Circuit board degumming tool and circuit board degumming system

Abstract

The utility model provides a circuit board degumming tool and a circuit board degumming system. The circuit board degumming tool comprises a scraper, a soldering bit and a soldering station, wherein the scraper comprises a scraper end head and a connecting end which are connected with each other; the soldering bit is detachably connected with the scraper end head through the connecting end; the welding table is located on the side, away from the scraper, of the soldering bit. According to the embodiment of the invention, by designing the scrapers and the solder tip which are detachably connected, different scrapers can be quickly and conveniently switched according to the connecting mode of the connecting end, different circuit board scenes can be adapted, the efficiency is improved, meanwhile, resources are saved through a ready-made soldering station on an operation site, and in the using process, only the glue fixing position is heated, so that the cost is reduced. And damage to surrounding devices is avoided, and the soldering bit is high in compatibility, high in operability and high in degumming efficiency. The tool is simple in structure and convenient to operate.

Description

Technical Field

[0001] The present application relates to the technical field of degumming equipment. Specifically, the present application relates to a circuit board degumming tool and a circuit board degumming system. Background Art

[0002] With the development of the aviation industry, the internal integration degree of various control devices is getting higher and higher. Traditional discrete devices are gradually replaced by integrated chips. In order to improve their reliability in complex environments, the electronic components on their circuit boards are still mainly through-hole devices, supplemented by fixing glue to fix the devices, further improving the anti-seismic performance. The fixing glue is relatively hard after curing. For traditional chemical degumming methods, it takes a long time to use a debonder, and it is difficult to achieve good results for relatively thick fixing glue.

[0003] Common degumming tools are not suitable for this kind of fixing glue and are mostly used for removing soft glue in the mobile phone industry. The operation is relatively easy and mainly consists of a scraper and a soldering station. The soldering station heats the scraper, and the heated scraper contacts the glue to soften it, then the glue is gradually removed, and finally the solder joints are cleaned with alcohol.

[0004] For traditional chemical degumming methods, it takes a long time to use a debonder, and it is difficult to achieve good results for relatively thick fixing glue. For the degumming tools in the mobile phone industry, the requirements for the soldering station by the scraper are single, usually a 936 soldering station, and the size of the scraper does not meet the space requirements for removing the glue of on-site circuit board components, greatly limiting its use.

[0005] In summary, the degumming tools in the prior art have technical problems of long time consumption and poor degumming effect. Utility Model Content

[0006] In view of the shortcomings of the existing methods, the present application provides a circuit board degumming tool and a circuit board degumming system to solve the technical problems of long time consumption and poor degumming effect existing in the prior art.

[0007] In a first aspect, an embodiment of the present application provides a circuit board degumming tool, including a scraper, a soldering iron tip, and a soldering station:

[0008] The scraper includes a scraper end and a connection end connected to each other;

[0009] The soldering iron tip is detachably connected to the scraper end through the connection end;

[0010] The soldering station is located on a side of the soldering iron tip away from the scraper.

[0011] In some embodiments of the present application, the connection end includes a hexagonal mounting structure and a rear thread structure that are connected to each other. The hexagonal mounting structure is connected to the scraper head end, and the rear thread structure is located on the side of the hexagonal mounting structure away from the scraper head end.

[0012] In some embodiments of the present application, the side of the soldering iron tip facing the scraper has a slot hole, and the inner wall of the slot hole has an internal thread structure that cooperates with the rear thread structure.

[0013] In some embodiments of the present application, the connection end includes a magnetic joint. The side of the soldering iron tip facing the scraper has a magnetic groove, and the magnetic joint and the magnetic groove have opposite magnetic polarities.

[0014] In some embodiments of the present application, the middle part of the scraper head end is a quadrangular prism, and the tip is a triangular prism. The cross-sectional contour of the triangular prism is an isosceles triangle, and the cross-sectional area of the scraper head end gradually decreases from the middle part to the tip.

[0015] In some embodiments of the present application, the middle part of the scraper head end has a cylindrical contour, and the tip has a conical contour. The cross-sectional area of the scraper head end gradually decreases from the middle part to the tip.

[0016] In some embodiments of the present application, the middle part of the scraper head end is a quadrangular prism, and the tip is a triangular prism. The cross-sectional contour of the triangular prism is a right triangle, and the cross-sectional area of the scraper head end gradually decreases from the middle part to the tip.

[0017] In some embodiments of the present application, the middle part of the scraper head end is an elliptic cylinder, and the elliptic cylinder has a curved surface.

[0018] In some embodiments of the present application, the soldering station includes a heating solder, a temperature controller, and a control chip. The control chip is respectively signal-connected to the heating solder and the temperature controller.

[0019] In a second aspect, embodiments of the present application further provide a circuit board degumming system, including a circuit board and the circuit board degumming tool as described in any one of the embodiments in the first aspect. The scraper in the circuit board degumming tool contacts the colloid on the circuit board.

[0020] The beneficial technical effects brought by the technical solution provided in the embodiment of the present application include: by designing a detachable scraper and soldering iron tip, different scrapers can be quickly and conveniently switched according to the connection method of the connection end to adapt to different circuit board scenarios, improve efficiency, and save resources by using an off-the-shelf soldering station on-site. During use, only the position of the fixing glue is heated to avoid damage to surrounding devices. The soldering iron tip has strong compatibility and operability, and high glue removal efficiency. This tool has a simple structure and is easy to operate.

[0021] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or can be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easy to understand from the following description of the embodiments in conjunction with the drawings, where:

[0023] Figure 1 is a schematic structural diagram of a circuit board glue removal tool in an embodiment of the present application;

[0024] Figure 2 is a schematic structural diagram of a scraper in an embodiment of the present application;

[0025] Figure 3 is a schematic structural diagram of a soldering iron tip in an embodiment of the present application;

[0026] Figure 4 is a schematic structural diagram of another scraper in an embodiment of the present application;

[0027] Figure 5 is a schematic structural diagram of yet another scraper in an embodiment of the present application;

[0028] Figure 6 is a schematic structural diagram of still another scraper in an embodiment of the present application.

[0029] REFERENCE SIGNS:

[0030] 100 / 400 / 500 / 600 - scraper, 200 - soldering iron tip, 300 - soldering station

[0031] 101 - rear thread structure, 102 - hexagonal mounting structure, 103 - scraper end. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The embodiments of the present application will be described below with reference to the drawings in the present application. It should be understood that the embodiments described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not constitute a limitation to the technical solutions of the embodiments of the present application.

[0033] Those skilled in the art can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the above" and "the" used herein may also include the plural forms. It should be further understood that the term "including" used in the specification of this application means the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence of other features, information, data, steps, operations, elements, components and / or their combinations supported by the art. It should be understood that when we say an element is "connected" to another element, the one element can be directly connected to the other element, or it can mean that the one element and the other element establish a connection relationship through an intermediate element. In addition, "connection" used herein can include wireless connection.

[0034] To make the objectives, technical solutions and advantages of this application clearer, the following will further describe the embodiments of this application in detail with reference to the accompanying drawings. It should be noted that the following embodiments can be referred to, learned from or combined with each other. For the same terms, similar features and similar implementation steps in different embodiments, they will not be described repeatedly.

[0035] In view of the disadvantages of the existing methods, this application proposes a circuit board degumming tool and a circuit board degumming system to solve the technical problems of long time consumption and poor degumming effect existing in the prior art.

[0036] In a first aspect, an embodiment of this application provides a circuit board degumming tool, as Figure 1 shown, Figure 1 which is a schematic structural diagram of a circuit board degumming tool in an embodiment of this application.

[0037] The circuit board degumming tool includes a scraper 100, a soldering iron tip 200, and a soldering station 300:

[0038] The scraper 100, the scraper 100 includes a scraper end 103 and a connection end that are connected to each other;

[0039] The soldering iron tip 200 is detachably connected to the scraper end 103 through the connection end;

[0040] The soldering station 300 is located on the side of the soldering iron tip 200 away from the scraper 100.

[0041] In the embodiment of this application, by designing the detachable connection between the scraper 100 and the soldering iron tip 200, different scrapers 100 can be quickly and conveniently switched according to the connection method of the connection end to adapt to different circuit board scenarios, improve efficiency, and at the same time save resources by using the existing soldering station 300 on the operation site. During the use process, only the fixed glue position is heated to avoid damaging the surrounding devices. The soldering iron tip 200 has strong compatibility, strong operability, and high degumming efficiency. This tool has a simple structure and convenient operation.

[0042] As Figure 2 and Figure 3 shown, Figure 2 is a schematic structural diagram of a scraper 100 in an embodiment of the present application; Figure 3 is a schematic structural diagram of a soldering iron tip 200 in an embodiment of the present application.

[0043] In some embodiments of the present application, the connection end includes a hexagonal mounting structure 102 and a rear thread structure 101 that are connected to each other. The hexagonal mounting structure 102 is connected to the scraper tip 103, and the rear thread structure 101 is located on a side of the hexagonal mounting structure 102 away from the scraper tip 103.

[0044] In some embodiments of the present application, a side of the soldering iron tip 200 facing the scraper 100 has a slot hole, and an inner wall of the slot hole has an internal thread structure that cooperates with the rear thread structure 101.

[0045] In this embodiment, the connection end of the scraper 100 and the soldering iron tip 200 are detachably connected through the rear thread structure 101 and the internal thread structure. The scraper 100 is threadedly connected to the soldering iron tip 200, which is convenient for disassembly. By adjusting the temperature of the soldering station 300, the temperature of the scraper 100 is ultimately controlled. The scraper 100 heats the fixing glue and softens the fixing glue through the physical heating principle, thereby facilitating and quickly removing the glue.

[0046] Without replacing the soldering iron tip 200 and the soldering station 300, multiple scrapers 100 suitable for different application scenarios can be prepared, and it is convenient to replace a more suitable scraper 100 during the glue removal process.

[0047] Threaded connection only requires the cooperation of thread teeth, has a relatively simple structure, and a relatively low manufacturing cost. Threaded connection can generate a large frictional force during fastening, with high reliability. Threaded connection is suitable for connections of various different materials, different thicknesses, and different sizes. Threaded connection can adjust the torque through the thread during fastening, which is convenient for adjustment. Threaded connection is relatively convenient for disassembly and installation, and the maintenance is relatively simple.

[0048] In some embodiments of the present application, the connection end includes a magnetic joint, and a side of the soldering iron tip 200 facing the scraper 100 has a magnetic groove, and the magnetic joint and the magnetic groove have opposite magnetic polarities.

[0049] In this embodiment, the connecting end of the scraper 100 and the soldering iron tip 200 are detachably connected through a magnetic structure. The magnetic connection utilizes magnetic attraction to achieve connection, with a fast connection speed, improving work efficiency. The magnetic connection does not require tools for connection and disconnection, and the operation is simple and convenient. The magnetic connection is suitable for metal materials, especially more suitable for connecting thin-walled metal parts. The magnetic connection has a certain shock absorption and noise reduction effect during the connection process. The magnetic connection can be reused multiple times, having a certain economy and durability.

[0050] In some embodiments of the present application, the middle part of the scraper tip 103 is a quadrangular prism, and the tip is a triangular prism. The cross-sectional contour of the triangular prism is an isosceles triangle, and the cross-sectional area of the scraper tip 103 gradually decreases from the middle part to the tip.

[0051] In this embodiment, the scraper tip 103 of the scraper 100 is triangular, suitable for processing glue at the position where the component is slender. The cross-sectional area of the tool tip is large, the effective contact space with the glue is large, the processing is fast, and it is not easy to break.

[0052] As Figure 4 shown, Figure 4 FIG. is a schematic structural diagram of another scraper 400 in the embodiment of the present application.

[0053] In some embodiments of the present application, the middle part contour of the scraper tip 103 is a cylinder, and the tip contour is a cone. The cross-sectional area of the scraper tip 103 gradually decreases from the middle part to the tip.

[0054] In this embodiment, the middle part of the scraper 400 is cylindrical, and the tip is slender, suitable for processing fixing glue at a relatively narrow position between adjacent components. The tip extends into the fixing glue, continuously heats it to soften it, which is convenient for cleaning, and will not contact the surrounding devices and cause damage.

[0055] As Figure 5 shown, Figure 5 FIG. is a schematic structural diagram of yet another scraper 500 in the embodiment of the present application.

[0056] In some embodiments of the present application, the middle part of the scraper tip 103 is a quadrangular prism, and the tip is a triangular prism. The cross-sectional contour of the triangular prism is a right triangle, and the cross-sectional area of the scraper tip 103 gradually decreases from the middle part to the tip.

[0057] In this embodiment, the scraper 500 is suitable for processing at the place where the relative position of the components is loose and the fixing glue is applied thickly. The front section of this tool tip is sharp, forming a cutting surface, which can cut the fixing glue like a knife edge while heating, and the processing speed is fast.

[0058] As Figure 6 shown,Figure 6 This is a schematic structural diagram of another scraper 600 in the embodiments of the present application.

[0059] In some embodiments of the present application, the middle part of the scraper end 103 is an elliptical cylinder, and the elliptical cylinder has an arc surface.

[0060] In this embodiment, the scraper end 103 of the scraper 600 is an elliptical arc, which is suitable for fixing glue in a large area around large devices, enabling its surface to be heated rapidly. When cooperating with other tool heads, the residual glue can be processed quickly and conveniently.

[0061] In some embodiments of the present application, the soldering station 300 includes a heating solder, a temperature controller, and a control chip, and the control chip is respectively signal-connected to the heating solder and the temperature controller.

[0062] In this embodiment, the soldering iron tip 200 has an internal thread structure or a magnetic structure and can be used in cooperation with the soldering station 300 at the production site, etc. The temperature controller can sense the temperature of the heating solder and transmit the sensing result to the control chip. The control chip controls the power of the heating solder to control the soldering station 300 to be at a preset temperature.

[0063] During use, the soldering iron tip 200 is installed on the soldering pen, and the scraper 100 is installed on the soldering iron tip 200 through a threaded connection structure with a hexagonal wrench, which is convenient for replacing the scraper 100 with different structures. By adjusting the temperature of the soldering iron, the temperature of the scraper end 103 can be conveniently controlled. The scraper 100 is aligned with the position where degumming is required and heated to soften it rapidly, so as to conveniently remove the fixed hard glue, and at the same time avoid damage caused by excessive heat concentration to the surrounding components.

[0064] In a second aspect, the embodiments of the present application further provide a circuit board degumming system, including a circuit board and a circuit board degumming tool as described in any one of the embodiments in the first aspect, and the scraper 100 in the circuit board degumming tool contacts the glue on the circuit board.

[0065] Compared with the prior art, by applying the embodiments of the present application, at least the following beneficial effects can be achieved: Through the design of the detachable connection between the scraper 100 and the soldering iron tip 200, different scrapers 100 can be quickly and conveniently switched according to the connection method of the connection end, adapting to different circuit board scenarios, improving efficiency, and saving resources by using the existing soldering station 300 at the operation site. During use, only the position of the fixed glue is heated to avoid damage to the surrounding devices. The soldering iron tip 200 has strong compatibility and operability, and high degumming efficiency. This tool has a simple structure and convenient operation.

[0066] In the description of the present application, the directions or positional relationships indicated by terms such as "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the exemplary directions or positional relationships shown in the drawings. They are for the convenience of describing or simplifying the embodiments of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as a limitation to the present application.

[0067] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0068] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0069] In the description of this specification, the specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0070] Those skilled in the art of the present technology can understand that the various operations, methods, steps, measures and solutions in the processes discussed in the present application can be alternated, changed, combined or deleted. Further, the other steps, measures and solutions in the various operations, methods and processes discussed in the present application can also be alternated, changed, rearranged, decomposed, combined or deleted. Further, the steps, measures and solutions in the prior art that are the same as those disclosed in the present application can also be alternated, changed, rearranged, decomposed, combined or deleted.

[0071] The above are only some embodiments of the present application. It should be noted that for those of ordinary skill in the art of the present technology, without departing from the technical concept of the solution of the present application, adopting other similar implementation means based on the technical idea of the present application also belongs to the protection scope of the embodiments of the present application.

Claims

1. A circuit board debonding tool, characterized in that, Comprising: A scraper, the scraper comprising a scraper tip and a connection end connected to each other; A soldering iron tip, detachably connected to the scraper tip through the connection end; A soldering station, located on a side of the soldering iron tip away from the scraper.

2. The debonding tool for circuit boards according to claim 1, characterized in that, The connection end comprises a hexagonal mounting structure and a rear thread structure connected to each other, the hexagonal mounting structure is connected to the scraper tip, and the rear thread structure is located on a side of the hexagonal mounting structure away from the scraper tip.

3. The debonding tool for circuit boards according to claim 2, wherein, One side of the soldering iron tip facing the scraper has a slot hole, and the inner wall of the slot hole has an internal thread structure, and the internal thread structure is matched with the rear thread structure.

4. The debonding tool for circuit boards according to claim 1, wherein, The connection end comprises a magnetic connector, one side of the soldering iron tip facing the scraper has a magnetic groove, and the magnetic polarities of the magnetic connector and the magnetic groove are opposite to each other.

5. The debonding tool for circuit boards according to claim 1, wherein The middle part of the scraper tip is a quadrangular prism, and the tip is a triangular prism. The cross-sectional contour of the triangular prism is an isosceles triangle, and the cross-sectional area of the scraper tip gradually decreases from the middle part to the tip.

6. The de-bonding tool for circuit boards according to claim 1, wherein, The middle part of the scraper tip has a cylindrical contour, and the tip has a conical contour. The cross-sectional area of the scraper tip gradually decreases from the middle part to the tip.

7. The de-bonding tool for circuit boards according to claim 1, characterized in that, The middle part of the scraper tip is a quadrangular prism, and the tip is a triangular prism. The cross-sectional contour of the triangular prism is a right triangle, and the cross-sectional area of the scraper tip gradually decreases from the middle part to the tip.

8. The debonding tool for circuit boards according to claim 1, wherein, The middle part of the scraper tip is an elliptic cylinder, and the elliptic cylinder has a curved surface.

9. The debonding tool for circuit boards according to claim 1, wherein The soldering station comprises a heating solder, a temperature controller and a control chip, and the control chip is respectively in signal connection with the heating solder and the temperature controller.

10. A circuit board degumming system, characterized in that, Comprising a circuit board and a circuit board degumming tool according to any one of claims 1 to 9, and the scraper in the circuit board degumming tool is in contact with the colloid on the circuit board.

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