Loading machine for manufacturing double-doubling NTC temperature sensor

Abstract

The utility model discloses a loading machine for manufacturing a double-doubling NTC (Negative Temperature Coefficient) temperature sensor, which comprises a box body and a working table top, the working table top is arranged in the box body, the loading machine also comprises a branching rack, the branching rack is arranged on the working table top, and one surface of the branching rack, which is far away from the working table top, is provided with a plurality of branching bumps which are uniformly arranged; the device further comprises a forming push plate, the plate face of the forming push plate is attached to the working face of the branching rack, and a plurality of evenly-arranged wire arranging notches are formed in the end, close to the branching protruding block, of the forming push plate. The device further comprises a wire pressing plate, the wire pressing plate is arranged above the position, where the wire separating protruding blocks are installed, of the wire separating rack, and a plurality of evenly-arranged wire pressing notches are formed in the end, close to the wire separating rack, of the wire pressing plate. The chip suction nozzle is arranged on the working table surface in a way of avoiding the branching rack; the above devices cooperate with each other to complete the loading operation of the double-doubling NTC temperature sensor.

Description

Technical Field

[0001] The utility model relates to the field of chip loading machines, and particularly relates to a loading machine device for manufacturing a dual-parallel NTC temperature sensor. Background Art

[0002] An NTC temperature sensor is a sensor that utilizes the characteristic of material resistance changing with temperature. It is usually a thermistor based on a specific semiconductor material. When the temperature changes, the resistance value of the thermistor changes, and the temperature can be determined by measuring the resistance value.

[0003] NTC temperature sensors are classified according to accuracy and stability, and can be divided into standard-precision NTC sensors and high-precision NTC sensors. Standard-precision NTC sensors are usually single-wire NTC temperature sensors, which have a relatively simple structure and small volume, and are convenient to use in applications with limited space; while the lead configurations of high-precision NTC sensors usually include single-wire, double-wire, three-wire or four-wire, etc. The more complex internal structure makes the size of the sensor slightly larger, and at the same time, it also has higher accuracy and anti-interference ability.

[0004] The structure of an NTC temperature sensor mainly includes an NTC thermistor and leads, etc. A single-wire NTC temperature sensor usually has only one lead, which is used both to measure the resistance and as a bridge for the sensor to connect with other circuits; a dual-parallel NTC temperature sensor has two leads, and these two leads are usually connected in parallel to both ends of the NTC thermistor for measuring the resistance value.

[0005] In the prior art, in the steps of manufacturing an NTC temperature sensor, it is usually necessary to attach the wire to the NTC chip. The operation of loading the wire onto the chip is mostly manual. Workers manually load the cut wires one by one. The pure manual loading operation is not only inefficient but also affects the yield rate of subsequent welding.

[0006] The Chinese utility model patent with the authorization announcement number: CN219520785U discloses a chip welding machine. The chip welding machine includes a chip feeding mechanism and a loading mechanism. The chip is placed on the loading mechanism through the chip feeding mechanism, and the loading mechanism clamps the chip with two fixture plates equipped with cables to complete the chip loading operation. This device realizes the automated operation of chip loading and solves the problem that the traditional chip loading operation requires pure manual operation. However, this chip loading operation is only applicable to loading single-wire products and is not applicable to loading chips for manufacturing dual-wire NTC temperature sensors. Therefore, it is necessary to further improve this device to obtain a more perfect solution. Summary of the Utility Model

[0007] In view of the fact that in the above-mentioned technology, it is impossible to perform the chip loading operation on the NTC temperature sensor with double wires, the present utility model provides a chip loader for manufacturing a double-parallel NTC temperature sensor, which includes a box body and a working table surface. The working table surface is installed inside the box body. It also includes a wire dividing rack, and the wire dividing rack is installed on the working table surface. The side of the wire dividing rack away from the working table surface is set as the working surface, and a number of evenly arranged wire dividing bumps are provided on the working surface. It also includes a forming push plate, and the plate surface of the forming push plate is attached to the working surface of the wire dividing rack. A number of evenly arranged wire aligning notches are provided at one end of the forming push plate close to the wire dividing bumps. It also includes a wire pressing plate, and the wire pressing plate is arranged above the wire dividing rack where the wire dividing bumps are installed. A number of evenly arranged wire pressing notches are provided at one end of the wire pressing plate close to the wire dividing rack. It also includes a chip suction nozzle, and the chip suction nozzle is installed on the working table surface avoiding the wire dividing rack, and the chip suction nozzle is used to adsorb the chip for the chip loading operation.

[0008] As a further improvement scheme of the present utility model, it also includes a linear vibrator tray, a linear vibrator block and a linear vibrator controller. The linear vibrator controller is fixed on the working table surface, and the linear vibrator controller is electrically connected to the linear vibrator block. A linear vibrator connecting plate is fixed on the side of the linear vibrator block away from the working table surface, and the linear vibrator tray is installed on the side of the linear vibrator connecting plate away from the linear vibrator block. Both ends of the linear vibrator block are connected to one end of two linear vibrator connecting pieces, and the other ends of the two linear vibrator connecting pieces are fixedly connected to both ends of a linear vibrator shock-absorbing bottom plate, and the linear vibrator shock-absorbing bottom plate is fixed on the working table surface.

[0009] As a further improvement scheme of the present utility model, a number of downwardly concave conveying tracks are provided on the side of the linear vibrator tray away from the working table surface. A chip retaining bar is also installed on the side of the linear vibrator tray where the conveying tracks are provided. The chip retaining bar divides the linear vibrator tray into a feeding end and a storage end. The linear vibrator tray is also installed with a chip pressing cover, and the chip pressing cover is arranged on the surface of the feeding end to cover the conveying tracks.

[0010] As a further improvement scheme of the present utility model, it also includes a suction nozzle guide rod. A number of fixing holes penetrating through the suction nozzle guide rod are provided on the suction nozzle guide rod, and the chip suction nozzle is installed in the fixing holes. The chip suction nozzle is arranged above the feeding end of the linear vibrator tray.

[0011] As a further improvement of the present utility model, one end of the nozzle guide rod is fixed to the plate surface of the lifting plate, and one side of the lifting plate away from the nozzle guide rod is fixed to the lifting slider. The lifting slider is sleeved on the first ball screw. The first ball screw is perpendicular to the workbench surface. One end of the first ball screw is connected to the first closed-loop motor, and the other end is connected to the sliding bottom plate. One side of the sliding bottom plate away from the first ball screw is fixed to the translation slider. The translation slider is sleeved on the second ball screw. The second ball screw is parallel to the workbench surface. One end of the second ball screw is connected to the second closed-loop motor, and the second closed-loop motor is fixed to the workbench surface.

[0012] As a further improvement of the present utility model, an upper piece platform is installed on the side surface of the first ball screw close to the sliding bottom plate, and an upper piece groove is provided on the side of the upper piece platform away from the workbench surface.

[0013] As a further improvement of the present utility model, it further includes a guide rail. The guide rail is arranged at the feeding end close to the straight vibrating tray. The guide rail is fixed to the workbench surface through a plurality of guide rail vertical plates. The guide rail is slidably connected to the guide rail slider. A belt fixing block is installed on the side surface of the guide rail slider. The belt fixing block is fixedly sleeved with a belt. The belt forms a transmission structure with a plurality of belt wheels. A plurality of the belt wheels are electrically connected to the rotating motor, and a plurality of the belt wheels are fixedly installed on the side surfaces of a plurality of the guide rail vertical plates.

[0014] As a further improvement of the present utility model, a wire tray is fixed to the side of the guide rail slider away from the guide rail, and a wire arranging plate placement groove is provided on the side of the wire tray away from the guide rail slider.

[0015] As a further improvement of the present utility model, it further includes a first pressing strip and a second pressing strip. Both the first pressing strip and the second pressing strip are located on the side away from the workbench surface of the guide rail. At the same time, the first pressing strip is relative to the pressing plate, and the second pressing strip is relative to the nozzle guide rod. Both the first pressing strip and the second pressing strip are connected to the lifting electric cylinder through a connecting plate, and both of the two lifting electric cylinders are fixed to the box body shell.

[0016] The beneficial effects of the present utility model are as follows: Compared with the prior art, a chip loading machine for manufacturing a double-parallel NTC temperature sensor provided by the present utility model can realize the chip loading operation of the double-parallel NTC temperature sensor through the wire dividing rack, the forming push plate, the pressing plate and the upper piece platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the overall view of the present utility model.

[0018] Figure 2Front view of the device on the workbench of the present utility model.

[0019] Figure 3 For the present utility model Figure 2 Partial enlarged view of area A.

[0020] Figure 4 Back view of the device on the workbench of the present utility model.

[0021] Figure 5 Schematic diagram of the shaping device of the present utility model.

[0022] Figure 6 For the present utility model Figure 5 Partial enlarged view of area B.

[0023] Figure 7 Partial device diagram of the present utility model.

[0024] Figure 8 Explosion diagram of the linear vibrator of the present utility model.

[0025] Descriptions of the main component symbols are as follows:

[0026] 1. Box body; 2. Workbench surface; 3. Wire dividing rack; 301. Wire dividing bump; 4. Forming push plate;

[0027] 41. Wire aligning notch; 5. Pressing plate; 51. Pressing notch; 6. Linear vibration tray; 61. Feeding end of the linear vibration tray;

[0028] 62. Storage end of the linear vibration tray; 63. Conveyor track; 64. Chip pressing cover; 65. Chip retaining bar;

[0029] 7. Linear vibration block; 8. Linear vibration controller; 9. Linear vibration connecting plate; 10. Linear vibration connecting piece;

[0030] 11. Linear vibration damping bottom plate; 12. Chip suction nozzle; 13. Suction nozzle guide rod; 14. Lifting plate;

[0031] 15. Lifting slider; 16. First ball screw; 17. First closed-loop motor; 18. Sliding bottom plate;

[0032] 19. Translation slider; 20. Second ball screw; 21. Second closed-loop motor; 22. Guide rail;

[0033] 23. Guide rail vertical plate; 24. Guide rail slider; 25. Belt fixing block; 26. Belt pulley;

[0034] 27. Rotating motor; 28. Wire tray; 281. Placement groove for wire arranging plate; 29. First pressing strip;

[0035] 30. Second wire pressing strip; 31. Lifting electric cylinder; 32. Upper sheet platform; 3201. Upper sheet slot. Specific embodiments

[0036] In order to describe the present invention more clearly, the present invention will be further described below with reference to the accompanying drawings.

[0037] Please refer to Figures 1-8 , a sheet loader for manufacturing a double-parallel NTC temperature sensor of the present invention includes a box body 1 and a workbench surface 2. The workbench surface 2 is installed in the box body 1. It also includes a wire dividing rack 3. The wire dividing rack 3 is installed on the workbench surface 2. One side of the wire dividing rack 3 away from the workbench surface 2 is set as the working surface, and a plurality of evenly arranged wire dividing bumps 301 are arranged at one end of the working surface; it also includes a forming push plate 4. The forming push plate 4 is closely attached to the working surface of the wire dividing rack 3. A plurality of evenly arranged wire aligning notches 41 are arranged at one end of the forming push plate 4 close to the wire dividing bumps 301; it also includes a wire pressing plate 5. The wire pressing plate 5 is arranged on the side of the forming push plate 4 away from the wire dividing rack 3. A plurality of evenly arranged wire pressing notches 51 are arranged at one end of the wire pressing plate 5 close to the wire dividing rack 3; it also includes a chip suction nozzle 12. The chip suction nozzle 12 is installed on the workbench surface 2 avoiding the wire dividing rack 3. The chip suction nozzle 12 is used to adsorb the chip for sheet loading operation.

[0038] More specifically, the wire dividing rack 3, the forming push plate 4 and the wire pressing plate 5 are all controlled to move by a slide rail, a slider and an electric cylinder in the prior art. The specific structure is that the wire dividing rack 3, the forming push plate 4 and the wire pressing plate 5 are of an integral structure. They share a base. The base is fixed to the workbench surface 2. A first slide rail and a second slide rail are installed on one side of the base away from the workbench surface 2. The first slide rail is connected to a first slider. One end of the first slider is fixed to the forming push plate 4, and the other end is fixed to a first electric cylinder. The first electric cylinder is parallel to the workbench surface 2; the second slide rail is connected to a second slider. One end of the second slider is fixedly connected to a connecting vertical plate. A transmission block is installed at the other end of the connecting vertical plate. A second electric cylinder parallel to the workbench surface 2 is installed on the side of the transmission block. A third electric cylinder perpendicular to the workbench surface 2 is installed on one side of the transmission block away from the workbench surface 2. The output end of the third electric cylinder faces the workbench surface 2. The output end of the third electric cylinder is fixed to the wire pressing plate 5; a third slide rail is also installed on the side of the base facing the guide rail. The third slide rail is connected to a third slider. The third slider fixes the wire dividing rack 3. One side of the wire dividing rack 3 close to the workbench surface 2 is connected to the output shaft of a fourth electric cylinder. The fourth electric cylinder is perpendicular to the workbench surface 2. The cylinder body of the fourth electric cylinder is fixed to the side of the base facing the guide rail 22.

[0039] During the whole wire process, the fourth electric cylinder drives the wire dividing rack 3 to move upward. The wire dividing rack 3 separates one end of two bundled wires through the wire dividing bump 301. Then, the second electric cylinder and the third electric cylinder cooperate to drive the wire pressing plate 5 to move downward. The wire pressing plate 5 fixes the wire through the wire pressing notch 51. Then, the first electric cylinder drives the forming push plate 4 to translate on a plane. The forming push plate 4 shapes one end of the two wires through the whole wire notch 41 so that one end of the two wires abuts against each other. At this time, the wire pressing plate 5 can not only fix the wire, but also prevent the wire from warping under the action of the forming push plate 4. Subsequently, the forming push plate 4, the wire pressing plate 5 and the wire dividing rack 3 are reset along the original paths respectively, and the wire is ready to enter the next chip loading operation. The chip nozzle sucks the chip and then inserts the chip from the middle of the two wires. After inserting in place, the chip is pulled backward so that the chip stays at the abutting position in the middle of the two wires, thus completing the loading operation.

[0040] Please refer to Figure 2 and 8 , the feeding device of the present utility model consists of a linear vibrator 6, a linear vibration block 7 and a linear vibration controller 8. The linear vibration controller 8 is fixed on the workbench surface 2. The linear vibration controller 8 is electrically connected to the linear vibration block 7. A linear vibration connecting plate 9 is fixed on one side of the linear vibration block 7 away from the workbench surface 2. A linear vibrator 6 is installed on one side of the linear vibration connecting plate 9 away from the linear vibration block 7. The two ends of the linear vibration block 7 are respectively connected to one end of two linear vibration connecting pieces 10. The other ends of the two linear vibration connecting pieces 10 are connected to the two ends of a linear vibration damping bottom plate 11. The linear vibration damping bottom plate 11 is fixed on the workbench surface 2; A number of downwardly concave conveying tracks 63 are provided on one side of the linear vibrator 6 away from the workbench surface 2. A chip stop bar 65 is also installed on the surface of the linear vibrator 6 where the conveying tracks 63 are provided. The chip stop bar 65 divides the linear vibrator 6 into a feeding end 61 and a storage end 62. A chip pressing cover 64 is also installed on the linear vibrator 6. The chip pressing cover 64 is arranged on the surface of the feeding end 61 to cover the conveying tracks 63.

[0041] During the feeding process, the linear vibration block 7 is started through the linear vibration controller 8, and the linear vibration block 7 vibrates, thereby driving the linear vibrator 6 and the linear vibration connecting plate 9. Since the linear vibration connecting plate 9 is connected to the linear vibration damping bottom plate 11, and the linear vibration damping bottom plate 11 is fixed on the workbench surface 2, the vibration of the linear vibration block 7 will not affect the workbench surface 2, but cause the linear vibrator 6 to vibrate. The linear vibrator 6 is provided with downwardly concave conveying tracks 63. The chip to be loaded is placed at the storage end 62 of the linear vibrator. The vibration of the linear vibrator 6 causes the chip to fall into the conveying tracks 63, and then the chip passes through the chip stop bar 65 in the conveying tracks 63 to reach the feeding end 61 of the linear vibrator, preparing for the suction of the chip nozzle 12.

[0042] Please refer to Figure 2 , Figure 3 andFigure 7 The material taking device of the utility model is composed of a chip suction nozzle 12 and a suction nozzle guide rod 13. The suction nozzle guide rod 13 is provided with a plurality of fixing holes penetrating through the suction nozzle guide rod 13, and the chip suction nozzle 12 is installed in the fixing holes. The chip suction nozzle 12 is arranged above the feeding end 61 of the linear vibrating bowl feeder. One end of the suction nozzle guide rod 13 is fixed on the plate surface of the lifting plate 14. The side of the lifting plate 14 away from the suction nozzle guide rod 13 is fixed to the lifting slider 15. The lifting slider 15 is sleeved on the first ball screw 16. The first ball screw 16 is perpendicular to the workbench surface 2. One end of the first ball screw 16 is connected to the first closed-loop motor 17, and the other end is connected to the sliding bottom plate 18. The sliding bottom plate 18 is fixed to the translation slider 19. The translation slider 19 is sleeved on the second ball screw 20. The second ball screw 20 is parallel to the workbench surface 2. One end of the second ball screw 10 is connected to the second closed-loop motor 21. The second closed-loop motor 21 is fixed to the workbench surface 2. An upper wafer platform 32 is installed on the side surface of the first ball screw 16 close to the sliding bottom plate 18. A wafer loading groove 3201 is arranged on the side of the upper wafer platform 32 away from the workbench surface 2.

[0043] More specifically, the first ball screw 16 is installed on the fixed vertical plate. Three photoelectric sensors are installed on the side surface of the fixed vertical plate facing the guide rail 22. The lifting plate 14 for fixing the suction nozzle guide rod 13 realizes the positioning of three heights through the three photoelectric sensors: the height required for sucking the chip, the height required for transporting the chip, and the height required for installing the chip. The second ball screw 20 is installed on the fixed horizontal plate. The fixed horizontal plate is fixed to the workbench surface 2. Three photoelectric sensors are also installed on the side surface of the fixed horizontal plate. The sliding bottom plate 18 for fixing the translation slider 19 realizes the positioning of three horizontal positions through the three photoelectric sensors: the horizontal position required for sucking the chip, the horizontal position required for transporting the chip, and the horizontal position required for installing the chip. At the same time, the upper wafer platform 32 is fixed to the side surface of the fixed vertical plate close to one end of the sliding bottom plate 18 and thus fixed to the workbench surface. The upper wafer platform 32 moves along with the linear movement of the second slider.

[0044] During the process of picking up, transporting, and installing the chip, the second slider drives the chip nozzle 12 to reach the horizontal position required for picking up the chip, and the first slider drives the chip nozzle 12 to reach the height required for picking up the chip, thereby completing the picking up of the chip. Then, the second slider drives the chip nozzle 12 to reach the horizontal position required for transporting the chip, and the first slider drives the chip nozzle 12 to reach the height required for carrying the chip, thereby completing the transportation of the chip. Finally, the second slider drives the chip nozzle 12 to reach the horizontal position required for installing the chip, thereby completing the installation operation of the chip. The more detailed installation steps are as follows: The first slider drives the chip nozzle 12 to reach the height required for installing the chip, inserts the chip from the middle of the two wire rods, and at the same time inserts the chip into the loading slot 3201 of the loading platform 32. After inserting it in place, since both the chip nozzle 12 and the loading platform 32 are fixed to the second slider by the first ball screw 16, the second slider drives the chip nozzle 12 and the loading platform 32 to slide simultaneously to the horizontal position of chip installation, that is, to perform the action of pulling the chip backward so that the chip stays at the abutting position in the middle of the two wire rods, thereby completing the installation operation of the chip.

[0045] Please refer to Figure 4 and Figure 7 As shown in FIGS. and, the wire transportation device of the present utility model is composed of a guide rail 22, a guide rail slider 24, and a wire tray 28. The guide rail 22 is arranged on one side close to the feeding end 61 of the straight vibrating tray. The guide rail 22 is fixed to the workbench surface 2 by a plurality of guide rail vertical plates 23. The guide rail 22 is slidably connected to the guide rail slider 24. A belt fixing block 25 is installed on the side surface of the guide rail slider 24. The belt fixing block 25 is fixedly sleeved with a belt. The belt forms a transmission structure with a plurality of belt pulleys 26. A plurality of belt pulleys 26 are electrically connected to a rotating motor 27. A plurality of belt pulleys 26 are fixedly installed on the side surfaces of a plurality of guide rail vertical plates 23. A wire tray 28 is fixed to the side of the guide rail slider 24 away from the guide rail 22. A wiring board placement groove 281 is arranged on the side of the wire tray 28 away from the guide rail slider 24.

[0046] Cooperating with the wire transportation device are also a first wire pressing strip 29 and a second wire pressing strip 30. Both the first wire pressing strip 29 and the second wire pressing strip 30 are located on the side of the guide rail 22 away from the workbench surface 2. At the same time, the first wire pressing strip 29 is relative to the wire pressing plate 5, and the second wire pressing strip 30 is relative to the nozzle guide rod 13. Both the first wire pressing strip 29 and the second wire pressing strip 30 are connected to a lifting electric cylinder 31 through a connecting plate. The two lifting electric cylinders 31 are both fixed to the housing 1 of the box body.

[0047] When the utility model is in use, first place the wire cut by the automatic wire cutting and arranging machine in the wire arranging board placement groove 281 of the wire supporting plate 28, and then press the start key. The wire supporting plate 28 moves along the guide rail 22 with the wire to the position of the forming device. The first wire pressing strip 29 moves downward under the action of the lifting electric cylinder 31 and abuts against the wire on the wire supporting plate 28 to fix the position of the wire. Then, the wire dividing rack 3, the forming push plate 4 and the wire pressing plate 5 of the forming device cooperate with each other to shape the wire. After the shaping is completed, the wire supporting plate 28 continues to move along the guide rail 22 with the wire to the position of chip loading. The second wire pressing strip 30 moves downward under the action of the lifting electric cylinder 31 and abuts against the wire on the wire supporting plate 28 to fix the position of the wire. Then, the loading platform 32, the chip suction nozzle 12 and the linear vibrator 6 cooperate with each other to complete the suction, transportation and installation of the chip, thus completing the chip loading operation. After the loading operation is completed, the mechanism for loading returns to its original position. The wire supporting plate 28 moves along the guide rail 22 with the wire after loading to the origin. After completion, the signal lamp lights up. Finally, the worker removes the wire after loading.

[0048] The advantages of the utility model are as follows:

[0049] 1. Through the mutual cooperation of the wire dividing rack, the forming push plate and the wire pressing plate, the utility model can realize the automatic shaping of the wire.

[0050] 2. Through the mutual cooperation of the linear vibrator, the linear vibration block and the linear vibration controller, the utility model can realize the automatic transportation of the chip.

[0051] 3. Through the mutual cooperation of the chip suction nozzle, the suction nozzle guide rod, the first ball screw, the second ball screw and the loading platform, the utility model can realize the operations of automatic suction, transportation and loading of the chip.

[0052] 4. Through the mutual cooperation of the guide rail, the wire supporting plate, the belt pulley, the belt and the rotating motor, the utility model can realize the automatic transportation of the wire.

[0053] The above only discloses several specific embodiments of the utility model, but the utility model is not limited thereto. Any change that can be thought of by those skilled in the art should fall within the protection scope of the utility model.

Claims

1. A chip loading machine for making dual parallel NTC temperature sensors, comprising a box and a work surface, wherein the work surface is installed in the box, characterized in that: It also includes a line dividing rack, the line dividing rack is installed on the work surface, a side of the line dividing rack away from the work surface is set as a working surface, and the working surface is provided with a plurality of evenly arranged line dividing protrusions; It also includes a forming push plate, the plate surface of which fits the working surface of the line dividing rack, and a plurality of evenly arranged line straightening notches are provided at one end of the forming push plate close to the line dividing protrusion; It also includes a wire pressing plate, which is arranged on the plate surface of the forming push plate away from the wire dividing rack, and one end of the wire pressing plate close to the wire dividing rack is provided with a plurality of evenly arranged wire pressing notches; It also includes a chip suction nozzle, which is installed on the workbench away from the line dividing rack, and is used for sucking the chip to perform chip loading operation.

2. The upper machine for manufacturing a double-parallel NTC temperature sensor according to claim 1, characterized in that, It also includes a direct vibration plate, a direct vibration block and a direct vibration controller, wherein the direct vibration controller is fixed on the work surface, the direct vibration controller is electrically connected to the direct vibration block, a direct vibration connecting plate is fixed on a side of the direct vibration block away from the work surface, the direct vibration plate is installed on a side of the direct vibration connecting plate away from the direct vibration block, two ends of the direct vibration block are connected to one end of two direct vibration connecting plates, the other ends of the two direct vibration connecting plates are fixedly connected to two ends of a direct vibration damping bottom plate, and the direct vibration damping bottom plate is fixed to the work surface.

3. The upper machine for manufacturing a double-parallel NTC temperature sensor according to claim 2, characterized in that, A side of the straight vibration plate away from the work surface is provided with a plurality of downwardly recessed conveying tracks, and a chip baffle is also installed on the side of the straight vibration plate where the conveying tracks are provided, and the chip baffle divides the straight vibration plate into a feeding end and a storage end. The straight vibration plate is also provided with a chip pressure cover, and the chip pressure cover is provided on the surface of the feeding end to cover the conveying track.

4. The upper machine for manufacturing a double-parallel NTC temperature sensor according to claim 2, characterized in that, It also includes a nozzle guide rod, which is provided with a plurality of fixing holes penetrating the nozzle guide rod, a plurality of chip nozzles are installed in the plurality of fixing holes, and the plurality of chip nozzles are arranged above the feeding end of the straight vibration plate.

5. The chip loading machine for manufacturing dual parallel NTC temperature sensors according to claim 4, characterized in that: One end of the nozzle guide rod is fixed to the plate surface of the lifting plate, and a side of the lifting plate away from the nozzle guide rod is fixed to a lifting slider, and the lifting slider is sleeved on a first ball screw, and the first ball screw is perpendicular to the work table, one end of the first ball screw is connected to a first closed-loop motor, and the other end is connected to a sliding base plate, and a side of the sliding base plate away from the first ball screw is fixed to a translation slider, and the translation slider is sleeved on a second ball screw, and the second ball screw is parallel to the work table, one end of the second ball screw is connected to a second closed-loop motor, and the second closed-loop motor is fixed to the work table.

6. The chip loading machine for manufacturing dual parallel NTC temperature sensors according to claim 5, characterized in that: A sheet loading platform is installed on the side of the first ball screw close to the sliding bottom plate, and a sheet loading groove is arranged on the side of the sheet loading platform away from the work table.

7. The upper machine for manufacturing a double-parallel NTC temperature sensor according to claim 1, characterized in that, It further includes a guide rail, which is fixed to the workbench surface by a number of guide rail vertical plates. The guide rail is slidably connected to a guide rail slider. A belt fixing block is installed on the side surface of the guide rail slider. The belt fixing block is fixedly sleeved with a belt. The belt forms a transmission structure with a number of belt pulleys. A number of the belt pulleys are electrically connected to a rotating motor, and a number of the belt pulleys are fixedly installed on the side surfaces of a number of the guide rail vertical plates.

8. The chip loading machine for manufacturing dual parallel NTC temperature sensors according to claim 7, characterized in that: One side of the guide rail slider away from the guide rail is fixed with a wire supporting tray, and a wire arranging plate placing groove is arranged on one side of the wire supporting tray away from the guide rail slider.

9. The chip loading machine for manufacturing dual parallel NTC temperature sensors according to claim 8, characterized in that: It further includes a first pressing strip and a second pressing strip. Both the first pressing strip and the second pressing strip are located on the side of the guide rail away from the workbench surface. The first pressing strip is relative to the pressing plate, and the second pressing strip is relative to the chip suction nozzle. Both the first pressing strip and the second pressing strip are respectively connected to a lifting electric cylinder through a connecting plate, and the two lifting electric cylinders are both fixed to the outer shell of the box body.

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