Photosensitive element module, camera module and electronic device

Abstract

A photosensitive element module, a camera module and an electronic device are provided, the photosensitive element module includes a photosensitive surface, a filter element facing the photosensitive surface, and a first anti-reflection microstructure disposed on the photosensitive surface. The light filtering element comprises a substrate, an optical deposition layer structure and an optical coating, the optical deposition layer structure is arranged on one side of the substrate far away from the light sensing surface, and the optical coating and the optical deposition layer structure are oppositely arranged on one side of the substrate facing the light sensing surface. And the optical deposition layer structure comprises a plurality of layers. An air layer is formed between the first anti-reflection microstructure and the light filtering element, and the first anti-reflection microstructure and the air layer are partially overlapped in the direction perpendicular to the light sensing face. Therefore, the imaging quality of night shooting can be improved.

Description

Technical Field

[0001] The present disclosure relates to an image sensor module and a camera module, and particularly to an image sensor module and a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices, tablet computers, etc., which have flooded into modern people's lives. The camera modules and their image sensor modules installed on portable electronic devices have also developed vigorously. Specifically, the image sensor module has high light transmittance for visible light and the characteristic of blocking non-visible light to improve optical quality.

[0003] Furthermore, existing image sensor modules are combined with various coating layers and coating films to endow the filter elements in the image sensor module with more functions in order to improve optical quality. However, this has caused a serious decrease in the transmittance of the filter elements. Therefore, with the increasing requirements for night shooting, developing an image sensor module with high light transmittance has become an important industrial demand. Summary of the Utility Model

[0004] The present disclosure provides an image sensor module, a camera module, and an electronic device. A new coating configuration is used to improve the light collection efficiency of the image sensor module and is not prone to generating glare, thereby improving the imaging quality of night shooting.

[0005] According to an embodiment of the present disclosure, an image sensor module is provided, which includes a photosensitive surface, a filter element, and a first anti-reflection microstructure. The filter element faces the photosensitive surface, and the first anti-reflection microstructure is disposed on the photosensitive surface. The filter element includes a substrate, an optical deposition layer structure, and an optical coating film. The optical deposition layer structure is disposed on the side of the substrate away from the photosensitive surface, and the optical coating film is disposed opposite to the optical deposition layer structure on the side of the substrate facing the photosensitive surface. The optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10. The number of layers of the optical coating film includes one, and the thickness of the optical coating film ranges from 900 nm to 5 μm. An air layer is formed between the first anti-reflection microstructure and the filter element, and the first anti-reflection microstructure and the air layer partially overlap in the direction perpendicular to the photosensitive surface. The light transmittance of the filter element for light with a wavelength of 450 nm to 550 nm is greater than or equal to 80%; the transmittance of the filter element is 50%, and a first wavelength greater than 550 nm is T50; the reflectance of the first anti-reflection microstructure for light from 450 nm to the first wavelength T50 is less than or equal to 0.93%, and it satisfies the following condition: 600 nm ≤ T50 ≤ 720 nm.

[0006] For the image sensor module according to the above-described embodiment, the reflectance of the first anti-reflection microstructure for light from 450 nm to the first wavelength T50 may be less than or equal to 0.48%.

[0007] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the filter element may further include a second anti-reflection microstructure, the second anti-reflection microstructure is disposed on a side of the optical coating away from the optical deposition layer structure, and partially overlaps with the air layer in a direction perpendicular to the photosensitive surface, and the average reflectivity of the second anti-reflection microstructure to wavelengths from 450 nm to the first wavelength T50 may be less than 0.93%.

[0008] A photosensitive element module according to the embodiment described in the previous paragraph may further include a light-shielding film layer, wherein the light-shielding film layer is disposed between the optical coating and the first anti-reflection microstructure.

[0009] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the filter element may further include an isolation layer, and the isolation layer is disposed between the optical coating and the air layer.

[0010] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the substrate may include a side surface that extends in a direction from the optical deposition layer structure toward the optical coating, and the optical coating is not disposed on the side surface.

[0011] A photosensitive element module according to the embodiment described in the previous paragraph may further include an electronic photosensitive element that forms a photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a part of the non-photosensitive surface.

[0012] A photosensitive element module according to the embodiment described in the previous paragraph may further include an electronic photosensitive element and a molding body. The electronic photosensitive element forms a photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface. The molding body is formed on the electronic photosensitive element, and the molding body may include an inner side surface that faces the center of the photosensitive surface, wherein the inner side surface extends from the non-photosensitive surface in a direction away from the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a part of the inner side surface.

[0013] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the photosensitive element module may include a mounting position and a filter element bracket. The filter element bracket is disposed at the mounting position, wherein the filter element bracket supports the filter element, and the first anti-reflection microstructure is disposed on at least a part of the mounting position.

[0014] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the substrate may be a red light absorbing glass.

[0015] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the light reflectivity of the optical deposition layer structure for light with a wavelength of 450 nm to 550 nm can be less than or equal to 10%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550 nm is R50; the transmittance of the filter element is 50% and a first wavelength greater than 550 nm is T50, which can satisfy the following conditions: 600 nm ≤ R50 ≤ 720 nm; and R50 ≥ T50.

[0016] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the transmittance of the filter element is 50% and a second wavelength less than 450 nm is T50-B, the second wavelength is in the wavelength range of 400 nm to 450 nm, and the reflectivity of the first anti-reflection microstructure for the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0017] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the optical coating can be an organic material layer.

[0018] According to an embodiment of the present disclosure, a camera module is provided, including an imaging lens and a photosensitive element module as described in the previous embodiment, wherein the photosensitive element module is disposed on the image side of the imaging lens.

[0019] According to an embodiment of the present disclosure, an electronic device is provided, including a camera module as described in the previous embodiment.

[0020] According to an embodiment of the present disclosure, a photosensitive element module is provided, which includes a photosensitive surface, a filter element, an air layer, and an anti-reflection microstructure, wherein the filter element faces the photosensitive surface. The filter element includes a substrate, an optical deposition layer structure, and an optical coating, wherein the optical deposition layer structure is disposed on the side of the substrate away from the photosensitive surface, and the optical coating is disposed opposite to the optical deposition layer structure on the side of the substrate facing the photosensitive surface. The optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10. The number of layers of the optical coating includes one, and the thickness of the optical coating is between 900 nm and 5 μm. The air layer is formed between the optical coating and the photosensitive surface. The anti-reflection microstructure is adjacent to the air layer and partially overlaps with the air layer in the direction perpendicular to the photosensitive surface. The transmittance of the filter element for light with a wavelength of 450 nm to 550 nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550 nm is T50; the reflectivity of the anti-reflection microstructure for light from 450 nm to the first wavelength T50 is less than or equal to 0.93%, which satisfies the following conditions: 600 nm ≤ T50 ≤ 720 nm.

[0021] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the reflectivity of the anti-reflection microstructure for light from 450 nm to the first wavelength T50 can be less than or equal to 0.48%.

[0022] The photosensitive element module according to the foregoing embodiment may further include a light-shielding film layer, wherein the light-shielding film layer is disposed between the optical coating and the anti-reflection microstructure.

[0023] The photosensitive element module according to the foregoing embodiment, wherein the substrate may include a side surface that extends along the thickness direction of the substrate, and the optical coating is not disposed on the side surface.

[0024] The photosensitive element module according to the foregoing embodiment may further include a filter element holder, wherein the filter element holder and the anti-reflection microstructure at least partially overlap in a projection parallel to the photosensitive surface, and the filter element is disposed on the filter element holder.

[0025] The photosensitive element module according to the foregoing embodiment, wherein the substrate may be a red light-absorbing glass.

[0026] The photosensitive element module according to the foregoing embodiment, wherein the reflectivity of the optical deposition layer structure to light with a wavelength of 450 nm to 550 nm may be less than or equal to 10%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550 nm is R50; the transmittance of the filter element is 50% and a first wavelength greater than 550 nm is T50, which may satisfy the following conditions: 600 nm ≤ R50 ≤ 720 nm; and R50 ≥ T50.

[0027] The photosensitive element module according to the foregoing embodiment, wherein the transmittance of the filter element is 50% and a second wavelength less than 450 nm is T50-B, the second wavelength is in the wavelength range of 400 nm to 450 nm, and the reflectivity of the anti-reflection microstructure to the second wavelength T50-B to the first wavelength T50 may be less than or equal to 0.93%.

[0028] The photosensitive element module according to the foregoing embodiment, wherein the optical coating may be an organic material layer.

[0029] The photosensitive element module according to the foregoing embodiment, wherein the filter element may further include an isolation layer, the isolation layer is disposed between the optical coating and the anti-reflection microstructure, and the isolation layer may be a multilayer film.

[0030] A photosensitive element module according to the embodiment described in the previous paragraph, wherein the light transmittance of the filter element for light with a wavelength of 450 nm to 550 nm can be greater than or equal to 84%; the maximum value of the light transmittance of the filter element for light with a wavelength of 450 nm to 550 nm can be greater than or equal to 88%; the reflectivity of the anti-reflection microstructure for 400 nm to 750 nm can be less than or equal to 0.25%; the reflectivity of the optical deposition layer structure for light with a wavelength of 450 nm to 550 nm can be less than or equal to 5%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550 nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550 nm is T50, which can satisfy the following conditions: 600 nm ≤ T50 ≤ 700 nm; 650 nm ≤ R50 ≤ 720 nm; and R50 - T50 ≥ 3 nm.

[0031] According to an embodiment of the present disclosure, a camera module is provided, including an imaging lens and a photosensitive element module as described in the previous embodiment, wherein the photosensitive element module is disposed on the image side of the imaging lens.

[0032] According to an embodiment of the present disclosure, an electronic device is provided, including the camera module as described in the previous embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1A A schematic diagram showing a camera module according to the first embodiment of the present disclosure;

[0034] Figure 1B Showing in accordance with Figure 1A A cross-sectional schematic diagram of the camera module in the first embodiment;

[0035] Figure 1C Showing in accordance with Figure 1A A schematic diagram of the photosensitive element module in the first example of the first embodiment;

[0036] Figure 1D Showing in accordance with Figure 1C A partially enlarged view of the photosensitive element module in the first example of the first embodiment;

[0037] Figure 1E Showing in accordance with Figure 1C A data diagram of the photosensitive element module in the first example of the first embodiment;

[0038] Figure 1F Showing in accordance with Figure 1A A schematic diagram of the photosensitive element module in the second example of the first embodiment;

[0039] Figure 1G Showing in accordance with Figure 1F A partially enlarged view of the photosensitive element module in the second example of the first embodiment;

[0040] Figure 1H Shows the schematic diagram of the photosensitive element module in the third embodiment according to Figure 1A the first embodiment;

[0041] Figure 1I Shows the schematic diagram of the photosensitive element module in the fourth embodiment according to Figure 1A the first embodiment;

[0042] Figure 1J Shows the schematic diagram of the photosensitive element module in the fifth embodiment according to Figure 1A the first embodiment;

[0043] Figure 1K Shows the schematic diagram of the photosensitive element module in the sixth embodiment according to Figure 1A the first embodiment;

[0044] Figure 1L Shows the schematic diagram of the photosensitive element module in the seventh embodiment according to Figure 1A the first embodiment;

[0045] Figure 1M Shows the transmittance data graph of the filter element in the first embodiment; Figure 1A according to

[0046] Figure 1N Shows another transmittance data graph of the filter element in the first embodiment; Figure 1A according to

[0047] Figure 1O Shows the reflectivity data graph of the optical deposition layer structure in the first embodiment; Figure 1A according to

[0048] Figure 1P Shows the reflectivity data graph of the anti-reflection microstructure in the first embodiment; Figure 1A according to

[0049] Figure 2A Shows the schematic diagram of the electronic device according to the second embodiment of the present disclosure;

[0050] Figure 2B Shows the schematic diagram of the electronic device according to Figure 2A another second embodiment;

[0051] Figure 3 Shows the schematic diagram of the electronic device according to the third embodiment of the present disclosure disposed on a drone; and

[0052] Figure 4 Shows the schematic diagram of the electronic device according to the fourth embodiment of the present disclosure disposed on an automobile.

[0053]

Symbol Explanation

[0054] 10: Camera module

[0055] 11: Imaging lens

[0056] 12: Photosensitive element module

[0057] 13: Carrier board

[0058] 110a, 110b, 110c, 110d, 110e, 110f, 110g: Electronic photosensitive element

[0059] 111a, 111b, 111c, 111d, 111e, 111f, 111g: Photosensitive surface

[0060] 112e, 112f: Non - photosensitive surface

[0061] 120a, 120b, 120c, 120d, 120e, 120f, 120g: Filter element

[0062] 121a, 121b, 121c, 121d, 121e, 121f, 121g: Substrate

[0063] 122a, 122b, 122c, 122d, 122e, 122f, 122g: Optical deposition layer structure

[0064] 123a, 123b, 123c, 123d, 123e, 123f, 123g: Optical coating

[0065] 124a, 124b, 124c, 124f, 124g: Isolation layer

[0066] 125a, 125c, 125f: Side surface

[0067] 130a, 130c, 130f, 130g: Anti - reflection microstructure

[0068] 131a, 131b, 131c, 131d, 131e, 131f, 131g: Air layer

[0069] 141b, 141d, 141e: First anti - reflection microstructure

[0070] 142b, 142d, 142e: Second anti - reflection microstructure

[0071] 150c, 150d: Light - shielding film layer

[0072] 160e, 160g: Forming body

[0073] 161e, 161g: Inner side surface

[0074] 162f: Molding base

[0075] 171e, 171f: Mounting position

[0076] 172a, 172b, 172c, 172d, 172e, 172f: Filter element holder

[0077] 173e: Fixing element

[0078] 20: Electronic device

[0079] 210: Imaging control interface

[0080] 211: Image playback button

[0081] 212: Camera module switching button

[0082] 213: Focus and take photo button

[0083] 214: Integrated menu button

[0084] 215: Zoom control key

[0085] 221: Front camera module

[0086] 222: Wide - angle camera module

[0087] 223: Telephoto camera module

[0088] 224: Ultra - wide - angle camera module

[0089] 225: Macro camera module

[0090] 226: TOF module

[0091] 23: Indicator light

[0092] 24: Circuit board

[0093] 241: Connector

[0094] 242: Electronic component

[0095] 25: Single - chip system

[0096] 26: Focus assist component

[0097] 261: Light - emitting component

[0098] 30: Drone

[0099] 31a, 41a: Front camera module

[0100] 31b, 41b: Side camera module

[0101] 41c: Rear camera module

[0102] 40: Vehicle

[0103] G: Colloid

[0104] OV: Overlap region

[0105] BL: Base layer

[0106] L: Central optical path

[0107] I1, I2, I3, I4: External space information Detailed implementation manner

[0108] The present disclosure provides a photosensitive element module, which includes a photosensitive surface and a filter element. The filter element faces the photosensitive surface and includes a substrate, an optical deposition layer structure, and an optical coating. The optical deposition layer structure is disposed on a side of the substrate away from the photosensitive surface. The optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10. The optical coating is disposed opposite to the optical deposition layer structure on a side of the substrate facing the photosensitive surface, wherein the number of layers of the optical coating includes one, and the thickness of the optical coating ranges from 900 nm to 5 μm. The light transmittance of the filter element for light with wavelengths from 450 nm to 550 nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550 nm is T50, which satisfies the following condition: 600 nm ≤ T50 ≤ 720 nm.

[0109] Furthermore, an air layer is used to prevent the thermal effect from affecting the lifespan of the optical coating, and the photosensitive surface has a light condensing array to improve the light collection efficiency of the photosensitive element.

[0110] Specifically, the number of layers of the optical deposition layer structure can be further greater than or equal to 36, and can be further greater than or equal to 72. The optical deposition layer structure with a high number of layers can be a superposition of multiple groups of coatings, but is not limited thereto. Adjacent layers of the optical deposition layer structure have different compositions to provide different reflectivities.

[0111] The photosensitive element module may include an air layer and an anti-reflection microstructure. The air layer is formed between the optical coating and the photosensitive surface. The anti-reflection microstructure is adjacent to the air layer, and the anti-reflection microstructure and the air layer partially overlap in a direction perpendicular to the photosensitive surface. The reflectivity of the anti-reflection microstructure for light from 450 nm to the first wavelength T50 can be less than or equal to 0.93%. The reflectivity of the anti-reflection microstructure corresponds to the transmittance of the filter element to reduce the loss on the photosensitive surface, and the anti-reflection microstructure is disposed on the surface of the light condensing array of the photosensitive surface. Furthermore, the reflectivity of the anti-reflection microstructure for light from 450 nm to the first wavelength T50 can be less than or equal to 0.48%.

[0112] Furthermore, a partially overlapping portion of the anti-reflection microstructure and the air layer in the direction perpendicular to the photosensitive surface can define an overlapping area, which allows light to enter the photosensitive surface gradually, thereby improving the light transmittance. The thickness of the overlapping area can be between 50 nm and 500 nm, and can be further between 75 nm and 250 nm. The overlapping area can be in direct contact with the photosensitive surface, or there can be a base layer spacing between the overlapping area and the photosensitive surface.

[0113] The transmittance of the filter element is 50%, and a second wavelength less than 450 nm is T50-B. The second wavelength is in the wavelength range of 400 nm to 450 nm, and the reflectivity of the anti-reflection microstructure for the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0114] Alternatively, the photosensitive element module can include a first anti-reflection microstructure, and the filter element can further include a second anti-reflection microstructure. The first anti-reflection microstructure is disposed on the photosensitive surface, an air layer is formed between the first anti-reflection microstructure and the filter element, and the first anti-reflection microstructure and the air layer partially overlap in the direction perpendicular to the photosensitive surface; the second anti-reflection microstructure is disposed on the side of the optical coating away from the optical deposition layer structure and partially overlaps with the air layer in the direction perpendicular to the photosensitive surface. The reflectivity of the first anti-reflection microstructure for wavelengths from 450 nm to the first wavelength T50 can be less than or equal to 0.93%, and the average reflectivity of the second anti-reflection microstructure for wavelengths from 450 nm to the first wavelength T50 can be less than 0.93%. Specifically, the reflectivity of the first anti-reflection microstructure corresponds to the transmittance of the filter element, thereby reducing the loss on the photosensitive surface and further reducing the reflection on the side of the filter element facing the photosensitive surface to further improve the light transmittance. Furthermore, the reflectivity of the first anti-reflection microstructure for wavelengths from 450 nm to the first wavelength T50 can be less than or equal to 0.48%.

[0115] The transmittance of the filter element is 50%, and a second wavelength less than 450 nm is T50-B. The second wavelength is in the wavelength range of 400 nm to 450 nm, and the reflectivity of the first anti-reflection microstructure for the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0116] The photosensitive element module can further include a light-shielding film layer, which is disposed between the optical coating and the first anti-reflection microstructure or between the optical coating and the anti-reflection microstructure. Thereby, the reflection on the surface of the light-shielding film layer can be avoided from generating glare, so as to improve the optical quality.

[0117] The filter element may further include an isolation layer, where the isolation layer is disposed between the optical coating and the air layer or between the optical coating and the anti-reflection microstructure. Thereby, the adhesion of the anti-reflection microstructure can be improved and the chemical stability of the optical coating can be enhanced to improve and ensure the yield. Specifically, the isolation layer may be a metal oxide layer and may be a single layer or include multiple layers.

[0118] The substrate may include a side surface, where the side surface extends along the direction of the optical deposition layer structure towards the optical coating or in the thickness direction of the substrate, and the optical coating is not disposed on the side surface. Thereby, uneven coating of the optical coating can be avoided to ensure the optical quality.

[0119] The photosensitive element module may further include an electronic photosensitive element, where the electronic photosensitive element forms a photosensitive surface and a non-photosensitive surface. The photosensitive surface is used to receive light passing through the filter element, the non-photosensitive surface is adjacent to the periphery of the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a part of the non-photosensitive surface. Thereby, the influence of the structural defects at the edge on the optical quality of the first anti-reflection microstructure can be reduced to ensure the peripheral optical quality. Specifically, the non-photosensitive surface may include a plurality of contacts, and the contacts can be electrically connected to a circuit.

[0120] The photosensitive element module may further include a molded body, where the molded body is molded on the electronic photosensitive element, and the molded body may include an inner side surface. The inner side surface faces the center of the photosensitive surface, the inner side surface extends from the non-photosensitive surface in a direction away from the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a part of the inner side surface. Thereby, the possibility of generating glare through the molded body can be reduced. Specifically, the molded body and the electronic photosensitive element can be integrally formed by insert injection molding.

[0121] The photosensitive element module may further include a mounting position and a filter element bracket, where the filter element bracket is disposed at the mounting position, the filter element bracket supports the filter element, and the first anti-reflection microstructure is disposed on at least a part of the mounting position. By further extending the first anti-reflection microstructure to the mounting position of the filter element bracket, the glare generated by the reflection of light through the internal structure can be avoided, thereby further optimizing the optical quality.

[0122] Furthermore, the filter element bracket and the anti-reflection microstructure at least partially overlap on a projection parallel to the photosensitive surface, and the filter element is disposed on the filter element bracket. Specifically, the further partial overlap of the anti-reflection microstructure with the filter element can avoid the glare generated by the reflection of light through the internal structure, thereby further optimizing the optical quality.

[0123] The substrate may be a red light absorbing glass. The red light absorbing glass can absorb part of the red light to match the photosensitive characteristics of the photosensitive element, thereby improving the optical quality. Specifically, the red light absorbing glass appears blue or blue-green due to absorbing red light, and the infrared light absorbing glass may be blue glass, but is not limited thereto.

[0124] The optical coating can be a layer of organic material. Thereby, the deterioration of the optical deposition layer structure due to heat during the process of setting the optical coating can be reduced, so as to improve the lifespan of the filter element. Specifically, the process of the optical coating can include spin coating, photocuring, thermal curing, etc., but is not limited thereto.

[0125] The reflectance of the optical deposition layer structure to light with wavelengths from 450nm to 550nm can be less than or equal to 10%. The reflectance of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can satisfy the following conditions: 600nm ≤ R50 ≤ 720nm; and R50 ≥ T50. Thereby, the transmittance of the filter element corresponds to the reflectance of the optical deposition layer structure to reduce the occurrence of glare.

[0126] The transmittance of the filter element to light with wavelengths from 450nm to 550nm can be greater than or equal to 84%; the maximum value of the transmittance of the filter element to light with wavelengths from 450nm to 550nm can be greater than or equal to 88%; the reflectance of the anti-reflection microstructure to light with wavelengths from 400nm to 750nm can be less than or equal to 0.25%; the reflectance of the optical deposition layer structure to light with wavelengths from 450nm to 550nm can be less than or equal to 5%; the reflectance of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can satisfy the following conditions: 600nm ≤ T50 ≤ 700nm; 650nm ≤ R50 ≤ 720nm; and R50 - T50 ≥ 3nm. Thereby, on the premise that the optical coating must exist, the light transmittance can be further improved and the probability of glare generation can be reduced.

[0127] Each technical feature in the photosensitive element module of the above disclosure can be combined and configured to achieve the corresponding effects.

[0128] The present disclosure provides a camera module, including an imaging lens and the aforementioned photosensitive element module, wherein the photosensitive element module is disposed on the image side of the imaging lens.

[0129] The present disclosure provides an electronic device, including the aforementioned camera module.

[0130] According to the above embodiments, specific embodiments and examples are proposed below and will be described in detail with reference to the accompanying drawings.

[0131] <First Embodiment>

[0132] Please refer to Figure 1A and Figure 1B , wherein Figure 1A FIG. shows a schematic diagram of the camera module 10 according to the first embodiment of the present disclosure.Figure 1B Shows a cross-sectional schematic view of the camera module 10 according to Figure 1A the first embodiment. As can be seen from Figure 1A and Figure 1B the camera module 10 sequentially includes an imaging lens 11, a photosensitive element module 12, and a carrier board 13 along a central optical path L, wherein the photosensitive element module 12 is disposed on the image side of the imaging lens 11, and the photosensitive element module 12 is disposed on the carrier board 13.

[0133] Please refer to Figure 1C and Figure 1D , wherein Figure 1C shows a schematic view of the photosensitive element module 12 in the first embodiment according to Figure 1A the first embodiment of the first implementation manner, Figure 1D shows a partial enlarged view of the photosensitive element module 12 in the first embodiment according to Figure 1C the first embodiment of the first implementation manner. As can be seen from Figure 1C and Figure 1D the photosensitive element module 12 includes a photosensitive surface 111a, a filter element 120a, an anti-reflection microstructure 130a, and an air layer 131a, wherein the filter element 120a faces the photosensitive surface 111a, the anti-reflection microstructure 130a is adjacent to the air layer 131a, and the anti-reflection microstructure 130a and the air layer 131a partially overlap in a direction perpendicular to the photosensitive surface 111a.

[0134] The filter element 120a includes a substrate 121a, an optical deposition layer structure 122a, and an optical coating 123a. The optical deposition layer structure 122a is disposed on a side of the substrate 121a away from the photosensitive surface 111a, and the optical coating 123a is disposed opposite to the optical deposition layer structure 122a on a side of the substrate 121a facing the photosensitive surface 111a, and the air layer 131a is formed between the optical coating 123a and the photosensitive surface 111a. Specifically, the optical deposition layer structure 122a is multilayered, the number of layers of the optical deposition layer structure 122a is greater than 10, the number of layers of the optical coating 123a includes one, and the thickness of the optical coating 123a is between 900 nm and 5 μm.

[0135] Specifically, the air layer 131a can be used to avoid the influence of the thermal effect on the lifespan of the optical coating 123a, and the photosensitive surface 111a has a light condensing array for improving the light receiving efficiency of the photosensitive element module 12, and the anti-reflection microstructure 130a can be disposed on the surface of the light condensing array of the photosensitive surface 111a.

[0136] The photosensitive element module 12 may further include an electronic photosensitive element 110a, wherein the electronic photosensitive element 110a forms the photosensitive surface 111a, and the photosensitive surface 111a is used to receive light passing through the filter element 120a.

[0137] The substrate 121a may include a side surface 125a, where the side surface 125a extends along the thickness direction of the substrate 121a, and the optical coating 123a is not provided on the side surface 125a. Thereby, uneven coating of the optical coating 123a can be avoided to ensure optical quality.

[0138] The photosensitive element module 12 may further include a filter element holder 172a, and the filter element holder 172a and the antireflection microstructure 130a at least partially overlap in a projection parallel to the photosensitive surface 111a, where the imaging lens 11 and the filter element 120a are disposed on the filter element holder 172a. Specifically, the antireflection microstructure 130a further partially overlaps with the filter element 120a, which can avoid flare generated by reflection of light through the internal structure, thereby further optimizing optical quality.

[0139] The filter element 120a may further include a separation layer 124a, where the separation layer 124a is disposed between the optical coating 123a and the antireflection microstructure 130a, and the separation layer 124a may be a multilayer film. Thereby, the adhesion of the antireflection microstructure 130a can be improved and the chemical stability of the optical coating 123a can be enhanced to ensure yield.

[0140] Furthermore, the overlapping portion where the antireflection microstructure 130a and the air layer 131a partially overlap in the direction perpendicular to the photosensitive surface 111a may define an overlapping region OV. The overlapping region OV allows light to enter the photosensitive surface 111a gradually, thereby increasing the light transmittance. The thickness of the overlapping region OV may be between 50 nm and 500 nm, and may further be between 75 nm and 250 nm.

[0141] The side surface 125a of the filter element 120a and the filter element holder 172a are bonded by a colloid G. The antireflection microstructure 130a and the air layer 131a overlap in the direction perpendicular to the photosensitive surface 111a in the overlapping region OV. The antireflection microstructure 130a may further include a base layer BL, and the base layer BL is disposed between the overlapping region OV and the photosensitive surface 111a.

[0142] The substrate 121a may be a red light absorbing glass. The red light absorbing glass can absorb part of the red light to match the photosensitive characteristics of the electronic photosensitive element 110a, thereby enhancing optical quality. Specifically, the red light absorbing glass appears blue or blue-green due to its absorption of red light. The infrared light absorbing glass may be blue glass, but is not limited thereto.

[0143] The optical coating 123a may be an organic material layer. Thereby, the optical deposition layer structure 122a can be prevented from deteriorating due to heat during the process of setting the optical coating 123a, so as to extend the lifespan of the filter element 120a. Specifically, the process of the optical coating 123a may include spin coating, photocuring, thermal curing, etc., but is not limited thereto.

[0144] The number of layers of the optical deposition layer structure 122a can be further greater than or equal to 36, and can be further greater than or equal to 72. The optical deposition layer structure 122a with a high number of layers can be the superposition of multiple sets of coating films, but is not limited thereto. Adjacent layers of the optical deposition layer structure 122a have different compositions and can provide different reflectivities.

[0145] Please refer to Table 1, which lists the number of layers, high or low refractive index, and thickness of the optical deposition layer structure 122a in the first embodiment of the first implementation manner. As can be seen from Table 1, the optical deposition layer structure 122a includes a first group of optical deposition layer structures and a second group of optical deposition layer structures. The number of layers of the first group of optical deposition layer structures is 34, the number of layers of the second group of optical deposition layer structures is 36, and H and L in the refractive index represent high refractive index and low refractive index respectively. By stacking high and low refractive indices, light of a specific wavelength has a higher reflectivity, thereby achieving the effect of light filtering.

[0146]

[0147]

[0148] Please refer to Figure 1E , which shows Figure 1C a data diagram of the photosensitive element module 12 in the first embodiment of the first implementation manner. As can be seen from Figure 1E , the transmittance of the light filtering element 120a is 50% and a first wavelength greater than 550nm is T50, the transmittance of the light filtering element 120a is 50% and a second wavelength less than 450nm is T50 - B, the reflectivity of the optical deposition layer structure 122a is 50% and a wavelength greater than 550nm is R50, and the maximum reflectivity is RA. Among them, RA[450, T50] corresponds to the wavelength range from 450nm to the first wavelength T50, RA[T50 - B, T50] corresponds to the wavelength range from the second wavelength T50 - B to the first wavelength T50, and RA[400, 800] corresponds to the wavelength range from 400nm to 800nm. The parameters satisfy the conditions in Table 2 below.

[0149]

[0150] Please refer to Figure 1F and Figure 1G , where Figure 1F shows Figure 1A a schematic diagram of the photosensitive element module 12 in the second embodiment of the first implementation manner, Figure 1G shows Figure 1F a partial enlarged view of the photosensitive element module 12 in the second embodiment of the first implementation manner. As can be seen from Figure 1F and Figure 1GIt can be known that the photosensitive element module 12 includes a photosensitive surface 111b, a filter element 120b, and a first anti-reflection microstructure 141b. Among them, the filter element 120b faces the photosensitive surface 111b, an air layer 131b is formed between the first anti-reflection microstructure 141b and the filter element 120b, and the first anti-reflection microstructure 141b and the air layer 131b partially overlap in the direction perpendicular to the photosensitive surface 111b.

[0151] The filter element 120b includes a substrate 121b, an optical deposition layer structure 122b, and an optical coating 123b. Among them, the optical deposition layer structure 122b is disposed on the side of the substrate 121b away from the photosensitive surface 111b, the optical coating 123b is disposed opposite to the optical deposition layer structure 122b on the side of the substrate 121b facing the photosensitive surface 111b, and the first anti-reflection microstructure 141b is disposed on the photosensitive surface 111b. Specifically, the optical deposition layer structure 122b is multi-layered, the number of layers of the optical deposition layer structure 122b is greater than 10, the number of layers of the optical coating 123b includes one, and the thickness of the optical coating 123b is between 900 nm and 5 μm.

[0152] The photosensitive element module 12 may further include an electronic photosensitive element 110b. Among them, the electronic photosensitive element 110b forms the photosensitive surface 111b, and the photosensitive surface 111b is used to receive light passing through the filter element 120b.

[0153] The photosensitive element module 12 may further include a filter element bracket 172b. Among them, the filter element bracket 172b supports the filter element 120b, and the side of the filter element 120b away from the photosensitive surface 111b is bonded to the filter element bracket 172b by a colloid G.

[0154] The filter element 120b may further include an isolation layer 124b and a second anti-reflection microstructure 142b. Among them, the second anti-reflection microstructure 142b is disposed on the side of the optical coating 123b away from the optical deposition layer structure 122b and partially overlaps with the air layer 131b in the direction perpendicular to the photosensitive surface 111b. The isolation layer 124b is disposed between the optical coating 123b and the second anti-reflection microstructure 142b, and the isolation layer 124b may be a multi-layer film.

[0155] Please refer to Figure 1H which shows a schematic diagram of the photosensitive element module 12 in the third embodiment according to Figure 1A the first embodiment. From Figure 1HIt can be known that the photosensitive element module 12 includes a photosensitive surface 111c, a filter element 120c, an anti-reflection microstructure 130c, and an air layer 131c. Among them, the filter element 120c faces the photosensitive surface 111c, the anti-reflection microstructure 130c is adjacent to the air layer 131c, and the anti-reflection microstructure 130c and the air layer 131c partially overlap in the direction perpendicular to the photosensitive surface 111c.

[0156] The filter element 120c includes a substrate 121c, an optical deposition layer structure 122c, and an optical coating 123c. Among them, the optical deposition layer structure 122c is disposed on the side of the substrate 121c away from the photosensitive surface 111c, the optical coating 123c is disposed opposite to the optical deposition layer structure 122c on the side of the substrate 121c facing the photosensitive surface 111c, and the air layer 131c is formed between the optical coating 123c and the photosensitive surface 111c. Specifically, the optical deposition layer structure 122c is multi-layered, the number of layers of the optical deposition layer structure 122c is greater than 10, the number of layers of the optical coating 123c includes one, and the thickness of the optical coating 123c is between 900 nm and 5 μm.

[0157] The photosensitive element module 12 may further include an electronic photosensitive element 110c. Among them, the electronic photosensitive element 110c forms the photosensitive surface 111c, and the photosensitive surface 111c is used to receive light passing through the filter element 120c.

[0158] The photosensitive element module 12 may further include a filter element bracket 172c. Among them, the filter element bracket 172c and the anti-reflection microstructure 130c at least partially overlap in a projection parallel to the photosensitive surface 111c, and the side surface 125c of the filter element 120c and the filter element bracket 172c are bonded by a colloid G. Specifically, the anti-reflection microstructure 130c further partially overlaps with the filter element 120c, which can avoid the glare generated by the reflection of light through the internal structure, thereby further optimizing the optical quality.

[0159] The filter element 120c may further include an isolation layer 124c. Among them, the isolation layer 124c is disposed between the optical coating 123c and the anti-reflection microstructure 130c, and the isolation layer 124c may be a multi-layer film.

[0160] The photosensitive element module 12 may further include a light-shielding film layer 150c. Among them, the light-shielding film layer 150c is disposed between the optical coating 123c and the isolation layer 124c. Thereby, the glare generated by the reflection of the surface of the light-shielding film layer 150c can be avoided to improve the optical quality.

[0161] Please refer to Figure 1I , which shows Figure 1A a schematic diagram of the photosensitive element module 12 in the fourth embodiment according to the first embodiment. From Figure 1IIt can be known that the photosensitive element module 12 includes a photosensitive surface 111d, a filter element 120d, and a first anti-reflection microstructure 141d. The filter element 120d faces the photosensitive surface 111d, the first anti-reflection microstructure 141d is disposed on the photosensitive surface 111d, an air layer 131d is formed between the first anti-reflection microstructure 141d and the filter element 120d, and the first anti-reflection microstructure 141d and the air layer 131d partially overlap in a direction perpendicular to the photosensitive surface 111d.

[0162] The filter element 120d includes a substrate 121d, an optical deposition layer structure 122d, and an optical coating 123d. The optical deposition layer structure 122d is disposed on a side of the substrate 121d away from the photosensitive surface 111d, and the optical coating 123d is disposed opposite to the optical deposition layer structure 122d on a side of the substrate 121d facing the photosensitive surface 111d. Specifically, the optical deposition layer structure 122d is multi-layered, the number of layers of the optical deposition layer structure 122d is greater than 10, the number of layers of the optical coating 123d is one, and the thickness of the optical coating 123d is between 900 nm and 5 μm.

[0163] The photosensitive element module 12 may further include an electronic photosensitive element 110d. The electronic photosensitive element 110d forms the photosensitive surface 111d, and the photosensitive surface 111d is used to receive light passing through the filter element 120d.

[0164] The photosensitive element module 12 may further include a filter element support 172d. The filter element support 172d supports the filter element 120d, and the filter element support 172d and the filter element 120d can be integrated by a hot pressing process.

[0165] The filter element 120d may further include a second anti-reflection microstructure 142d. The second anti-reflection microstructure 142d is disposed on a side of the optical coating 123d away from the optical deposition layer structure 122d and partially overlaps with the air layer 131d in a direction perpendicular to the photosensitive surface 111d. Thereby, the reflection on the side of the filter element 120d facing the photosensitive surface can be further reduced to further improve the light transmittance.

[0166] Specifically, the anti-reflection microstructures (i.e., the first anti-reflection microstructure 141d and the second anti-reflection microstructure 142d) are simultaneously disposed on the photosensitive surface 111d and the filter element 120d, and the second anti-reflection microstructure 142d is further disposed on at least a part of the filter element support 172d.

[0167] The photosensitive element module 12 may further include a light-shielding film layer 150d. The light-shielding film layer 150d is disposed on a side of the optical deposition layer structure 122d away from the optical coating 123d.

[0168] Please refer to Figure 1J, which shows according to Figure 1A A schematic diagram of the photosensitive element module 12 in the fifth embodiment according to the first embodiment. It can be seen from Figure 1J that the photosensitive element module 12 includes a photosensitive surface 111e, a filter element 120e, and a first anti-reflection microstructure 141e. The filter element 120e faces the photosensitive surface 111e, the first anti-reflection microstructure 141e is disposed on the photosensitive surface 111e, an air layer 131e is formed between the first anti-reflection microstructure 141e and the filter element 120e, and the first anti-reflection microstructure 141e and the air layer 131e partially overlap in a direction perpendicular to the photosensitive surface 111e.

[0169] The filter element 120e includes a substrate 121e, an optical deposition layer structure 122e, and an optical coating 123e. The optical deposition layer structure 122e is disposed on a side of the substrate 121e away from the photosensitive surface 111e, and the optical coating 123e is disposed opposite to the optical deposition layer structure 122e on a side of the substrate 121e facing the photosensitive surface 111e. Specifically, the optical deposition layer structure 122e is multilayered, the number of layers of the optical deposition layer structure 122e is greater than 10, the number of layers of the optical coating 123e includes one, and the thickness of the optical coating 123e is between 900 nm and 5 μm.

[0170] The photosensitive element module 12 may further include an electronic photosensitive element 110e and a molding body 160e. The electronic photosensitive element 110e forms a photosensitive surface 111e and a non-photosensitive surface 112e, where the non-photosensitive surface 112e is adjacent to the periphery of the photosensitive surface 111e. The molding body 160e is molded on the electronic photosensitive element 110e. The molding body 160e includes an inner side surface 161e, and the inner side surface 161e faces the center of the photosensitive surface 111e. The inner side surface 161e extends from the non-photosensitive surface 112e in a direction away from the photosensitive surface 111e, and the first anti-reflection microstructure 141e is disposed on at least a part of the inner side surface 161e. Thereby, the possibility of flare generated through the molding body 160e can be reduced. Specifically, the molding body 160e and the electronic photosensitive element 110e may be integrally formed by insert injection molding.

[0171] The photosensitive element module 12 may further include a mounting position 171e, a filter element bracket 172e, and a fixing element 173e. The filter element bracket 172e is disposed in the mounting position 171e, the filter element bracket 172e supports the filter element 120e, the first anti-reflection microstructure 141e is disposed on at least a part of the mounting position 171e, and the fixing element 173e fixes the filter element 120e to the filter element bracket 172e. By further extending the first anti-reflection microstructure 141e to the mounting position 171e, the flare generated by the reflection of light through the internal structure can be avoided, thereby further optimizing the optical quality.

[0172] The filter element 120e may further include a second anti-reflection microstructure 142e, wherein the second anti-reflection microstructure 142e is disposed on a side of the optical coating 123e away from the optical deposition layer structure 122e, and partially overlaps with the air layer 131e in a direction perpendicular to the photosensitive surface 111e, and the second anti-reflection microstructure 142e and the filter element bracket 172e partially overlap in a projection parallel to the photosensitive surface 111e.

[0173] Specifically, the anti-reflection microstructures (i.e., the first anti-reflection microstructure 141e and the second anti-reflection microstructure 142e) are disposed on both the photosensitive surface 111e and the filter element 120e. The second anti-reflection microstructure 142e is further disposed on at least a part of the filter element bracket 172d, and the molded body 160e further forms a mounting position 171e.

[0174] Please refer to Figure 1K , which shows a schematic diagram of the photosensitive element module 12 in the sixth embodiment according to Figure 1A the first embodiment. As can be seen from Figure 1K , the photosensitive element module 12 includes a photosensitive surface 111f, a filter element 120f, an anti-reflection microstructure 130f, and an air layer 131f, wherein the filter element 120f faces the photosensitive surface 111f, the anti-reflection microstructure 130f is adjacent to the air layer 131f, and the anti-reflection microstructure 130f and the air layer 131f partially overlap in a direction perpendicular to the photosensitive surface 111f.

[0175] The filter element 120f includes a substrate 121f, an optical deposition layer structure 122f, and an optical coating 123f. The optical deposition layer structure 122f is disposed on a side of the substrate 121f away from the photosensitive surface 111f, the optical coating 123f is disposed opposite to the optical deposition layer structure 122f on a side of the substrate 121f facing the photosensitive surface 111f, and the air layer 131f is formed between the optical coating 123f and the photosensitive surface 111f. Specifically, the optical deposition layer structure 122f is multi-layered, the number of layers of the optical deposition layer structure 122f is greater than 10, the number of layers of the optical coating 123f includes one, and the thickness of the optical coating 123f ranges from 900 nm to 5 μm.

[0176] The photosensitive element module 12 may further include an electronic photosensitive element 110f and a molding base 162f. The electronic photosensitive element 110f forms a photosensitive surface 111f and a non-photosensitive surface 112f, and the molding base 162f is in physical contact with the non-photosensitive surface 112f. The photosensitive surface 111f is used to receive light passing through the filter element 120f. The non-photosensitive surface 112f is adjacent to the periphery of the photosensitive surface 111f, and the anti-reflection microstructure 130f is disposed on the non-photosensitive surface 112f. Thereby, the influence of the structural defects at the edges on the optical quality of the anti-reflection microstructure 130f can be reduced to ensure the peripheral optical quality. Specifically, the non-photosensitive surface 112f may include a plurality of contacts, and can be electrically connected to the circuit through the contacts.

[0177] The substrate 121f may include a side surface 125f, where the side surface 125f extends along the optical deposition layer structure 122f in the direction of the optical coating 123f, and the optical coating 123f is not disposed on the side surface 125f.

[0178] The photosensitive element module 12 may further include a mounting position 171f and a filter element bracket 172f. The filter element bracket 172f is disposed in the mounting position 171f. The filter element bracket 172f supports the filter element 120f. The anti-reflection microstructure 130f is disposed on at least a part of the mounting position 171f, and the filter element bracket 172f and the anti-reflection microstructure 130f at least partially overlap in a projection parallel to the photosensitive surface 111f. Further, the non-photosensitive surface 112f includes the mounting position 171f, and the filter element bracket 172f and the filter element 120f are integrally formed by insert injection molding.

[0179] The filter element 120f may further include a separation layer 124f, where the separation layer 124f is disposed between the optical coating 123f and the anti-reflection microstructure 130f, and the separation layer 124f may be a multi-layer film.

[0180] Please refer to Figure 1L , which shows Figure 1A a schematic diagram of the photosensitive element module 12 in the seventh embodiment according to the first embodiment. As can be seen from Figure 1L , the photosensitive element module 12 includes a photosensitive surface 111g, a filter element 120g, an anti-reflection microstructure 130g, and an air layer 131g. The filter element 120g faces the photosensitive surface 111g. The anti-reflection microstructure 130g is adjacent to the air layer 131g, and the anti-reflection microstructure 130g and the air layer 131g partially overlap in the direction perpendicular to the photosensitive surface 111g.

[0181] The filter element 120g includes a substrate 121g, an optical deposition layer structure 122g, and an optical coating 123g. The optical deposition layer structure 122g is disposed on a side of the substrate 121g away from the photosensitive surface 111g, and the optical coating 123g is disposed opposite to the optical deposition layer structure 122g on a side of the substrate 121g facing the photosensitive surface 111g, and an air layer 131g is formed between the optical coating 123g and the photosensitive surface 111g. Specifically, the optical deposition layer structure 122g is multilayered, the number of layers of the optical deposition layer structure 122g is greater than 10, the number of layers of the optical coating 123g is one, and the thickness of the optical coating 123g is between 900 nm and 5 μm.

[0182] The photosensitive element module 12 may further include an electronic photosensitive element 110g and a molding body 160g. The electronic photosensitive element 110g forms the photosensitive surface 111g, and the molding body 160g is molded on the electronic photosensitive element 110g. The molding body 160g includes an inner side surface 161g, and the inner side surface 161g faces the center of the photosensitive surface 111g, and the antireflection microstructure 130g is disposed on both the photosensitive surface 111g and the inner side surface 161g. By disposing the antireflection microstructure 130g on the photosensitive surface 111g and the inner side surface 161g, the filter element 120g is in contact with the molding body 160g, thereby achieving the effect of sealing the photosensitive surface 111g. Furthermore, the molding body 160g is formed by curing a colloid, but is not limited thereto.

[0183] The filter element 120g may further include a separation layer 124g. The separation layer 124g is disposed between the optical coating 123g and the antireflection microstructure 130g, and the separation layer 124g may be a multilayer film.

[0184] Please refer to Figure 1M and Figure 1N which Figure 1M shows the transmittance data diagram of the filter element according to Figure 1A the first embodiment, Figure 1N shows another transmittance data diagram of the filter element according to Figure 1A the first embodiment. From Figure 1M and Figure 1N it can be seen that the transmittance of the filter element for light with wavelengths from 450 nm to 550 nm is Tmin450 - 550, the first wavelength at which the transmittance of the filter element is 50% and greater than 550 nm is T50, the second wavelength at which the transmittance of the filter element is 50% and less than 450 nm is T50 - B, and the maximum value of the transmittance of the filter element for light with wavelengths from 450 nm to 550 nm is Tmax. The said parameters satisfy the conditions in Table 3 below. It should be noted that samples i to xv can all be applied to the first to seventh embodiments of the first embodiment.

[0185]

[0186] Please refer to Figure 1O , which shows according to Figure 1A the reflectance data graph of the optical deposition layer structure in the first embodiment. It can be seen from Figure 1O that the reflectance of the optical deposition layer structure is 50% and a wavelength greater than 550 nm is R50, and the parameters satisfy the conditions in Table 4 below. It should be noted that samples a to h can all be applied to the first to seventh embodiments of the first embodiment.

[0187]

[0188] Please refer to Figure 1P , which shows according to Figure 1A the reflectance data graph of the anti-reflection microstructure in the first embodiment. It can be seen from Figure 1P that the maximum reflectance of the anti-reflection microstructure for wavelengths from 400 nm to 800 nm is Rmax, and the parameters satisfy the conditions in Table 5 below. It should be noted that samples 1 to 10 can all be applied to the first to seventh embodiments of the first embodiment.

[0189]

[0190] To clearly show the relative positions between components, Figure 1C , Figure 1D and Figures 1F to 1L the light-shielding film layer, the optical coating, the anti-reflection microstructure, etc. in

[0191] <Second Embodiment>

[0192] Please refer to Figure 2A and Figure 2B , wherein Figure 2A shows a schematic diagram of the electronic device 20 according to the second embodiment of the present disclosure, Figure 2B shows according to Figure 2A another schematic diagram of the electronic device 20 in the second embodiment. It can be seen from Figure 2A and Figure 2B that the electronic device 20 is a smart phone, and the electronic device 20 can also be a notebook computer, a tablet computer, a driving recorder, etc., but not limited thereto. The electronic device 20 includes a camera module and an imaging control interface 210, wherein the camera module includes an imaging lens and a photosensitive element module, and the photosensitive element module is disposed on the image side of the imaging lens. Further, the photosensitive element module can be the photosensitive element module of the first to seventh embodiments of the foregoing first embodiment, but the present disclosure is not limited thereto.

[0193] In the second embodiment, the camera modules are respectively a front camera module 221, a wide-angle camera module 222, a telephoto camera module 223, an ultra-wide-angle camera module 224, a macro camera module 225, and a TOF module (Time-Of-Flight) 226. The TOF module 226 can be other types of camera modules, and this configuration is not limited to this.

[0194] Specifically, in the second embodiment, the front camera module 221 and the TOF module 226 are disposed on the front of the electronic device 20, while the wide-angle camera module 222, the telephoto camera module 223, the ultra-wide-angle camera module 224, and the macro camera module 225 are disposed on the back of the electronic device 20.

[0195] The imaging control interface 210 can be a touch screen, which is used to display images and has a touch function, and can be used to manually adjust the shooting angle. Specifically, the imaging control interface 210 includes an image playback button 211, a camera module switching button 212, a focus and capture button 213, an integrated menu button 214, and a zoom control button 215. Further, the user enters the shooting mode through the imaging control interface 210 of the electronic device 20. The camera module switching button 212 can freely switch to use one of the front camera module 221, the wide-angle camera module 222, the telephoto camera module 223, the ultra-wide-angle camera module 224, and the macro camera module 225 for shooting. The zoom control button 215 is used to adjust the zoom. The focus and capture button 213 captures an image after framing and determining one of the front camera module 221, the wide-angle camera module 222, the telephoto camera module 223, the ultra-wide-angle camera module 224, and the macro camera module 225. The image playback button 211 allows the user to view the photo after imaging. The integrated menu button 214 is used to adjust the details during imaging (such as timed shooting, shooting ratio, etc.).

[0196] The electronic device 20 may further include a notification light 23. The notification light 23 is disposed on the front of the electronic device 20 and can be used to notify the user of unread messages, missed calls, and the status of the mobile phone.

[0197] Further, after the user enters the shooting mode through the imaging control interface 210 of the electronic device 20, the imaging light rays of the camera modules are converged on the photosensitive element and an electronic signal related to the image is output to the image signal processor (not shown) of the single-chip system 25. The single-chip system 25 may further include a random access memory (RAM) (not shown), a central processing unit (not shown), and a storage unit (not shown), and may further include but is not limited to a display unit, a control unit, a read-only storage unit (ROM), or a combination thereof.

[0198] Furthermore, the electronic device 20 may further include an imaging software processor and an imaging signal processor, and may further integrate the imaging software processor, the imaging signal processor, the position locator, the transmission signal processor, the gyroscope, the storage unit, and the random access memory into the system-on-chip 25.

[0199] According to the camera specifications of the electronic device 20, the electronic device 20 may further include an optical image stabilization component (not shown in the figure). Further, the electronic device 20 may further include at least one focus assist element 26 and at least one sensing element (not shown in the figure). The focus assist element 26 may include a light-emitting element 261 for compensating the color temperature, an infrared distance measuring element (not shown in the figure), a laser focus module (not shown in the figure), etc. The sensing element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall Effect Element, a position locator, and a transmission signal processor, to sense the shaking and jitter applied by the user's hand or the external environment, thereby facilitating the automatic focus function of the camera module configuration and the optical image stabilization component in the electronic device 20 to obtain good imaging quality, and helping the electronic device 20 according to the present disclosure to have various shooting functions, such as optimized selfies, low-light HDR (High Dynamic Range) imaging, high-resolution 4K video recording, etc. In addition, the user can directly view the shooting screen of the camera through the image capture control interface 210 and manually operate the viewing range on the image capture control interface 210 to achieve the automatic focus function of what you see is what you get.

[0200] Furthermore, the camera module, the optical image stabilization component, the sensing element, the focus assist element 26, and the electronic component 242 may be disposed on a circuit board 24 and electrically connected to related components such as the imaging signal processor through a connector 241 to execute the shooting process, where the circuit board 24 may be a flexible printed circuit board (FPC). Current electronic devices such as smartphones tend to be thin and light. Configuring the camera module and related components on the circuit board and then integrating the circuits to the main board of the electronic device through the connector can meet the mechanical design and circuit layout requirements of the limited space inside the electronic device and obtain a greater margin, and also make the automatic focus function of its camera module more flexible to control through the touch screen of the electronic device. In the second embodiment, the sensing element and the focus assist element 26 are disposed on the circuit board 24 and at least one other flexible circuit board (not shown in the figure), and are electrically connected to related components such as the imaging signal processing element through corresponding connectors to execute the shooting process. In other embodiments (not shown in the figure), the sensing element and the auxiliary optical element may also be disposed on the main board of the electronic device or other forms of carrier boards according to the mechanical design and circuit layout requirements.

[0201] Furthermore, the wide-angle camera module 222 can capture images within a certain range with high pixel count and has the functions of high resolution and low distortion. The imaging result of the telephoto camera module 223 can have a smaller viewing angle and depth of field than that of the wide-angle camera module 222 and can be used to photograph moving targets. That is, an actuator (not shown in the figure) of the electronic device 20 can drive the telephoto camera module 223 to perform fast and continuous auto focus on the target, so that the target object will not be blurred due to moving away from the focused position. The imaging result of the ultra-wide-angle camera module 224 can have a larger viewing angle and depth of field than that of the wide-angle camera module 222, but is often accompanied by larger distortion.

[0202] Specifically, by using camera modules with different focal lengths for framing and combining with image processing technology, the zoom function can be achieved on the electronic device 20.

[0203] <Third Embodiment>

[0204] Please refer to Figure 3 , which shows a schematic diagram of the electronic device disposed on the unmanned aerial vehicle 30 according to the third embodiment of the present disclosure. As Figure 3 can be seen, the electronic device (not labeled in the figure) includes a camera module, where the camera module includes an imaging lens and a photosensitive element module, and the photosensitive element module is disposed on the image side of the imaging lens. Further, the photosensitive element module can be the photosensitive element module of the first to seventh embodiments of the first embodiment described above, but the present disclosure is not limited thereto.

[0205] In the third embodiment, the camera modules are respectively a front camera module 31a and a side camera module 31b.

[0206] Specifically, the front camera module 31a is disposed at the front end of the unmanned aerial vehicle 30, and the side camera module 31b is disposed at the side of the unmanned aerial vehicle 30. Thereby, the electronic device can cope with complex ambient light.

[0207] <Fourth Embodiment>

[0208] Please refer to Figure 4 , which shows a schematic diagram of the electronic device disposed on the vehicle 40 according to the fourth embodiment of the present disclosure. As Figure 4 can be seen, the electronic device (not labeled in the figure) includes a camera module, where the camera module includes an imaging lens and a photosensitive element module, and the photosensitive element module is disposed on the image side of the imaging lens. Further, the photosensitive element module can be the photosensitive element module of the first to seventh embodiments of the first embodiment described above, but the present disclosure is not limited thereto.

[0209] In the fourth embodiment, the camera modules are respectively a front camera module 41a, a side camera module 41b, and a rear camera module 41c.

[0210] By respectively disposing the front camera module 41a, the side camera module 41b, and the rear camera module 41c at the front end, the side, and the rear end of the vehicle 40, it helps the driver obtain external space information outside the vehicle 40, such as external space information I1, I2, I3, I4, but not limited thereto. Thereby, more perspectives can be provided to reduce blind spots, which in turn helps to improve driving safety.

[0211] Although the present utility model has been disclosed above in embodiments and examples, it is not intended to limit the present utility model. Any person with ordinary knowledge in the technical field to which the present utility model pertains may make some modifications and refinements without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model shall be determined by the scope defined by the appended claims.

Claims

1. A photosensitive element module, characterized in that, Comprising: A photosensitive surface; A filter element facing the photosensitive surface and comprising: A substrate; An optical deposited layer structure disposed on a side of the substrate away from the photosensitive surface, wherein the optical deposited layer structure is multi-layered and the number of layers of the optical deposited layer structure is greater than 10; and An optical coating disposed opposite to the optical deposited layer structure on a side of the substrate facing the photosensitive surface, wherein the number of layers of the optical coating is one and the thickness of the optical coating is between 900 nm and 5 μm; and A first anti-reflection microstructure disposed on the photosensitive surface, an air layer being formed between the first anti-reflection microstructure and the filter element, and the first anti-reflection microstructure and the air layer partially overlapping in a direction perpendicular to the photosensitive surface; Wherein, the light transmittance of the filter element for light with wavelengths from 450 nm to 550 nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550 nm is T50; the reflectance of the first anti-reflection microstructure for light from 450 nm to the first wavelength T50 is less than or equal to 0.93%, and it satisfies the following conditions: 600 nm ≤ T50 ≤ 720 nm.

2. The photosensitive element module according to claim 1, wherein, The reflectance of the first anti-reflection microstructure for light from 450 nm to the first wavelength T50 is less than or equal to 0.48%.

3. The photosensitive element module according to claim 1, wherein, The filter element further comprises: A second anti-reflection microstructure disposed on a side of the optical coating away from the optical deposited layer structure and partially overlapping with the air layer in a direction perpendicular to the photosensitive surface, the average reflectance of the second anti-reflection microstructure for light from 450 nm to the first wavelength T50 being less than 0.93%.

4. The photosensitive element module according to claim 3, wherein, Further comprising: A light-shielding film layer disposed between the optical coating and the first anti-reflection microstructure.

5. The photosensitive element module according to claim 1, wherein The filter element further comprises: An isolation layer disposed between the optical coating and the air layer.

6. The photosensitive element module according to claim 1, characterized in that, The substrate comprises: A side surface extending in a direction from the optical deposited layer structure towards the optical coating, and the optical coating is not disposed on the side surface.

7. The photosensitive element module according to claim 1, wherein Further comprising: An electronic photosensitive element forming the photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a part of the non-photosensitive surface.

8. The photosensitive element module according to claim 1, wherein Further comprising: An electronic photosensitive element forming the photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface; and A formed body formed on the electronic photosensitive element, the formed body comprising an inner side surface facing the center of the photosensitive surface, wherein the inner side surface extends from the non-photosensitive surface in a direction away from the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a part of the inner side surface.

9. The photosensitive element module according to claim 1, characterized in that, The photosensitive element module comprises: A mounting position; and A filter element bracket disposed at the mounting position, wherein the filter element bracket supports the filter element, and the first anti-reflection microstructure is disposed on at least a part of the mounting position.

10. The photosensitive element module according to claim 1, wherein, The substrate is a red light-absorbing glass.

11. The photosensitive element module according to claim 1, wherein The reflectance of the optical deposition layer structure for light with wavelengths from 450 nm to 550 nm is less than or equal to 10%; the reflectance of the optical deposition layer structure is 50% and a wavelength greater than 550 nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550 nm is T50, which satisfies the following conditions: 600 nm ≤ R50 ≤ 720 nm; and R50 ≥ T50.

12. The photosensitive element module according to claim 1, wherein The transmittance of the filter element is 50% and a second wavelength less than 450 nm is T50-B. The second wavelength is in the wavelength range of 400 nm to 450 nm, and the reflectance of the first anti-reflection microstructure for the second wavelength T50-B to the first wavelength T50 is less than or equal to 0.93%.

13. The photosensitive element module according to claim 1, wherein The optical coating is an organic material layer.

14. A camera module, characterized in that, Comprising: An imaging lens; and The photosensitive element module as described in claim 1, disposed on the image side of the imaging lens.

15. An electronic device, characterized in that, Comprising: The camera module as described in claim 14.

16. A photosensitive element module, characterized in that, Comprising: A photosensitive surface; A filter element, facing the photosensitive surface, and comprising: A substrate; An optical deposition layer structure, disposed on the side of the substrate away from the photosensitive surface, wherein the optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10; and An optical coating, disposed opposite to the optical deposition layer structure on the side of the substrate facing the photosensitive surface, wherein the number of layers of the optical coating is one, and the thickness of the optical coating is between 900 nm and 5 μm; An air layer, formed between the optical coating and the photosensitive surface; and An anti-reflection microstructure, adjacent to the air layer, and partially overlapping with the air layer in the direction perpendicular to the photosensitive surface; Wherein, the transmittance of the filter element for light with wavelengths from 450 nm to 550 nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550 nm is T50; the reflectance of the anti-reflection microstructure for light from 450 nm to the first wavelength T50 is less than or equal to 0.93%, which satisfies the following conditions: 600 nm ≤ T50 ≤ 720 nm.

17. The photosensitive element module according to claim 16, wherein, The reflectance of the anti-reflection microstructure for light from 450 nm to the first wavelength T50 is less than or equal to 0.48%.

18. The photosensitive element module as described in claim 16, wherein, Further comprising: A light-shielding film layer, disposed between the optical coating and the anti-reflection microstructure.

19. The photosensitive element module according to claim 16, wherein The substrate comprises: A side surface, extending along the thickness direction of the substrate, and the optical coating is not disposed on the side surface.

20. The photosensitive element module according to claim 16, characterized in that, Further comprising: A filter element bracket, at least partially overlapping with the anti-reflection microstructure in a projection parallel to the photosensitive surface, wherein the filter element is disposed on the filter element bracket.

21. The photosensitive element module according to claim 16, wherein, The substrate is a red light-absorbing glass.

22. The photosensitive element module according to claim 16, wherein, The reflectance of the optical deposition layer structure for light with wavelengths from 450 nm to 550 nm is less than or equal to 10%; the reflectance of the optical deposition layer structure is 50% and a wavelength greater than 550 nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550 nm is T50, which satisfies the following conditions: 600 nm ≤ R50 ≤ 720 nm; and R50 ≥ T50.

23. The photosensitive element module according to claim 16, wherein, The transmittance of the filter element is 50%, and a second wavelength less than 450 nm is T50-B. The second wavelength is in the wavelength range of 400 nm to 450 nm, and the reflectance of the anti-reflection microstructure for the second wavelength T50-B to the first wavelength T50 is less than or equal to 0.93%.

24. The photosensitive element module according to claim 16, wherein The optical coating is an organic material layer.

25. The photosensitive element module as described in claim 16, wherein The filter element further comprises: An isolation layer disposed between the optical coating and the anti-reflection microstructure, and the isolation layer is a multilayer film.

26. The photosensitive element module according to claim 16, wherein, The transmittance of the filter element for light with a wavelength of 450 nm to 550 nm is greater than or equal to 84%; the maximum value of the transmittance of the filter element for light with a wavelength of 450 nm to 550 nm is greater than or equal to 88%; the reflectance of the anti-reflection microstructure for 400 nm to 750 nm is less than or equal to 0.25%; the reflectance of the optical deposition layer structure for light with a wavelength of 450 nm to 550 nm is less than or equal to 5%; the reflectance of the optical deposition layer structure is 50%, and a wavelength greater than 550 nm is R50; the transmittance of the filter element is 50%, and the first wavelength greater than 550 nm is T50, which satisfies the following conditions: 600 nm ≤ T50 ≤ 700 nm; 650 nm ≤ R50 ≤ 720 nm; and R50 - T50 ≥ 3 nm.

27. A camera module, characterized in that, Comprising: An imaging lens; and The photosensitive element module according to claim 16, disposed on the image side of the imaging lens.

28. An electronic device, characterized in that, Comprising: The camera module according to claim 27.

Images