BMS shell and battery module
By using bidirectional inline heat dissipation parts and thermal conduction plates in the BMS shell, the problem of poor heat dissipation effect of BMS plastic shell is solved, efficient heat export and aesthetics of the battery shape are achieved, and the assembly process is simplified.
Patent Information
- Application Number
- CN202421941073.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-12
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-12
AI Technical Summary
The existing BMS plastic shell has poor heat dissipation effect and cannot effectively export the heat on the BMS protection board, especially in high temperature environments, which affects the normal operation and safety of the battery.
The heat dissipation member adopts a bidirectional inline design, including a first heat dissipation part and a second heat dissipation part, and combines a heat conducting plate to export heat from the retention space to the outside of the shell. The heat dissipation area and efficiency are improved by setting a plurality of convex ribs and thermal conducting glue on the shell, and a groove and a heat dissipation isolation retaining wall are provided on the lower shell to prevent heat from flowing back.
It effectively increases the heat dissipation area and heat conduction efficiency, ensures that heat is exported from the BMS protective plate and MOS tube, avoids high temperature environments, simplifies the assembly process, and maintains the overall aesthetics of the battery appearance.
Smart Images
Figure CN223142265U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of batteries, and particularly to a BMS housing and a battery module. Background Art
[0002] BMS (Battery Management System) is a key component in applications such as electric vehicles, energy storage systems, drones, and power tools, responsible for monitoring and managing the state of the battery. It is used to monitor and control the state of the battery to ensure the normal operation and safe use of the battery. At present, the housing materials of BMS are mainly divided into two types: metal and plastic. Among them, the BMS housing made of metal has good shielding and heat dissipation properties, but the weight of the BMS housing made of metal is relatively large, and its cost is relatively high. Compared with the BMS housing made of metal, the BMS housing made of plastic is light in weight, low in cost, and has good appearance processing performance. However, most plastics have poor heat dissipation performance, and even melt at high temperatures.
[0003] Due to the increasing requirements of the market for the charging and discharging power of electric vehicle lithium batteries, the overcurrent of the MOS transistors on the BMS protection board is getting larger and the resulting temperature rise is getting higher. At present, the heat dissipation methods adopted by BMS made of plastic materials mostly increase the heat dissipation area of the aluminum substrate heat sink. However, usually limited by the overall shape of the battery, the space for increasing the aluminum substrate heat sink is limited, and the aluminum substrate heat sink only dissipates heat in the inner compartment of the BMS plastic housing, and the heat does not conduct to the outside of the BMS plastic housing, so that the BMS protection board still works in a high-temperature environment. Summary of the Utility Model
[0004] The utility model provides a BMS housing and a battery pack to solve the problem that the heat dissipation method of increasing the aluminum substrate heat sink has poor effect when it is not convenient to increase the BMS plastic housing in the prior art.
[0005] To solve the above technical problems, in the first aspect, the technical solution adopted by the utility model is to provide a BMS housing, which includes: a housing, at least one heat dissipation member, and a heat conduction plate.
[0006] The housing includes an upper housing and a lower housing. Among them, the upper housing and the lower housing are buckled with each other along a first direction to form an accommodation space for accommodating the BMS protection board.
[0007] The heat dissipation member includes a first heat dissipation part and a second heat dissipation part which are connected to each other. The first heat dissipation part is located in the accommodation space, and the second heat dissipation part is located outside the housing; the heat conduction plate is located between the heat dissipation member and the BMS protection board along the first direction.
[0008] The beneficial effects brought by the technical solution provided by the utility model compared with the prior art are:
[0009] By embedding heat dissipation components bidirectionally on the housing, the heat generated by the BMS protection board and the MOS transistors thereon can be effectively conducted out of the accommodation space along the heat dissipation components. Specifically, a heat conduction plate is provided between the BMS protection board and the heat dissipation component, so that the heat of the BMS protection board can be conducted along the heat conduction plate to the heat dissipation component. Among them, the heat dissipation component includes a first heat dissipation part and a second heat dissipation part. The first heat dissipation part receives the heat from the heat conduction plate and transfers the heat to the outside of the housing through the second heat dissipation part.
[0010] Compared with the current method of increasing the number of aluminum substrates on the BMS protection board to improve heat dissipation, the via design of the above heat dissipation component, that is, the first heat dissipation part is located in the accommodation space and the second heat dissipation part is located outside the housing, can effectively increase the heat dissipation area and conduct out the heat while not affecting the overall shape of the battery.
[0011] In some embodiments, a plurality of the heat dissipation components are inserted into the accommodation space in opposite directions along the second direction.
[0012] In some embodiments, heat dissipation fins are provided on one side of the second heat dissipation part away from the BMS protection board along the second direction. Among them, the heat dissipation fins include a plurality of ribs arranged at intervals along the first direction or the second direction.
[0013] By adopting the above technical solution, the surface area of the heat dissipation fins can be effectively increased by providing a heat dissipation fin with a plurality of ribs, thereby improving the heat conduction efficiency. Further, a heat conduction adhesive is coated on the outer side of the heat dissipation fins. The heat conduction adhesive is a special adhesive, and coating the heat conduction adhesive can effectively improve the heat conduction efficiency and ensure the heat dissipation performance of the heat dissipation component.
[0014] In some embodiments, grooves are provided on both sides of the lower housing along the second direction, and the second heat dissipation part is embedded in the grooves. By adopting the above technical solution, the lower housing is embedded in the grooves, making the outer surface of the housing relatively flat.
[0015] Further, a heat dissipation isolation wall is provided in the groove. The heat dissipation isolation wall is located between the lower housing and the second heat dissipation part along the second direction and is used to prevent heat from flowing back to the accommodation space.
[0016] By adopting the above technical solution, when heat is conducted out through the heat dissipation component, in order to prevent the heat dissipation component from contacting the lower housing and causing heat to flow back, a heat dissipation isolation wall is added for temperature rise conduction isolation, thereby controlling the distribution of heat flow.
[0017] In some embodiments, the projection shape of the heat sink along the second direction is L-shaped or T-shaped. Both the T-shaped heat sink and the L-shaped heat sink can be inserted into the accommodation space through the through-hole technology of the housing to export the internal heat.
[0018] In some embodiments, the lower housing is further provided with fixing hooks for fixing the heat sink. Among them, the fixing hooks are located below the heat conduction plate along the first direction and between the two heat sinks arranged oppositely along the second direction.
[0019] Adopting the above technical solution, the heat sink is fixed by the fixing hooks, which effectively simplifies the assembly process of the heat sink when no additional installation tools are required.
[0020] In some embodiments, the heat conduction plate is a heat-conducting silicone film and is adhered to the bottom surface of the first heat dissipation part along the first direction.
[0021] Adopting the above technical solution, the heat-conducting silicone film is a composite material based on silicone rubber and added with heat-conducting fillers (such as alumina, boron nitride, carbon nanotubes, etc.). Using it as the heat conduction plate can effectively transfer heat from the BMS protection plate to the heat sink.
[0022] On the other hand, the present application further provides a battery module, including the above-mentioned BMS housing and the module housing. The BMS housing is located inside the module housing. Among them, the second heat dissipation part of the BMS housing is attached to the inner wall of the module housing. Further, a heat-conducting adhesive is coated between the second heat dissipation part and the module housing.
[0023] Adopting the above technical solution, the heat is conducted to both sides of the BMS housing through the heat conduction plate, and finally, the temperature rise heat of the BMS protection plate is transferred to the module housing of the battery module by coating the heat-conducting adhesive. Description of the Drawings
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:
[0025] Figure 1 is a schematic cross-sectional structure diagram of a BMS housing provided by the present invention;
[0026] Figure 2 is Figure 1 the heat flow diagram of;
[0027] Figure 3It is an exploded schematic diagram of an embodiment of a BMS housing provided by the present utility model;
[0028] Figure 4 It is a three-dimensional structural schematic diagram of an embodiment of a BMS housing provided by the present utility model;
[0029] Figure 5 It is an L-shaped three-dimensional structural diagram of an embodiment of a heat dissipation component of a BMS housing provided by the present utility model;
[0030] Figure 6 It is a T-shaped three-dimensional structural diagram of an embodiment of a heat dissipation component of a BMS housing provided by the present utility model;
[0031] Figure 7 It is a cross-sectional view of an embodiment of a battery module provided by the present utility model.
[0032] In the figure:
[0033] Housing - 10; Upper housing - 11; Lower housing - 12; Groove - 120; Heat dissipation isolation wall - 121; Fixed hook - 122; Accommodation space - 13;
[0034] Heat dissipation component - 20; First heat dissipation part - 21; Second heat dissipation part - 22; Heat dissipation plate - 220; Rib - 221; Screw hole - 23; Heat conduction plate - 30; BMS protection plate - 40; Module housing - 50. Detailed implementation manners
[0035] Next, with reference to the accompanying drawings in the embodiments of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0036] For the convenience of subsequent description, before describing the specific structures of the BMS housing and the battery module, the present application first combines Figure 1 Define the first direction (Z) and the second direction (X). Among them, the first direction is the height direction of the BMS housing when it is placed normally, for example, the Z direction; the second direction is the width direction of the BMS housing when it is placed normally, for example, the X direction. In the present application, the first direction (Z) and the second direction (X).
[0037] See Figures 1 to 2 as shown, Figure 1 shows a cross-sectional structural schematic diagram of a BMS housing provided by the present application; Figure 2 For Figure 1 is the heat flow diagram of
[0038] In some embodiments, the BMS housing includes: a housing 10, at least one heat sink 20, and a heat conducting plate 30. The housing 10 includes an upper housing 11 and a lower housing 12, wherein the upper housing 11 and the lower housing 12 are mutually engaged along a first direction to form an accommodating space 13 for accommodating the BMS protection plate 40.
[0039] The heat sink 20 includes a first heat sink 21 and a second heat sink 22 connected to each other. The first heat sink 21 is located in the accommodating space 13, and the second heat sink 22 is located outside the housing 10. The heat conducting plate 30 is located between the heat sink 20 and the BMS protection plate 40 along the first direction.
[0040] In the embodiment of the present application, the heat sink 20 is provided in a bidirectional embedded manner on the housing 10, for example, in combination with Figure 1 As shown, a plurality of heat sinks 20 are inserted into the accommodating space 13 in a direction opposite to each other, and the heat sinks 20 are symmetrically embedded in the lower housing 12 in the direction opposite to each other. The present application does not limit the number of heat sinks 20, and for example, the number of heat sinks 20 is 2 or 4. The housing 10 is made of plastic, and the heat sink 20 is made of aluminum alloy as a base material, which has good thermal conductivity and heat dissipation properties.
[0041] Combination Figure 2 As shown, a heat conducting plate 30 is provided between the BMS protection plate 40 and the heat sink 20, so that the heat of the BMS protection plate 40 can be conducted to the heat sink 20 along the heat conducting plate 30. Specifically, the heat generated by the BMS protection plate 40 and the MOS tube thereon is conducted to the heat sink 20 through the heat conducting plate 30, and is conducted out of the accommodating space 13 along the heat sink 20. The heat sink 20 includes a first heat sink 21 and a second heat sink 22. The first heat sink 21 receives the heat of the heat conducting plate 30 and transfers the heat to the outside of the housing 10 through the second heat sink 22.
[0042] Compared with the current method of increasing the amount of aluminum substrate on the BMS protection plate 40 to improve heat dissipation, the through-hole design of the above-mentioned heat sink 20, that is, the first heat dissipation part 21 is located in the accommodating space 13, and the second heat dissipation part 22 is located outside the shell 10, can effectively increase the heat dissipation area and conduct heat without affecting the overall shape of the battery.
[0043] See also Figure 3 As shown, Figure 3 An exploded schematic diagram of an embodiment of a BMS housing provided by the present application is shown.
[0044] In some embodiments, grooves 120 are provided on both sides of the lower housing 12 along the second direction, and the second heat dissipation part 22 is embedded in the grooves 120. Exemplarily, the lower housing 12 is provided with grooves 120 so that the heat dissipation member 20 can be designed in an embedded manner. Among them, through holes are provided in the grooves 120 so that the first heat dissipation part 21 of the heat dissipation member 20 can pass through them, and the outer surface of the housing 10 is ensured to be relatively flat.
[0045] Further, as shown in Figure 2 In addition, a heat dissipation isolation retaining wall 121 is further provided in the groove 120. The heat dissipation isolation retaining wall 121 is located between the lower housing 12 and the second heat dissipation part 22 along the second direction, preventing the heat dissipation member 20 from contacting the lower housing 12 and causing heat backflow. The heat dissipation isolation retaining wall 121 is added to conduct temperature rise conduction isolation, thereby controlling the distribution of heat flow.
[0046] As shown in Figure 4 illustrates Figure 4 a three-dimensional structural schematic diagram of an embodiment of a BMS housing provided by the present application.
[0047] In some embodiments, as shown in Figure 2 a heat dissipation plate 220 is provided on the side of the second heat dissipation part 22 away from the BMS protection plate 40 along the second direction. Among them, the heat dissipation plate 220 includes a plurality of ribs 221 spaced along the first direction or the second direction.
[0048] In the embodiments of the present application, by providing the heat dissipation plate 220 with a plurality of ribs 221, the surface area of the heat dissipation plate 220 can be effectively increased, thereby improving the heat conduction efficiency. Further, a thermal conductive adhesive is coated on the outer side of the heat dissipation plate 220. The thermal conductive adhesive is a special adhesive, and coating the thermal conductive adhesive can effectively improve the heat conduction efficiency and ensure the heat dissipation performance of the heat dissipation member 20.
[0049] Referring to Figure 5 and Figure 6 illustrates Figure 5 an L-shaped three-dimensional structure diagram of an embodiment of a heat dissipation member 20 of a BMS housing provided by the present application; Figure 6 illustrates a T-shaped three-dimensional structure diagram of an embodiment of a heat dissipation member 20 of a BMS housing provided by the present application.
[0050] In some embodiments, the projection shape of the heat dissipation member 20 along the second direction is L-shaped or T-shaped. Both the T-shaped heat dissipation member 20 and the L-shaped heat dissipation member 20 can be inserted into the accommodation space 13 through the through-hole technology of the housing 10 to export internal heat. Exemplarily, the T-shaped and L-shaped are determined by the stamping technology or the outer shape of the lower housing 12. For example, when the space at the lower end of the lower housing 12 is insufficient, the L-shaped heat dissipation member 20 can be used, or the T-shaped heat dissipation member 20 can be used to increase the heat dissipation area.
[0051] In some embodiments, the lower housing 12 is further provided with fixing hooks 122 for fixing the heat dissipation member 20. Among them, the fixing hooks 122 are located below the heat conduction plate 30 in the first direction and are located between two oppositely arranged heat dissipation members 20 in the second direction.
[0052] In the embodiments of the present application, the heat dissipation member 20 is fixed by the fixing hooks 122, which effectively simplifies the assembly process of the heat dissipation member 20 without the need for additional installation tools. Exemplarily, the fixing hooks 122 can also isolate two oppositely arranged heat dissipation members 20. Exemplarily, as shown in Figure 5 shown, the first heat dissipation portion 21 is further provided with a screw hole 23; so that the heat dissipation member 20 can be fixed in the accommodation space 13.
[0053] In some embodiments, the heat conduction plate 30 is a heat-conducting silicone film and is adhered to the bottom surface of the first heat dissipation portion 21 in the first direction.
[0054] In the embodiments of the present application, the heat-conducting silicone film is a composite material based on silicone rubber and added with heat-conducting fillers (such as alumina, boron nitride, carbon nanotubes, etc.). Using it as the heat conduction plate 30 can effectively transfer heat from the BMS protection plate 40 to the heat dissipation member 20.
[0055] See Figure 7 shown in Figure 7 which shows a cross-sectional view of an embodiment of a battery module provided by the present application.
[0056] In some embodiments, the present application further provides a battery module, including the above-mentioned BMS housing and the module housing 50. The BMS housing is located inside the module housing 50. Among them, the second heat dissipation portion 22 of the BMS housing is in contact with the inner wall of the module housing 50. Further, a heat-conducting adhesive is coated between the second heat dissipation portion 22 and the module housing 50.
[0057] In the embodiments of the present application, heat is conducted to both sides of the BMS housing through the heat conduction plate 30, and finally, by coating the heat-conducting adhesive, the temperature rise heat of the BMS protection plate 40 is transferred to the module housing 50 of the battery module. Exemplarily, coating the heat-conducting adhesive at Figure 7 point A can effectively fill and increase the heat conduction efficiency. The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be within the protection scope of the present invention.
Claims
1. A BMS housing, characterized in that, Comprising: A housing, the housing including an upper housing and a lower housing, wherein the upper housing and the lower housing are snap-fitted to each other in a first direction to form an accommodation space for accommodating a BMS protection board; At least one heat dissipation member, the heat dissipation member including a first heat dissipation portion and a second heat dissipation portion connected to each other, the first heat dissipation portion being located in the accommodation space and the second heat dissipation portion being located outside the housing; A heat conduction plate, the heat conduction plate being located between the heat dissipation member and the BMS protection board in the first direction.
2. The BMS housing according to claim 1, wherein, A plurality of the heat dissipation members are inserted into the accommodation space in opposite directions in a second direction, the first direction being the height direction and the second direction being the width direction.
3. The BMS housing according to claim 1, characterized in that, A heat dissipation fin is provided on a side of the second heat dissipation portion away from the BMS protection board in the second direction, wherein the heat dissipation fin includes a plurality of ribs spaced apart in the first direction or the second direction.
4. The BMS housing according to claim 3, wherein A heat conduction adhesive is further coated on the outer side of the heat dissipation fin.
5. The BMS housing according to claim 1, characterized in that, Grooves are provided on both sides of the lower housing in the second direction, and the second heat dissipation portion is embedded in the grooves.
6. The BMS housing according to claim 5, characterized in that, A heat dissipation isolation wall is further provided in the grooves, the heat dissipation isolation wall being located between the lower housing and the second heat dissipation portion in the second direction and being used to prevent heat from flowing back to the accommodation space.
7. The BMS housing according to any one of claims 1 to 6, characterized in that, The projection shape of the heat dissipation member in the second direction is L-shaped or T-shaped.
8. The BMS housing according to claim 1, characterized in that, The lower housing is further provided with fixing hooks for fixing the heat dissipation member, wherein the fixing hooks are located below the heat conduction plate in the first direction and between two of the heat dissipation members arranged oppositely in the second direction.
9. The BMS housing according to claim 1, characterized in that, The heat conduction plate is a heat conduction silicone film and is adhered to the bottom surface of the first heat dissipation portion in the first direction.
10. A battery module, characterized in that, Including the BMS housing and the module housing according to any one of claims 1 to 9, the BMS housing being located inside the module housing, wherein the second heat dissipation portion of the BMS housing is in contact with the inner wall of the module housing and is coated with a heat conduction adhesive.