Plating solution sampling device

Abstract

The utility model relates to the technical field of plating solution sampling, in particular to a plating solution sampling device which comprises an installation frame, an inflow pipe and an outflow pipe and further comprises a sampling assembly, and the sampling assembly comprises an upper flow dividing pipe, a lower flow dividing pipe, a connecting pipe, a first hose, a fixed pipeline, a second hose, a movable pipeline, a first valve, a second valve, a third valve, a collecting bottle and a movable component. An operator controls the first valve, the second valve and the third valve to move the movable pipeline, so that non-contact sampling of a medium in the flowing-in pipe can be completed, and the situation that in the sampling process, a plating solution is splashed to make contact with a human body and hurt the human body is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of plating solution sampling, in particular to a plating solution sampling device. Background Art

[0002] During the use of traditional electroplating solutions, various impurities may be mixed in, which can easily affect the production and processing of electroplating solutions.

[0003] The existing anti-corrosion electroplating solution sampling tool is used to sample the electroplating solution, which plays an important role in electroplating production and quality control. The existing sampling method places the sampling bucket under the sampling valve, and the operator opens the sampling valve, so that the electroplating solution can naturally flow into the sampling bucket, thereby realizing the sampling and collection of the electroplating solution by the operator, and then facilitating the operator to sample and analyze the impurities in the sampled electroplating solution.

[0004] However, in the existing sampling method, when the electroplating solution flows into the sampling bucket during sampling, it is easy to cause splashing of the electroplating solution, and when the splashed electroplating solution contacts the human body, it will cause harm to the human body. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a plating solution sampling device, aiming to solve the problem that in the existing sampling method, when the electroplating solution flows into the sampling bucket during sampling, it is easy to cause splashing of the electroplating solution, and when the splashed electroplating solution contacts the human body, it will cause harm to the human body.

[0006] To achieve the above purpose, the utility model provides a plating solution sampling device, including a mounting frame, an inflow pipe and an outflow pipe. The inflow pipe is arranged on the mounting frame and is located on one side of the mounting frame. The outflow pipe is arranged on the mounting frame and is located on one side of the mounting frame.

[0007] It further includes a sampling assembly.

[0008] The sampling assembly includes an upper shunt pipe, a lower shunt pipe, a connecting pipe, a first hose, a fixed pipe, a second hose, a movable pipe, a first valve, a second valve, a third valve, a collection bottle, and a movable member. The upper shunt pipe is connected to the inflow pipe and is located on one side of the inflow pipe. The lower shunt pipe is connected to the outflow pipe and is located on one side of the outflow pipe. The connecting pipe is respectively connected to the upper shunt pipe and the lower shunt pipe, and the connecting pipe is located on the side of the upper shunt pipe close to the lower shunt pipe. The first hose is connected to the lower shunt pipe and is located on one side of the lower shunt pipe. The fixed pipe is fixedly connected to the mounting bracket, is connected to the first hose, and is located on the side of the mounting bracket close to the first hose. The second hose is connected to the upper shunt pipe and is located on one side of the upper shunt pipe. The movable pipe is connected to the mounting bracket through the movable member, is connected to the second hose, and is located on the side of the mounting bracket close to the second hose. The first valve is arranged on the connecting pipe. The second valve is arranged on the fixed pipe. The third valve is arranged on the movable pipe. The collection bottle is arranged on the fixed pipe and is located on the side of the fixed pipe close to the movable pipe. The movable member is arranged on the mounting bracket and is connected to the movable pipe.

[0009] Wherein, the movable member includes a mounting seat, an electric push rod, and a connecting plate. The mounting seat is fixedly connected to the mounting bracket and is located on one side of the mounting bracket. The electric push rod is fixedly connected to the mounting seat and is located on one side of the mounting seat. The connecting plate is connected to the output end of the electric push rod, is fixedly connected to the movable pipe, and is located on the side of the electric push rod close to the movable pipe.

[0010] Wherein, the sampling assembly further includes a first gasket. The first gasket is fixedly connected to the collection bottle and is located on the side of the collection bottle close to the fixed pipe.

[0011] Wherein, the sampling assembly further includes a second gasket. The second gasket is fixedly connected to the collection bottle and is located on the side of the collection bottle close to the movable pipe.

[0012] Wherein, the sampling assembly further includes a rotating base and a rotating door. The rotating base is fixedly connected to the mounting bracket and is located on one side of the mounting bracket. The rotating door is rotatably connected to the rotating base and is located on the side of the rotating base close to the mounting bracket.

[0013] The utility model provides a plating liquid sampling device, wherein the plating liquid medium in the inflow pipe can flow out from the outflow pipe through the connecting pipe. When the plating liquid medium in the inflow pipe needs to be sampled, the valve of the collecting bottle is opened and the collecting bottle is docked and placed in the fixed pipe and connected with the fixed pipe. The movable component is started to drive the movable pipe to move downward, and dock and connect with the inlet above the collecting bottle after movement. After the inlet and outlet of the collecting bottle are docked and connected, the operator closes the first valve, opens the second valve and the third valve, so that the medium in the inflow pipe can flow into the collecting bottle through the second hose and the movable pipe. After the collection is completed, the operator opens the first valve, closes the second valve and the third valve, moves the movable pipe, and closes the valve on the collecting bottle, thereby completing the contactless sampling of the medium in the inflow pipe, thereby avoiding the injury to the human body caused by splashing of plating liquid during the sampling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0015] Figure 1 It is a structural schematic diagram of the plating solution sampling device of the first embodiment of the present utility model.

[0016] Figure 2 It is a structural diagram of the sampling assembly of the first embodiment of the present utility model.

[0017] Figure 3 It is a structural schematic diagram of a collecting bottle in the first embodiment of the present utility model.

[0018] In the figure: 101-mounting frame, 102-inflow pipe, 103-outflow pipe, 104-upper diversion pipe, 105-lower diversion pipe, 106-connecting pipe, 107-first hose, 108-fixed pipe, 109-second hose, 110-movable pipe, 111-first valve, 112-second valve, 113-third valve, 114-collecting bottle, 115-first sealing gasket, 116-second sealing gasket, 117-rotating base, 118-rotating door, 119-mounting seat, 120-electric push rod, 121-connecting plate. DETAILED DESCRIPTION

[0019] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0020] The first embodiment of the present application is as follows:

[0021] Please refer to Figure 1 and Figure 2 where Figure 1 is a schematic structural diagram of the plating solution sampling device according to the first embodiment of the present utility model. Figure 2 is a schematic structural diagram of the sampling assembly according to the first embodiment of the present utility model. Figure 3 is a schematic structural diagram of the collection bottle according to the first embodiment of the present utility model.

[0022] The present utility model provides a plating solution sampling device, which includes a mounting frame 101, an inflow pipe 102, an outflow pipe 103, and a sampling assembly. The sampling assembly includes an upper shunt pipe 104, a lower shunt pipe 105, a connecting pipe 106, a first hose 107, a fixed pipe 108, a second hose 109, a movable pipe 110, a first valve 111, a second valve 112, a third valve 113, a collection bottle 114, a movable member, a first gasket 115, a second gasket 116, a rotating base 117, and a rotating door 118. The movable member includes a mounting seat 119, an electric push rod 120, and a connecting plate 121. By the foregoing solution, it is solved that during the sampling process of the existing sampling method, when the electroplating solution flows into the sampling bucket, it is easy to cause splashing of the electroplating solution, and when the splashed electroplating solution contacts the human body, it will cause harm to the human body. It can be understood that the foregoing solution can be used in cases where it is necessary to avoid splashing of the electroplating solution during sampling.

[0023] In this embodiment, the inflow pipe 102 is arranged on the mounting frame 101, and the outflow pipe 103 is arranged on the mounting frame 101. Through the inflow pipe 102, it is convenient for the inflow of the electroplating solution, and through the outflow pipe 103, it is convenient for the export of the electroplating solution.

[0024] Among them, the upper shunt pipe 104 is connected to the inflow pipe 102 and is located on one side of the inflow pipe 102. The lower shunt pipe 105 is connected to the outflow pipe 103 and is located on one side of the outflow pipe 103. The connecting pipe 106 is respectively connected to the upper shunt pipe 104 and the lower shunt pipe 105. The connecting pipe 106 is located on the side of the upper shunt pipe 104 close to the lower shunt pipe 105. The first hose 107 is connected to the lower shunt pipe 105 and is located on one side of the lower shunt pipe 105. The fixed pipe 108 is fixedly connected to the mounting bracket 101, is connected to the first hose 107, and is located on the side of the mounting bracket 101 close to the first hose 107. The second hose 109 is connected to the upper shunt pipe 104 and is located on one side of the upper shunt pipe 104. The movable pipe 110 is connected to the mounting bracket 101 through the movable member, is connected to the second hose 109, and is located on the side of the mounting bracket 101 close to the second hose 109. The first valve 111 is arranged on the connecting pipe 106. The second valve 112 is arranged on the fixed pipe 108. The third valve 113 is arranged on the movable pipe 110. The collection bottle 114 is arranged on the fixed pipe 108 and is located on the side of the fixed pipe 108 close to the movable pipe 110. The movable member is arranged on the mounting bracket 101 and is connected to the movable pipe 110. The inflow pipe 102 is communicated with the inflow port of the upper shunt pipe 104. The upper shunt pipe 104 has two outflow ports. The outflow pipe 103 is communicated with the outflow port of the lower shunt pipe 105. The lower shunt pipe 105 has two inflow ports. The two ends of the connecting pipe 106 are respectively communicated with the outflow port of the upper shunt pipe 104 and the inflow port of the lower shunt pipe 105, so that the electroplating liquid medium in the inflow pipe 102 can flow out from the outflow pipe 103 through the connecting pipe 106. The first hose 107 is communicated with the inflow port of the lower shunt pipe 105. The fixed pipe 108 is communicated with the first hose 107. The second hose 109 is communicated with the outflow port of the upper shunt pipe 104. The movable pipe 110 is communicated with the second hose 109. At the same time, the movable pipe 110 is connected to the mounting bracket 101 through the movable member, and the movable pipe 110 can be driven to move through the movable member. The first valve 111 is arranged on the connecting pipe 106, and the flow of the connecting pipe 106 can be controlled through the first valve 111. The second valve 112 is arranged on the fixed pipe 108, and the flow of the fixed pipe 108 can be controlled through the second valve 112. The third valve 113 is arranged on the movable pipe 110, and the flow of the movable pipe 110 can be controlled through the third valve 113. The second valve 112 is arranged on the fixed pipe 108,The flow of the fixed pipeline 108 can be controlled by the second valve 112. The collection bottle 114 is arranged on the fixed pipeline 108. The outlet at the lower part of the collection bottle 114 can be butted and communicated with the fixed pipeline 108. The inlet at the upper part of the collection bottle 114 can be butted and communicated with the movable pipeline 110 after movement. Valves are provided at both the inlet and outlet of the collection bottle 114. The movable member is arranged on the mounting rack 101 and is connected to the movable pipeline 110. The movable pipeline 110 can be driven to move by the movable member, so that the electroplating liquid medium in the inlet pipe 102 can flow out from the outlet pipe 103 through the connecting pipe 106. When it is necessary to sample the electroplating liquid medium in the inlet pipe 102, the valve of the collection bottle 114 is opened, and the collection bottle 114 is butted and placed in the fixed pipeline 108 and communicated with the fixed pipeline 108. The movable member is started to drive the movable pipeline 110 to move downward and be butted and communicated with the inlet at the upper part of the collection bottle 114 after movement. After the inlet and outlet of the collection bottle 114 are butted and communicated, the operator closes the first valve 111, opens the second valve 112 and the third valve 113, so that the medium in the inlet pipe 102 can flow into the collection bottle 114 through the second hose 109 and the movable pipeline 110. After the collection is completed, the operator opens the first valve 111, closes the second valve 112 and the third valve 113, moves the movable pipeline 110, and closes the valve on the collection bottle 114, thus completing the non-contact sampling of the medium in the inlet pipe 102, and further avoiding the harm caused to the human body by the splashing of the plating solution contacting the human body during the sampling process.

[0025] Secondly, the mounting seat 119 is fixedly connected to the mounting rack 101 and is located on one side of the mounting rack 101; the electric push rod 120 is fixedly connected to the mounting seat 119 and is located on one side of the mounting seat 119; the connecting plate 121 is connected to the output end of the electric push rod 120 and is fixedly connected to the movable pipeline 110, and is located on the side of the electric push rod 120 close to the movable pipeline 110. There are two mounting seats 119, and the two mounting seats 119 are welded to the mounting rack 101. There are two electric push rods 120, and the two electric push rods 120 are bolt-fixed to the corresponding two mounting seats 119. There are two connecting plates 121, and the two connecting plates 121 are connected to the output ends of the corresponding two electric push rods 120. The two connecting plates 121 are welded to the outside of the movable pipeline 110, so that the movable pipeline 110 on the connecting plate 121 can be driven to move through the driving output of the electric push rod 120.

[0026] At the same time, the first sealing gasket 115 is fixedly connected to the collecting bottle 114 and is located on the side of the collecting bottle 114 close to the fixed pipe 108. The first sealing gasket 115 is bonded to the bottom of the collecting bottle 114. The first sealing gasket 115 can improve the sealing performance when the collecting bottle 114 and the fixed pipe 108 are docked and connected.

[0027] In addition, the second sealing gasket 116 is fixedly connected to the collecting bottle 114 and is located on the side of the collecting bottle 114 close to the moving pipe 110. The second sealing gasket 116 is bonded to the top of the collecting bottle 114. The second sealing gasket 116 can improve the sealing performance when the collecting bottle 114 and the moving pipe 110 are docked and connected.

[0028] Finally, the rotating base 117 is fixedly connected to the mounting frame 101 and is located on one side of the mounting frame 101; the rotating door 118 is rotatably connected to the rotating base 117 and is located on a side of the rotating base 117 close to the mounting frame 101. There are two rotating bases 117, and the two rotating bases 117 are welded to the mounting frame 101. The rotating door 118 is rotatably connected to the two rotating bases 117. The rotating base 117 can be used to connect and support the flipping of the rotating door 118 on the mounting frame 101, and then the rotating door 118 can be used to shield and protect the entire device on the mounting frame 101 when the entire device is not in use to avoid damage from external collisions.

[0029] When using a plating liquid sampling device of the present embodiment, the plating liquid medium in the inflow pipe 102 can flow out of the outflow pipe 103 through the connecting pipe 106. When it is necessary to sample the plating liquid medium in the inflow pipe 102, the valve of the collecting bottle 114 is opened and the collecting bottle 114 is docked and placed in the fixed pipe 108 and connected with the fixed pipe 108. The moving member is started to drive the moving pipe 110 to move downward and dock and connect with the inlet above the collecting bottle 114. After the inlet and outlet of the collecting bottle 114 are docked and connected, the operator The operator closes the first valve 111, opens the second valve 112 and the third valve 113, so that the medium in the inflow pipe 102 can flow into the collecting bottle 114 through the second hose 109 and the mobile pipe 110. After the collection is completed, the operator opens the first valve 111, closes the second valve 112 and the third valve 113, moves the mobile pipe 110, and closes the valve on the collecting bottle 114, thereby completing the contactless sampling of the medium in the inflow pipe 102, thereby avoiding the damage to the human body caused by the splashing of the plating solution during the sampling process.

[0030] The above disclosure is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A plating solution sampling device, comprising a mounting frame, an inflow pipe and an outflow pipe. The inflow pipe is arranged on the mounting frame and is located on one side of the mounting frame. The outflow pipe is arranged on the mounting frame and is located on one side of the mounting frame. It is characterized in that, It further comprises a sampling assembly. The sampling assembly includes an upper shunt pipe, a lower shunt pipe, a connecting pipe, a first hose, a fixed pipe, a second hose, a movable pipe, a first valve, a second valve, a third valve, a collection bottle and a movable member. The upper shunt pipe is connected to the inflow pipe and is located on one side of the inflow pipe. The lower shunt pipe is connected to the outflow pipe and is located on one side of the outflow pipe. The connecting pipe is respectively connected to the upper shunt pipe and the lower shunt pipe, and the connecting pipe is located on the side of the upper shunt pipe close to the lower shunt pipe. The first hose is connected to the lower shunt pipe and is located on one side of the lower shunt pipe. The fixed pipe is fixedly connected to the mounting frame, is connected to the first hose, and is located on the side of the mounting frame close to the first hose. The second hose is connected to the upper shunt pipe and is located on one side of the upper shunt pipe. The movable pipe is connected to the mounting frame through the movable member, is connected to the second hose, and is located on the side of the mounting frame close to the second hose. The first valve is arranged on the connecting pipe. The second valve is arranged on the fixed pipe. The third valve is arranged on the movable pipe. The collection bottle is arranged on the fixed pipe and is located on the side of the fixed pipe close to the movable pipe. The movable member is arranged on the mounting frame and is connected to the movable pipe.

2. The plating solution sampling device according to claim 1, characterized in that, The movable member includes a mounting seat, an electric push rod and a connecting plate. The mounting seat is fixedly connected to the mounting frame and is located on one side of the mounting frame. The electric push rod is fixedly connected to the mounting seat and is located on one side of the mounting seat. The connecting plate is connected to the output end of the electric push rod, is fixedly connected to the movable pipe, and is located on the side of the electric push rod close to the movable pipe.

3. The plating solution sampling device according to claim 1, characterized in that, The sampling assembly further includes a first sealing gasket, which is fixedly connected to the collection bottle and is located on the side of the collection bottle close to the fixed pipe.

4. The plating solution sampling device according to claim 1, characterized in that, The sampling assembly further includes a second sealing gasket, which is fixedly connected to the collection bottle and is located on the side of the collection bottle close to the movable pipe.

5. The plating solution sampling device according to claim 1, characterized in that, The sampling assembly further includes a rotating base and a rotating door. The rotating base is fixedly connected to the mounting frame and is located on one side of the mounting frame. The rotating door is rotatably connected to the rotating base and is located on the side of the rotating base close to the mounting frame.

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