Temperature sensing adhesive tape, detection device and BMS shell

Abstract

The utility model relates to the technical field of battery detection, in particular to a temperature sensing adhesive tape, a detection device and a BMS shell, the temperature sensing adhesive tape comprises a temperature sensing layer and an adhesive layer, and the temperature sensing layer can display different colors along with temperature changes; and the adhesive layer is arranged on one side of the temperature sensing layer and can be adhered to the battery pack shell. The temperature of the corresponding area of the battery pack is judged by identifying the color of the temperature sensing layer, and the temperature of the AFE sampling chip in the corresponding area is accurately judged, so that the failed AFE chip in the plurality of AFE sampling chips in the BMS is quickly checked, the failed AFE sampling chip is found in time, and compared with a traditional failed chip checking method, the method has the advantages that the cost is reduced, and the working efficiency is improved. By adopting the adhesive tape, the checking time can be effectively shortened, and the loss can be effectively reduced.

Description

Technical Field

[0001] This application relates to the technical field of battery detection, and particularly relates to a temperature-sensitive sticker, a detection device, and a BMS housing. Background Art

[0002] In recent years, under the general environment of vigorously developing new energy vehicles in China, the electric vehicle industry has developed rapidly, and consumers have higher and higher requirements for the quality of electric vehicles. In the design process of power batteries, there may be situations where the design is unreasonable or problems occur in the materials supplied by suppliers, which may lead to overheating or burning of the BMS (Battery Management System).

[0003] Currently, when such a situation occurs, the traditional process of troubleshooting is to check one by one the AFE (Analog Front End) chips that have problems. However, since there are multiple AFE sampling chips in the BMS, when the BMS overheats or burns, it is necessary to check one by one the AFE sampling chips that have problems, and the troubleshooting process is cumbersome, consuming a large amount of time and manpower. Utility Model Content

[0004] This application provides a temperature-sensitive sticker, a detection device, and a BMS housing to solve the problem of the cumbersome troubleshooting process of the battery sampling chips that have problems when the BMS overheats or burns in the prior art.

[0005] On the one hand, this application provides a temperature-sensitive sticker, including:

[0006] A temperature-sensitive layer that can display different colors according to temperature changes;

[0007] An adhesive layer disposed on one side of the temperature-sensitive layer.

[0008] In a possible design, the temperature induction color change range of the temperature-sensitive layer is 30°C - 400°C.

[0009] In a possible design, the temperature-sensitive layer includes a carrier and temperature-sensitive color-changing powder, and the temperature-sensitive color-changing powder is evenly distributed on the carrier.

[0010] In a possible design, the temperature-sensitive layer is a temperature-sensitive film;

[0011] And / or, the thickness of the temperature-sensitive layer is 0.1 - 0.3 mm.

[0012] In a possible design, the sticker further includes a protective layer, the protective layer is a transparent film, and the protective layer is disposed on the other side of the temperature-sensitive layer.

[0013] In a possible design, the sticker further includes a standard color card, on which a plurality of color patches are provided, and each color patch corresponds to the display color of the temperature-sensitive layer within a temperature threshold respectively.

[0014] In a possible design, the standard color card is arranged at the edge position of the protective layer, and the standard color card and the protective layer are connected through a weak structure, which is used to weaken the connection strength between the standard color card and the protective layer.

[0015] In a possible design, the sticker further includes a release film, which is arranged on the side of the adhesive layer away from the temperature-sensitive layer.

[0016] In a possible design, the sticker further includes a separation part, which is connected to the protective layer, and the separation part protrudes from the edge position of the protective layer.

[0017] On the other hand, the present application also provides a detection device, including the temperature-sensitive sticker as described above.

[0018] On another aspect, the present application also provides a BMS housing, including the temperature-sensitive sticker as described above.

[0019] The beneficial effects of the present application are as follows:

[0020] For the temperature-sensitive sticker of the present application, by providing a temperature-sensitive layer and an adhesive layer, the temperature-sensitive layer can display different colors with the change of temperature; the adhesive layer is arranged on one side of the temperature-sensitive layer and can adhere to the battery pack housing, so that the temperature-sensitive layer is attached to the battery pack housing, and the temperature of the corresponding area of the battery pack is judged by identifying the color of the temperature-sensitive layer, thereby accurately judging the temperature of the AFE sampling chip in the corresponding area and timely discovering the problematic AFE sampling chip.

[0021] When testing the battery pack, when the BMS of the battery pack has a fever or burns out, by attaching the temperature-sensitive sticker of the present application to the battery pack housing and comparing the colors of the stickers, the problematic AFE chip can be quickly identified among several AFE sampling chips in the BMS. Compared with the traditional method of troubleshooting problem chips, using the sticker of the present application can effectively shorten the troubleshooting time and effectively reduce losses.

[0022] For the detection device provided by the present application, since it includes the temperature-sensitive sticker in the present application, it simultaneously includes all the above advantages of the temperature-sensitive sticker.

[0023] For the BMS housing provided by the present application, since it includes the temperature-sensitive sticker in the present application, it simultaneously includes all the above advantages of the temperature-sensitive sticker. Description of the Drawings

[0024] To more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 A schematic structural diagram of a temperature-sensitive adhesive patch provided for an embodiment of the present application;

[0026] Figure 2 Another schematic structural diagram of a temperature-sensitive adhesive patch provided for an embodiment of the present application;

[0027] Figure 3 Yet another schematic structural diagram of a temperature-sensitive adhesive patch provided for an embodiment of the present application.

[0028] Reference numerals:

[0029] 100, protective layer; 200, temperature-sensitive layer; 300, adhesive layer; 400, release film; 500, standard color card; 600, weak structure; 700, separation part. Specific embodiments

[0030] The following will clearly and completely describe the technical solutions of the present application in combination with the embodiments. Obviously, the described embodiments are some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0031] Since there may be unreasonable designs in power batteries, which may lead to the BMS of the battery pack heating up or burning out during the test of the battery pack. When this situation occurs, it is often difficult to identify the problematic AFE chip because there are multiple AFE sampling chips in the BMS. The troubleshooting process is cumbersome and will consume a large amount of time and manpower.

[0032] To solve the above problems, the following will be combined with Figures 1 - 3, describe the temperature-sensitive sticker provided in the embodiments of the present application, including a temperature-sensitive layer 200 and an adhesive layer 300. The temperature-sensitive layer 200 can display different colors as the temperature changes; the adhesive layer 300 is disposed on one side of the temperature-sensitive layer 200. In some specific embodiments, as the temperature rises, the color of the temperature-sensitive layer 200 gradually changes from a cold color tone to a warm color tone. For example, as the temperature rises, the colors of the temperature-sensitive layer 200 are successively: blue, green, cyan, yellow, orange, red, etc.; of course, each large color block also contains multiple small color blocks. For example, red includes red, vermilion, rose red, peach red, golden red, etc. In some specific embodiments, the adhesive layer 300 uses a pressure-sensitive adhesive. In this way, when pressure is applied to it, the adhesive layer 300 will have adhesiveness, and the pressure-sensitive adhesive can be peeled off by people due to its unique adhesive force and will not automatically detach, so it can be bonded repeatedly. In some of these embodiments, the adhesive layer 300 uses a heat-resistant pressure-sensitive adhesive. In this way, when the BMS of the battery pack heats up or burns out, the adhesive layer 300 will not melt and can still remain in a flexible solid state, so it is convenient to tear off the sticker from the battery pack housing, which is beneficial to the repeated use of the sticker in this embodiment on multiple different battery packs.

[0033] Using the technical solution of the above embodiment, by setting the temperature-sensitive layer 200 and the adhesive layer 300, the temperature-sensitive layer 200 can display different colors as the temperature changes; the adhesive layer 300 is disposed on one side of the temperature-sensitive layer 200 and can adhere to the battery pack housing, so that the temperature-sensitive layer 200 is attached to the battery pack housing. By identifying the color of the temperature-sensitive layer 200, the temperature of the corresponding area of the battery pack can be judged, and thus the temperature of the AFE sampling chip in the corresponding area can be accurately judged, and the problematic AFE sampling chip can be found in time.

[0034] When testing the battery pack, when the BMS of the battery pack heats up or burns out, by attaching the temperature-sensitive sticker of the present application to the battery pack housing and comparing the colors of the stickers, the problematic AFE chip can be quickly identified among several AFE sampling chips in the BMS. Compared with the traditional method of identifying problematic chips, using the sticker in this embodiment can effectively shorten the troubleshooting time and effectively reduce losses.

[0035] In some embodiments of the present application, the temperature-sensing color-changing range of the temperature-sensitive layer 200 is 30°C - 400°C. Specifically, the temperature-sensitive layer 200 can display different colors under different temperature conditions. In some specific embodiments, by refining the color-changing levels of the temperature-sensitive layer 200, the troubleshooting accuracy of the temperature-sensitive layer 200 for problematic chips can be improved.

[0036] In some embodiments of the present application, the temperature-sensitive layer 200 includes a carrier and thermochromic powder, and the thermochromic powder is uniformly distributed on the carrier. In some specific embodiments, the temperature-sensitive layer 200 is thermochromic powder, and the color change of the thermochromic powder can be selected from one or more of red, vermilion, rose red, peach red, golden red, yellow, bright yellow, dark green, grass green, medium green, peacock green, blue, violet, dark blue, Turkish blue, coffee color, brown black or fluorescent powder for color mixing; the carrier is plastic resin, and the plastic resin is one of thermosensitive ink and polyvinyl chloride (PVC), polypropylene (PP), polyethylene (PE) and ethylene-vinyl acetate (EVA) resin. The temperature-sensitive layer 200 is a sheet structure formed by blending and printing thermochromic powder and plastic resin. In some other specific embodiments, the temperature-sensitive layer 200 is a layered structure in which thermochromic powder is uniformly laid on plastic resin. Thus, by uniformly distributing the thermochromic powder on the carrier, the uniformity of the thermochromic powder in each area of the temperature-sensitive layer 200 is ensured, so that at the same temperature, the colors of different areas of the temperature-sensitive layer 200 tend to be consistent, improving the accuracy of temperature perception.

[0037] In some embodiments of the present application, the temperature-sensitive layer 200 is a temperature-sensitive film. Specifically, the temperature-sensitive film is a film formed by blending and blow-molding thermochromic powder and plastic resin. In some embodiments of the present application, the thickness of the temperature-sensitive layer 200 is 0.1-0.3 mm. For example, the thickness of the temperature-sensitive layer 200 is 0.1 mm, 0.15 mm, 0.2 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc. Thus, by reducing the thickness of the temperature-sensitive layer 200, it is beneficial to make the temperature-sensitive layer 200 fit tightly with the battery pack housing, thereby improving the sensitivity of the temperature-sensitive layer 200 to temperature perception.

[0038] Refer to Figure 1 As shown, in some embodiments of the present application, the adhesive tape further includes a protective layer 100. The protective layer 100 is a transparent film, and the protective layer 100 is disposed on the other side of the temperature-sensitive layer 200. Specifically, the protective layer 100 is a transparent polymer film. For example, the protective layer 100 is one of PET film, PP film, PVC film, PBT film, polyurethane film and PE film. Thus, the protective layer 100 can cooperate with the adhesive layer 300 to sandwich the temperature-sensitive layer 200 between the protective layer 100 and the adhesive layer 300, thereby playing a role in protecting the temperature-sensitive layer 200 and preventing the thermochromic powder on the temperature-sensitive layer 200 from falling off.

[0039] Refer to Figure 2As shown, in some embodiments of the present application, the adhesive sticker further includes a standard color card 500. Multiple color patches are provided on the standard color card 500, and each color patch respectively corresponds to the display color of the temperature-sensitive layer 200 within a temperature threshold. In some of these embodiments, from 30°C to 400°C, a temperature threshold is set every 20 degrees. For example, 30°C - 50°C, 50°C - 70°C, 70°C - 90°C, ……, and so on. Each temperature threshold respectively corresponds to a color patch on the standard color card 500. In other embodiments, by reducing the temperature interval value, more temperature gradients can be set, so that the standard color card 500 has more color patches, and by refining the color patches on the standard color card 500 for comparison with the temperature-sensitive layer 200, the accuracy of the temperature-sensitive layer 200 in detecting problem chips can be improved.

[0040] Referring to Figure 2 As shown, in some embodiments of the present application, the standard color card 500 is disposed at the edge position of the protective layer 100. The standard color card 500 and the protective layer 100 are connected by a weak structure 600, and the weak structure 600 is used to weaken the connection strength between the standard color card 500 and the protective layer 100. In some specific embodiments, the weak structure 600 is a groove structure or a through-hole structure. For example, at the connection between the standard color card 500 and the protective layer 100, a plurality of through-holes are provided along the connection line. In this way, the standard color card 500 remains connected to the adhesive sticker, thereby avoiding color matching errors due to the mismatch between the standard color card 500 and the adhesive sticker; or avoiding the accident that the standard color card 500 is lost and the adhesive sticker cannot be used normally. At the same time, by designing the weak structure 600 at the connection between the standard color card 500 and the protective layer 100, it is convenient to tear the standard color card 500 from the protective layer 100 and move the standard color card 500 to other positions. For example, due to the structure of the battery pack itself, the position of the standard color card 500 is not convenient for people to observe, or when the position of the standard color card 500 is far from other positions on the adhesive sticker and not convenient for comparison, the standard color card 500 can be torn from the protective layer 100. In this way, the accuracy of detecting problem chips according to the standard color card 500 can be improved.

[0041] Referring to Figure 1 As shown, in some embodiments of the present application, the adhesive sticker further includes a release film 400. The release film 400 is disposed on the side of the adhesive layer 300 away from the temperature-sensitive layer 200. Specifically, the release film 400 is a double-silicon release film 400. The release film 400 is used to protect the adhesive layer 300 from being contaminated by impurities and enable the adhesive layer 300 to maintain good adhesiveness. When using the adhesive sticker to detect problem chips, the release film 400 is torn from the adhesive layer 300; after use, the release film 400 is re-covered on the adhesive layer 300 so that the adhesive sticker can be reused.

[0042] Referring to Figure 3As shown, in some embodiments of the present application, the adhesive sticker further includes a separation part 700. The separation part 700 is connected to the protective layer 100, and the separation part 700 protrudes from the edge position of the protective layer 100. Specifically, the separation part 700 and the protective layer 100 are integral. By protruding the separation part 700 from the edge position of the protective layer 100, it is convenient to hold the separation part 700. By tearing the separation part 700 in a direction away from the battery pack housing, the adhesive layer 300 can be separated from the battery pack housing. The provision of the separation part 700 is beneficial to removing the adhesive sticker from the battery pack housing after the test is completed.

[0043] The general working principle of the temperature-sensitive adhesive sticker of the present application:

[0044] Before the test, tear off the release film 400 of the adhesive sticker, paste the adhesive layer 300 on the surface of the BMS housing, and let it stand for 5 minutes until the color of the adhesive sticker becomes stable and uniform. Compare with the standard color card 500 to find the temperature corresponding to the color of the adhesive sticker in the current state, and record it;

[0045] Conduct the test, continuously observe the color and distribution of the adhesive sticker, and compare with the standard color card 500 until the end of the test;

[0046] Among them: If no color corresponding to abnormal temperature appears within the range of the adhesive sticker, it indicates that the BMS has not malfunctioned; if an abnormal color appears within the range of the adhesive sticker, take a photo and record it, and stop the test; the position where the abnormal color appears is the position of the problematic AFE chip; it can be listed as the key point for problem troubleshooting; if abnormal colors appear at the positions of multiple AFE chips, the troubleshooting priority of the problematic AFE chips can be determined according to the color gradient; troubleshoot the problematic AFE chips one by one according to the priority.

[0047] After the test is completed, the adhesive sticker can be peeled off from the surface of the BMS housing, and the release film 400 can be reattached to the adhesive layer 300.

[0048] In the embodiments of the present application, a detection device is further provided, including the temperature-sensitive adhesive sticker in the above embodiments.

[0049] It should be noted that since the detection device includes the temperature-sensitive adhesive sticker, it also includes all the above-mentioned advantages of the temperature-sensitive adhesive sticker, which will not be elaborated here.

[0050] In the embodiments of the present application, a BMS housing is further provided, including the temperature-sensitive adhesive sticker in the above embodiments. Specifically, the temperature-sensitive adhesive sticker is attached to the outer surface of the BMS housing. As a part of the battery product, the temperature-sensitive adhesive sticker can timely monitor the heating degree of the battery product through temperature-sensitive color display during use, which is beneficial to protecting the battery and improving the safety performance of the battery.

[0051] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present application.

[0052] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0053] In the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integral; it may be a mechanical connection, an electrical connection, or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0054] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0055] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as a limitation on the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A temperature-sensitive adhesive patch, characterized in that, Comprising: A temperature-sensitive layer that can display different colors with temperature changes. The temperature-sensitive layer is a film formed by blending a temperature-sensitive color-changing powder and a plastic resin by blow molding. The thickness of the temperature-sensitive layer is 0.1 - 0.3 mm; An adhesive layer provided on one side of the temperature-sensitive layer.

2. The temperature-sensitive adhesive patch according to claim 1, wherein: The temperature induction color-changing range of the temperature-sensitive layer is 30°C - 400°C.

3. The temperature-sensitive adhesive patch according to claim 1, wherein: The temperature-sensitive layer includes a carrier and a temperature-sensitive color-changing powder, and the temperature-sensitive color-changing powder is evenly distributed on the carrier.

4. The temperature-sensitive adhesive patch according to claim 1, wherein: It further includes a protective layer, the protective layer is a transparent film, and the protective layer is provided on the other side of the temperature-sensitive layer.

5. The temperature-sensitive adhesive patch according to claim 4, characterized in that: It further includes a standard color card, and a plurality of color patches are provided on the standard color card, and each color patch respectively corresponds to the display color of the temperature-sensitive layer within a temperature threshold.

6. The temperature-sensitive adhesive patch according to claim 5, wherein: The standard color card is provided at the edge position of the protective layer, and the standard color card and the protective layer are connected through a weak structure, and the weak structure is used to weaken the connection strength between the standard color card and the protective layer.

7. The temperature-sensitive adhesive patch according to any one of claims 1-6, characterized in that: It further includes a release film, and the release film is provided on the side of the adhesive layer away from the temperature-sensitive layer.

8. A detection device, characterized in that: Comprising the temperature-sensitive adhesive sticker according to any one of claims 1 - 7.

9. A BMS housing, characterized in that: Comprising the temperature-sensitive adhesive sticker according to any one of claims 1 - 7.

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