Display substrate and display device
By setting grooves and covering metal layers in the barrier area of the OLED display substrate, combined with a multi-layer isolation structure and packaging layer, the problem of water vapor and oxygen corrosion is solved, and the efficient packaging and stress resistance of the display product is achieved, meeting the requirements of lightweight and harsh testing.
Patent Information
- Application Number
- CN202422391000.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-29
AI Technical Summary
Existing OLED display products are susceptible to moisture and oxygen corrosion at the edges of the packaging, resulting in adverse problems such as dark spots, especially under lightweight and harsh testing conditions.
Grooves are provided in the barrier area and covered with metal layers, combining a multi-layer isolation structure and a packaging layer, forming a multi-layer encapsulation structure to block water vapor and oxygen, reducing the conduction path of the organic material film layer, and naturally breaks at the edge of the organic material film layer through the undercut structure to further block corrosive media.
Effectively prevent water vapor and oxygen from entering the display area, avoiding bad spots and other defects, improving the reliability of the display product and resistance to external stresses, and meeting the requirements of lightweight and harsh testing.
Smart Images
Figure CN223142409U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display substrate and a display device. Background Art
[0002] An organic light-emitting diode (OLED) is a light-emitting device that uses an organic solid semiconductor as a light-emitting material. Due to its advantages such as simple preparation process, low cost, low power consumption, high luminous brightness, and wide working temperature range, it has broad application prospects.
[0003] With the continuous development of display technology, higher requirements have been put forward for the reliability conditions of OLED display products and harsh tests such as pressing. During the test, corrosive media such as water vapor and oxygen will enter the interior (such as the display area) of the display product from the encapsulation edge (such as the opening area) of the OLED display product, corrode components such as the light-emitting devices inside the display product, resulting in encapsulation failure and easily causing defects such as black spots. Summary of the Utility Model
[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and provides a display substrate and a display device.
[0005] In a first aspect, an embodiment of the present disclosure provides a display substrate, which has an opening area, a display area surrounding the opening area, and a barrier area disposed between the opening area and the display area. The display substrate includes: a substrate; an inorganic insulating layer located on the substrate; the inorganic insulating layer is provided with a groove in the barrier area; the display substrate further includes: a first metal layer;
[0006] The first metal layer covers the side surface of the groove, and overlaps with at least a part of the bottom surface of the groove and a part of the surface of the inorganic insulating layer facing away from the substrate.
[0007] In some embodiments, the display substrate further includes: a second metal layer located on a side of the first metal layer facing away from the substrate;
[0008] At the overlapping portion of the first metal layer and the inorganic insulating layer, a positive projection of the second metal layer on the substrate covers a positive projection of the first metal layer on the substrate.
[0009] In some embodiments, the first metal layer and the second metal layer are continuously provided on the bottom surface of the groove, and the first metal layer completely covers the bottom surface of the groove.
[0010] In some embodiments, the first metal layer and the second metal layer are both discontinuously disposed on the bottom surface of the groove;
[0011] At the discontinuity of the first metal layer and the second metal layer, the orthographic projection of the second metal layer on the substrate covers the orthographic projection of the first metal layer on the substrate.
[0012] In some embodiments, the bottom surface of the groove has a central region and a lap region surrounding the central region, and the first metal layer only covers the lap region of the bottom surface of the groove, exposing the central region of the bottom surface of the groove.
[0013] In some embodiments, the bottom surface of the groove has a central region and a lap region surrounding the central region, and the first metal layer covers the edge region and a part of the central region of the bottom surface of the groove.
[0014] In some embodiments, the display substrate further includes: a plurality of isolation columns and barrier dams located on a side of the inorganic insulating layer facing away from the substrate and disposed in the barrier region;
[0015] The groove is located between adjacent isolation columns, and is located on a side of the barrier dam close to the opening region and / or a side away from the opening region.
[0016] In some embodiments, the isolation column includes: a first isolation layer and a second isolation layer stacked;
[0017] The first isolation layer is disposed on the same layer as the first metal layer;
[0018] The second isolation layer is disposed on the same layer as the second metal layer.
[0019] In some embodiments, the display substrate further includes: a source-drain conductive layer and an anode conductive layer located on the substrate;
[0020] The source-drain conductive layer is disposed on the same layer as the first metal layer;
[0021] The anode conductive layer is disposed on the same layer as the second metal layer.
[0022] In a second aspect, an embodiment of the present disclosure provides a display device, and the display device includes the display substrate provided as above. Description of the Drawings
[0023] Figure 1 It is a schematic plan view of an exemplary display substrate.
[0024] Figure 2 is Figure 1 A schematic cross-sectional structure view of the display substrate shown along the C-C' direction.
[0025] Figure 3 A schematic plan view of a display substrate provided by an embodiment of the present disclosure.
[0026] Figure 4 For Figure 3 A schematic cross-sectional view of the display substrate shown in the D-D' direction.
[0027] Figure 5 For Figure 3 Another schematic cross-sectional view of the display substrate shown in the D-D' direction.
[0028] Figure 6 For Figure 3 Another schematic cross-sectional view of the display substrate shown in the D-D' direction.
[0029] Figure 7 For Figure 3 A schematic cross-sectional view of the display substrate shown in the E-E' direction.
[0030] Figure 8 For Figure 3 Another schematic cross-sectional view of the display substrate shown in the E-E' direction.
[0031] Figure 9 For Figure 3 Another schematic cross-sectional view of the display substrate shown in the E-E' direction.
[0032] Figure 10 A schematic flow chart of a method for manufacturing a display substrate provided by an embodiment of the present disclosure. Detailed implementation manners
[0033] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are only some, but not all, of the embodiments of the present disclosure. Components of the embodiments of the present disclosure described and illustrated herein generally may be arranged and designed in a variety of different configurations. Therefore, the detailed description of the embodiments of the present disclosure provided herein is not intended to limit the scope of the claimed present disclosure, but is merely representative of selected embodiments of the present disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative efforts fall within the scope of protection of the present disclosure.
[0034] Unless otherwise defined, technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second" and similar terms used in this disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, terms such as "a", "an" or "the" do not denote a limitation of quantity, but mean that there is at least one. Terms such as "comprising" or "including" mean that the elements or items appearing before this term cover the elements or items listed after this term and their equivalents, without excluding other elements or items.
[0035] As used in this disclosure, "a plurality of" or "several" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.
[0036] Figure 1 It is a schematic plan view of the planar structure of an exemplary display substrate, as Figure 1 shown, the display substrate includes: an opening area AA-hole, a display area AA surrounding the opening area AA-hole, and a barrier area BB disposed between the opening area AA-hole and the display area AA. Sensing devices such as cameras are disposed in the opening area AA-hole, and functions such as imaging can be realized. Pixel units are disposed in the display area AA, and the pixel units may include structures such as pixel driving circuits and light-emitting devices. The light-emitting device therein can emit light under the driving voltage provided by the pixel driving circuit, and a display function can be realized. Organic material film layers are disposed in both the pixel driving circuit and the light-emitting device. For example, the light-emitting device may be an OLED, in which an organic light-emitting layer is disposed. The organic material film layer may extend from the display area AA to the edge of the opening area AA-hole and terminate. Since the organic material film layer has good conduction performance for corrosive media such as water vapor and oxygen, a conduction path for corrosive media such as water vapor and oxygen can be formed along the extending direction of the organic material film layer. Therefore, a barrier area BB is disposed between the opening area AA-hole and the display area AA to block corrosive media such as water vapor and oxygen, and the specific structure in the barrier area BB can refer to Figure 2 .
[0037] Figure 2 For Figure 1 the schematic cross-sectional structure view of the display substrate shown along the C-C' direction, as Figure 2As shown, the display substrate includes: a substrate substrate 101, an inorganic insulating layer 102 located on the substrate substrate 101, a plurality of isolation pillars 103 and a dam 104 located on the side of the inorganic insulating layer 102 facing away from the substrate substrate 101 and disposed in the barrier region BB.
[0038] The isolation pillar 103 can be made of a double-layer structure, that is, a first isolation layer 1031 and a second isolation layer 1032 arranged in a stacked manner, wherein the first isolation layer 1031 is closer to the substrate substrate 101 than the second isolation layer 1032. And the area of the first isolation layer 1031 is smaller than the area of the second isolation layer 1032, and an "upper large and lower small" undercut structure can be formed. When subsequently preparing an organic material film layer (such as an organic light-emitting layer in a light-emitting device), due to the existence of the undercut structure, the organic material film layer thereon will naturally break at the edge of the second isolation layer 1032, so that the conduction paths of corrosive media such as water vapor and oxygen are truncated. At the same time, in cooperation with the dam 104, corrosive media such as water vapor and oxygen can be blocked to prevent corrosive media such as water vapor and oxygen from invading the display region AA along the organic material film layer and damaging the light-emitting devices therein.
[0039] However, due to the further improvement of the requirements for the thinness and lightness of display products at present, the height of the isolation pillar 103 is relatively low, so that there is a high probability that the organic material film layer will not break naturally at the edge of the second isolation layer 1032. And with the continuous development of display technology, higher requirements are also put forward for the reliability conditions of OLED display products and the requirements for harsh tests such as pressing. In the current display products during the test process, corrosive media such as water vapor and oxygen will enter the interior of the display products (such as the display region AA) from the encapsulation edge of the OLED display products (such as the opening region AA-hole), corrode the components such as the light-emitting devices inside the display products, resulting in encapsulation failure and easily causing defects such as black spots.
[0040] In order to at least solve one of the above technical problems, the embodiments of the present disclosure provide a display substrate and a display device. Below, the display substrate and the display device provided by the embodiments of the present disclosure will be further described in detail with reference to the drawings and specific embodiments.
[0041] In a first aspect, the embodiments of the present disclosure provide a display substrate. Figure 3 For a schematic plan view of a display substrate provided by an embodiment of the present disclosure, as Figure 3 shown, the display substrate includes: an opening region AA-hole, a display region AA surrounding the opening region AA-hole, and a barrier region BB disposed between the opening region AA-hole and the display region AA. Figure 4 For Figure 3 a schematic cross-sectional structure view of the display substrate shown along the D-D' direction, asFigure 4 As shown in Figure 4 , the display substrate includes: a substrate substrate 101, and an inorganic insulating layer 102 located on the substrate substrate 101; the inorganic insulating layer 102 is provided with a groove in the barrier region BB; the display substrate further includes: a first metal layer 105; the first metal layer 105 covers the side surface of the groove, and overlaps with at least a part of the bottom surface of the groove and a part of the surface of the inorganic insulating layer 102 facing away from the substrate substrate 101.
[0042] The substrate substrate 101 can be made of a rigid material such as glass, which can improve the load-bearing capacity of the substrate substrate 101 for other film layers thereon. Of course, the substrate substrate 101 can also be made of a flexible material such as polyimide (PI), which can improve the overall anti-bending and anti-stretching performance of the display substrate, and avoid the substrate substrate 101 from breaking due to stress generated during bending, stretching, and twisting, resulting in open-circuit defects. In practical applications, the material of the substrate substrate 101 can be reasonably selected according to actual needs to ensure that the display substrate has good performance.
[0043] The inorganic insulating layer 102 can be made of at least one of silicon nitride (SiN) and silicon dioxide (SiO2). It can form a single-layer structure made of a single material, or a multi-layer structure made of multiple different materials, which can prevent short circuits between adjacent two conductive layers. The pixel driving circuit in the display substrate can be a 4T2C (i.e., 4 transistors and 2 capacitors) structure, a 7T1C (i.e., 7 transistors and 1 capacitor) structure, a 5T1C (i.e., 5 transistors and 1 capacitor) structure, an 8T1C (i.e., 8 transistors and 1 capacitor) structure, or an 8T2C (i.e., 8 transistors and 2 capacitors) structure, etc. The transistors therein can specifically be thin-film transistors, and the thin-film transistors can include: a gate, a gate insulating layer, an active layer, an interlayer insulating layer, and a source-drain electrode layer arranged in sequence along the direction of the substrate substrate 101. The source-drain electrode layer can include: a source electrode and a drain electrode. The source electrode and the drain electrode are respectively connected to both ends of the active layer through vias penetrating the interlayer insulation. The inorganic insulating layer 102 can specifically be the gate insulating layer and the interlayer insulating layer in the thin-film transistor. Among them, the gate insulating layer can cover the gate to prevent short circuits between the gate and the active layer thereon, and the interlayer insulating layer can cover the active layer to prevent short circuits between the active layer and the source-drain electrode layer thereon. The gate insulating layer and the interlayer insulating layer extend from the display region AA to the barrier region BB.
[0044] The inorganic insulating layer 102 (gate insulating layer and interlayer insulating layer) can extend from the display area AA to the barrier area BB, and a groove is provided in the barrier area BB. The groove can penetrate the entire inorganic insulating layer 102 or only penetrate a part of the inorganic insulating layer 102, and its depth can specifically be 1.0 micrometer to 2.0 micrometers, for example, about 1.3 micrometers. Its width can specifically be 8 micrometers to 10 micrometers, for example, about 8 micrometers. In practical applications, the width and depth of the groove can be reasonably set according to actual needs, and will not be limited herein.
[0045] The first metal layer 105 can be made of at least one of the materials molybdenum Mo, aluminum Al, and titanium Ti. It can be a single material among the above materials or an alloy material of two or more of the above materials. It has good ductility and certain strength. The first metal layer 105 can cover the side surface of the groove and lap with at least a part of the bottom surface of the groove and a part of the surface of the inorganic insulating layer 102 facing away from the substrate 101. The lap width between the first metal layer 105 and the inorganic insulating layer 102 can be 3 micrometers to 5 micrometers, for example, 3 micrometers, and the lap width between the first metal layer 105 and the bottom surface of the groove can be at least 2 micrometers to ensure that the first metal layer 105 can completely cover the side surface of the groove.
[0046] In the display substrate provided by the embodiments of the present disclosure, a groove is provided in the inorganic insulating layer 102 in the barrier area BB, and the depth of the groove can be about 1.3 micrometers. When preparing the organic material film layer subsequently, the thickness of the organic material film layer on the side surface of the groove will be significantly thinned. By the structure of the groove itself, the thickness of the organic material film layer can be reduced, which is beneficial to blocking corrosive media such as water vapor and oxygen, and preventing corrosive media such as water vapor and oxygen from entering the inside of the display substrate (such as the display area AA) from the packaging edge of the display substrate (such as the opening area AA-hole), and corroding components such as light-emitting devices inside the display substrate, thereby avoiding defects such as black spots. At the same time, since the first metal layer 105 covers the side surface of the groove and laps with at least a part of the bottom surface of the groove and a part of the surface of the inorganic insulating layer 102 facing away from the substrate 101, when the opening area AA-hole of the display substrate is subjected to external stress, the first metal layer 105 can block the external stress and prevent the external stress from further conducting to the display area AA, thereby preventing the external stress from damaging other devices in the display area AA, and further avoiding defects such as black spots.
[0047] In some embodiments, such as Figure 4As shown, the display substrate further includes: a second metal layer 106 located on a side of the first metal layer 105 away from the substrate 101; at a lap joint of the first metal layer 105 and the inorganic insulating layer 102, a positive projection of the second metal layer 106 on the substrate 101 covers a positive projection of the first metal layer 105 on the substrate 101.
[0048] At a lap joint of the first metal layer 105 and the inorganic insulating layer 102, a positive projection of the second metal layer 106 on the substrate 101 covers a positive projection of the first metal layer 105 on the substrate 101, that is, an area of the second metal layer 106 is larger than an area of the first metal layer 105, and the two can form an undercut structure with "larger on the top and smaller on the bottom". During subsequent preparation of the organic material film layer, due to the existence of the undercut structure, the organic material film layer will naturally break at an edge of the second metal layer 106, and can further block corrosive media such as water vapor and oxygen.
[0049] As Figure 4 shown, the first metal layer 105 and the second metal layer 106 are both continuously provided on a bottom surface of the groove, and the first metal layer 105 completely covers the bottom surface of the groove. The first metal layer 105 and the second metal layer 106 are both continuously provided on the bottom surface of the groove, and the first metal layer 105 completely covers the bottom surface of the groove. During the preparation process, the number of mask plates can be reduced, the process difficulty can be lowered, and the preparation cost can be saved.
[0050] Figure 5 For Figure 3 another schematic cross-sectional structure diagram of the display substrate shown along the D-D' direction, Figure 6 For Figure 3 yet another schematic cross-sectional structure diagram of the display substrate shown along the D-D' direction, as Figure 5 and Figure 6 shown, the first metal layer 105 and the second metal layer 106 are both discontinuously provided on the bottom surface of the groove; at a disconnection of the first metal layer 105 and the second metal layer 106, a positive projection of the second metal layer 106 on the substrate 101 covers a positive projection of the first metal layer 105 on the substrate 101.
[0051] The first metal layer 105 is discontinuously disposed on the bottom surface of the groove. During the manufacturing process, the entire first metal layer 105 can be etched so that the first metal layer 105 only covers a part of the bottom surface of the groove and exposes a part of the bottom surface of the groove. Correspondingly, the second metal layer 106 is also discontinuously disposed on the bottom surface of the groove. At the disconnection between the two, the orthographic projection of the second metal layer 106 on the substrate 101 covers the orthographic projection of the first metal layer 105 on the substrate 101, that is, the area of the second metal layer 106 is larger than the area of the first metal layer 105, and the two can form an "upper-large and lower-small" undercut structure. During the subsequent preparation of the organic material film layer, due to the existence of the undercut structure, the organic material film layer will break naturally at the edge of the second metal layer 106, which can further block corrosive media such as water vapor and oxygen.
[0052] In some embodiments, as Figure 5 shown, the bottom surface of the groove has a central region and a lap region surrounding the central region, and the first metal layer 105 only covers the lap region of the bottom surface of the groove, exposing the central region of the bottom surface of the groove.
[0053] The first metal layer 105 only covers the lap region of the bottom surface of the groove, exposing the central region of the bottom surface of the groove. The second metal layer 106 is disposed in the same manner as the first metal layer 105. At the disconnection between the two, the orthographic projection of the second metal layer 106 on the substrate 101 covers the orthographic projection of the first metal layer 105 on the substrate 101, that is, the area of the second metal layer 106 is larger than the area of the first metal layer 105, and the two can form an "upper-large and lower-small" undercut structure. During the subsequent preparation of the organic material film layer, due to the existence of the undercut structure, the organic material film layer will break naturally at the edge of the second metal layer 106, which can further block corrosive media such as water vapor and oxygen.
[0054] In some embodiments, as Figure 6 shown, the bottom surface of the groove has a central region and a lap region surrounding the central region, and the first metal layer 105 covers the edge region and a part of the central region of the bottom surface of the groove.
[0055] The first metal layer 105 covers the edge area and part of the central area of the bottom surface of the groove, and the second metal layer 106 is arranged in the same way as the first metal layer 105. At the disconnection point between the two, the orthographic projection of the second metal layer 106 on the base substrate 101 covers the orthographic projection of the first metal layer 105 on the base substrate 101, that is, the area of the second metal layer 106 is larger than the area of the first metal layer 105, and the two can form an undercut structure of "large on top and small on bottom". When the organic material film layer is subsequently prepared, due to the existence of the undercut structure, the organic material film layer will naturally break at the edge of the second metal layer 106, which can further block corrosive media such as water vapor and oxygen.
[0056] It should be noted here that Figure 5 and Figure 6 The structure shown differs in that Figure 5 In the structure shown in , the first metal layer 105 only covers the overlapping area of the bottom surface of the groove, exposing the central area of the bottom surface of the groove, and two "large on top and small on bottom" undercut structures can be formed at the disconnection point between the first metal layer 105 and the second metal layer 106. Figure 6 In the structure shown in , the first metal layer 105 covers the edge area and part of the central area of the bottom surface of the groove. At the disconnection point between the first metal layer 105 and the second metal layer 106, four "large on top and small on bottom" undercut structures can be formed, which can further block corrosive media such as water vapor and oxygen.
[0057] like Figure 4 , Figure 5 and Figure 6 As shown, the display substrate also includes: an organic light-emitting layer 107, a first inorganic encapsulation layer 108, an organic encapsulation layer 109 and a second inorganic encapsulation layer 110; the organic light-emitting layer 107 is located on the side of the second metal layer 106 away from the base substrate 101; the first inorganic encapsulation layer 108 is located on the side of the organic light-emitting layer 107 away from the base substrate 101, and is recessed and extended at a position corresponding to the groove; the organic encapsulation layer 109 is located on the side of the first inorganic encapsulation layer 108 away from the base substrate 101, and is filled at a position corresponding to the groove; the second inorganic encapsulation layer 110 is located on the side of the organic encapsulation layer 109 away from the base substrate 101.
[0058] The organic light-emitting layer 107 can be formed by using an organic light-emitting material through an inkjet printing process, and excitons are formed under the driving of an electric field to emit light.
[0059] Both the first inorganic encapsulation layer 108 and the second inorganic encapsulation layer 110 can be made of at least one material among silicon nitride (SiN) and silicon dioxide (SiO2), which can encapsulate the organic light-emitting layer 107 to prevent corrosive media such as water vapor and oxygen from invading and causing damage to the organic light-emitting layer 107.
[0060] The organic insulating layer 109 can be made of an organic material such as epoxy resin. It has a relatively large thickness and high elasticity, which can buffer external stress and prevent the first inorganic encapsulation layer 108 and the second inorganic encapsulation layer 110 from breaking.
[0061] The first inorganic encapsulation layer 108 extends in a recessed manner at the position corresponding to the recess. On the side surface of the recess, stress concentration is likely to occur in the first inorganic encapsulation layer 108, guiding the fracture caused by external stress to occur on the side surface of the recess. At the same time, due to the presence of the organic encapsulation layer 109, it can buffer external stress, preventing the external stress from further conducting to the display area AA, thereby preventing the external stress from damaging other devices in the display area AA and further avoiding defects such as black spots.
[0062] At the same time, due to the presence of the recess, the encapsulation structure formed by the first inorganic encapsulation layer 108, the organic encapsulation layer 109, and the second inorganic encapsulation layer 110 has an undulating shape. Even when peeling occurs between adjacent film layers, due to the undulating shape causing the force direction to change, the peeling phenomenon can be interrupted at the side position of the recess, preventing the film layer peeling phenomenon from further conducting to the display area AA and further avoiding defects such as black spots.
[0063] In some embodiments, as Figure 4 、 Figure 5 and Figure 6 shown, the angle between the side surface and the bottom surface of the recess is 90 degrees to 110 degrees.
[0064] The included angle between the side surface and the bottom surface of the groove is 90 degrees to 110 degrees, which can make the angle between the side surface and the bottom surface of the groove relatively large, and can provide a deposition platform for the first metal layer 105, so that the first metal layer 105 can be deposited on the side surface of the groove. At the same time, when preparing the organic material film layer subsequently, the thickness of the organic material film layer deposited on the side surface of the groove will be significantly thinned, which is beneficial to blocking corrosive media such as water vapor and oxygen, and preventing corrosive media such as water vapor and oxygen from entering the interior of the display substrate (such as the display area AA) from the encapsulation edge of the display substrate (such as the opening area AA-hole), thereby avoiding corrosion of components such as light-emitting devices inside the display substrate and preventing defects such as black spots. Moreover, since the first metal layer 105 covers the side surface of the groove and laps with at least a part of the bottom surface of the groove and the surface of the inorganic insulating layer 102 facing away from the substrate 101, when the opening area AA-hole of the display substrate is subjected to external stress, the first metal layer 105 can block the external stress and prevent the external stress from further conducting to the display area AA, thereby preventing damage to other devices in the display area AA by the external stress and further avoiding defects such as black spots.
[0065] Figure 7 is Figure 3 a schematic cross-sectional structure diagram of the shown display substrate along the E-E' direction, Figure 8 is Figure 3 another schematic cross-sectional structure diagram of the shown display substrate along the E-E' direction, Figure 9 is Figure 3 yet another schematic cross-sectional structure diagram of the shown display substrate along the E-E' direction, as Figure 7 、 Figure 8 and Figure 9 shown, the display substrate further includes: a plurality of isolation columns 103 and barrier dams 104 located on the side of the inorganic insulating layer 102 facing away from the substrate 101 and disposed in the barrier area BB; the groove is located between adjacent isolation columns 103 and on one side of the barrier dam 104 close to the opening area AA-hole and / or on one side of the barrier dam 104 far from the opening area AA-hole.
[0066] As Figure 7 、 Figure 8 and Figure 9As shown, the groove is located between adjacent isolation columns 103. The groove and the isolation columns 103 serve the same function of blocking the organic material film layer thereon to prevent corrosive media such as water vapor and oxygen from entering the interior of the display substrate (such as the display area AA) from the encapsulation edge of the display substrate (such as the opening area AA-hole). In practical applications, the position of the groove of the inorganic insulating layer 102 can be reasonably set according to actual needs. For example, the groove can be set on one side of the dam 104 close to the opening area AA-hole and / or on one side away from the opening area AA-hole.
[0067] As Figure 7 , Figure 8 and Figure 9 shown, the isolation column 103 includes: a first isolation layer 1031 and a second isolation layer 1032 arranged in a stacked manner; the first isolation layer 1031 is arranged on the same layer as the first metal layer 105; the second isolation layer 1032 is arranged on the same layer as the second metal layer 106.
[0068] The first isolation layer 1031 and the first metal layer 105 can be formed of the same material and by the same process, and the second isolation layer 1032 and the second metal layer 106 can be formed of the same material and by the same process, which can reduce the process steps and save the preparation cost.
[0069] In some embodiments, the display substrate further includes: a source-drain conductive layer 111 and an anode conductive layer 112 located on the substrate; the source-drain conductive layer 111 is arranged on the same layer as the first metal layer 105; the anode conductive layer 112 is arranged on the same layer as the second metal layer 106.
[0070] Specifically, the first metal layer 105 can be formed by using the source-drain conductive layer 111 in the display substrate, and the second metal layer 106 can be formed by using the anode conductive layer 112 in the display substrate, which can avoid increasing the number of film layers in the display substrate and is beneficial to the thinning of the display substrate.
[0071] It should be noted here that Figure 7 , Figure 8 and Figure 9 the scribe lines in the display substrate shown are grooves formed by cutting the mother board during the preparation process. In order to form the openings in the opening area AA-hole, grooving is also required. For the convenience of display, the position of the scribe lines in the figure is the opening of the opening area AA-hole.
[0072] Figure 10 is a schematic flow chart of a method for manufacturing a display substrate provided by an embodiment of the present disclosure. As Figure 10 shown, the method for manufacturing a display substrate provided by an embodiment of the present disclosure includes the following steps S101 to step S105, which can be used to manufacture the display substrate provided by any of the above embodiments.
[0073] S101, providing a substrate.
[0074] S102, forming an inorganic insulating layer on the base substrate, and forming a groove in the barrier region.
[0075] In the above step S102, the inorganic insulating layer 102 can be made of at least one material selected from silicon nitride (SiN) and silicon oxide (SiO2), which can form a single-layer structure made of a single material or a multi-layer structure made of a plurality of different materials, so as to prevent short circuits between two adjacent conductive layers. The pixel driving circuit in the display substrate can be a 4T2C (i.e., 4 transistors and 2 capacitors) structure, a 7T1C (i.e., 7 transistors and 1 capacitor) structure, a 5T1C (i.e., 5 transistors and 1 capacitor) structure, an 8T1C (i.e., 8 transistors and 1 capacitor) structure, or an 8T2C (i.e., 8 transistors and 2 capacitors) structure, etc. The transistors therein can be specifically thin film transistors, which can include: a gate, a gate insulating layer, an active layer, an interlayer insulating layer, and a source-drain electrode layer sequentially arranged along the direction of the substrate 101. The source-drain electrode layer can include: a source electrode and a drain electrode. The source electrode and the drain electrode are respectively connected to the two ends of the active layer through vias penetrating the interlayer insulation. The inorganic insulating layer 102 may be a gate insulating layer and an interlayer insulating layer in a thin film transistor. The gate insulating layer may cover the gate to prevent a short circuit between the gate and the active layer thereon, and the interlayer insulating layer may cover the active layer to prevent a short circuit between the active layer and the source and drain electrode layer thereon. The gate insulating layer and the interlayer insulating layer extend from the display area AA to the blocking area BB.
[0076] The inorganic insulating layer 102 (gate insulating layer and interlayer insulating layer) can extend from the display area AA to the blocking area BB, and a groove is provided in the blocking area BB. The groove can penetrate the entire inorganic insulating layer 102, or only penetrate a portion of the inorganic insulating layer 102, and its depth can be specifically 1.0 micrometer to 2.0 micrometers, for example, about 1.3 micrometers. Its width can be specifically 8 micrometers to 10 micrometers, for example, about 8 micrometers. In practical applications, the width and depth of the groove can be reasonably set according to actual needs, and no limitation is made here.
[0077] S103, forming a first metal layer on the side of the inorganic insulating layer facing away from the base substrate, the first metal layer covers the side of the groove and overlaps at least a portion of the bottom surface of the groove and a portion of the surface of the inorganic insulating layer facing away from the base substrate.
[0078] In the above step S103, the first metal layer 105 can be made of at least one of molybdenum (Mo), aluminum (Al), and titanium (Ti). It can be a single material among the above materials or an alloy material of two or more of the above materials. It has good ductility and certain strength. The first metal layer 105 can cover the side surface of the groove and overlap with at least part of the bottom surface of the groove and part of the surface of the inorganic insulating layer 102 facing away from the substrate 101. The overlapping width between the first metal layer 105 and the inorganic insulating layer 102 can be 3 to 5 micrometers, for example, it can be 3 micrometers. The overlapping width between the first metal layer 105 and the bottom surface of the groove can be at least 2 micrometers to ensure that the first metal layer 105 can completely cover the side surface of the groove.
[0079] It can be understood that multiple source-drain electrode layers can be provided in the thin-film transistor of the display substrate. Specifically, the first metal layer 105 can be the first source-drain electrode layer in the thin-film transistor, or the second source-drain electrode layer, or other source-drain electrode layers.
[0080] S104, form a planarization layer on the side of the first metal layer facing away from the substrate; the planarization layer stops at the junction of the display area and the barrier area.
[0081] In the above step S104, the planarization layer (not shown in the figure) can be made of a combination of one or more resin materials such as acrylic, polyimide, epoxy resin, polyester, photoresist, polyacrylate, polyamide, silicone, etc.; or a combination of one or more elastic materials such as urethane, thermoplastic polyurethane (TPU), etc. The planarization layer stops at the junction of the display area AA and the barrier area BB, so it is not shown in the structural diagram of the above display substrate.
[0082] It can be understood that when there are multiple source-drain electrode layers in the thin-film transistor of the display substrate, the planarization layer can also be multiple layers. The planarization layer can not only cover the source-drain electrode layer but also be disposed between adjacent source-drain electrode layers.
[0083] S105, form a second metal layer on the side of the planarization layer facing away from the substrate; at the overlapping portion of the first metal layer and the inorganic insulating layer, the orthographic projection of the second metal layer on the substrate covers the orthographic projection of the first metal layer on the substrate.
[0084] In the above step S105, the second metal layer 106 can be made of at least one material among molybdenum (Mo), aluminum (Al), and titanium (Ti). It can be a single material among the above materials or an alloy material of two or more of the above materials. Specifically, the second metal layer 106 can be the anode conductive layer of the light-emitting device. At the overlapping portion of the first metal layer 103 and the inorganic insulating layer 102, the orthographic projection of the second metal layer 106 on the substrate 101 covers the orthographic projection of the first metal layer 105 on the substrate 101, that is, the area of the second metal layer 106 is larger than the area of the first metal layer 105, and the two can form an "upper-large and lower-small" undercut structure. During the subsequent preparation of the organic material film layer, due to the existence of the undercut structure, the organic material film layer will naturally break at the edge of the second metal layer 106, which can further block corrosive media such as water vapor and oxygen.
[0085] In a second aspect, embodiments of the present disclosure provide a display device. The display device includes a display substrate provided in any of the above embodiments. The display device can be, for example, any product with a display function such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a vehicle-mounted device, etc. Other essential components of the display device are understood by those of ordinary skill in the art and will not be elaborated here, nor should they be considered as a limitation to the present disclosure.
[0086] It should be noted that in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. Also, it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Further, it can be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.
[0087] In several embodiments provided by the embodiments of the present disclosure, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the positions of the illustrated components are only for a logical functional position, and there may be other position arrangements in actual implementation.
[0088] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the present disclosure, and the present disclosure is not limited thereto. Those of ordinary skill in the art can make various modifications and improvements without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered within the protection scope of the present disclosure.
Claims
1. A display substrate having an opening region, a display region surrounding the opening region, and a barrier region disposed between the opening region and the display region, characterized in that The display substrate includes: a substrate substrate, and an inorganic insulating layer located on the substrate substrate; the inorganic insulating layer is provided with a groove in the barrier region; the display substrate further includes: a first metal layer; The first metal layer covers the side surface of the groove, and overlaps with at least a part of the bottom surface of the groove and a part of the surface of the inorganic insulating layer facing away from the substrate substrate.
2. The display substrate according to claim 1, wherein The display substrate further includes: a second metal layer located on the side of the first metal layer facing away from the substrate substrate; At the overlapping portion of the first metal layer and the inorganic insulating layer, the orthographic projection of the second metal layer on the substrate substrate covers the orthographic projection of the first metal layer on the substrate substrate.
3. The display substrate according to claim 2, wherein The first metal layer and the second metal layer are both continuously provided on the bottom surface of the groove, and the first metal layer completely covers the bottom surface of the groove.
4. The display substrate according to claim 2, wherein The first metal layer and the second metal layer are both discontinuously provided on the bottom surface of the groove; At the discontinuous portion of the first metal layer and the second metal layer, the orthographic projection of the second metal layer on the substrate substrate covers the orthographic projection of the first metal layer on the substrate substrate.
5. The display substrate according to claim 4, wherein The bottom surface of the groove has a central region and a overlapping region surrounding the central region, and the first metal layer only covers the overlapping region of the bottom surface of the groove, exposing the central region of the bottom surface of the groove.
6. The display substrate according to claim 4, wherein The bottom surface of the groove has a central region and a overlapping region surrounding the central region, and the first metal layer covers the edge region and a part of the central region of the bottom surface of the groove.
7. The display substrate according to claim 2, wherein The display substrate further includes: a plurality of isolation columns and barrier dams located on the side of the inorganic insulating layer facing away from the substrate substrate and provided in the barrier region; The groove is located between adjacent isolation columns, and is located on one side and / or the other side of the barrier dam close to and / or away from the opening region.
8. The display substrate according to claim 7, wherein The isolation column includes: a first isolation layer and a second isolation layer stacked; The first isolation layer is provided on the same layer as the first metal layer; The second isolation layer is provided on the same layer as the second metal layer.
9. The display substrate according to claim 8, wherein The display substrate further includes: a source-drain conductive layer and an anode conductive layer located on the substrate substrate; The source-drain conductive layer is provided on the same layer as the first metal layer; The anode conductive layer is provided on the same layer as the second metal layer.
10. A display device, characterized in that, The display device includes the display substrate according to any one of claims 1 to 9.