Quartz boat and wafer processing equipment
The quartz boat design with V-shaped and flat-bottomed slots addresses wafer adhesion issues by stabilizing support and enhancing gas flow, reducing fragmentation and improving wafer processing efficiency and quality in semiconductor manufacturing.
Patent Information
- Application Number
- CN202422329679.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-23
AI Technical Summary
During the wafer processing process, existing quartz boats have narrow spaces between the wafer and the groove edges due to narrowness and depth, which is easy to bond during high temperatures and long-term operation, affecting product integrity and processing efficiency.
A quartz boat is designed, using a combined structure of V-shaped groove and flat bottom groove. The V-shaped groove is used for wafer limiting, and the flat bottom groove is used to support and increase gas flow, prevent phosphorus source from remaining and bonding.
Improves the stability and processing efficiency of wafers, reduces fragmentation rates, and improves product integrity and quality.
Smart Images
Figure CN223108863U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a quartz boat and wafer processing equipment. Background Art
[0002] Quartz boats are widely used in the semiconductor industry, mainly for carrying wafers, and in the high-temperature heat treatment process of chip manufacturing, for diffusion, deposition, annealing and other processes. Quartz boats have high-temperature corrosion resistance and good chemical stability, can withstand high temperature and high pressure environments, have excellent thermal conductivity and thermal stability, can ensure high precision and high quality of the heat treatment process, and thus obtain better semiconductor product quality.
[0003] During the manufacturing process, the integrity of the wafer is highly correlated with the quartz boat. The quartz boats currently on the market have narrow and deep slots, which makes the space between the wafer and the edge of the slot narrow. During the phosphorus pre-expansion at high temperature for a long time, due to the particularity of the phosphorus diffusion process, the wafer and the edge of the quartz boat slot form adhesion, resulting in fragments and affecting the integrity of the product.
[0004] In summary, in the prior art, there is a problem in which the quartz boat affects the integrity of the product during the wafer manufacturing process. Utility Model Content
[0005] The purpose of the present application is to provide a quartz boat and wafer processing equipment to solve the problem in the prior art that the quartz boat affects the integrity of the product during the wafer manufacturing process.
[0006] In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:
[0007] On the one hand, an embodiment of the present application provides a quartz boat, the quartz boat includes a first slot rod, a second slot rod, a third slot rod, a fourth slot rod, a first side plate and a second side plate, the first slot rod, the second slot rod, the third slot rod and the fourth slot rod are all arranged in parallel, and the first slot rod and the second slot rod are located above the third slot rod and the fourth slot rod, the projections of the third slot rod and the fourth slot rod on the horizontal plane are located between the projections of the first slot rod and the second slot rod on the horizontal plane, and the first slot rod, the second slot rod, the third slot rod and the fourth slot rod have two ends connected to the first side plate and the second side plate respectively; wherein,
[0008] The inner sides of the first groove bar and the second groove bar are provided with V-shaped grooves, the inner sides of the third groove bar and the fourth groove bar are provided with flat-bottom grooves, and the groove widths of the V-shaped grooves and the flat-bottom grooves are both greater than the width of the wafer;
[0009] When the wafer is placed on the quartz boat, the wafer abuts against the bottom of the flat-bottomed groove and the side walls of the V-shaped groove.
[0010] Optionally, the groove width of the flat-bottomed groove is 2 to 3 mm.
[0011] Optionally, the flat-bottomed groove is a square groove or an inverted trapezoidal groove; and when the flat-bottomed groove is an inverted trapezoidal groove, the included angle of the side walls of the flat-bottomed groove is 15° to 25°.
[0012] Optionally, the included angle of the side walls of the flat-bottomed groove is 20°.
[0013] Optionally, the groove width of the V-shaped groove is 0.4 to 0.8 mm.
[0014] Optionally, the included angle of the side walls of the V-shaped groove is 45° to 75°.
[0015] Optionally, the included angle of the side walls of the V-shaped groove is 60°.
[0016] Optionally, the groove depths of both the V-shaped groove and the flat-bottomed groove are 2 to 4 mm.
[0017] Optionally, the plane where the first groove bar and the second groove bar are located is parallel to the plane where the third groove bar and the fourth groove bar are located; and the distance between the first groove bar and the second groove bar is greater than the distance between the third groove bar and the fourth groove bar.
[0018] On the other hand, the embodiment of the present application also provides a wafer processing device, and the wafer processing device includes the above-mentioned quartz boat.
[0019] Compared with the prior art, the present application has the following beneficial effects:
[0020] An embodiment of the present application provides a quartz boat and a wafer processing device. The quartz boat includes a first groove bar, a second groove bar, a third groove bar, a fourth groove bar, a first side plate, and a second side plate. The first groove bar, the second groove bar, the third groove bar, and the fourth groove bar are all arranged in parallel, and the first groove bar and the second groove bar are located above the third groove bar and the fourth groove bar. The projections of the third groove bar and the fourth groove bar on the horizontal plane are located between the projections of the first groove bar and the second groove bar on the horizontal plane. Both ends of the first groove bar, the second groove bar, the third groove bar, and the fourth groove bar are connected to the first side plate and the second side plate respectively. Among them, V-shaped grooves are provided on the inner sides of the first groove bar and the second groove bar, flat-bottom grooves are provided on the inner sides of the third groove bar and the fourth groove bar, and the groove widths of the V-shaped grooves and the flat-bottom grooves are both greater than the width of the wafer. When the wafer is placed on the quartz boat, the wafer abuts against the bottom of the flat-bottom groove and the side walls of the V-shaped groove. In the quartz boat provided by the present application, the combination of the V-shaped groove and the flat-bottom groove is set. On the one hand, it can achieve a stable wafer support effect. On the other hand, through the setting of the flat-bottom groove, the gas flow between the groove and the wafer can be increased, so that the phosphorus source can be fully decomposed, and no phosphorus source crystals will remain in the groove, thereby preventing the silicon wafer from sticking to the quartz boat and improving the integrity of the wafer product.
[0021] To make the above objects, features, and advantages of the present application more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, makes a detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.
[0023] Figure 1 A schematic structural diagram of the quartz boat provided by the embodiment of the present application.
[0024] Figure 2 A schematic structural diagram of the quartz boat provided by the embodiment of the present application from another perspective.
[0025] Figure 3 A schematic cross-sectional diagram of the first groove bar, the second groove bar, the third groove bar, and the fourth groove bar provided by the embodiment of the present application.
[0026] Figure 4 A schematic cross-sectional diagram of the first groove bar provided by the embodiment of the present application.
[0027] Figure 5 A schematic cross-sectional diagram of the third groove bar provided by the embodiment of the present application.
[0028] In the figure:
[0029] 110 - First groove bar; 120 - Second groove bar; 130 - Third groove bar; 140 - Fourth groove bar; 150 - First side plate; 160 - Second side plate. Detailed implementation manners
[0030] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0031] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.
[0032] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.
[0033] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0034] The following will describe in detail some implementation manners of the present application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0035] As described in the background art, currently, in the processing of wafers, quartz boats are widely used as wafer carrying devices. Currently, the slots on the quartz boats on the market are narrow and deep, making the space between the wafer and the slot edge narrow. Due to the special nature of the diffusion process, using traditional quartz boats will cause wafer sticking, resulting in difficult wafer unloading, low efficiency, high fragmentation rate, and affecting the integrity of the product. Moreover, after forcibly unloading the wafers, there is too much broken silicon slag adhering to the quartz boat, and it needs to be cleaned again every time it is used, increasing the workload of the staff and resulting in low wafer processing efficiency.
[0036] In view of this, in order to solve the above problems, the embodiments of the present application provide a quartz boat. By changing the shape and size of the grooves on the slot rods, it is convenient to insert and take out the wafers, while reducing the breakage rate and improving the integrity and quality of the products.
[0037] The following is an exemplary description of the quartz boat provided by the present application:
[0038] As an optional implementation, please refer to Figure 1 and Figure 2 , the quartz boat provided by the present application includes a first slot rod 110, a second slot rod 120, a third slot rod 130, a fourth slot rod 140, a first side plate 150 and a second side plate 160. The first slot rod 110, the second slot rod 120, the third slot rod 130 and the fourth slot rod 140 are all arranged in parallel, and the first slot rod 110 and the second slot rod 120 are located above the third slot rod 130 and the fourth slot rod 140. The projections of the third slot rod 130 and the fourth slot rod 140 on the horizontal plane are located between the projections of the first slot rod 110 and the second slot rod 120 on the horizontal plane. The two ends of the first slot rod 110, the second slot rod 120, the third slot rod 130 and the fourth slot rod 140 are respectively connected to the first side plate 150 and the second side plate 160; wherein, V-shaped grooves are provided on the inner sides of the first slot rod 110 and the second slot rod 120, flat-bottom grooves are provided on the inner sides of the third slot rod 130 and the fourth slot rod 140, and the groove widths of the V-shaped grooves and the flat-bottom grooves are both greater than the width of the wafer; when the wafer is placed on the quartz boat, the wafer abuts against the bottom of the flat-bottom groove and the side walls of the V-shaped groove.
[0039] In the existing quartz boat, the grooves provided on the four slot rods are all V-shaped grooves. When placing the wafer, the side of the wafer abuts against the V-shaped groove, and the space between the wafer and the groove edge is narrow. During the high-temperature and long-time operation of phosphorus pre-diffusion, due to the particularity of the phosphorus diffusion process, the wafer and the groove edge part of the quartz boat are adhered, resulting in breakage.
[0040] In the present application, the grooves in the third slot rod 130 and the fourth slot rod 140 located at the bottom are set as flat-bottom grooves. By this grooving method, the gas flow between the groove and the wafer is increased, so that the phosphorus source can be fully decomposed and no phosphorus source crystals will remain in the groove, thereby preventing the risk of adhesion between the silicon wafer and the boat and improving the integrity during the wafer processing.
[0041] It can be understood that the first slot rod 110 and the second slot rod 120 provided by the present application are used as the upper slot rods, the third slot rod 130 and the fourth slot rod 140 are used as the lower slot rods. At the same time, the first side plate 150 and the second side plate 160 adopt vertical quartz side plates, and the first slot rod 110, the second slot rod 120, the third slot rod 130 and the fourth slot rod 140 are fixed by the first side plate 150 and the second side plate 160 located at both ends.
[0042] Among them, for the convenience of wafer placement, the first groove rod 110, the second groove rod 120, the third groove rod 130, and the fourth groove rod 140 are all arranged in parallel, and the grooves on the groove rods are arranged on the inner side surfaces of the groove rods. The inner side surfaces referred to in this application are the surfaces of the first groove rod 110, the second groove rod 120, the third groove rod 130, and the fourth groove rod 140 that are used to contact the wafer. Of course, in one implementation, the grooves can also be arranged in a surrounding manner on the groove rods, that is, the outer side surfaces of the first groove rod 110, the second groove rod 120, the third groove rod 130, and the fourth groove rod 140 can also be provided with grooves.
[0043] As one implementation of this application, the plane where the first groove rod 110 and the second groove rod 120 are located may not be parallel to the plane where the third groove rod 130 and the fourth groove rod 140 are located. At this time, the four groove rods can be staggered in the vertical direction to achieve stable support of the wafer. In another implementation, please refer to Figure 3 , the plane where the first groove rod 110 and the second groove rod 120 are located is parallel to the plane where the third groove rod 130 and the fourth groove rod 140 are located; and the distance between the first groove rod 110 and the second groove rod 120 is greater than the distance between the third groove rod 130 and the fourth groove rod 140. That is, the distance X1 in the figure is greater than the distance X2. Through this setting method, the quartz boat as a whole presents an inverted trapezoidal structure, which is convenient for wafer placement and taking.
[0044] In addition, in order to fix the first groove rod 110, the second groove rod 120, the third groove rod 130, and the fourth groove rod 140, support blocks can also be provided between the groove rods, which are not limited here.
[0045] And, please refer to Figure 4 , in the quartz boat provided by this application, V-shaped grooves are provided on the inner side surfaces of the first groove rod 110 and the second groove rod 120. Exemplarily, with the end face as the reference plane, the groove width of the V-shaped groove is 0.4 - 0.8 mm. The included angle of the side walls of the V-shaped groove is 45° - 75°. Exemplarily, the included angle of the side walls of the V-shaped groove can be selected as 45°, 60°, or 75°, and the groove depth of the V-shaped groove is 2 - 4 mm. Figure 4 , A1 represents the groove width of the V-shaped groove, B1 represents the included angle of the side walls of the V-shaped groove, and C1 represents the groove depth of the V-shaped groove. Through the setting of this structure, the included angle of the V-shaped groove on the quartz boat provided by this application is larger than that of the V-shaped groove in the prior art. Such a grooving method is more convenient for wafer guiding, and reduces the contact area between the wafer and the groove edge, and stabilizes the wafer.
[0046] And, please refer to Figure 5, a flat-bottomed groove is provided on the inner side surfaces of the third slot bar 130 and the fourth slot bar 140. The flat-bottomed groove can be a square groove or an inverted trapezoidal groove; for example, the square groove can be set as a rectangular groove. And when the flat-bottomed groove is an inverted trapezoidal groove, the included angle of the side walls of the flat-bottomed groove is 15° to 25°, for example, the included angle can be 15°, 20° or 25°. The groove width of the flat-bottomed groove is 2 to 3 mm. Figure 5 Among them, A2 represents the groove width of the flat-bottomed groove, B2 represents the included angle of the side walls of the flat-bottomed groove, and C2 represents the groove depth of the flat-bottomed groove. Through the setting of this grooving method, the gas flow between the groove and the wafer can be increased, so that the phosphorus source can be fully decomposed, and no phosphorus source crystals will remain in the groove, thereby preventing the risk of adhesion between the silicon wafer and the boat.
[0047] Generally speaking, in the quartz boat provided by the present application, V-shaped grooves are provided on the first slot bar 110 and the second slot bar 120 located above, while flat-bottomed grooves are provided on the third slot bar 130 and the fourth slot bar 140 located below. By combining the use of V-shaped grooves and flat-bottomed grooves, on the one hand, stable holding of the wafer can be achieved. That is, the bottom of the wafer is supported by the flat-bottomed groove, and at the same time, the wafer is limited by the V-shaped groove to ensure that the wafer does not slide randomly. On the other hand, after combining the sizes of the V-shaped groove and the flat-bottomed groove, it can be ensured that the included angle of the V-shaped groove increases, reducing the contact area between the wafer and the groove edge, and at the same time ensuring the gas flow at the bottom of the wafer. Specifically, the thickness of the wafer is 525 microns to 775 microns. Therefore, in the quartz boat provided by the present application, firm holding between the wafer and the slot bar can be ensured, and at the same time, sufficient clearance can be ensured between the wafer and the groove to ensure the normal flow of the phosphorus source gas and prevent a large amount of accumulation at the contact points between the wafer and the groove. In addition, when the flat-bottomed groove is set as an inverted trapezoidal groove, its side walls are inclined, which is more convenient for gas flow, no phosphorus source crystals will remain in the groove, and thus it is not easy to have adhesion between the wafer and the quartz boat.
[0048] Based on the above implementation manner, the embodiment of the present application also provides a wafer processing device, and the wafer processing device includes the above-mentioned quartz boat.
[0049] In summary, the embodiment of the present application provides a quartz boat and a wafer processing device. The quartz boat includes a first groove bar, a second groove bar, a third groove bar, a fourth groove bar, a first side plate, and a second side plate. The first groove bar, the second groove bar, the third groove bar, and the fourth groove bar are all parallelly arranged, and the first groove bar and the second groove bar are located above the third groove bar and the fourth groove bar. The projections of the third groove bar and the fourth groove bar on the horizontal plane are located between the projections of the first groove bar and the second groove bar on the horizontal plane. The two ends of the first groove bar, the second groove bar, the third groove bar, and the fourth groove bar are respectively connected to the first side plate and the second side plate. Among them, V-shaped grooves are provided on the inner sides of the first groove bar and the second groove bar, flat-bottom grooves are provided on the inner sides of the third groove bar and the fourth groove bar, and the groove widths of the V-shaped grooves and the flat-bottom grooves are both greater than the width of the wafer. When the wafer is placed on the quartz boat, the wafer abuts against the bottom of the flat-bottom groove and the side walls of the V-shaped groove. In the quartz boat provided by the present application, the combination of the V-shaped groove and the flat-bottom groove is set. On the one hand, it can achieve a stable wafer support effect. On the other hand, through the setting of the flat-bottom groove, the gas flow between the groove and the wafer can be increased, so that the phosphorus source can be fully decomposed and no phosphorus source crystals will remain in the groove, thereby preventing the silicon wafer from sticking to the quartz boat and improving the integrity of the wafer product.
[0050] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
[0051] For those skilled in the art, it is obvious that the present application is not limited to the details of the above-described exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present application is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the present application. Any reference signs in the claims should not be regarded as limiting the claimed rights.
Claims
1. A quartz boat, characterized in that, The quartz boat includes a first groove bar, a second groove bar, a third groove bar, a fourth groove bar, a first side plate, and a second side plate. The first groove bar, the second groove bar, the third groove bar, and the fourth groove bar are all arranged in parallel. The first groove bar and the second groove bar are located above the third groove bar and the fourth groove bar. The projections of the third groove bar and the fourth groove bar on the horizontal plane are located between the projections of the first groove bar and the second groove bar on the horizontal plane. The two ends of the first groove bar, the second groove bar, the third groove bar, and the fourth groove bar are respectively connected to the first side plate and the second side plate; wherein, V-shaped grooves are provided on the inner sides of the first groove bar and the second groove bar, flat-bottom grooves are provided on the inner sides of the third groove bar and the fourth groove bar, and the groove widths of the V-shaped grooves and the flat-bottom grooves are both larger than the width of the wafer; When the wafer is placed on the quartz boat, the wafer abuts against the bottom of the flat-bottom groove and the side walls of the V-shaped groove.
2. The quartz boat according to claim 1, wherein, The groove width of the flat-bottom groove is 2 - 3 mm.
3. The quartz boat according to claim 1, wherein The flat-bottom groove is a square groove or an inverted trapezoidal groove; and when the flat-bottom groove is an inverted trapezoidal groove, the included angle of the side walls of the flat-bottom groove is 15° - 25°.
4. The quartz boat according to claim 3, characterized in that, The included angle of the side walls of the flat-bottom groove is 20°.
5. The quartz boat according to claim 1, characterized in that, The groove width of the V-shaped groove is 0.4 - 0.8 mm.
6. The quartz boat according to claim 1, wherein The included angle of the side walls of the V-shaped groove is 45° - 75°.
7. The quartz boat according to claim 6, wherein, The included angle of the side walls of the V-shaped groove is 60°.
8. The quartz boat according to claim 1, characterized in that, The groove depths of the V-shaped groove and the flat-bottom groove are both 2 - 4 mm.
9. The quartz boat according to claim 1, characterized in that, The plane where the first groove bar and the second groove bar are located is parallel to the plane where the third groove bar and the fourth groove bar are located; and the distance between the first groove bar and the second groove bar is greater than the distance between the third groove bar and the fourth groove bar.
10. A wafer processing device, characterized in that, The wafer processing equipment includes the quartz boat according to any one of claims 1 to 9.