Chip radiator and server

Abstract

The utility model belongs to the technical field of chip heat dissipation devices, and particularly relates to a chip heat dissipation device and a server, and the chip heat dissipation device comprises a heat dissipation bottom plate which is in contact with a chip; the heat dissipation fins are arranged on the heat dissipation bottom plate, and a spacing distance is formed between every two adjacent heat dissipation fins; the heat dissipation bottom plate and the heat dissipation fins each comprise a foam alloy base body, a plurality of foam holes are formed in the foam alloy base bodies, and the foam holes are filled with epoxy resin compounds. According to the chip radiator and the server provided by the utility model, the radiating bottom plate and the radiating fins respectively comprise the foam alloy matrix, the foam alloy matrix is internally provided with the plurality of foam holes, the mass of the chip radiator is reduced, and the foam holes are filled with the epoxy resin compound, so that the easy oxidation caused by high specific surface area is reduced, the oxidation resistance is improved, and the service life of the chip radiator is prolonged. And meanwhile, the electromagnetic shielding rate is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip heat dissipation devices, and particularly relates to a chip radiator and a server. Background Art

[0002] The rapid development of artificial intelligence, the Internet, and mobile terminals has brought great opportunities and challenges to the server market. Subsequently, the chip industry has witnessed rapid development. The product side has higher and higher requirements for chip functions, resulting in an increase in transistor density and a significant increase in chip power consumption. Therefore, a chip radiator is needed to dissipate heat from the chip.

[0003] In the prior art, most chip radiators use pure alloy as the heat-conducting material. However, the pure alloy chip radiator not only has a relatively large weight but also has poor electromagnetic shielding and oxidation resistance. Summary of the Utility Model

[0004] The utility model provides a chip radiator and a server, aiming to solve the defects of relatively large weight and easy oxidation in the prior art, and realizing not only weight reduction but also improved oxidation resistance.

[0005] The utility model provides a chip radiator, comprising:

[0006] A heat dissipation bottom plate, which is in contact with the chip;

[0007] A plurality of heat dissipation fins, which are arranged on the heat dissipation bottom plate, and there is a spacing distance between every two adjacent heat dissipation fins;

[0008] Both the heat dissipation bottom plate and the heat dissipation fins include a foam alloy matrix, the foam alloy matrix has a plurality of foam holes, and the foam holes are all filled with an epoxy resin composite.

[0009] According to the chip radiator provided by the utility model, the outer periphery of the foam alloy matrix is wrapped with the epoxy resin composite layer.

[0010] According to the chip radiator provided by the utility model, the outer walls of the epoxy resin composites are all in contact with the inner walls of the foam holes.

[0011] According to the chip radiator provided by the utility model, the foam alloy matrix includes a copper-nickel foam alloy matrix.

[0012] According to the chip radiator provided by the utility model, the porosity of the foam alloy matrix is 60%-90%, the foam holes include boundary holes and internal holes, the boundary holes are connected to the outside, and the internal holes are connected to at least one of the boundary holes.

[0013] A chip radiator provided by the present utility model, the porosity of the foam alloy matrix is less than 60%, and the foam holes include boundary holes.

[0014] A chip radiator provided by the present utility model, a heat-conducting filler is provided in the epoxy resin composite layer.

[0015] A chip radiator provided by the present utility model, a plurality of the heat dissipation fins are arranged in parallel.

[0016] A chip radiator provided by the present utility model, the heat dissipation fins are vertically arranged on the heat dissipation bottom plate.

[0017] The present utility model also provides a server, including the chip radiator described in any one of the above.

[0018] For the chip radiator provided by the present utility model, since both the heat dissipation bottom plate and the heat dissipation fins include a foam alloy matrix, and there are a plurality of foam holes in the foam alloy matrix, the mass of the chip radiator can be reduced. The foam holes are all filled with an epoxy resin composite, reducing the easy oxidation caused by the high specific surface area, and at the same time improving the electromagnetic shielding rate.

[0019] In addition, since the foam alloy matrix 3 itself is in an irregular shape and will generate turbulence, by providing a smooth epoxy resin composite layer 5 on the outer periphery of the foam alloy matrix 3, the turbulence caused by the irregular shape will be offset.

[0020] For the server provided by the present utility model, since it includes the chip radiator as described above, it has various advantages as described above. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is one of the structural schematic diagrams of the chip radiator provided by the present utility model.

[0023] Figure 2 It is the second structural schematic diagram of the chip radiator provided by the present utility model.

[0024] Reference Signs:

[0025] 1, heat dissipation bottom plate; 2, heat dissipation fins; 3, foam alloy matrix; 4, foam holes; 41, boundary holes; 42, internal holes; 5, epoxy resin composite layer; 100, chip. Detailed implementation mode

[0026] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the present utility model will be clearly and completely described below with reference to the accompanying drawings in the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0027] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0028] The following combines with Figure 1 - Figure 2 Describe the chip heat sink of the present utility model.

[0029] As Figure 1 and Figure 2 shown, the present utility model provides a chip heat sink, including a heat dissipation bottom plate 1 and a plurality of heat dissipation fins 2. The heat dissipation bottom plate 1 is the main support part of the entire chip heat sink. The heat dissipation bottom plate 1 directly contacts the chip 100 that needs to dissipate heat, and quickly absorbs and disperses heat through the large contact surface area of the heat dissipation bottom plate 1. A plurality of heat dissipation fins 2 are arranged on the heat dissipation bottom plate 1, and there is a spacing distance between each adjacent heat dissipation fin 2, which is beneficial to air circulation and reduces the overall weight. The heat dissipation fins 2 can increase the heat dissipation surface area and accelerate the dissipation of heat through air convection.

[0030] Both the heat dissipation bottom plate 1 and the heat dissipation fins 2 include a foam alloy matrix 3. The foam alloy matrix 3 is a lightweight, high-porosity, and high-strength metal material. The lightweight characteristic of the foam alloy matrix 3 makes the entire heat sink more convenient for installation and use and reduces the mass of the chip heat sink.

[0031] The foam alloy matrix 3 has a plurality of foam holes 4, and epoxy resin composites are filled in the foam holes 4. By setting the epoxy resin composites, the oxidation susceptibility caused by the high specific surface area is reduced, the antioxidant property is improved, and at the same time, the electromagnetic shielding rate is increased.

[0032] Therefore, for the chip radiator provided by the present utility model, due to the high porosity and light weight characteristics of the foam metal, combined with the high specific surface area characteristics of the heat dissipation fins 2, the radiator can relatively quickly and effectively dissipate the heat generated by the chip into the surrounding environment. The epoxy resin composite filled in the foam pores 4 effectively prevents the oxidation of the metal at high temperatures, improving the corrosion resistance and service life of the radiator. The light weight characteristics of the foam alloy and the epoxy resin composite make the entire radiator lighter in weight, facilitating installation and use in various electronic devices.

[0033] It should be noted that the epoxy resin composite is a filler made of epoxy resin composite material. Epoxy resin composite material is a well-known material in the art and has the characteristics of longitudinal tension, transverse tension, and longitudinal compression. Therefore, the epoxy resin composite here is a filler made of known materials, and this filler is arranged in the foam pores to reduce the oxidation susceptibility caused by the high specific surface area and improve the antioxidant property.

[0034] In a feasible embodiment of the present utility model, the outer periphery of the foam alloy matrix 3 is wrapped with an epoxy resin composite layer, which further improves the antioxidant ability and greatly increases the electromagnetic shielding performance. In addition, using the mold forming process, the manufactured epoxy resin composite layer has a relatively high flatness and will not generate additional airflows between the heat dissipation fins 2. In addition, since the foam alloy matrix 3 itself has an irregular shape and will generate turbulence, by providing a smooth epoxy resin composite layer on the outer periphery of the foam alloy matrix 3, the turbulence caused by the irregular shape will be offset.

[0035] It should be noted that the epoxy resin composite layer is a coating made of epoxy resin composite material. The epoxy resin composite layer can effectively isolate the direct contact between the metal and oxygen, thereby preventing the metal from undergoing oxidation reactions in high-temperature environments. This is crucial for the service life of the radiator because oxidation not only causes a decline in metal performance but may also affect the heat dissipation effect. In addition, epoxy resin composite material is a well-known material in the art and has the characteristics of longitudinal tension, transverse tension, and longitudinal compression, and has a certain strength and toughness.

[0036] In a feasible embodiment of the present utility model, the outer walls of the epoxy resin composites are all in contact with the inner walls of the foam pores, which can more greatly reduce the high specific surface area and enhance the antioxidant performance.

[0037] In addition, graphite can also be doped in the foam alloy matrix 3. Graphite is a high thermal conductivity material. Doping graphite in the foam copper can significantly improve the thermal conductivity of the foam alloy matrix 3. The addition of graphite can also improve the friction performance of the foam alloy matrix 3. The lubrication rate of graphite can also form a solid lubricating layer with the wear debris, further reducing wear.

[0038] Such as Figure 1As shown, in a feasible embodiment of the utility model, the porosity of the foam alloy matrix 3 is 60%-90%. The foam alloy matrix 3 with high porosity has more space inside, and these spaces can be continuous channels. In the application of the radiator, the high porosity helps to increase the heat dissipation area and improve the heat conduction efficiency. The foam pores 4 include boundary pores 41 and built-in pores 42. The boundary pores 41 are connected to the outside world, and the built-in pores 42 are connected to at least one of the boundary pores 41. The high porosity requires that the built-in pores 42 are filled with epoxy resin composites to reduce the easy oxidation caused by the high specific surface area, while improving the electromagnetic shielding rate, and reducing the quality of the radiator relative to pure alloy.

[0039] like Figure 2 As shown, in a feasible embodiment of the present invention, the porosity of the foam alloy matrix 3 is less than 60%, and the foam pores 4 include boundary holes 41. The boundary holes 41 are open holes and are located at the edge of the foam alloy matrix 3. The existence of the boundary holes 41 also has a certain influence on the overall performance of the foam alloy matrix 3.

[0040] In a feasible embodiment of the utility model, a thermally conductive filler is provided in the epoxy resin composite layer. By providing the thermally conductive filler, the thermal conductivity of the epoxy resin composite layer can be effectively improved, thereby enhancing the heat dissipation effect. As a thermosetting material, the thermal conductivity of the epoxy resin composite layer is also relatively low. Therefore, when the epoxy resin composite layer is used alone as a covering layer or an adhesive layer of the foam alloy substrate 3, it may not be possible to significantly improve the thermal conductivity of the entire structure. In order to overcome the problem of low thermal conductivity of the foam alloy substrate 3 and the epoxy resin composite layer, a thermally conductive filler can be provided in the epoxy resin composite layer, and the thermally conductive filler can be added when preparing the epoxy resin composite layer, and finally heated and cured together, and then demolded.

[0041] In a feasible embodiment of the utility model, a plurality of heat sink fins 2 are arranged in parallel, and the heat sink fins 2 are arranged vertically on the heat sink base plate 1. The heat sink fins 2 arranged vertically can significantly increase the surface area in contact with the surrounding air, thereby improving the efficiency of heat exchange. More surface area means that more heat can be transferred to the air faster and then taken away. The vertically arranged heat sink fins 2 help to guide the air to flow through the channels between the fins, forming more effective convection heat dissipation. When the air flows through the heat sink fins 2, it will take away the heat on the fins and diffuse into the surrounding environment as the air flows. The vertical setting usually promotes natural convection or forced convection of air better than the horizontal setting. The vertically arranged heat sink fins 2 can also enhance the structural stability of the entire heat sink to a certain extent. As a supporting structure, the fins can disperse and withstand the pressure and stress from the base plate and the heat source, which helps to extend the service life of the heat sink.

[0042] The processing process of the chip radiator provided by the present utility model is as follows: First, the heat dissipation base plate 1 and the heat dissipation fins 2 are made from metal raw materials to obtain the foam alloy matrix 3; Second, through the material processing technology, the foam alloy matrix 3 is prepared into the shape of the radiator to obtain a semi-finished product; Third, the semi-finished product is placed in a mold, and a mixture of epoxy resin composite material and heat conduction filler is filled in the mold and heated; Finally, the whole is cured and formed and demolded to obtain the finished product of the chip radiator.

[0043] In summary, for the chip radiator provided by the present utility model, the heat dissipation base plate 1 and the heat dissipation fins 2 are made of the foam alloy matrix 3. The high porosity will result in a large number of voids between the metals. To improve the antioxidant ability, epoxy resin composite is filled in the voids.

[0044] In addition, considering the possible turbulent effect caused by the porous material of the foam alloy matrix 3, an epoxy resin composite layer is attached to the surface of the foam alloy matrix 3. Using the mold forming process, the manufactured epoxy resin composite layer 5 has a high flatness and will not generate additional air flow between the heat dissipation fins 2.

[0045] To increase the heat conduction efficiency, heat conduction fillers are arranged in the epoxy resin composite layer 5 to improve the heat conduction performance of the epoxy resin composite layer 5, thereby enhancing the heat dissipation effect. Through the setting of the epoxy resin composite layer 5, the electromagnetic shielding performance and antioxidant ability will be greatly increased, while taking into account the heat dissipation efficiency, the mass of the radiator / complete machine is reduced, and the procurement cost is lowered.

[0046] Therefore, the chip radiator provided by the present utility model is not only lightweight but also has strong antioxidant performance, and is suitable for scenarios with high requirements for the lightweight of the complete machine, chip power consumption and performance. It is suitable for customers with high requirements for electromagnetic shielding and electronic components with low radiator weight.

[0047] The server provided by the present utility model will be described below. The server described below can be mutually corresponded and referred to the chip radiator described above.

[0048] In the second aspect of the present utility model, an embodiment provides a server, including the chip radiator described in any one of the above.

[0049] For the server provided by the present utility model, since it includes the chip radiator described above, it can not only reduce the mass of the complete machine, but also improve the antioxidant property and electromagnetic shielding rate of the radiator, and is suitable for scenarios with lightweight of the complete machine and heat dissipation of low-temperature fluid medium.

[0050] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "joined" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0051] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "mode", "specific mode", or "some modes", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or mode are included in at least one embodiment or mode of the embodiments of the present utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or modes. In addition, without conflict, those skilled in the art can combine and combine the different embodiments or modes described in this specification and the features of different embodiments or modes.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A chip radiator, characterized in that, Comprising: A heat dissipation base plate (1), which is in contact with the chip (100); A plurality of heat dissipation fins (2), which are arranged on the heat dissipation base plate (1), and there is a spacing distance between every two adjacent heat dissipation fins (2); Both the heat dissipation base plate (1) and the heat dissipation fins (2) include a foam alloy matrix (3), there are a plurality of foam holes (4) in the foam alloy matrix (3), and epoxy resin composites are filled in the foam holes (4).

2. The chip radiator according to claim 1, wherein, An epoxy resin composite layer is arranged on the outer periphery of the foam alloy matrix (3).

3. The chip radiator according to claim 1, wherein The outer walls of the epoxy resin composites are all in contact with the inner walls of the foam holes (4).

4. The chip heat sink according to claim 1, wherein The foam alloy matrix (3) includes a copper-nickel foam alloy matrix.

5. The chip heat sink according to claim 1, characterized in that, The porosity of the foam alloy matrix (3) is 60%-90%, the foam holes (4) include boundary holes (41) and internal holes (42), the boundary holes (41) are communicated with the outside, and the internal holes (42) are communicated with at least one of the boundary holes (41).

6. The chip heat sink according to claim 1, wherein The porosity of the foam alloy matrix (3) is less than 60%, and the foam holes (4) include boundary holes (41).

7. The chip heat sink according to claim 2, wherein Thermal conductive fillers are arranged in the epoxy resin composite layer.

8. The chip heat sink according to claim 1, characterized in that A plurality of the heat dissipation fins (2) are arranged in parallel.

9. The chip radiator according to claim 1, characterized in that, The heat dissipation fins (2) are vertically arranged on the heat dissipation base plate (1).

10. A server, characterized in that, Including the chip radiator according to any one of claims 1-9.

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