Mini-LED direct display screen packaging structure
The Mini LED direct display module designed through magnetic connection and packaging layer solves the problems of module shedding and inconsistent color, achieving high brightness and simplified packaging, reducing costs and preventing glare.
Patent Information
- Application Number
- CN202422212246.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-09
AI Technical Summary
When the Mini LED direct display screen is displayed on a large screen, there are problems such as the display module falling off, inconsistent color, complex circuit design and surface glare.
The direct display module design with magnetic suction connection is adopted, including a first magnet and a second magnet, multiple direct display modules are connected by magnetic suction, and an anti-glare layer and an anti-reflection layer are provided on the packaging layer, and an RGB Mini-LED chip is integrated to improve color consistency and brightness.
It effectively avoids module shedding, simplifies the packaging process, improves color consistency and brightness, reduces costs, and prevents glare.
Smart Images
Figure CN223140327U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure of a Mini-LED direct display screen. Background Art
[0002] Mini LED direct display screens are called "sub-millimeter light-emitting diodes", which refer to LED chips with a size of 100 - 300 mm, a chip pitch between 0.1 - 1 mm, and are micro LED device modules using SMD, COB or IMD packaging forms. Mini LED direct display screens are mainly applied in fields such as display screens, vehicle-mounted displays, mobile phones, and wearable devices. Since 2018, application terminals such as Pad, vehicle-mounted, e-sports, and TVs have also shown strong interest in Mini LED direct display screens and use them as an alternative to OLED. Since Mini LED direct display screens are usually composed of multiple display screen modules for large-screen display, the following problems exist when applying Mini LED direct display screens to large-screen display: the display screen modules may fall off, the colors of each display screen module are inconsistent, the circuit and PCB circuit board design are complex, and glare is likely to occur on the surface.
[0003] The above problems need to be solved urgently at present. Summary of the Utility Model
[0004] The purpose of the utility model is to overcome at least one technical problem existing in the prior art, and provides a packaging structure of a Mini-LED direct display screen, which includes a plurality of direct display screen modules, a connecting device between the plurality of direct display screen modules, and an external fixing bracket. The external fixing bracket is installed outside the plurality of direct display screen modules. The connecting device includes a first magnet and a second magnet, and the plurality of direct display screen modules are magnetically connected to each other. The direct display screen module includes a plurality of Mini-LED light-emitting units, a packaging substrate, and a packaging layer. The Mini-LED light-emitting unit includes a driving chip, a first light-emitting chip, a second light-emitting chip, a third light-emitting chip, a fourth light-emitting chip, and a substrate. The driving chip is placed in the middle part of the substrate, and the first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip are respectively placed at the four vertex positions of the substrate and are connected to the driving chip. The packaging layer covers the Mini-LED light-emitting unit and the packaging substrate, and an anti-glare layer and at least one anti-reflection layer are sequentially stacked on the packaging layer.
[0005] Further, each of the first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip includes two groups of red Mini-LED chips, two groups of blue Mini-LED chips, and two groups of green Mini-LED chips, and the same-color Mini-LED chips are connected in series.
[0006] Further, on the surface of the substrate, the Mini-LED chips of the same light color in the same light-emitting chip are arranged in central symmetry.
[0007] Further, the substrate includes an exposed metal pad and a metal trace located inside the substrate. The Mini-LED chips of the same light color in one light-emitting chip are directly connected in series through the metal pad, or the Mini-LED chips of the same light color in one light-emitting chip are connected in series through the metal trace.
[0008] Further, the substrate and the encapsulation substrate are a PCB substrate, a BT resin substrate, a glass substrate, a silicon substrate or a ceramic substrate.
[0009] Further, the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the fourth light-emitting chip share an anode and are connected to the anode pin of the substrate.
[0010] Further, the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the fourth light-emitting chip share a cathode and are connected to the cathode pin of the substrate.
[0011] Further, the thickness of the anti-glare layer is 0 - 15 μm, the haze of the anti-glare layer is 0 - 90, there is 1 layer of the anti-reflection layer, the thickness of the anti-reflection layer is 100 - 200 nm, and the visible light reflectivity of the anti-reflection layer is less than 2%.
[0012] Further, the anti-reflection layer is a magnesium fluoride layer, a titanium dioxide layer, a silicon dioxide layer, an aluminum oxide layer, a zirconium dioxide layer, a zinc sulfide layer, a silicon carbide layer or a silicon nitride layer.
[0013] Further, the anti-glare layer is an anti-glare optical structure layer, an anti-glare coating or an anti-glare plating layer, and the anti-glare optical structure layer includes a matte layer.
[0014] The beneficial effects of the present utility model are as follows: The present utility model provides a Mini-LED direct display screen packaging structure, which includes a plurality of direct display screen modules, a connection device between the plurality of direct display screen modules, and an external fixing bracket. The external fixing bracket is installed outside the plurality of direct display screen modules. The connection device includes a first magnet and a second magnet, and the plurality of direct display screen modules are magnetically connected to each other. The direct display screen module includes a plurality of Mini-LED light-emitting units, a packaging substrate, and a packaging layer. The Mini-LED light-emitting unit includes a driving chip, a first light-emitting chip, a second light-emitting chip, a third light-emitting chip, a fourth light-emitting chip, and a substrate. The driving chip is placed in the middle of the substrate, and the first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip are respectively placed at the four vertex positions of the substrate and are connected to the driving chip. The packaging layer covers the Mini-LED light-emitting unit and the packaging substrate, and an anti-glare layer and at least one anti-reflection layer are sequentially stacked on the packaging layer. Connecting a plurality of direct display screen modules together by magnetic attraction can effectively avoid the situation of the direct display screen module falling off during use; integrating the light-emitting chip and the driving chip makes the packaging simple; integrating two groups of RGB Mini-LED chips in the same light-emitting chip can meet the application requirements of high brightness, with good color consistency and high cost performance; sequentially stacking an anti-glare layer and at least one anti-reflection layer on the packaging layer can effectively prevent glare. Description of the Drawings
[0015] The present utility model will be further described below with reference to the drawings and embodiments.
[0016] Figure 1 It is an overall schematic diagram of a Mini-LED direct display screen packaging structure provided by an embodiment of the present utility model.
[0017] Figure 2 It is a schematic diagram of the structure of a direct display screen module provided by an embodiment of the present utility model.
[0018] Figure 3 It is a schematic diagram of the structure of a Mini-LED light-emitting unit provided by an embodiment of the present utility model. Detailed Embodiments
[0019] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations as sequential processes, many of the operations can be implemented in parallel, concurrently, or simultaneously. In addition, the order of the operations can be rearranged. The process can be terminated when its operations are completed, but it can also have additional steps not included in the figures. The process can correspond to a method, function, procedure, subroutine, subprogram, and so on.
[0020] It should be understood that although terms such as "first" and "second" may be used herein to describe various units, these units should not be limited by these terms. These terms are only used to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, the first unit can be referred to as the second unit, and similarly, the second unit can be referred to as the first unit. The term "and / or" used herein includes any and all combinations of one or more of the listed associated items.
[0021] The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only schematically shows the basic structure of the present invention, and therefore only shows the components related to the present invention.
[0022] Embodiment 1
[0023] As shown in Figure 1 the figure, a Mini-LED direct display screen packaging structure provided by the present invention is shown.
[0024] As an example, in combination with Figure 2, including multiple direct display screen modules 1, connection devices between the multiple direct display screen modules 1, and an external fixing bracket 2. The external fixing bracket 2 is installed outside the multiple direct display screen modules 1. The connection device includes a first magnet and a second magnet (not shown in the figure). The multiple direct display screen modules 1 are magnetically connected to each other. The direct display screen module 1 includes multiple Mini-LED light-emitting units 110, a packaging substrate 120, and a packaging layer 130. The Mini-LED light-emitting unit 110 includes a driving chip 1101, a first light-emitting chip 1102, a second light-emitting chip 1103, a third light-emitting chip 1104, a fourth light-emitting chip 1105, and a substrate 1106. The driving chip 1101 is placed in the middle of the substrate 1106. The first light-emitting chip 1102, the second light-emitting chip 1103, the third light-emitting chip 1104, and the fourth light-emitting chip 1105 are respectively placed at the four vertex positions of the substrate 1106 and are connected to the driving chip 1101. The packaging layer 130 covers the Mini-LED light-emitting unit 110 and the packaging substrate 120. An anti-glare layer 140 and at least one anti-reflection layer 150 are sequentially stacked on the packaging layer 130.
[0025] Preferably, the driving chip 1101 is a constant-current PWM driving chip. Among them, the digital interface of the driving chip 1101 includes datain (data input), clkin (clock input), dataout (data output), and clkout (clock output). The internal pins of the driving chip 1101 include 12 constant-current channels, namely VDD-GB (blue-green chip power supply), VDDR (red chip power supply), and several GNDs. When the driving chip drives 3 RGB pixels, the driving chip has 12 constant-current outputs.
[0026] Preferably, as Figure 3 shown, the first light-emitting chip 1102, the second light-emitting chip 1103, the third light-emitting chip 1104, and the fourth light-emitting chip 1105 respectively include two groups of red Mini-LED chips 11021, two groups of blue Mini-LED chips 11022, and two groups of green Mini-LED chips 11023. The same-color Mini-LED chips are connected in series. Among them, on the surface of the substrate 1106, the Mini-LED chips of the same light color in the same light-emitting chip are arranged in central symmetry.
[0027] Preferably, the substrate 1106 includes exposed metal pads and metal traces located inside the substrate 1106. The Mini-LED chips of the same light color in one light-emitting chip are directly connected in series through the metal pads, or the Mini-LED chips of the same light color in one light-emitting chip are connected in series through the metal traces.
[0028] Preferably, the substrate 1106 and the encapsulation substrate 120 are PCB substrates, BT resin substrates, glass substrates, silicon substrates or ceramic substrates.
[0029] Preferably, the first light-emitting chip 1102, the second light-emitting chip 1103, the third light-emitting chip 1104 and the fourth light-emitting chip 1105 are common anode and are connected to the anode pin of the substrate 1106.
[0030] Preferably, the first light-emitting chip 1102, the second light-emitting chip 1103, the third light-emitting chip 1104 and the fourth light-emitting chip 1105 are common cathode and are connected to the cathode pin of the substrate 1106.
[0031] Preferably, the thickness of the anti-glare layer 140 is 0-15 μm, the haze of the anti-glare layer 140 is 0-90, one layer of the anti-reflection layer 150 is provided, the thickness of the anti-reflection layer is 100-200 nm, and the visible light reflectivity of the anti-reflection layer 150 is less than 2%.
[0032] Preferably, as Figure 2 shown, a black underfill 160 is provided on the encapsulation substrate 120 at the gap between any two adjacent Mini-LED light-emitting units 110 to improve the overall contrast of the direct-view display module 1. The vertical cross-sectional shape of the black underfill 160 can be rectangular or trapezoidal (such as an isosceles trapezoid). And on the encapsulation substrate 120, the black underfill 160 extends into the gap between the Mini-LED light-emitting unit 110 and the encapsulation substrate 120. Further exemplarily, the upper surface height of the black underfill 160 is lower than the lower surface height of the light-emitting chip in the Mini-LED light-emitting unit 110 to avoid the absorption of the light emitted by the Mini-LED light-emitting unit 110 by the black underfill 160. The black underfill 160 is a black light-absorbing material and can be realized by processes such as inkjet, sputtering, evaporation, embossing, printing, coating, dispensing, etc. The material of the black underfill 160 can be ink, coating, dry film, etc. The black underfill 160 can be completed on the encapsulation substrate 120 before die-bonding of several Mini-LED light-emitting units 110, or can also be completed after die-bonding.
[0033] Preferably, the anti-reflection layer 150 is a magnesium fluoride layer, a titanium dioxide layer, a silicon dioxide layer, an aluminum oxide layer, a zirconium dioxide layer, a zinc sulfide layer, a silicon carbide layer or a silicon nitride layer.
[0034] Preferably, the anti-glare layer 140 is an anti-glare optical structure layer, an anti-glare coating or an anti-glare plating layer, and the anti-glare optical structure layer includes a matte layer.
[0035] In the above embodiments, the multiple direct display screen modules are connected together by magnetic attraction, which can effectively avoid the detachment of the direct display screen modules during use; by integrating the light-emitting chip and the driving chip together, the packaging is simple; by integrating two groups of RGB Mini-LED chips in the same light-emitting chip, the application requirements of high brightness can be met, the color consistency is good, and the cost performance is high; by sequentially laminating an anti-glare layer and at least one anti-reflection layer on the encapsulation layer, the situation of glare can be effectively prevented.
[0036] The above are only embodiments of the present utility model. Common general knowledge such as specific structures and characteristics in the solution are not described in detail herein. Those of ordinary skill in the art know all the common general knowledge in the technical field to which the utility model belongs before the application date or priority date, can know all the existing technologies in this field, and have the ability to apply conventional experimental means before this date. Those of ordinary skill in the art can, under the inspiration given in this application, combine their own abilities to complete and implement this solution. Some typical well-known structures or well-known methods should not be an obstacle for those of ordinary skill in the art to implement this application. It should be noted that for those skilled in the art, without departing from the structure of the present utility model, several deformations and improvements can still be made, and these should also be regarded as the protection scope of the present utility model, and these will not affect the implementation effect of the present utility model and the practicality of the patent. The protection scope required by this application should be subject to the content of its claims, and the specific implementation manners and the like recorded in the specification can be used to interpret the content of the claims.
Claims
1. A Mini-LED direct display screen packaging structure, characterized in that, It includes multiple direct display screen modules, a connecting device between the multiple direct display screen modules, and an external fixing bracket. The external fixing bracket is installed outside the multiple direct display screen modules. The connecting device includes a first magnet and a second magnet. The multiple direct display screen modules are magnetically connected to each other. The direct display screen module includes multiple Mini-LED light-emitting units, a packaging substrate, and a packaging layer. The Mini-LED light-emitting unit includes a driving chip, a first light-emitting chip, a second light-emitting chip, a third light-emitting chip, a fourth light-emitting chip, and a substrate. The driving chip is placed in the middle part of the substrate. The first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip are respectively placed at the four vertex positions of the substrate and are connected to the driving chip. The packaging layer covers the Mini-LED light-emitting unit and the packaging substrate. An anti-glare layer and at least one anti-reflection layer are sequentially stacked on the packaging layer.
2. The Mini-LED direct display screen packaging structure according to claim 1, characterized in that, Each of the first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip includes two groups of red Mini-LED chips, two groups of blue Mini-LED chips, and two groups of green Mini-LED chips, and the same-color Mini-LED chips are connected in series.
3. The Mini-LED direct display screen packaging structure according to claim 2, characterized in that, On the surface of the substrate, the Mini-LED chips of the same light color in the same light-emitting chip are arranged in central symmetry.
4. The Mini-LED direct display screen packaging structure according to claim 2, wherein The substrate includes exposed metal pads and metal traces located inside the substrate. The Mini-LED chips of the same light color in one light-emitting chip are directly connected in series through the metal pads, or the Mini-LED chips of the same light color in one light-emitting chip are connected in series through the metal traces.
5. The Mini-LED direct display screen packaging structure according to claim 1, wherein, The substrate and the packaging substrate are PCB substrates, BT resin substrates, glass substrates, silicon substrates, or ceramic substrates.
6. The Mini-LED direct display screen packaging structure according to claim 1, characterized in that, The first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip are common anode and are connected to the anode pin of the substrate.
7. The Mini-LED direct display screen packaging structure according to claim 1, wherein, The first light-emitting chip, the second light-emitting chip, the third light-emitting chip, and the fourth light-emitting chip are common cathode and are connected to the cathode pin of the substrate.
8. The Mini-LED direct display screen packaging structure according to claim 1, wherein, The thickness of the anti-glare layer is 0 - 15μm, the haze of the anti-glare layer is 0 - 90, one anti-reflection layer is provided, the thickness of the anti-reflection layer is 100 - 200nm, and the visible light reflectivity of the anti-reflection layer is less than 2%.
9. The Mini-LED direct display screen packaging structure according to claim 8, wherein, The anti-reflection layer is a magnesium fluoride layer, a titanium dioxide layer, a silicon dioxide layer, an aluminum oxide layer, a zirconium dioxide layer, a zinc sulfide layer, a silicon carbide layer, or a silicon nitride layer.
10. The Mini-LED direct display screen packaging structure according to claim 8, characterized in that, The anti-glare layer is an anti-glare optical structure layer, an anti-glare coating, or an anti-glare plating layer, and the anti-glare optical structure layer includes a matte layer.