Display module and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, and provides a display module and electronic equipment, the display module comprises a display panel and a supporting backboard, the display panel comprises a display surface and a backlight surface, and the supporting backboard is arranged on the backlight surface; the supporting backboard comprises a first bonding layer, a supporting layer, a second bonding layer and a copper layer which are sequentially arranged in the direction away from the backlight face, the density of the supporting layer is smaller than that of the copper layer, and the film printing resistance of the supporting layer is larger than or equal to that of the copper layer. According to the display module and the electronic equipment, the copper layer playing a supporting role in the display module is thinned, and at least the film printing resistance of the display module can be kept not to be reduced.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a display module and an electronic device. Background Art

[0002] In an electronic device with a display function, a display module usually includes a support backplane. The main material of the support backplane is copper, and the high density of copper results in a relatively large weight of the display module. Therefore, in specific implementation, attempts are made to reduce the weight of the overall display module by thinning the copper layer in the support backplane. However, thinning the copper layer in the support backplane will reduce the anti-film printing ability of the display module. Summary of the Utility Model

[0003] Embodiments of this application provide a display module and an electronic device, so as to maintain the anti-film printing ability of the display module without decline while thinning the copper layer in the support backplane.

[0004] In a first aspect, this application provides a display module. The display module includes a display panel and a support backplane. The display panel includes a display surface and a backlight surface. The support backplane is disposed on the backlight surface. The support backplane includes a first adhesive layer, a support layer, a second adhesive layer, and a copper layer sequentially arranged in a direction away from the backlight surface. The density of the support layer is less than that of the copper layer, and the anti-film printing ability of the support layer is greater than or equal to that of the copper layer. In this solution, the support layer is added, and the anti-film printing ability of the support layer is greater than or equal to that of the copper layer. Compared with the related art where only the thickness of the copper layer in the support backplane is thinned, the anti-film printing ability of the display module can be improved. Moreover, since the density of the support layer is less than that of the copper layer, the display module provided by this application can achieve the same weight reduction as the related art, so that the anti-film printing ability of the display module does not decline, and even can be improved, without increasing the weight of the display module.

[0005] In a possible embodiment, the thickness of the support layer is 15 to 35 micrometers. The anti-film printing ability is positively correlated with the thickness of the material. This is beneficial to ensuring that the anti-film printing ability of the support layer is greater than or equal to that of the copper layer, and further ensuring that the anti-film printing ability of the display module does not decline and even can be improved. In this solution, the thickness of the copper layer can be 9 to 35 micrometers, so that the display module can be thinned while reducing weight and controlling the weight from increasing.

[0006] In a possible embodiment, the tensile modulus of the support layer is greater than or equal to 5 GPa. The anti-film printing ability is also positively correlated with the tensile modulus of the material. The tensile modulus of the support layer being greater than or equal to 5 GPa can make the anti-film printing ability of the support layer better, and further make the anti-film printing ability of the display module better.

[0007] In a possible embodiment, the support layer may be a laminate composed of one or at least two of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cycloolefin polymer layer, and a triacetate cellulose layer.

[0008] In a possible embodiment, the support layer includes a first sub-support layer, a third adhesive layer, a heat-conducting layer, a fourth adhesive layer, and a second sub-support layer, which are sequentially arranged in a direction away from the backlight surface. In this solution, the heat-conducting layer can conduct heat. Compared with the solution of arranging a vacuum chamber heat sink on the surface of the copper layer facing away from the light-transmitting cover plate, in this solution, the heat-conducting layer is arranged inside the display module, and the area of the heat-conducting layer can be larger. Therefore, on the basis of reducing the weight of the display module, the display module provided by this solution can also enhance the heat-conducting ability of the display module through the heat-conducting layer. Exemplarily, the heat-conducting layer may be a graphite layer.

[0009] In a possible embodiment, the edges of the third adhesive layer and the fourth adhesive layer can both extend beyond the edge of the heat-conducting layer, and the edges of the third adhesive layer and the fourth adhesive layer are adhered to form a sealing edge area to seal the heat-conducting layer and prevent the heat-conducting layer from delaminating, thereby ensuring the heat-conducting performance of the heat-conducting layer.

[0010] In a possible embodiment, the edge of the display module has a curved surface area, the heat-conducting layer is located within the range enclosed by the curved surface area, and the distance between the edge of the heat-conducting layer and the inner edge of the curved surface area is 1 to 5 millimeters, so as to prevent the heat-conducting layer from entering the curved surface area and causing problems such as fitting imprints and wrinkles.

[0011] In a possible embodiment, the sum of the thicknesses of the first sub-support layer and the third adhesive layer may be 5 to 20 micrometers; and / or, the thickness of the heat-conducting layer may be 10 to 25 micrometers; and / or, the sum of the thicknesses of the fourth adhesive layer and the second sub-support layer may be 5 to 20 micrometers, so that the support layer can play a better supporting role and the display module has stronger anti-imprinting ability.

[0012] In a possible embodiment, the tensile moduli of both the first sub-support layer and the second sub-support layer are not less than 5 GPa, so as to play a better supporting role and the display module has stronger anti-imprinting ability.

[0013] In a possible embodiment, the thickness of the first adhesive layer is 70 to 140 micrometers, and the tensile modulus of the first adhesive layer is not greater than 75 KPa, so that the first adhesive layer can also play a certain role in supporting the display panel and can also help improve the anti-imprinting ability of the display module, making the anti-imprinting ability of the display module better.

[0014] In a possible embodiment, the thickness of the second adhesive layer is 10 to 100 micrometers, and the tensile modulus of the second adhesive layer is not greater than 75 Kpa, so that the second adhesive layer can also play a certain role in supporting the display panel, and the second adhesive layer can also help improve the anti-film printing ability of the display module, making the anti-film printing ability of the display module better.

[0015] In a second aspect, an electronic device provided by an embodiment of the present application includes the display module provided in the first aspect and any possible embodiment thereof. Since the electronic device has the display module provided in the first aspect and any possible embodiment thereof, the electronic device provided by the present application can at least achieve the technical effects that the above display module can achieve, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the simulation result of the relationship between the copper layer thickness shown and the anti-film printing;

[0017] Figure 2 Schematic perspective view of an electronic device provided by the present application;

[0018] Figure 3 is Figure 2 front view of the electronic device shown;

[0019] Figure 4a is Figure 3 A-A cross-sectional view of;

[0020] Figure 4b is Figure 4a partial enlarged view of;

[0021] Figure 5 Partial cross-sectional view of a display module provided by an embodiment of the present application;

[0022] Figure 6 Another partial cross-sectional view of a display module provided by an embodiment of the present application;

[0023] Figure 7 Schematic diagram of the positional relationship between the heat conduction layer and the edge sealing area in a display module provided by an embodiment of the present application;

[0024] Figure 8 Schematic diagram of the positional relationship between the heat conduction layer and the edge sealing area during the processing of a display module provided by an embodiment of the present application;

[0025] Figure 9 Partial cross-sectional view of a display module provided by an embodiment of the present application;

[0026] Figure 10 Partial cross-sectional view of a display module provided by an embodiment of the present application;

[0027] Figure 11 Another partial cross-sectional view of a display module provided by an embodiment of the present application;

[0028] Figure 12a A top view of a display module;

[0029] Figure 12b is Figure 12a A bottom view of the shown display module;

[0030] Figure 13 A side view of a display module.

[0031] Reference numerals: 100 - display module; 110 - middle frame; 120 - back cover; 111 - frame; 112 - middle plate; 1 - display panel; 2 - support backplane; 21 - first adhesive layer; 22 - support layer; 221 - first sub - support layer; 222 - third adhesive layer; 223 - heat - conducting layer; 224 - fourth adhesive layer; 225 - second sub - support layer; 23 - second adhesive layer; 24 - copper layer; 3 - light - transmissive cover plate; 4 - optical adhesive layer; 5 - polarizer; 6 - back film; 200 - structural member; 300 - circuit board; 400 - battery. Detailed implementation manners

[0032] Lightweight is an important direction for the development of electronic devices. How to reduce the weight of each component of an electronic device and ultimately achieve the weight reduction of the entire electronic device is a topic that electronic device manufacturers need to continuously challenge. Specifically, in an electronic device with a display module, the display module includes a light - transmissive cover plate, a screen stack, and a support backplane. Among them, the screen stack includes a display panel, and the support backplane plays a role in supporting and protecting the display panel, making the force on the display panel uniform, and preventing the display module from generating film prints. Among the components of the display module except the light - transmissive cover plate, the heaviest is the copper layer in the support backplane. Taking a mobile phone with a conventional size as an example, a copper layer with a thickness of 1 micron weighs about 0.1 g. And directly reducing the thickness of the copper layer in the support backplane to reduce the overall weight of the display module, although it can effectively control or reduce the weight of the display module, it will reduce the film - print resistance ability of the display module. For example, from Figure 1 the schematic diagram of the simulation result of the relationship between the copper layer thickness and the film - print resistance as shown, when the copper layer thickness is reduced from 50 microns to 25 microns, the film - print resistance ability of the display panel will decrease by about 35%.

[0033] Based on this, the embodiments of the present application provide a display module and an electronic device to maintain the film - print resistance ability of the display module without decreasing while thinning the copper layer in the support backplane and reducing the weight of the display module. To make the purpose, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0034] The terms used in the following embodiments are for the purpose of describing specific embodiments only and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above-mentioned", "said", and "this" are also intended to include expressions such as "one or more", unless the context clearly indicates otherwise.

[0035] References to "one embodiment" or "some embodiments" or the like described in this specification mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc., which appear in different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having" and their variants mean "including but not limited to", unless otherwise specifically emphasized.

[0036] Embodiments of the present application provide a display module and an electronic device. For example, the electronic device may be a wearable device, such as a smart watch, a smart bracelet, etc. The electronic device may also be a mobile phone, a laptop computer, a tablet computer, a vehicle-mounted device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet, etc. The display module can be applied to the above-mentioned various electronic devices. For the convenience of description below, the electronic device is taken as a mobile phone as an example for detailed description.

[0037] Figure 2 It is a schematic three-dimensional structure diagram of an electronic device provided by the present application. Figure 3 is Figure 2 a front view of the shown electronic device. Figure 4a is Figure 3 a sectional view taken along line A-A of Figure 4b is Figure 4a a partial enlarged view of Figure 2 , Figure 3 , Figure 4a and Figure 4b As shown in Figure 4a and Figure 4b, In a specific implementation, the electronic device includes a display module 100, a structural member 200, a circuit board 300, etc. The structural member 200 is used to carry many components including the display module 100 and the circuit board 300. During specific implementation, the structural member 200 can be an integral structure, or the structural member 200 can be split into two components: a middle frame 110 and a back cover 120. Next, in combination with Figure 4a and Figure 4b , the case where the structural member 200 includes two components, the middle frame 110 and the back cover 120, will be introduced. As shown in Figure 4a and Figure 4b , the middle frame 110 includes a frame 111 and a middle plate 112 for carrying each component. The middle plate 112 is fixed inside the middle frame 110, and holes, steps, etc. can be provided on the middle plate 112 to facilitate the setting of each component in the structural member 200. The back cover 120 can also be called the battery 400 cover. The back cover 120 is provided at one end of the middle frame 110, and the back cover 120 and the middle frame 110 jointly enclose a receiving space. The battery 400, the circuit board 300, and other electronic components are all arranged in the receiving space jointly enclosed by the back cover 120 and the middle frame 110. One end of the middle frame 110 opposite to the back cover 120 has an open receiving cavity, and at least a part of the display module 100 is located in the receiving cavity, and the display module 100 is fixedly connected to the middle frame 110.

[0038] Figure 5 is a partial cross-sectional view of a display module 100 provided by an embodiment of the present application. As shown in Figure 5 , in some embodiments, the display module 100 includes a display panel 1 and a support backplane. Among them, the display panel 1 includes a display surface and a backlight surface, and the support backplane is arranged on the backlight surface of the display panel 1. It should be understood that the display panel 1 is a part of the screen stack of the display module 100, and the screen stack further includes other layers. That is to say, the display module 100 includes a screen stack, and the screen stack includes the display panel 1. Other layers of the screen stack will be described in detail later. Next, the support backplane will be introduced. Please continue to refer to Figure 5, the support backplane includes a first adhesive layer 21, a support layer 22, a second adhesive layer 23, and a copper layer 24 that are sequentially arranged in a direction away from the backlight surface of the display panel 1. Among them, the first adhesive layer 21 and the second adhesive layer 23 mainly play an adhesive role. Specifically, the first adhesive layer 21 is used to bond the support layer 22 to the display panel 1, and the second adhesive layer 23 is used to bond the support layer 22 and the copper layer 24 together. Further, the density of the support layer 22 is less than the density of the copper layer 24, and the anti-film printing ability of the support layer 22 is greater than or equal to the anti-film printing ability of the copper layer 24. In this solution, the support layer 22 is added, which can improve the anti-film printing ability of the display module 100 compared with simply reducing the thickness of the copper layer 24 in the support backplane in the related art. Moreover, the density of the support layer 22 is less than the density of the copper layer 24, so that the display module 100 provided by the present application can achieve weight reduction of the display module 100 in the same way as the related art.

[0039] The anti-film printing ability is positively correlated with the thickness of the material. Therefore, when specifically realizing that the anti-film printing ability of the support layer 22 is greater than or equal to the anti-film printing ability of the copper layer 24, the thickness of the support layer 22 can be set to 15-35 microns, which is beneficial to ensuring that the anti-film printing ability of the support layer 22 is greater than or equal to the anti-film printing ability of the copper layer 24, and further enabling the anti-film printing ability of the display module 100 not to decrease or even to be improved. Exemplarily, the thickness of the support layer 22 can be 15 microns, 20 microns, 25 microns, or 35 microns, etc. The support layer 22 can be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a triacetate cellulose layer. The support layer 22 can also be a laminate composed of at least two of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a triacetate cellulose layer. For example: the support layer 22 is a laminate composed of a polyethylene terephthalate layer and a polyimide layer, or the support layer 22 is a laminate composed of a polyimide layer, a polymethyl methacrylate layer, and a cyclic olefin polymer layer, or the support layer 22 is other combinations of the above layers, which will not be listed one by one here. Taking the electronic device as a mobile phone as an example, when the copper layer 24 in the support backplane of the display module 100 is not thinned, the thickness of the copper layer 24 is usually 50 microns. In this solution, the thickness of the copper layer 24 can be 9-35 microns so that the display module 100 can be thinned while reducing weight. When specifically setting the above copper layer 24, in some embodiments, the thickness of the copper layer 24 can be 9 microns, 18 microns, 20 microns, 25 microns, or 35 microns, etc. The tensile modulus of the copper layer 24 is greater than or equal to 100 GPa.

[0040] The anti-film printing ability is also positively correlated with the tensile modulus of the material. Therefore, in some other embodiments, when specifically implementing that the anti-film printing ability of the support layer 22 is greater than or equal to that of the copper layer 24, it may include that the tensile modulus of the support layer 22 is greater than or equal to 5 GPa, so that the anti-film printing ability of the support layer 22 is better, and further the anti-film printing ability of the display module 100 is better. Exemplarily, the tensile modulus of the support layer 22 may be 5 GPa, 10 GPa, or 12 GPa, etc.

[0041] In some embodiments, the thickness of the support layer 22 may be 15 - 35 microns, the tensile modulus of the support layer 22 may be greater than or equal to 5 GPa, and the thickness of the copper layer 24 may be 9 - 35 microns, so that the anti-film printing ability of the support layer 22 is better, and further the anti-film printing ability of the display module 100 is better.

[0042] When specifically setting the above-mentioned first adhesive layer 21, in a specific implementation manner, the thickness of the first adhesive layer 21 may be 70 - 140 microns, and the tensile modulus of the first adhesive layer 21 may not be greater than 75 KPa, so that the first adhesive layer 21 can also play a certain role in supporting the display panel 1, thereby enabling the first adhesive layer 21 to also contribute to improving the anti-film printing ability of the display module 100, making the anti-film printing ability of the display module 100 better. Exemplarily, the thickness of the first adhesive layer 21 may be 70 microns, 80 microns, 100 microns, 130 microns, or 140 microns, etc. The tensile modulus of the first adhesive layer 21 is 30 KPa, 45 KPa, 50 KPa, or 75 KPa; the first adhesive layer 21 is a silica gel layer.

[0043] In some embodiments, the thickness of the second adhesive layer 23 may be 10 - 100 microns, and the tensile modulus of the second adhesive layer 23 may not be greater than 75 KPa, so that the second adhesive layer 23 can also play a certain role in supporting the display panel 1, thereby enabling the second adhesive layer 23 to also contribute to improving the anti-film printing ability of the display module 100, making the anti-film printing ability of the display module 100 better. Exemplarily, the thickness of the second adhesive layer 23 may be 10 microns, 20 microns, 50 microns, or 100 microns, etc. The tensile modulus of the second adhesive layer 23 is 30 KPa, 45 KPa, 50 KPa, or 75 KPa; the second adhesive layer 23 is a silica gel layer.

[0044] The following combines Figure 5 to introduce a specific implementation manner of the present application. As Figure 5As shown in the figure, the display module 100 includes a display panel 1 and a support backplane disposed on the backlight side of the display panel 1. The support backplane includes a first adhesive layer 21, a support layer 22, a second adhesive layer 23, and a copper layer 24 that are sequentially disposed in a direction away from the backlight side of the display panel 1. Among them, the thickness of the first adhesive layer 21 is 100 microns, the thickness of the support layer 22 is 25 microns, the thickness of the second adhesive layer 23 is 20 microns, and the thickness of the copper layer 24 is 18 microns. Both the first adhesive layer 21 and the second adhesive layer 23 are silicone gel layers, and the support layer 22 is a polyethylene terephthalate layer with a thickness of 25 millimeters. In this solution, the thickness of the support backplane is 163 microns, which is 7 microns thinner than the related technology, with a weight reduction of 2.83 g and a 4% improvement in the anti-film printing ability. That is to say, this solution realizes an improvement in the anti-extrusion and film printing ability of the display module 100 while thinning and reducing the weight of the copper layer 24.

[0045] Figure 6 A partial cross-sectional view of another display module 100 provided by an embodiment of the present application is shown in Figure 6 As shown in the figure, in some embodiments, the support layer 22 includes a first sub-support layer 221, a third adhesive layer 222, a heat-conducting layer 223, a fourth adhesive layer 224, and a second sub-support layer 225 that are sequentially disposed in a direction away from the backlight side of the display panel 1. That is to say, the first sub-support layer 221 is adhered to the backlight side of the display panel through the first adhesive layer 21, the heat-conducting layer 223 is adhered to the surface of the first sub-support layer 221 opposite to the display panel 1 through the third adhesive layer 222, the second sub-support layer 225 is adhered to the surface of the heat-conducting layer 223 opposite to the display panel 1 through the fourth adhesive layer 224, and the copper layer 24 is adhered to the surface of the second sub-support layer 225 opposite to the display panel 1 through the second adhesive layer 23. In this solution, the heat-conducting layer 223 can conduct heat. Compared with the solution of setting a vapor chamber (VC) on the surface of the copper layer 24 away from the light-transmitting cover plate, in this solution, the heat-conducting layer 223 is disposed inside the display module 100, and the area of the heat-conducting layer 223 can be larger. Therefore, on the basis of realizing the weight reduction of the display module 100, the display module 100 provided by this solution can also enhance the heat-conducting ability of the display module 100 through the heat-conducting layer 223. Exemplarily, the heat-conducting layer 223 can be a graphite layer.

[0046] Figure 7 A schematic diagram of the positional relationship between the heat-conducting layer 223 and the edge-sealing area in a display module 100 provided by an embodiment of the present application. Please refer to Figure 6 and Figure 7, in some embodiments, the edges of the third adhesive layer 222 and the fourth adhesive layer 224 can both extend beyond the edge of the heat-conducting layer 223, and the edges of the third adhesive layer 222 and the fourth adhesive layer 224 are adhered to form a sealing edge area, closing the heat-conducting layer 223 and preventing delamination of the heat-conducting layer 223, thereby ensuring the heat-conducting performance of the heat-conducting layer 223. Figure 8 In the processing of a display module 100 provided by an embodiment of the present application, the following is a schematic diagram of the positional relationship between the heat-conducting layer 223 and the sealing edge area. As Figure 8 shown, during the processing, the size by which the initial contour c of the sealing edge area exceeds the final contour d required by the supporting backplane is 1 to 5 mm to reserve a cutting area.

[0047] Please continue to refer to Figure 7 , in some embodiments, the edge of the display module 100 has a curved surface area, the heat-conducting layer 223 is located within the range surrounded by the curved surface area A, and the distance C between the edge of the heat-conducting layer 223 and the inner edge of the curved surface area A is 1 to 5 millimeters, that is, the edge of the heat-conducting layer 223 is retracted 1 to 5 millimeters from the edge of the planar area B of the display module 100, so as to avoid the heat-conducting layer 223 entering the curved surface area and causing problems such as fitting imprints and wrinkles. Exemplarily, the distance between the edge of the heat-conducting layer 223 and the inner edge of the curved surface area is 1 millimeter, 2 millimeters or 5 millimeters, etc.

[0048] In some embodiments, the sum of the thicknesses of the first sub-supporting layer 22 and the third adhesive layer 222 can be 5 to 20 micrometers, for example: 5 micrometers, 10 micrometers, 15 micrometers or 20 micrometers, so that the first sub-supporting layer 212 and the third adhesive layer 222 play a certain supporting role and make the display module 100 have stronger anti-imprinting ability.

[0049] When specifically setting the above heat-conducting layer 223, the thickness of the heat-conducting layer 223 can be 10 to 25 micrometers, for example: 10 micrometers, 20 micrometers, or 25 micrometers, so that the heat-conducting layer 223 can also play a certain supporting role, thereby improving the anti-imprinting ability of the display module 100.

[0050] In some possible embodiments, the sum of the thicknesses of the fourth adhesive layer 224 and the second sub-supporting layer 225 can be 5 to 20 micrometers, for example: 5 micrometers, 10 micrometers, 15 micrometers or 20 micrometers, so that the fourth adhesive layer 224 and the second sub-supporting layer 22 also play a supporting role and make the display module 100 have stronger anti-imprinting ability.

[0051] In a possible embodiment, the tensile moduli of the first sub-support layer 221 and the second sub-support layer 225 are both not less than 5 GPa, so as to play a better supporting role and make the display module 100 have stronger anti-film printing ability. Exemplarily, the first sub-support layer 221 may be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cycloolefin polymer layer, and a cellulose triacetate layer. The first sub-support layer 221 may also be a laminate composed of at least two of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cycloolefin polymer layer, and a cellulose triacetate layer. For example, the first sub-support layer 221 is a laminate composed of a polyethylene terephthalate layer and a polyimide layer, or the first sub-support layer 221 is a laminate composed of a polyimide layer, a polymethyl methacrylate layer, and a cycloolefin polymer layer, or the first sub-support layer 22 is other combinations of the above layers, which will not be listed one by one here. The second sub-support layer 225 may also be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cycloolefin polymer layer, and a cellulose triacetate layer. The second sub-support layer 225 may also be a laminate composed of at least two of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cycloolefin polymer layer, and a cellulose triacetate layer, which will not be listed one by one here.

[0052] Figure 9 FIG. is a partial cross-sectional view of a display module 100 provided by an embodiment of the present application. The following will be described in conjunction with Figure 9 A specific implementation manner of the present application will be introduced. As Figure 9As shown in the figure, the display module 100 includes a display panel 1 and a support backplane disposed on the backlight surface of the display panel 1. The support backplane includes a first adhesive layer 21, a first sub-support layer 221, a third adhesive layer 222, a heat-conducting layer 223, a fourth adhesive layer 224, and a second sub-support layer 225, a second adhesive layer 23, and a copper layer 24, which are sequentially disposed in a direction away from the backlight surface of the display panel 1. Among them, both the first adhesive layer 21 and the second adhesive layer 23 are silicone gel layers. The thickness of the first adhesive layer 21 can be 100 microns, and the thickness of the second adhesive layer 23 can be 20 microns. The first sub-support layer 221 and the second sub-support layer 225 can both be polyethylene terephthalate layers. The third adhesive layer 222 and the fourth adhesive layer 224 can both be pressure sensitive adhesive tapes (PSA). The thicknesses of the first sub-support layer 221, the second sub-support layer 225, the third adhesive layer 222, and the fourth adhesive layer 224 can all be 5 microns. The heat-conducting layer 223 can be a graphite layer, and the thickness of the graphite layer is 20 microns. In this solution, the heat dissipation capacity gain of the display module 100 is 0.7 / mA / °C. The anti-extrusion stamping ability of the display module 100 is improved by 46% compared with the related technology, and the display module 100 is reduced in weight by 0.88 - 2.57 g.

[0053] Figure 10 It is a partial cross-sectional view of a display module provided by an embodiment of the present application. Figure 11 It is a partial cross-sectional view of another display module provided by an embodiment of the present application. As Figure 10 and Figure 11 shown, in some embodiments, the display module 100 includes a light-transmitting cover plate 3 and a screen stack. The screen stack has a display surface and a backlight surface. The light-transmitting cover plate 3 is adhesively bonded to the light-emitting surface of the screen stack through an adhesive. Exemplarily, the material of the light-transmitting cover plate can be glass, and the light-transmitting cover plate 3 and the screen stack are adhesively bonded together through an optically clear adhesive (OCA) layer. The display panel 1 is a part of the screen stack. Specifically, the screen stack includes an optically clear adhesive (OCA) layer 4, a polarizer (POL) 5, a display panel 1 (panel), and a back film (BF) 6, which are sequentially disposed in a direction away from the light-transmitting cover plate. Among them, the optically clear adhesive layer 4 is used to bond module materials, the polarizer 5 is used to eliminate the influence of external ambient light, the display panel 1 is used to implement display and touch functions, and the back film 6 is used to support and protect the display panel 1. In other embodiments, the polarizer 5 can be replaced by a color filter on encapsulation (COE), and the color filter can also achieve the function of eliminating the influence of ambient light. Please refer to Figure 4a and Figure 4b, taking the structural member 200 including the middle frame 110 and the back cover 120 as an example, the light-transmitting cover plate 3 is bonded to one end of the middle frame 110 away from the back cover 120, the screen stack is located in the space jointly surrounded by the light-transmitting cover plate and the middle frame 110, and the support back plate 2 is bonded to the middle frame 110 through back glue.

[0054] It should be noted that the display module 100 mentioned in this application can be a straight plate screen, that is, both the light-transmitting cover plate and the screen stack of the display module 100 are flat plates, as Figure 12a and Figure 12b shown, where Figure 12a is a top view of a display module 100, Figure 12b is Figure 12a the bottom view of the display module 100 shown. The display module 100 mentioned in this application can also be a curved screen. For example: the display module 100 is a "2.5D screen", that is, the screen stack of the display module 100 is flat, and the edge of the light-transmitting cover plate is rounded to form a curved surface area, or the display module 100 is a "3D screen", that is, there are curved surface areas Q at the edges of both the screen stack and the light-transmitting cover plate of the display module 100, as Figure 13 shown, where Figure 13 is a side view of a display module 100.

[0055] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to include these changes and modifications.

Claims

1. A display module, characterized in that, It includes a display panel and a support backplane. The display panel includes a display surface and a backlight surface. The support backplane is disposed on the backlight surface. The support backplane includes a first adhesive layer, a support layer, a second adhesive layer, and a copper layer that are sequentially disposed in a direction away from the backlight surface. The density of the support layer is less than that of the copper layer, and the anti-film printing ability of the support layer is greater than or equal to that of the copper layer.

2. The display module according to claim 1, wherein The thickness of the support layer is 15 to 35 micrometers, and the thickness of the copper layer is 9 to 35 micrometers.

3. The display module according to claim 1, wherein The tensile modulus of the support layer is greater than or equal to 5 GPa.

4. The display module according to claim 1, wherein The support layer is a single layer or a laminate composed of at least two of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a cellulose triacetate layer.

5. The display module according to claim 1, wherein The support layer includes a first sub-support layer, a third adhesive layer, a heat-conducting layer, a fourth adhesive layer, and a second sub-support layer that are sequentially disposed in a direction away from the backlight surface.

6. The display module according to claim 5, wherein The edges of the third adhesive layer and the fourth adhesive layer both extend beyond the edge of the heat-conducting layer, and the edges of the third adhesive layer and the fourth adhesive layer are bonded to each other.

7. The display module according to claim 5, wherein The edge of the display module has a curved surface area. The heat-conducting layer is located within the range enclosed by the curved surface area, and the distance between the edge of the heat-conducting layer and the inner edge of the curved surface area is 1 to 5 millimeters.

8. The display module according to claim 5, wherein The sum of the thicknesses of the first sub-support layer and the third adhesive layer is 5 to 20 micrometers; and / or The thickness of the heat-conducting layer is 10 to 25 micrometers; and / or The sum of the thicknesses of the fourth adhesive layer and the second sub-support layer is 5 to 20 micrometers.

9. The display module according to claim 5, wherein The tensile moduli of the first sub-support layer and the second sub-support layer are both not less than 5 GPa.

10. The display module according to any one of claims 1-9, characterized in that, The thickness of the first adhesive layer is 70 to 140 micrometers, and the tensile modulus of the first adhesive layer is not greater than 75 KPa.

11. The display module according to any one of claims 1-9, characterized in that, The thickness of the second adhesive layer is 10 to 100 micrometers, and the tensile modulus of the second adhesive layer is not greater than 75 KPa.

12. An electronic device, characterized in that, It includes a display module according to any one of claims 1-11.

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