Mesh disassembling and assembling jig

Abstract

The utility model provides a mesh dismounting and mounting jig, which is used for dismounting and mounting a mesh in semiconductor equipment, and comprises a positioning piece used for being detachably connected with the semiconductor equipment; the supporting assembly is provided with a positioning hole, and the positioning piece is used for being detachably arranged in the positioning hole in a penetrating mode; the locking piece is arranged on the supporting assembly and used for enabling the positioning piece to be fixedly arranged in the positioning hole in a locking state; and when the positioning piece is fixedly arranged in the positioning hole, the supporting assembly can be used for supporting the mesh grid, so that the mesh grid is disassembled or assembled. According to the invention, the number of operators required for dismounting and mounting the mesh can be reduced, the operation area is liberated, the operation efficiency is improved, and mesh damage caused by manual protection and holding of the mesh is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor technology, and more particularly to a grid disassembly and assembly fixture. Background Art

[0002] During the maintenance of semiconductor equipment, it is necessary to disassemble and assemble the double-layer grid in the device.

[0003] In the related art, the double-layer grid is disassembled and assembled by means of multi-person operation. Taking disassembly as an example, during the process of one person disassembling the screws fixing the double-layer grid, another person needs to hold the double-layer grid to prevent it from falling. Similarly, during the installation process of the double-layer grid, one person also needs to hold the double-layer grid to prevent it from falling, and another person installs the screws fixing the double-layer grid into the semiconductor equipment.

[0004] However, the above method requires multi-person operation, which affects the operation space and seriously reduces the operation efficiency. Moreover, when manually holding the double-layer grid, the double-layer grid is prone to uneven force, resulting in deformation or other damage to the double-layer grid, affecting the subsequent semiconductor process flow.

[0005] In view of the above technical problems, the utility model provides a new grid disassembly and assembly fixture. Summary of the Utility Model

[0006] A series of simplified concepts are introduced in the summary of the utility model part, which will be further described in detail in the specific implementation part. The summary of the utility model part does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0007] In view of the existing problems, the utility model provides a grid disassembly and assembly fixture for disassembling and assembling the grid in a semiconductor device, and the grid disassembly and assembly fixture includes:

[0008] A positioning member for detachably connecting to the semiconductor device;

[0009] A support assembly provided with a positioning hole, and the positioning member is detachably inserted into the positioning hole;

[0010] A locking member provided on the support assembly for fixedly setting the positioning member in the positioning hole in the locked state;

[0011] Wherein, when the positioning member is fixedly arranged in the positioning hole, the support assembly can be used to support the grid to achieve disassembly or installation of the grid.

[0012] In some embodiments of the present application, the locking member is further configured to movably arrange the positioning member in the positioning hole in the released state;

[0013] Wherein, when the positioning member is movably arranged in the positioning hole, the support assembly can move along the positioning member.

[0014] In some embodiments of the present application, the positioning member includes a positioning pin,

[0015] A first end of the positioning pin has a first threaded portion, and the positioning pin is detachably connected to the semiconductor device through the first threaded portion;

[0016] A second end of the positioning pin has a second threaded portion, and the locking member restricts the second threaded portion in the locked state so that the positioning member is fixedly arranged in the positioning hole.

[0017] In some embodiments of the present application, the locking member includes:

[0018] A locking portion, a first elastic member, and a first operation portion, wherein the first elastic member is configured to drive the locking portion to contact the positioning member through its own elastic force so that the locking member is in the locked state, and the first operation portion is configured to drive the locking portion to disengage from the positioning member after receiving a user operation so that the locking member is in the released state.

[0019] In some embodiments of the present application, the support assembly includes:

[0020] A base;

[0021] A support member;

[0022] A knob, arranged on the base and connected to the support member, for driving the support member to approach or move away from the base.

[0023] In some embodiments of the present application, the support member is configured as an annular structure.

[0024] In some embodiments of the present application, the grid includes a double-layer grid.

[0025] In some embodiments of the present application, the grid disassembly and assembly fixture further includes:

[0026] A calibration member, arranged on the base, for calibrating the double-layer grid.

[0027] In some embodiments of the present application, the calibration member includes:

[0028] A calibration unit, a second elastic member, and a second operation unit, wherein the second operation unit is configured to drive the calibration unit to calibrate the double-layer grid through the second elastic member after receiving a calibration operation, and the second elastic member is configured to drive the calibration unit to reset through its own elastic action after the second operation unit receives a reset operation.

[0029] In some embodiments of the present application, the semiconductor device includes a film stripping device.

[0030] For the grid disassembly and assembly jig of the present utility model, when the locking member is in the locked state, the positioning member is fixedly arranged in the positioning hole, and the support assembly can support the grid to prevent the grid from falling during disassembly and assembly, thereby reducing the number of operators required for grid disassembly and assembly, liberating the working area, improving work efficiency, and avoiding damage to the grid caused by manual holding of the grid. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The following drawings of the present utility model are used as a part of the present utility model to understand the present utility model. The embodiments of the present utility model shown in the drawings and their descriptions are used to explain the principles of the present utility model.

[0032] In the drawings:

[0033] Figure 1 The front view shows a partial structure of the grid disassembly and assembly jig according to a specific embodiment of the present utility model;

[0034] Figure 2 The top view shows a partial structure of the grid disassembly and assembly jig according to a specific embodiment of the present utility model;

[0035] Figure 3 Shows Figure 1 An enlarged view of area A in

[0036] Figure 4 The front view shows a partial structure of the grid disassembly and assembly jig according to a specific embodiment of the present utility model;

[0037] Figure 5 Shows Figure 4 An enlarged view of area B in

[0038] Figure 6 The schematic diagram shows the grid disassembly using the grid disassembly and assembly jig according to a specific embodiment of the present utility model;

[0039] Figure 7 The schematic diagram shows the grid assembly using the grid disassembly and assembly jig according to a specific embodiment of the present utility model.

[0040] In the drawings:

[0041] 101 Base;

[0042] 1011 The first connecting member;

[0043] 1012 The second connecting member;

[0044] 1013 The rotating shaft;

[0045] 102 The support member;

[0046] 103 The knob;

[0047] 104 The calibration member;

[0048] 1041 The calibration portion;

[0049] 1042 The second elastic member;

[0050] 1043 The second operating portion;

[0051] 105 The positioning hole;

[0052] 106 The knob;

[0053] 107 The positioning member;

[0054] 1071 The first threaded portion;

[0055] 1072 The second threaded portion;

[0056] 108 The locking member;

[0057] 1081 The locking portion;

[0058] 1082 The first elastic member;

[0059] 1083 The first operating portion;

[0060] 200 The grid;

[0061] 300 The screw. Detailed implementation manner

[0062] In the following description, a large number of specific details are given to provide a more thorough understanding of the present utility model. However, it is obvious to those skilled in the art that the present utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present utility model, some technical features known to the public are not described.

[0063] It should be understood that the present utility model can be implemented in different forms and should not be construed as limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the present utility model to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. Throughout the drawings, the same reference numerals denote the same elements.

[0064] It should be understood that when an element or layer is referred to as being "on", "adjacent to", "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, under the teachings of the present utility model, the first element, component, region, layer or part discussed below may be denoted as the second element, component, region, layer or part.

[0065] Spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. are used herein for convenience in describing the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, then an element or feature described as "under" or "beneath" or "below" another element or feature will be oriented "on" the other element or feature. Thus, the exemplary terms "under" and "below" can include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are to be interpreted accordingly.

[0066] The purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present utility model. When used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups. When used herein, the term "and / or" includes any and all combinations of the related listed items.

[0067] In the related art, the double-layer grid is disassembled and assembled by means of multi-person operation. Taking disassembly as an example, during the process of one person disassembling the screws fixing the double-layer grid, another person needs to hold the double-layer grid to prevent it from falling. Similarly, during the installation process of the double-layer grid, one person also needs to hold the double-layer grid to prevent it from falling, and another person installs the screws fixing the double-layer grid into the semiconductor device.

[0068] However, the above method requires multi-person operation, which affects the operation space and seriously reduces the operation efficiency. Moreover, when manually holding the double-layer grid, the double-layer grid is prone to uneven force, resulting in deformation or other damage to the double-layer grid, affecting the subsequent semiconductor process flow.

[0069] To solve at least one of the above technical problems, the present application provides a grid disassembly and assembly fixture for disassembling and assembling the grid in a semiconductor device. The grid disassembly and assembly fixture includes: a positioning member for detachably connecting to the semiconductor device; a support assembly provided with a positioning hole, and the positioning member is detachably inserted into the positioning hole; a locking member provided on the support assembly for fixedly setting the positioning member in the positioning hole in the locked state; wherein, when the positioning member is fixedly set in the positioning hole, the support assembly can be used to support the grid to achieve disassembly or installation of the grid.

[0070] According to the grid disassembly and assembly fixture of the present application, the locking member fixedly sets the positioning member in the positioning hole in the locked state, and the support assembly can support the grid to prevent the grid from falling during disassembly and assembly. Compared with the method of disassembling and assembling the grid by multi-person operation, it can reduce the number of operators, increase the operation space, improve the operation efficiency, and also avoid deformation or other damage to the grid caused by manual holding of the grid, without affecting the subsequent semiconductor process flow.

[0071] To thoroughly understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solutions proposed by this application. The preferred embodiments of this application are described in detail below. However, in addition to these detailed descriptions, this application may have other implementation manners.

[0072] Reference is made below Figures 1 to 7 to describe a grid disassembly and assembly jig according to an embodiment of the present application. The grid disassembly and assembly jig is used for disassembling and assembling the grid 200 in a semiconductor device. The grid disassembly and assembly jig includes: a positioning member 107 for detachably connecting to the semiconductor device; a support assembly provided with a positioning hole 105, and the positioning member 107 is used for detachably passing through the positioning hole 105; a locking member 108 provided on the support assembly for fixedly setting the positioning member 107 in the positioning hole 105 in a locked state; wherein, when the positioning member 107 is fixedly set in the positioning hole 105, the support assembly can be used to support the grid 200 to disassemble or install the grid 200.

[0073] Specifically, taking the disassembly of the grid 200 in the semiconductor device as an example, as Figure 6 shown, the positioning member 107 can be first connected to the semiconductor device, and then the support assembly is sleeved on the positioning member 107 through the positioning hole 105 so that the positioning member 107 passes through the positioning hole 105. After that, the positioning member 107 is fixedly set in the positioning hole 105 in a locked state by the locking member 108, so that the support assembly can support the grid 200. The support assembly applies a lifting force to the grid 200 to prevent the grid 200 from falling. Then, the screw 300 used to fix the grid 200 in the semiconductor device can be disassembled, so as to disassemble the grid 200 from the semiconductor device.

[0074] Taking the installation of the grid 200 into the semiconductor device as an example, as Figure 7 shown, the positioning member 107 can be first connected to the semiconductor device (it is possible to temporarily not disassemble the positioning member 107 connected to the semiconductor device after disassembling the grid 200 from the semiconductor device in the above text), and then the support assembly supporting the grid 200 is sleeved on the positioning member 107 through the positioning hole 105 so that the positioning member 107 passes through the positioning hole 105. After that, the positioning member 107 is fixedly set in the positioning hole 105 in a locked state by the locking member 108, so that the support assembly can support the grid 200. The support assembly applies a lifting force to the grid 200 to prevent the grid 200 from falling. Then, the screw 300 used to fix the grid 200 can be installed on the semiconductor device, so as to install the grid 200 into the semiconductor device.

[0075] After the mesh grid 200 is installed in the semiconductor device, the positioning member 107 connected to the semiconductor device can be disassembled. It should be noted that the mesh grid 200 can be fixed in the semiconductor device by a plurality of screws 300. Therefore, when disassembling the mesh grid 200, some of the screws 300 fixing the mesh grid 200 can be disassembled first, and then the positioning member 107 can be fixed in the threaded holes generated after the screws 300 are disassembled; correspondingly, after the mesh grid 200 is installed in the semiconductor device and the positioning member 107 connected to the semiconductor device is disassembled, corresponding screws 300 also need to be installed in the threaded holes corresponding to the positioning member 107. Of course, in some other cases, the positioning member 107 can also be detachably connected to the semiconductor device in other ways, and the specific implementation method is not limited.

[0076] Based on this, the present application provides a mesh grid disassembly and assembly jig capable of disassembling and assembling the mesh grid 200 in a semiconductor device. According to the mesh grid disassembly and assembly jig of the present application, when the locking member 108 is in the locked state, the positioning member 107 is fixedly arranged in the positioning hole 105, and the support assembly can support the mesh grid 200 to prevent the mesh grid 200 from falling during disassembly and assembly. Compared with the method of disassembling and assembling the mesh grid 200 by multiple workers, it can reduce the number of workers, increase the working space, improve the working efficiency, and can also avoid deformation or other damages of the mesh grid 200 caused by manual holding of the mesh grid 200, without affecting the subsequent semiconductor process flow.

[0077] In some embodiments, the locking member 108 is further configured to movably arrange the positioning member 107 in the positioning hole 105 when in the released state; wherein, when the positioning member 107 is movably arranged in the positioning hole 105, the support assembly can move along the positioning member 107.

[0078] Taking the disassembly of the mesh grid 200 in the semiconductor device as an example, as Figure 6 shown, after the positioning member 107 is connected to the semiconductor device and the support assembly is sleeved on the positioning member 107 through the positioning hole 105, the positioning member 107 is movably arranged in the positioning hole 105 by setting the locking member 108 in the released state, so that the position of the support assembly can be adjusted; after the support assembly is adjusted to a suitable position, the locking member 108 is switched to the locked state to fixedly arrange the positioning member 107 in the positioning hole 105. At this time, the support assembly can support the mesh grid 200 to prevent the mesh grid 200 from falling during disassembly and assembly, and then the screws 300 used to fix the mesh grid 200 in the semiconductor device can be disassembled, so as to disassemble the mesh grid 200 from the semiconductor device; after the screws 300 are disassembled, the locking member 108 can be switched to the released state again, so that the support assembly can support the disassembled mesh grid 200 to move downward along the positioning member 107 to remove the support assembly and the mesh grid 200, thereby completing the disassembly operation.

[0079] Taking the installation of the grid 200 into a semiconductor device as an example, as Figure 7 shown, after the positioning member 107 is connected to the semiconductor device (the positioning member 107 connected to the semiconductor device can be temporarily not disassembled after the disassembly operation is completed above), and the support assembly supporting the grid 200 is sleeved on the positioning member 107 through the positioning hole 105, the positioning member 107 is movably arranged in the positioning hole 105 by making the locking member 108 in the released state, so that the position of the support assembly can be adjusted; after the support assembly is adjusted to a proper position, the locking member 108 is switched to the locked state to fixedly arrange the positioning member 107 in the positioning hole 105. At this time, the support assembly can support the grid 200 to prevent the grid 200 from falling during the disassembly and assembly process. Then, the screw 300 for fixing the grid 200 in the semiconductor device can be installed, so as to install the grid 200 into the semiconductor device; after the screw 300 is installed, the locking member 108 can be switched to the released state again, so that the support assembly can move downward along the positioning member 107 to remove the support assembly, thus completing the installation operation.

[0080] In some embodiments, the positioning member 107 can adopt various structures, which are not limited herein. Exemplarily, as Figure 4 shown, the positioning member 107 can include a positioning pin. The first end of the positioning pin has a first thread portion 1071, and the positioning pin is detachably connected to the semiconductor device through the first thread portion 1071; the second end of the positioning pin has a second thread portion 1072, and the locking member 108 restricts the second thread portion 1072 in the locked state to fixedly arrange the positioning member 107 in the positioning hole 105.

[0081] As described above, when disassembling the grid 200, some of the screws 300 fixing the grid 200 can be disassembled first, and then the first thread portion 1071 at the first end of the positioning pin is fixed in the threaded hole generated after the screws 300 are disassembled, so that the positioning pin is connected to the semiconductor device; after the installation operation of the grid 200 is completed, the positioning pin can be disassembled from the semiconductor device by rotating the positioning pin in the reverse direction.

[0082] During the disassembly and assembly process of the grid 200, the locking member 108 can fix the positioning pin in the positioning hole 105 by restricting the second thread portion 1072 at the second end of the positioning pin.

[0083] In some embodiments, the locking member 108 can be in the form of a pin structure, a ratchet structure, etc., and there is no limitation thereto. Taking the pin structure as an example, the pin in the pin structure can be in contact with or separated from the second threaded portion 1072 of the positioning pin, so that the positioning member 107 is fixedly arranged in the positioning hole 105 or movably arranged in the positioning hole 105; taking the ratchet structure as an example, the ratchet in the ratchet structure can be in contact with or separated from the second threaded portion 1072 of the positioning pin, so that the positioning member 107 is fixedly arranged in the positioning hole 105 or movably arranged in the positioning hole 105.

[0084] Exemplarily, as Figure 5 shown, the locking member 108 can include: a locking portion 1081, a first elastic member 1082, and a first operation portion 1083. The first elastic member 1082 is used to drive the locking portion 1081 to contact the positioning member 107 through its own elastic action so that the locking member 108 is in a locked state, and the first operation portion 1083 is used to drive the locking portion 1081 to separate from the positioning member 107 after receiving a user operation so that the locking member 108 is in a released state.

[0085] Specifically, in the default state, the first elastic member 1082 is in a natural and relaxed state. After the positioning member 107 passes through the positioning hole 105, the contact between the positioning member 107 and the locking portion 1081 causes the first elastic member 1082 to be compressed. The first elastic member 1082 drives the locking portion 1081 to apply a force to the positioning member 107 through its own elastic action (for example, the pin can be clamped in the second threaded portion 1072), so as to fixedly arrange the positioning member 107 in the positioning hole 105. At this time, the locking member 108 is in a locked state; after the first operation portion 1083 receives a user operation, the first operation portion 1083 can apply a pressure force to the first elastic member 1082 to make the first elastic member 1082 in a compressed state, so that the locking portion 1081 is separated from the positioning member 107 (for example, the pin is separated from the second threaded portion 1072), and the positioning member 107 is movably arranged in the positioning hole 105. At this time, the locking member 108 is in a released state.

[0086] Among them, the locking portion 1081 can be in the form of a pin, etc., the first elastic member 1082 can be in the form of a spring, a spring piece, etc., and the first operation portion 1083 can be in the form of a buckle, a button, etc., and there is no limitation thereto.

[0087] In some embodiments, as Figure 1 and Figure 2 shown, the support assembly can include: a base 101; a support member 102; a knob 106, arranged on the base 101 and connected to the support member 102, and used to drive the support member 102 to approach or move away from the base 101.

[0088] Specifically, the position of the support member 102 can be adjusted by driving the support member 102 closer to or farther away from the base 101 through the knob 106.

[0089] Taking the disassembly of the mesh grid 200 in the semiconductor device as an example, after the support assembly is sleeved on the positioning member 107 and the locking member 108 is in the locked state to fixedly arrange the positioning member 107 in the positioning hole 105, there may still be a certain distance between the support member 102 and the mesh grid 200 at this time. In this case, the knob 106 can be rotated to drive the support member 102 to rise so that the support member 102 contacts the mesh grid 200 to support the mesh grid 200. Taking the installation of the mesh grid 200 into the semiconductor device as an example, after the support assembly supporting the mesh grid 200 is sleeved on the positioning member 107 and the locking member 108 is in the locked state to fixedly arrange the positioning member 107 in the positioning hole 105, there may still be a certain distance between the mesh grid 200 and the inner wall of the semiconductor device at this time. In this case, the knob 106 can be rotated to drive the support member 102 to rise so that the support member 102 drives the mesh grid 200 to rise and contact the inner wall of the semiconductor device.

[0090] In some embodiments, the support member 102 can be configured as a circular ring structure, an elliptical ring structure, or any other suitable structure design with an empty area. Through the empty area design inside the support member 102, the support member 102 can be made not to contact the air holes of the mesh grid 200, further avoiding damage to the mesh grid 200. Moreover, the empty area design can reduce the weight of the support member 102, further improving the disassembly and assembly efficiency.

[0091] In some embodiments, the mesh grid 200 can be a single-layer mesh grid, a double-layer mesh grid, or a mesh grid with other numbers of layers, which is not limited herein.

[0092] Taking the double-layer mesh grid as an example, as Figure 6 shown, the double-layer mesh grid can include an inner-layer mesh grid 210 and an outer-layer mesh grid 220. The inner-layer mesh grid 210 and the outer-layer mesh grid 220 can be connected by screws 300. During disassembly, since the inner-layer mesh grid 210 and the outer-layer mesh grid 220 are connected by screws 300, the inner-layer mesh grid 210 and the outer-layer mesh grid 220 can be disassembled simultaneously during disassembly. After disassembly, the screws 300 connecting the inner-layer mesh grid 210 and the outer-layer mesh grid 220 can be removed, so as to maintain and repair the inner-layer mesh grid 210 and the outer-layer mesh grid 220 respectively. After maintenance, the inner-layer mesh grid 210 and the outer-layer mesh grid 220 can be fixedly connected together again by using the screws 300, and then the maintained inner-layer mesh grid 210 and outer-layer mesh grid 220 can be installed into the semiconductor device together.

[0093] In some embodiments, the mesh grid disassembly and assembly jig further includes: a calibration member 104, which is arranged on the base 101 and is used for calibrating the double-layer mesh grid.

[0094] It should be noted that when the inner grid 210 and the outer grid 220 are fixedly connected together by the screw 300, it is necessary to ensure that the air holes of the inner grid 210 and the air holes of the outer grid 220 are completely staggered and do not overlap. If the air holes of the inner grid 210 and the air holes of the outer grid 220 overlap, in the semiconductor process flow, it will cause charged particles not to be completely and effectively conducted away by the double-layer grid, and some charged particles will directly pass through the overlapping air holes, and then bombard the photoresist layer, affecting the semiconductor process and the product yield.

[0095] In this embodiment, after maintenance, before the inner grid 210 and the outer grid 220 are fixedly connected together by the screw 300, the inner grid 210 and the outer grid 220 can be calibrated by the calibration member 104 first. After the calibration is correct, the inner grid 210 and the outer grid 220 are fixedly connected together by the screw 300. Through precise calibration, it can be ensured that the air holes of the inner grid 210 and the air holes of the outer grid 220 are completely staggered and do not overlap, thus effectively avoiding the problem of charged particles passing through the double-layer grid, improving the process environment, and increasing the product yield.

[0096] In some embodiments, as Figure 3 shown, the calibration member 104 may include: a calibration portion 1041, a second elastic member 1042, and a second operation portion 1043. The second operation portion 1043 is used to drive the calibration portion 1041 to calibrate the double-layer grid through the second elastic member 1042 after receiving a calibration operation, and the second elastic member 1042 is used to drive the calibration portion 1041 to reset through its own elastic action after the second operation portion 1043 receives a reset operation.

[0097] Specifically, during the calibration process, after the two grids 200 are placed on the support assembly, the user can apply a calibration operation to the second operation portion 1043. The second operation portion 1043 can drive the calibration portion 1041 to calibrate the double-layer grid according to the calibration operation. At this time, the second elastic member 1042 is in a compressed state under the action of the second operation portion 1043; after the calibration is completed, the user can apply a reset operation to the second operation portion 1043. The second operation portion 1043 can be reset according to the reset operation, so that the second elastic member 1042 can no longer be compressed by the second operation portion 1043, and the second elastic member 1042 then drives the calibration portion 1041 to reset through its own elastic action.

[0098] Among them, the second elastic member 1042 can be a spring, a spring piece, etc., and the second operation portion 1043 can be a buckle, a button, etc., and no limitation is imposed thereon

[0099] In some embodiments, as Figure 2As shown, the base 101 includes: a first connecting member 1011 and a second connecting member 1012 that are cross - arranged; a rotating shaft 1013 disposed at the cross - part of the first connecting member 1011 and the second connecting member 1012; wherein, a positioning hole 105 is disposed on the first connecting member 1011, and a knob 106 is disposed on the second connecting member 1012.

[0100] Specifically, corresponding positioning holes 105 may be provided on the support member 102 and the first connecting member 1011, so that the support assembly can be sleeved on the positioning member 107 through the positioning holes 105.

[0101] In some embodiments, as Figure 2 shown, the calibration member 104 may be disposed at both ends of the second connecting member 1012, such that the position of the calibration member 104 can be adjusted by rotating the rotating shaft 1013.

[0102] In some embodiments, a level meter may be provided on the rotating shaft 1013. When placing the fixture on the workbench, the level meter can be used to determine whether the fixture is level.

[0103] In some embodiments, the semiconductor device may include a film stripping device (which may also be referred to as a photoresist dry stripping device). Of course, the semiconductor device may also be other types of devices with a mesh grid 200, which is not limited herein.

[0104] Generally speaking, the disassembly process of the mesh grid 200 using the mesh grid disassembly and assembly fixture of the present application may be as follows:

[0105] First, remove some of the screws 300 that fix the mesh grid 200 in the semiconductor device, and install the positioning member 107 into the threaded hole generated after removing the screws 300.

[0106] Then, sleeved the support assembly on the positioning member 107 through the positioning holes 105, so that the positioning member 107 passes through the positioning holes 105.

[0107] After that, after moving the support assembly to a suitable position, make the locking member 108 in a locked state to fixedly set the positioning member 107 in the positioning hole 105.

[0108] Then, rotate the knob 106 to drive the support member 102 to rise, so that the support member 102 contacts the mesh grid 200 to support the mesh grid 200.

[0109] After that, remove the remaining screws 300 that fix the mesh grid 200 in the semiconductor device.

[0110] Then, switch the locking member 108 to the release state, so that the support assembly can support the removed grid 200 and move downward along the positioning member 107 to remove the support assembly and the grid 200, thus completing the disassembly operation.

[0111] The installation process of the grid 200 using the grid disassembly and assembly fixture of the present application can be as follows:

[0112] Place the support assembly on the workbench, and place the well-maintained grid 200 on the support assembly (for a double-layer grid, it can be calibrated by the calibration member 104);

[0113] Then, sleuth the support assembly supporting the grid 200 onto the positioning member 107 through the positioning hole 105 (it is possible not to disassemble the positioning member 107 connected to the semiconductor device temporarily after completing the disassembly operation above);

[0114] After that, after moving the support assembly to a suitable position, make the locking member 108 in the locked state so as to fixedly set the positioning member 107 in the positioning hole 105;

[0115] Then, rotate the knob 106 to drive the support member 102 to rise, so that the support member 102 drives the grid 200 to rise and contact the inner wall of the semiconductor device;

[0116] After that, install the screw 300 for fixing the grid 200 in the semiconductor device;

[0117] Then, switch the locking member 108 to the release state, so that the support assembly can move downward along the positioning member 107 to remove the support assembly;

[0118] After that, remove the positioning member 107 and install the corresponding screw 300 in the threaded hole corresponding to the positioning member 107, thus completing the installation operation.

[0119] In summary, for the grid disassembly and assembly fixture according to the embodiment of the present application, when the locking member is in the locked state, the positioning member is fixedly set in the positioning hole, and the support assembly can support the grid to prevent the grid from falling during disassembly and assembly. Compared with the method of disassembling and assembling the grid by multiple operators, it can reduce the number of operators, increase the working space, improve the working efficiency, and also avoid deformation or other damage to the grid caused by manual holding of the grid, without affecting the subsequent semiconductor process flow.

[0120] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.

[0121] Similarly, it should be understood that, for the purpose of streamlining the present application and assisting in the understanding of one or more of the various aspects of the application, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the methods of the present application should not be construed as reflecting an intention that the claimed present application requires more features than are expressly recited in each claim. Rather, as reflected by the corresponding claims, the point of the application is that the corresponding technical problems can be solved with features fewer than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim itself serves as a separate embodiment of the present application.

[0122] In addition, those skilled in the art will appreciate that, although some of the embodiments described herein include certain features included in other embodiments but not others, combinations of features of different embodiments are meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0123] It should be noted that the above embodiments illustrate rather than limit the present application, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words first, second, and third, etc. does not denote any order. These words can be interpreted as names.

Claims

1. A jig for disassembling and assembling a mesh grid, characterized in that, For disassembling and assembling a mesh grid in a semiconductor device, the mesh grid disassembly and assembly jig includes: A positioning member for detachably connecting to the semiconductor device; A support assembly provided with a positioning hole, and the positioning member is detachably inserted into the positioning hole; A locking member provided on the support assembly for fixing the positioning member in the positioning hole in the locked state; Wherein, when the positioning member is fixedly arranged in the positioning hole, the support assembly can be used to support the mesh grid to disassemble or install the mesh grid.

2. The grid disassembly and assembly jig according to claim 1, wherein The locking member is further used to movably arrange the positioning member in the positioning hole in the released state; Wherein, when the positioning member is movably arranged in the positioning hole, the support assembly can move along the positioning member.

3. The grid disassembly and assembly jig according to claim 1, characterized in that The positioning member includes a positioning pin, The first end of the positioning pin has a first threaded portion, and the positioning pin is detachably connected to the semiconductor device through the first threaded portion; The second end of the positioning pin has a second threaded portion, and the locking member restricts the second threaded portion in the locked state to fixedly arrange the positioning member in the positioning hole.

4. The grid disassembly and assembly fixture according to claim 2, characterized in that, The locking member includes: A locking portion, a first elastic member and a first operation portion, wherein the first elastic member is used to drive the locking portion to contact the positioning member through its own elastic action so that the locking member is in the locked state, and the first operation portion is used to drive the locking portion to disengage from the positioning member after receiving a user operation so that the locking member is in the released state.

5. The grid disassembly and assembly jig according to claim 1, characterized in that, The support assembly includes: A base; A support member; A knob provided on the base and connected to the support member for driving the support member to approach or move away from the base.

6. The grid disassembly and assembly jig according to claim 5, wherein, The support member is configured as an annular structure.

7. The grid disassembly and assembly fixture according to claim 5, wherein, The mesh grid includes a double-layer mesh grid.

8. The grid disassembly and assembly jig according to claim 7, characterized in that, The mesh grid disassembly and assembly jig further includes: A calibration member provided on the base for calibrating the double-layer mesh grid.

9. The grid disassembly and assembly fixture according to claim 8, wherein, The calibration member includes: A calibration portion, a second elastic member and a second operation portion, wherein the second operation portion is used to drive the calibration portion to calibrate the double-layer mesh grid through the second elastic member after receiving a calibration operation, and the second elastic member is used to drive the calibration portion to reset through its own elastic action after the second operation portion receives a reset operation.

10. The grid disassembly and assembly jig according to claim 1, characterized in that, The semiconductor device includes a film stripping device.

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