Heat conduction channel sealing structure
By designing a heat-conducting channel sealing structure, including an open section and a tight section, the problem that the traditional sealing structure cannot adapt to complex environments is solved, efficient filling and packaging of the heat-conducting medium is achieved, and the heat dissipation performance of the radiator is improved.
Patent Information
- Application Number
- CN202421734360.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-07-22
AI Technical Summary
The traditional heat conducting medium sealing structure cannot meet the filling and packaging requirements of different media in complex environments, resulting in poor heat dissipation effect.
A heat-conducting channel sealing structure is designed, including an open section and a tight-conducting section. The open section is connected to the outside world, and the tight-conducting section is connected to the heat-conducting channel. The diameter of the open section is larger than that of the tight-conducting section. Combined with the sealing plug, it can adapt to the filling and packaging needs of different media.
The filling and packaging of heat conducting media in complex or harsh environments can enhance the thermal conductivity of the radiator and improve the heat dissipation speed and efficiency.
Smart Images
Figure CN223140772U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat exchange equipment, in particular to a sealing structure for a heat conduction channel. Background Technique
[0002] With the development of technology, more and more electronic devices are developing towards miniaturization, multi-functionality, and multi-chip integration. As a result, high integration density leads to higher heat generation in the integrated circuits inside the devices. As is well known, high temperature is the enemy of integrated circuits. High temperature not only causes unstable system operation and shortened service life, but may even cause some components to burn out. Continuous high temperature will greatly reduce the reliability of electronic devices and even cause electronic devices to fail. Therefore, the problem of rapid and effective heat dissipation of integrated circuits has received wide attention.
[0003] In order to reduce the temperature of integrated circuits and ensure their normal operation, a radiator is usually installed on the integrated circuits. The radiator absorbs the heat dissipated by the integrated circuits, reduces the temperature of the integrated circuits, and then the liquid heat conduction medium circulates in the heat conduction channel of the radiator to cool the radiator. Cooperating with heat dissipation fins to increase the heat dissipation area, continuous heat dissipation is achieved.
[0004] With the rapid development of the liquid cooling heat dissipation technology of integrated circuits, the heat conduction medium is also constantly updated, improving the heat dissipation effect of the radiator, thereby accelerating the heat dissipation speed and upper limit of integrated circuits.
[0005] At the same time, the filling and encapsulation requirements of the heat conduction medium are also constantly improving. The filling and encapsulation requirements of different media are significantly different. Some need to be filled under conditions higher than 50 degrees, some need to be filled under conditions lower than -10 degrees, some need to be filled under conditions higher than 1.5 times atmospheric pressure, some need to be filled under conditions lower than 0.8 times atmospheric pressure, some need to be filled in a gaseous state, and some need to be filled in a liquid state.
[0006] Therefore, the traditional sealing structure of the heat conduction medium can no longer meet its filling and encapsulation requirements. Content of the Utility Model
[0007] The purpose of the utility model is to provide a sealing structure for a heat conduction channel, which can meet the filling and encapsulation requirements of the heat conduction medium in various complex environments.
[0008] A sealing structure for a heat conduction channel includes a radiator body. A cooling channel and a heat conduction channel are arranged in the radiator body. The key lies in that the heat conduction channel is provided with a sealing structure communicating with the outside, and the sealing structure is located on the side wall of the radiator body;
[0009] The sealing structure is provided with an open section and a tight section. Among them, the open section communicates with the outside world, the tight section communicates with the heat conduction channel, and the diameter of the open section is larger than that of the tight section.
[0010] The above structure can meet the filling and encapsulation requirements of different heat conduction media, and realize the filling and encapsulation operations of heat conduction media in various complex or harsh environments, thereby enhancing the heat conduction effect of the radiator body and improving the heat dissipation speed and effect of the radiator.
[0011] Furthermore, the open section is a straight hole section, the tight section is a straight hole section, and the axes of the open section and the tight section coincide.
[0012] Furthermore, the open section is a flared hole, the tight section is a straight hole section, the large end of the flared hole communicates with the outside world, the small end of the flared hole is connected to the straight pipe, and the axes of the open section and the tight section coincide.
[0013] Furthermore, the large end of the flared hole communicates with the outside world through a connecting section, and the diameter of the connecting section is greater than or equal to the diameter of the large end.
[0014] The axes of the tight section, the connecting section and the open section coincide.
[0015] Furthermore, the open section is a spherical crown open structure, its large end communicates with the outside world, and its small end is connected to the tight section.
[0016] Furthermore, the large end of the spherical crown open structure communicates with the outside world through a connecting section, and the diameter of the connecting section is greater than or equal to the diameter of the large end.
[0017] Furthermore, the radiator body is a metal body.
[0018] The metal body has good heat conductivity. Combined with the heat conduction working medium, it can reduce the temperature of the integrated circuit faster, and the structure has strong stability, ensuring that the heat conduction channel and its sealing structure will not deform.
[0019] Furthermore, a sealing plug is welded at the connection part of the open section and the tight section.
[0020] Furthermore, the sealing plug is solder paste.
[0021] Furthermore, the heat conduction channel is a blind tube, and the middle section of the blind tube is connected to the tight section.
[0022] Beneficial effects: The above structure can meet the filling and encapsulation requirements of different heat conduction media, and realize the filling and encapsulation operations of heat conduction media in various complex or harsh environments, thereby enhancing the heat conduction effect of the radiator body and improving the heat dissipation speed and effect of the radiator. Description of the Drawings
[0023] Figure 1 It is a three-dimensional view of the radiator;
[0024] Figure 2 It is a schematic structural view of the first embodiment;
[0025] Figure 3 It is a schematic structural view of the second embodiment;
[0026] Figure 4 It is a schematic structural view of the third embodiment;
[0027] Figure 5 It is a schematic structural view of the fourth embodiment;
[0028] Figure 6 It is a schematic structural view of the fifth embodiment. Detailed implementation manners
[0029] The following further elaborates in detail on the specific implementation manners and working principles of the present utility model in conjunction with the accompanying drawings.
[0030] As Figures 1 - 6 shown, the heat conduction channel sealing structure includes a radiator body 1, and the radiator body 1 is made of a metal with good thermal conductivity such as copper, silver, or aluminum. Three groups of non - communicating cooling channels 3 and heat conduction channels 2 are arranged in the radiator body 1. All the heat conduction channels 2 are sequentially connected through a heat conduction connection channel 5. Among them, the heat conduction channel 2 is a group of mutually parallel and connected heat dissipation tubes, and these heat dissipation tubes are all blind tubes.
[0031] The heat conduction connection channel 5 is connected to a sealing structure 4 communicating with the outside, and the sealing structure 4 is located on the side wall of the radiator body 1;
[0032] The sealing structure 4 is provided with an open section 42 and a tightened section 41. Among them, the open section 42 communicates with the outside, the tightened section 41 communicates with the heat conduction connection channel 5, the diameter of the open section 42 is larger than that of the tightened section 41, and a sealing plug is welded at the connection part of the open section 42 and the tightened section 41. The sealing plug is solder paste or a metal plug made of the same material as the radiator body 1.
[0033] Embodiment 1:
[0034] As Figure 2 shown, both the open section 42 and the tightened section 41 are straight hole sections, and the axes of the open section 42 and the tightened section 41 coincide.
[0035] Embodiment 2:
[0036] As Figure 3As shown, the open section 42 is a flared hole, and the narrow section 41 is a straight hole section. The large end of the flared hole communicates with the outside world, the small end of the flared hole is connected to the straight hole section, and the axes of the open section 42 and the narrow section 41 coincide.
[0037] Embodiment 3:
[0038] As Figure 4 shown, the open section 42 is a flared hole, and the narrow section 41 is a straight hole section. The large end of the flared hole communicates with the outside world through a connecting section 43 having the same diameter as the large end, and the small end of the flared hole is connected to the straight pipe;
[0039] The axes of the narrow section 41, the connecting section 43, and the open section 42 coincide.
[0040] Embodiment 4:
[0041] As Figure 5 shown, the open section 42 is a spherical crown-shaped open structure, the narrow section 41 is a straight hole section, the large end of the spherical crown-shaped open structure communicates with the outside world, the small end of the spherical crown-shaped open structure is connected to the straight hole section, and the axes of the open section 42 and the narrow section 41 coincide.
[0042] Embodiment 5:
[0043] As Figure 6 shown, the open section 42 is a spherical crown-shaped open structure, the narrow section 41 is a straight hole section, the large end of the spherical crown-shaped open structure communicates with the outside world through a connecting section 43 having the same diameter as the large end, and the small end of the spherical crown-shaped open structure is connected to the straight hole section;
[0044] The axes of the narrow section 41, the connecting section 43, and the open section 42 coincide.
[0045] In the above Embodiments 1 to 5, heat-conducting media can be filled and encapsulated in various complex or harsh environments, such as filling liquid and gaseous heat-conducting media under high temperature and high pressure, filling liquid and gaseous heat-conducting media under high temperature and low pressure, filling liquid and gaseous heat-conducting media under low temperature and low pressure, and filling liquid and gaseous heat-conducting media under low temperature and high pressure.
[0046] Finally, it should be noted that: The above are only specific examples of the present invention. Of course, those skilled in the art can make changes and modifications to the present invention, such as adding the number of connecting sections 43, open sections 42, and narrow sections 41 of the sealing structure 4, changing the shapes of the open section 42 and the narrow section 41, replacing the material of the sealing plug, and changing the material of the radiator body 1. These modifications and variations fall within the scope of the claims of the present invention and its equivalent technologies, and should all be considered as the protection scope of the present invention.
Claims
1. A heat conduction channel sealing structure, including a radiator body (1), wherein a cooling channel (3) and a heat conduction channel (2) are arranged in the radiator body (1), and it is characterized in that, The heat conduction channel (2) is provided with a sealing structure (4) communicating with the outside, and the sealing structure (4) is located on the side wall of the radiator body (1). The sealing structure (4) is provided with an open section (42) and a tightened section (41). Among them, the open section (42) communicates with the outside, the tightened section (41) communicates with the heat conduction channel (2), and the diameter of the open section (42) is larger than that of the tightened section (41).
2. The heat conduction channel sealing structure according to claim 1, wherein The open section (42) is a straight hole section, the tightened section (41) is a straight hole section, and the axes of the open section (42) and the tightened section (41) coincide.
3. The heat conduction channel sealing structure according to claim 1, wherein The open section (42) is a flared hole, the tightened section (41) is a straight hole section, the large end of the flared hole communicates with the outside, the small end of the flared hole is connected to the straight hole section, and the axes of the open section (42) and the tightened section (41) coincide.
4. The heat conduction channel sealing structure according to claim 3, characterized in that, The large end of the flared hole communicates with the outside through a connecting section (43), and the diameter of the connecting section (43) is larger than or equal to the diameter of the large end. The axes of the tightened section (41), the connecting section (43) and the open section (42) coincide.
5. The heat conduction channel sealing structure according to claim 1, characterized in that, The open section (42) is a spherical crown-shaped open structure, its large end communicates with the outside, and its small end is connected to the tightened section (41).
6. The heat conduction channel sealing structure according to claim 5, characterized in that The large end of the spherical crown-shaped open structure communicates with the outside through a connecting section (43), and the diameter of the connecting section (43) is larger than or equal to the diameter of the large end.
7. The heat conduction channel sealing structure according to claim 1, characterized in that, The radiator body (1) is a metal body.
8. The heat conduction channel sealing structure according to claim 1, characterized in that A sealing plug is welded at the connection part of the open section (42) and the tightened section (41).
9. The heat conduction channel sealing structure according to claim 8, characterized in that, The sealing plug is solder paste.
10. The heat conduction channel sealing structure according to any one of claims 1 to 9, wherein The heat conduction channel (2) is a blind tube, and the middle section of the blind tube is connected to the tightened section (41).