device according to claim 1, characterized in that: A water suction pipe (54) is detachably communicated between the circulating water pump (52) and the cooling water tank (51), the serpentine cooling pipe (53) is provided with two pipe interfaces, and a hose (531) is detachably communicated between the serpentine cooling pipe (53) and the cooling water tank (51) and the circulating water pump (52) respectively.