Double-layer finished PCB with high sealing performance

Abstract

The utility model discloses a double-layer finished PCB with high sealing performance, which relates to the technical field of double-layer PCBs and comprises an upper shell. A lower shell is mounted at the top end of the upper shell; an assembling bolt is mounted in the lower shell; the side end of the upper shell is fixedly connected with a power line; a first PCB (Printed Circuit Board) is mounted in the upper shell; a second PCB is mounted at the top end of the first PCB; after the first PCB and the second PCB are installed in the upper shell, the lower shell and the upper shell are connected and assembled through the multiple sets of assembling bolts, the first PCB and the second PCB can be protected through the upper shell and the lower shell, the first PCB and the second PCB can also be sealed, the first PCB and the second PCB are prevented from being affected by external factors, and the reliability of the product is improved. And the damage to the first PCB and the second PCB caused by dust and rainwater entering the upper shell and the lower shell is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of double - layer PCB boards, and particularly relates to a double - layer finished PCB board with high sealing performance. Background Art

[0002] A double - layer PCB board is a common printed circuit board with two metal wire layers; the double - layer PCB board is composed of two substrate layers and an intermediate insulating layer; when designing a double - layer PCB board, factors such as signal transmission, electrical connection, and electromagnetic compatibility need to be considered.

[0003] Chinese Patent with the authorization announcement number CN213880411U discloses a double - layer combined PCB board, including a connecting frame. Connecting blocks are installed on both sides inside the connecting frame, a heat - dissipation component is connected and installed between the connecting blocks, a fixing block is connected to the outside of the connecting frame, a fixing frame is connected to the right end of the connecting frame, a heat - dissipation port is provided at the right end of the connecting frame, an axial - flow fan is connected and installed on the fixing frame, and the left side of the axial - flow fan is connected to one side of the connecting frame through a connecting rod; during operation, a certain amount of heat will be generated. At this time, the heat - conducting plate on the heat - dissipation component absorbs the temperature on the surface of the PCB board body. Next, the heat - conducting sheet conducts heat transfer, which is transferred to the heat - conducting pipe connected to the right end. Finally, the temperature on the heat - conducting pipe is further transferred to the second heat - conducting sheet. After the second heat - conducting sheet absorbs and accumulates a certain temperature, the axial - flow fan is turned on to take away the heat on the second heat - conducting sheet, realizing rapid heat dissipation and ensuring the service life of the PCB board body.

[0004] The deficiencies of the above - mentioned existing technical solutions are as follows: The above - mentioned solution absorbs the temperature on the surface of the PCB board body through the heat - conducting plate on the heat - dissipation component. Next, the heat - conducting sheet conducts heat transfer, which is transferred to the heat - conducting pipe connected to the right end. The axial - flow fan is turned on to take away the heat on the second heat - conducting sheet, realizing rapid heat dissipation, but the sealing performance is insufficient. The above - mentioned solution uses a large number of heat - dissipation structures to improve the heat - dissipation effect, which also reduces the sealing performance, resulting in easy entry of dust and water and being not suitable for special environments. Therefore, we provide a double - layer finished PCB board with high sealing performance here. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a double - layer finished PCB board with high sealing performance, so as to solve the technical problems in the prior art that the sealing performance is insufficient, a large number of heat - dissipation structures are used to improve the heat - dissipation effect, which also reduces the sealing performance, resulting in easy entry of dust and water and being not suitable for special environments.

[0006] The technical problems to be solved by the utility model can be realized through the following technical solutions:

[0007] A double-layer finished PCB board with high sealing performance, including an upper housing; a lower housing is installed at the top of the upper housing; an assembly bolt is installed inside the lower housing; a power cord is fixedly connected to the side end of the upper housing; a first PCB board is installed inside the upper housing; a second PCB board is installed on the top of the first PCB board.

[0008] As a further solution of the present utility model: a heat dissipation cavity is provided inside the lower housing; a heat dissipation plate is fixedly connected to the inner side wall of the heat dissipation cavity; heat dissipation holes are provided inside the heat dissipation plate.

[0009] As a further solution of the present utility model: a connecting plate is fixedly connected to the side end of the first PCB board; a second positioning bolt is installed inside the connecting plate; a connecting bolt is installed on the first PCB board, and the first PCB board and the second PCB board are assembled through the connecting bolt.

[0010] As a further solution of the present utility model: a second sealing ring is fixedly connected inside the upper housing; a first sealing ring is fixedly connected inside the lower housing, and the first sealing ring corresponds to the second sealing ring.

[0011] As a further solution of the present utility model: a plurality of heat dissipation fins are provided below the heat dissipation plate; the heat dissipation fins are fixedly connected to the bottom end of the upper housing.

[0012] As a further solution of the present utility model: a positioning plate is fixedly connected to the side end of the upper housing; a first positioning bolt is installed on the positioning plate.

[0013] The beneficial effects of the present utility model: After the first PCB board and the second PCB board are installed inside the upper housing, the lower housing and the upper housing are connected and assembled through a plurality of assembly bolts. The upper housing and the lower housing can protect the first PCB board and the second PCB board, and can also perform a sealing treatment on the first PCB board and the second PCB board, avoiding the influence of external factors on the first PCB board and the second PCB board, and reducing the damage caused by dust and rain entering the inside of the upper housing and the lower housing to the first PCB board and the second PCB board. Description of the Drawings

[0014] The following further describes the present utility model with reference to the drawings.

[0015] Figure 1 is the overall structural schematic diagram of the present utility model;

[0016] Figure 2 is the structural schematic diagram of the upper housing in the present utility model;

[0017] Figure 3 is the present utility model Figure 2 Enlarged view at A in;

[0018] In the figure: 1. Upper housing; 2. Lower housing; 3. Assembly bolt; 4. Power cord; 5. Positioning plate; 6. First positioning bolt; 7. First PCB board; 8. Second PCB board; 9. Connection plate; 10. Second positioning bolt; 11. Connection bolt; 12. First sealing ring; 13. Second sealing ring; 14. Heat dissipation cavity; 15. Heat dissipation plate; 16. Heat sink. Detailed implementation mode

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] As Figures 1 - 3 shown, a double-layer finished PCB board with high sealing performance includes an upper housing 1; a lower housing 2 is installed at the top of the upper housing 1; an assembly bolt 3 is installed inside the lower housing 2; a power cord 4 is fixedly connected to the side end of the upper housing 1; a first PCB board 7 is installed inside the upper housing 1; a second PCB board 8 is installed on the top of the first PCB board 7.

[0021] After the first PCB board 7 and the second PCB board 8 are installed inside the upper housing 1, the lower housing 2 is installed and fixed at the top of the upper housing 1. The lower housing 2 and the upper housing 1 are connected and assembled through multiple groups of assembly bolts 3. The first PCB board 7 and the second PCB board 8 can be protected by the upper housing 1 and the lower housing 2, and the first PCB board 7 and the second PCB board 8 can also be sealed to prevent external factors from affecting the first PCB board 7 and the second PCB board 8. When the upper housing 1 and the lower housing 2 are connected, the second sealing ring 13 will contact the first sealing ring 12. The sealing performance of the upper housing 1 and the lower housing 2 can be improved through the first sealing ring 12 and the second sealing ring 13, reducing the damage caused by dust and rain entering the inside of the upper housing 1 and the lower housing 2 to the first PCB board 7 and the second PCB board 8. The power cord 4 can be connected to other electronic components.

[0022] A heat dissipation cavity 14 is opened inside the lower housing 2; a heat dissipation plate 15 is fixedly connected to the inner side wall of the heat dissipation cavity 14; heat dissipation holes are opened inside the heat dissipation plate 15.

[0023] During the operation of the first PCB board 7 and the second PCB board 8, a large amount of heat will be generated. The heat of the first PCB board 7 and the second PCB board 8 will be transferred to the upper housing 1 and the lower housing 2. A heat dissipation cavity 14 is provided at the top end of the lower housing 2, and a plurality of heat dissipation plates 15 are arranged inside the heat dissipation cavity 14. The heat dissipation plates 15 can absorb heat well and then quickly dissipate the heat, thereby improving the heat dissipation effect of the first PCB board 7 and the second PCB board 8. Airflow can pass through the heat dissipation holes inside the heat dissipation plates 15, which can improve the heat dissipation speed of the heat dissipation plates 15.

[0024] A connecting plate 9 is fixedly connected to the side end of the first PCB board 7; a second positioning bolt 10 is installed inside the connecting plate 9; a connecting bolt 11 is installed on the first PCB board 7, and the first PCB board 7 and the second PCB board 8 are assembled through the connecting bolt 11.

[0025] Before work, first install the first PCB board 7 and the second PCB board 8 inside the upper housing 1. The position of the connecting plate 9 can be fixed inside the upper housing 1 through the second positioning bolt 10, thereby fixing the position of the first PCB board 7. At this time, then install the second PCB board 8 on the first PCB board 7, and then fix the second PCB board 8 on the first PCB board 7 through the connecting bolt 11.

[0026] A second sealing ring 13 is fixedly connected inside the upper housing 1; a first sealing ring 12 is fixedly connected inside the lower housing 2, and the first sealing ring 12 corresponds to the second sealing ring 13.

[0027] The first PCB board 7 and the second PCB board 8 can be hermetically protected through the upper housing 1 and the lower housing 2. When the upper housing 1 and the lower housing 2 are connected, the second sealing ring 13 will contact the first sealing ring 12. Through the first sealing ring 12 and the second sealing ring 13, the sealing performance of the upper housing 1 and the lower housing 2 can be improved, and the entry of dust and rainwater into the inside of the upper housing 1 and the lower housing 2 to damage the first PCB board 7 and the second PCB board 8 can be reduced.

[0028] A plurality of heat dissipation fins 16 are provided below the heat dissipation plates 15; the heat dissipation fins 16 are fixedly connected to the bottom end of the upper housing 1.

[0029] A plurality of heat dissipation fins 16 are fixedly connected to the bottom end of the upper housing 1. The heat generated by the first PCB board 7 during operation will first be transferred to the upper housing 1, and then the upper housing 1 will transfer and dissipate the heat to the heat dissipation fins 16. Airflow can flow through the bottom end of the upper housing 1, and together with the heat dissipation fins 16, the heat dissipation effect of the upper housing 1 can be improved, and the heat dissipation effect of the first PCB board 7 can also be improved, reducing the heat on the operating environment of the first PCB board 7 and the second PCB board 8.

[0030] A positioning plate 5 is fixedly connected to the side end of the upper housing 1; a first positioning bolt 6 is installed on the positioning plate 5.

[0031] After the first PCB board 7 and the second PCB board 8 are installed inside the upper housing 1, when the position of the upper housing 1 needs to be fixed, the first positioning bolt 6 is passed through the inside of the positioning plate 5 so that the first positioning bolt 6 is connected to other devices, and the position of the upper housing 1 can be fixed through the positioning plate 5 and the first positioning bolt 6.

[0032] Working principle of the utility model: Before working, first install the first PCB board 7 and the second PCB board 8 inside the upper shell 1. The position of the connecting plate 9 can be fixed inside the upper shell 1 through the second positioning bolt 10, thereby fixing the position of the first PCB board 7. At this time, install the second PCB board 8 on the first PCB board 7, and then fix the second PCB board 8 on the first PCB board 7 through the connecting bolt 11. After the first PCB board 7 and the second PCB board 8 are installed inside the upper shell 1, install and fix the lower shell 2 at the top of the upper shell 1. Connect and assemble the lower shell 2 and the upper shell 1 through multiple sets of assembly bolts 3. The first PCB board 7 and the second PCB board 8 can be protected by the upper shell 1 and the lower shell 2, and the first PCB board 7 and the second PCB board 8 can also be sealed to prevent external factors from affecting the first PCB board 7 and the second PCB board. When the upper shell 1 and the lower shell 2 are connected, the second sealing ring 13 will contact the first sealing ring 12. The sealing performance of the upper shell 1 and the lower shell 2 can be improved through the first sealing ring 12 and the second sealing ring 13, reducing the damage caused by dust and rain entering the inside of the upper shell 1 and the lower shell 2 to the first PCB board 7 and the second PCB board. The power cord 4 can be connected to other electronic components. After the first PCB board 7 and the second PCB board 8 are installed inside the upper shell 1, when the position of the upper shell 1 needs to be fixed, pass the first positioning bolt 6 through the inside of the positioning plate 5, and connect the first positioning bolt 6 to other devices. The position of the upper shell 1 can be fixed through the positioning plate 5 and the first positioning bolt 6. A large amount of heat will be generated during the operation of the first PCB board 7 and the second PCB board 8. The heat of the first PCB board 7 and the second PCB board 8 will be transferred to the upper shell 1 and the lower shell 2. A heat dissipation cavity 14 is provided at the top of the lower shell 2, and multiple sets of heat dissipation plates 15 are provided inside the heat dissipation cavity 14. The heat dissipation plates 15 can absorb heat well and then quickly dissipate the heat, thereby improving the heat dissipation effect of the first PCB board 7 and the second PCB board. Multiple sets of heat dissipation fins 16 are fixedly connected to the bottom end of the upper shell 1. The heat generated by the first PCB board 7 during operation will first be transferred to the upper shell 1, and then the upper shell 1 will transfer and dissipate the heat to the heat dissipation fins 16. The air flow can flow through the bottom end of the upper shell 1, and the heat dissipation effect of the upper shell 1 can be improved in cooperation with the heat dissipation fins 16, and the heat dissipation effect of the first PCB board 7 can also be improved, reducing the heat on the operating environment of the first PCB board 7 and the second PCB board.

[0033] The above has described a detailed description of an embodiment of the present invention, but the content described above is only the preferred embodiment of the present invention and cannot be considered as limiting the scope of implementation of the present invention. Any equivalent changes and improvements made within the scope of the application of the present invention shall still fall within the scope covered by the patent of the present invention.

Claims

1. A double-layer finished PCB board with high sealing performance, characterized in that, It includes an upper housing (1); a lower housing (2) is installed at the top of the upper housing (1); an assembly bolt (3) is installed inside the lower housing (2); a power cord (4) is fixedly connected to the side end of the upper housing (1); a first PCB board (7) is installed inside the upper housing (1); a second PCB board (8) is installed at the top of the first PCB board (7).

2. A highly-sealed double-layer finished PCB board according to claim 1, characterized in that, A heat dissipation cavity (14) is formed inside the lower housing (2); a heat dissipation plate (15) is fixedly connected to the inner side wall of the heat dissipation cavity (14); heat dissipation holes are formed inside the heat dissipation plate (15).

3. A highly-sealed double-layer finished PCB board according to claim 1, characterized in that, A connecting plate (9) is fixedly connected to the side end of the first PCB board (7); a second positioning bolt (10) is installed inside the connecting plate (9); a connecting bolt (11) is installed on the first PCB board (7), and the first PCB board (7) and the second PCB board (8) are assembled by the connecting bolt (11).

4. A highly-sealed double-layer finished PCB board according to claim 1, characterized in that, A second sealing ring (13) is fixedly connected inside the upper housing (1); a first sealing ring (12) is fixedly connected inside the lower housing (2), and the first sealing ring (12) corresponds to the second sealing ring (13).

5. A highly-sealed double-layer finished PCB board according to claim 2, characterized in that A plurality of heat dissipation fins (16) are provided below the heat dissipation plate (15); the heat dissipation fins (16) are fixedly connected to the bottom end of the upper housing (1).

6. A highly-sealed double-layer finished PCB board according to claim 1, characterized in that A positioning plate (5) is fixedly connected to the side end of the upper housing (1); a first positioning bolt (6) is installed on the positioning plate (5).

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