Liquid cooling cabinet and electronic equipment system

Abstract

The utility model discloses a liquid cooling cabinet which comprises a cabinet body and a plurality of liquid inlet pipes, the cabinet body is provided with an accommodating cavity, the liquid inlet pipes penetrate through the inner wall of the cabinet body along the thickness direction, a distribution channel is formed on the inner wall of the cabinet body, one end of each liquid inlet pipe is inserted into the distribution channel, and the other end of each liquid inlet pipe is inserted into the accommodating cavity. A plurality of liquid inlets communicated with the distribution channel are further formed in the inner wall of the cabinet body, the distribution channel is communicated with the containing cavity through the liquid inlets, a first hydrophobic coating is arranged on the inner surface of at least one liquid inlet pipe, and the liquid inlet pipe provided with the first hydrophobic coating comprises a straight pipe part and a bent pipe part; the straight pipe part is communicated with the bent pipe part, the first hydrophobic coating comprises a first hydrophobic part arranged on the inner surface of the straight pipe part and a second hydrophobic part arranged on the inner surface of the bent pipe part, and the thickness of the first hydrophobic part is smaller than that of the second hydrophobic part. The utility model also discloses an electronic equipment system.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling of electronic equipment, in particular to a liquid cooling cabinet and an electronic equipment system. Background Art

[0002] The cabinet is a carrier for storing electronic equipment. The operation of electronic equipment generates heat. If this heat is not dissipated in time, it is likely to cause equipment failure, thereby affecting data security. Therefore, the cabinet is required to have good heat dissipation performance.

[0003] Liquid cooling technology uses liquid as a heat dissipation medium to remove heat from equipment in server cabinets. Existing liquid cooling technology primarily relies on direct contact of the coolant with the surface of electronic devices to transfer heat. Improving cooling efficiency has become a pressing technical challenge in this field. Utility Model Content

[0004] The present invention aims to solve one of the technical problems in the related art to a certain extent. To this end, the present invention provides a liquid cooling cabinet and an electronic equipment system.

[0005] In order to achieve the above-mentioned purpose, the utility model discloses a liquid cooling cabinet, which includes a cabinet body and multiple liquid inlet pipes. The cabinet body has a accommodating cavity, and the liquid inlet pipe penetrates the inner wall of the cabinet body along the thickness direction. A distribution channel is formed on the inner wall of the cabinet body, and one end of the liquid inlet pipe is inserted into the distribution channel. A plurality of liquid inlets connected to the distribution channel are also formed on the inner wall of the cabinet body, and the distribution channel is connected to the accommodating cavity through the liquid inlet. A first hydrophobic coating is provided on the inner surface of at least one of the liquid inlet pipes, and the liquid inlet pipe provided with the first hydrophobic coating includes a straight pipe portion and a curved pipe portion, and the straight pipe portion is connected to the curved pipe portion. The first hydrophobic coating includes a first hydrophobic portion provided on the inner surface of the straight pipe portion and a second hydrophobic portion provided on the inner surface of the curved pipe portion. The thickness of the first hydrophobic portion is less than the thickness of the second hydrophobic portion.

[0006] Furthermore, the thickness of the second hydrophobic portion is 5 micrometers to 20 micrometers greater than the thickness of the first hydrophobic portion.

[0007] Furthermore, the thickness of the first hydrophobic portion is between 5 micrometers and 20 micrometers, and the thickness of the second hydrophobic portion is between 10 micrometers and 25 micrometers.

[0008] Furthermore, a second hydrophobic coating is provided on the inner wall of the liquid inlet.

[0009] Further, the multiple liquid inlets are all circular holes, the liquid inlets are spaced along the length direction of the distribution channel, the liquid inlets include a first liquid inlet and a second liquid inlet, the first liquid inlet corresponds to the liquid inlet pipe, the second liquid inlet is distributed along the direction away from the liquid inlet pipe, the diameter of the first liquid inlet is smaller than that of the second liquid inlet, and the thickness of the second hydrophobic coating is between 5 microns and 25 microns.

[0010] Further, a third hydrophobic coating is provided on the inner wall of the cabinet body.

[0011] Further, the thickness of the third hydrophobic coating is between 15 microns and 35 microns.

[0012] Further, the liquid-cooled cabinet also includes a flow equalizing plate and a sensor. A fixed card slot is formed on one inner wall of the cabinet body. The flow equalizing plate is provided with uniformly distributed guide through holes. One side of the flow equalizing plate is detachably arranged in the fixed card slot. A cooling cavity is formed between the flow equalizing plate and the corresponding inner wall through the fixed card slot. The sensor is arranged in the cooling cavity, and a fourth hydrophobic coating is provided on the flow equalizing plate.

[0013] As the second aspect of the present utility model, an electronic device system is disclosed, which includes an electronic device and a liquid-cooled cabinet. The electronic device is arranged in the liquid-cooled cabinet, and the liquid-cooled cabinet is the above-mentioned liquid-cooled cabinet.

[0014] Further, a fifth hydrophobic coating is provided on the surface of the electronic device.

[0015] In the liquid-cooled cabinet provided by the embodiment of the present utility model, a hydrophobic coating is provided on the inner surface of the liquid inlet pipe of the liquid-cooled cabinet. This hydrophobic coating avoids the direct contact between the coolant and the liquid inlet pipe and makes the coolant directly contact with the hydrophobic coating. When the coolant contacts the hydrophobic coating, the contact angle between the coolant and the coating increases, which is greater than the contact angle between the coolant and the liquid inlet pipe. This can make the coolant form a smaller contact area on the hydrophobic coating, thereby accelerating the flow of the coolant in the liquid inlet pipe and improving the heat conduction efficiency. On the other hand, according to the requirements of different regions of the liquid inlet pipe, different coating thicknesses are adopted. A thicker hydrophobic coating is set at the elbow to effectively reduce the wear accumulated by the continuous impact of the coolant on this area. The thicker hydrophobic coating can improve the anti-wear property of the coating against the impact of the coolant, slow down the wear thickness of the hydrophobic coating, and prevent the hydrophobic coating from failing due to wear.

[0016] In the electronic device system provided by the embodiment of the present utility model, the above-mentioned liquid-cooled cabinet is used to perform liquid heat dissipation cooling on the electronic device. The liquid-cooled cabinet coated with the hydrophobic coating accelerates the flow of the coolant and accelerates the heat exchange between the coolant in the liquid-cooled cabinet and the electronic device, thereby significantly improving the heat dissipation efficiency of the coolant in the cabinet for the electronic device.

[0017] These features and advantages of the present utility model will be disclosed in detail in the following specific embodiments and the accompanying drawings. The best embodiments or means of the present utility model will be elaborated in combination with the accompanying drawings, but it is not a limitation to the technical solution of the present utility model. In addition, these features, elements, and components that appear in each of the following texts and drawings are multiple, and different symbols or numbers are marked for convenience of representation, but they all represent components with the same or similar structures or functions. Description of the Drawings

[0018] The present utility model will be further described below in conjunction with the accompanying drawings:

[0019] Figure 1 Schematic diagram of an embodiment of the liquid-cooled cabinet provided by the present utility model;

[0020] Figure 2 Schematic diagram of another embodiment of the liquid-cooled cabinet provided by the present utility model;

[0021] Figure 3 Top view of an embodiment of the liquid-cooled cabinet provided by the present utility model;

[0022] Figure 4 Stereoscopic schematic diagram of an embodiment of the electronic device system provided by the present utility model;

[0023] Figure 5 Front view of an embodiment of the liquid-cooled cabinet provided by the present utility model;

[0024] Figure 6 Side view of an embodiment of the liquid-cooled cabinet provided by the present utility model.

[0025] Description of the Reference Numerals in the Drawings

[0026] 1: Cabinet body 2: Liquid inlet pipe

[0027] 3: Electronic device 11: Inner wall

[0028] 12: Accommodation cavity 13: Distribution channel

[0029] 14: Fixed card slot 15: Flow equalizing plate

[0030] 21: Straight pipe part 22: Bent pipe part

[0031] 131: Liquid inlet 131a: First liquid inlet

[0032] 131b: Second liquid inlet 211: First hydrophobic part

[0033] 221: Second hydrophobic part Specific Embodiments

[0034] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. Based on the embodiments in the implementation manners, it is intended to explain the present utility model and should not be construed as a limitation to the present utility model.

[0035] As used herein, the phrase "one embodiment" or "example" or "instance" means that a particular feature, structure, or characteristic described in connection with the embodiment itself can be included in at least one embodiment disclosed in this application. The appearances of the phrase "in one embodiment" in various positions in the specification do not necessarily refer to the same embodiment.

[0036] Through research by the applicant, it is found that the existing liquid cooling technology mainly relies on the coolant directly contacting the surface of the electronic device to transfer heat. However, this cooling method easily forms a thin film-like liquid layer after the coolant contacts the surfaces of various regions of the liquid cooling cabinet. This thin film-like liquid layer will block the transfer of heat from the cabinet surface to the coolant, and the coolant cannot carry away the heat as it flows. At the same time, the flow rate of the coolant in the cabinet is small, further increasing the thermal resistance and resulting in an unsatisfactory heat dissipation efficiency. In addition, the internal structure design of the cabinet is complex, which also causes a great resistance to the flow of the coolant, further affecting the heat dissipation efficiency.

[0037] The present utility model aims to apply a superhydrophobic coating to the surface of the liquid cooling cabinet to reduce the thermal resistance between the coolant and the cabinet surface, thereby significantly improving the heat dissipation efficiency.

[0038] The present utility model discloses a liquid cooling cabinet, as Figure 1 shown. The liquid cooling cabinet includes a cabinet body 1 and a plurality of liquid inlet pipes 2. The cabinet body has a receiving cavity 12 for placing electronic devices. The liquid inlet pipes 2 penetrate the inner wall 11 of the cabinet body in the thickness direction. A distribution channel 13 is formed on the inner wall 11 of the cabinet body. One end of the liquid inlet pipe 2 is inserted into the distribution channel 13. A plurality of liquid inlet openings 131 communicating with the distribution channel 13 are further formed on the inner wall 11 of the cabinet body 1. The distribution channel 13 communicates with the receiving cavity 12 through the liquid inlet openings 131. A first hydrophobic coating is provided on the inner surface of at least one liquid inlet pipe 2. The liquid inlet pipe 2 provided with the first hydrophobic coating includes a straight pipe portion 21 and a bent pipe portion 22. The straight pipe portion 21 is communicated with the bent pipe portion 22. The first hydrophobic coating includes a first hydrophobic portion 211 provided on the inner surface of the straight pipe portion and a second hydrophobic portion 221 provided on the inner surface of the bent pipe portion. The thickness of the first hydrophobic portion is less than the thickness of the second hydrophobic portion.

[0039] A hydrophobic coating is provided on the inner surface of the liquid inlet pipe of the liquid-cooled cabinet. When the coolant passes through the cabinet, this hydrophobic coating prevents the direct contact between the coolant and the inlet pipe, and instead makes the coolant directly contact with the hydrophobic coating. When the coolant contacts the hydrophobic coating, the contact angle between the coolant and the coating increases, which is greater than the contact angle between the coolant and the surface of the inlet pipe. This enables the coolant to form a smaller contact area on the hydrophobic coating, preventing the formation of the above-mentioned thin film-like liquid layer due to wetting on the bonding surface, accelerating the heat transfer of the cabinet, thereby accelerating the flow of the coolant in the inlet pipe and improving the heat conduction efficiency.

[0040] A hydrophobic coating is provided on the inner surface of the pipe. The pipe includes a bent pipe and a straight pipe. The bent pipe usually only changes the flow direction without changing the flow velocity magnitude. When the coolant flows through the bent pipe, the flow direction changes rapidly, resulting in flow separation and forming two fluids with different flow rates, velocities, and flow directions. The fluid affected by the inertial effect will further affect the coolant flowing into this area subsequently, and this fluid will disappear after a certain distance. The maximum length of the influence of the fluid generated by the bent pipe can exceed fifty times the pipe diameter. According to the hydrodynamic model of the present invention, by providing a hydrophobic coating with a corresponding thickness at the bent pipe, the shape, the angle of the bent pipe, the cross-sectional area of the bent pipe, etc. can be changed, optimizing the structure of the bent pipe, thereby reducing the local resistance of the coolant passing through here, reducing the energy loss of the coolant and the impact wear on the hydrophobic coating. On the contrary, a relatively thinner hydrophobic coating can be provided on the straight pipe section to further promote the flow of the coolant. Preferably, the thickness of the second hydrophobic part 221 of the bent pipe part is 5 to 20 microns greater than the thickness of the first hydrophobic part 211 of the straight pipe part. A suitable coating thickness can ensure both hydrophobic performance and not cause significant resistance to fluid flow.

[0041] Preferably, the thickness of the first hydrophobic part is between 5 and 20 microns, and the thickness of the second hydrophobic part is between 10 and 25 microns.

[0042] The hydrophobic coating is a low surface energy material with a micro-nano structure. The contact angle between the coolant and the hydrophobic coating is greater than 90 degrees. The hydrophobic coating has the function of increasing the flow velocity of the coolant. The present invention does not make special limitations on the hydrophobic coating, as long as it can be provided on the surface of the liquid-cooled cabinet and the contact angle between the coolant and the coating is greater than 90 degrees. And the larger the contact angle, the better the hydrophobic effect of the hydrophobic coating. The hydrophobic coating can be a compound of fluorine or silane. Preferably, the hydrophobic coating can be acrylate. After the acrylate material is formed into a plasma by plasma-enhanced chemical vapor deposition method, a chemical bond is formed with the surfaces of various components of the cabinet through the principle of chemical vapor deposition, and a hydrophobic coating is formed on the surface.

[0043] The present utility model does not specifically limit the areas where the hydrophobic coating is provided. In a liquid-cooled cabinet, there are some areas with relatively high coolant flow velocities. However, the structural design of these areas is complex. When the coolant with a relatively high flow velocity passes through these areas, due to the complexity of their structures, the flow of the coolant will be obstructed, causing the original flow direction to suddenly change, generating a rapidly changing flow domain. Due to inertia, flow separation occurs here for the coolant, and a large amount of coolant impacts the surface of the cabinet, resulting in a large loss of flow energy. This concentrated energy loss will further consume the mechanical energy generated by the cabinet to control the coolant. Moreover, the significant obstruction of the coolant flow generates strong disturbances, causing the flow velocity and flow rate of the coolant flowing into this area subsequently to decrease sharply. Only a small portion of the coolant flow will continue to flow along the surface of the original structure, unable to carry away more heat, leading to a significant decrease in the heat dissipation efficiency. The present utility model can, according to the hydrodynamic model of the above areas, specifically set hydrophobic coatings with corresponding thicknesses in multiple areas, change the shape, angle, cross-sectional area, etc. of the structures in the above areas, optimize the structures in the above areas, and make the structures in the above areas closer to streamline, thereby reducing the local resistance of the coolant passing through here, reducing the energy loss of the coolant, and the impact wear on the hydrophobic coating.

[0044] On the other hand, the surface of the cabinet impacted by a large amount of coolant is prone to wear, and the degree of wear is higher than that of other areas. In this application, relatively thicker hydrophobic coatings are provided in sections where the local flow velocity changes, sections where the local flow direction changes sharply, and sections where the local flow rate changes suddenly. For example, various structural areas such as pipes, liquid inlet and outlet ports, expanding or contracting variable-diameter pipes, elbows, tees (branch pipes), valves, and gates. Setting thicker hydrophobic coatings in the above areas can effectively reduce the wear accumulated by the continuous impact of the coolant on this area of the cabinet. The thicker hydrophobic coating can improve the anti-wear property of the hydrophobic coating against the impact of the coolant, slow down the wear thickness of the hydrophobic coating, and prevent the hydrophobic coating from failing due to wear. At the same time, such areas are non-direct heat exchange areas and have a lower temperature. Therefore, the thicker hydrophobic coating will not have a significant negative effect on the direct heat transfer in this area.

[0045] In some embodiments, such as Figure 2 and Figure 3As shown, multiple liquid inlets 131 are all circular holes, and the liquid inlets are spaced along the length direction of the distribution channel 13. The liquid inlets include a first liquid inlet 131a and a second liquid inlet 131b. The first liquid inlet 131a corresponds to the liquid inlet pipe 2, and the second liquid inlet 131b is distributed along the direction away from the liquid inlet pipe 2. The diameter of the first liquid inlet is smaller than that of the second liquid inlet. The first liquid inlet 131a closer to the liquid inlet pipe 2 may be affected by the flow rate of the liquid inlet pipe, resulting in a relatively large flow rate or flow velocity of the coolant passing through the first liquid inlet. While the second liquid inlet 131b farther from the liquid inlet pipe 2 may have a relatively smaller flow rate and velocity. To evenly distribute the fluid of the coolant entering the accommodation cavity from the liquid inlets, the diameter of the first liquid inlet is set to be smaller than that of the second liquid inlet, which can effectively evenly distribute the fluid of the coolant and make the coolant flow rate and temperature in the accommodation cavity more uniform. A second hydrophobic coating is provided on the inner wall of the liquid inlet 131. Preferably, the thickness of the second hydrophobic coating is between 5 microns and 25 microns. For the liquid inlet provided with the second hydrophobic coating, the coolant has a fast flow velocity when passing through the liquid inlet, and the liquid inlet

[0046] In some embodiments, as Figure 2 and Figure 3 shown, a third hydrophobic coating is provided on the inner wall 11 of the cabinet body 1 of the liquid-cooled cabinet. The inner wall 11 of the liquid-cooled cabinet forms an accommodation cavity. When the liquid-cooled cabinet is working, at least one electronic device 3 is arranged in the accommodation cavity and immersed in the coolant. Multiple electronic devices 3 can be stored in the liquid-cooled cabinet at the same time. When multiple electronic devices are running, a large amount of heat will be generated, which requires the coolant in the liquid-cooled cabinet to have a relatively fast flow velocity around the electronic devices for rapid heat exchange and timely heat dissipation. As the inner wall of the liquid-cooled cabinet, it is mainly made of metal material, which has a high thermal conductivity coefficient and can transfer the heat in the cabinet to the external environment for heat dissipation. However, the coolant is easily in contact with and wetted on the metal surface, causing a residual thin film-like liquid layer to form when the coolant flows through the inner wall. The residual thin film-like liquid layer expands and accumulates continuously with the flow of the coolant to form accumulated water, which is more unfavorable for rapid heat dissipation. The third hydrophobic coating of the present application is provided on the inner wall of the cabinet, covering the entire inner wall surface, avoiding the above-mentioned wetting and water accumulation phenomena, and accelerating the flow of the coolant.

[0047] Preferably, the thickness of the third hydrophobic coating is between 15 microns and 35 microns. As a non-direct heat exchange area, the inner wall 11 can be provided with a thicker hydrophobic coating without affecting heat dissipation. At the same time, the thicker coating helps to form a stable hydrophobic surface and will not be worn and consumed by the coolant.

[0048] In some embodiments, as Figure 2 and Figure 3As shown in the figure, the cabinet body 1 of the liquid-cooled cabinet further includes a flow equalizing plate 15 and a sensor. On one inner wall 11 of the cabinet body 1 of the liquid-cooled cabinet, a fixed card slot 14 is formed for fixing the flow equalizing plate 15. The flow equalizing plate 15 is provided with uniformly distributed flow guiding through holes. One side of the flow equalizing plate 15 is detachably arranged in the fixed card slot 14. A cooling cavity is formed between the flow equalizing plate 15 and the corresponding inner wall 11 through the fixed card slot 14, and a sensor is arranged in the cooling cavity.

[0049] A flow equalizing plate is installed on the inner wall on the side where the sensor is arranged. The flow guiding holes on the flow equalizing plate are used to evenly guide the coolant, so that the coolant in contact with the sensor forms a uniform and stable fluid field after passing through the flow equalizing plate, avoiding the influence of the liquid level or temperature fluctuation of the coolant on the sensor detection.

[0050] Preferably, a fourth hydrophobic coating is provided on the flow equalizing plate. The hydrophobic coating on the flow equalizing plate avoids the existence of a thin film-like liquid layer hindering the heat exchange of the coolant, and the hydrophobic coating makes the flow rate of the coolant passing through the flow equalizing plate faster. Preferably, the thickness of the fourth hydrophobic coating is between 5 microns and 30 microns.

[0051] As a new cooling method, liquid cooling technology has broad application prospects in the field of server cabinets. The present utility model does not make special limitations on the types of liquid-cooled cabinets, and only needs to satisfy that the coolant in the liquid-cooled cabinet is in direct contact with the inside of the cabinet. Immersion liquid cooling is to completely immerse the server in the coolant, and the heat of all heating elements is directly transferred to the coolant, and then heat dissipation is carried out through the circulating flow or evaporation and condensation phase change of the coolant. Among them, the way of circulating flow of the coolant is single-phase immersion liquid cooling, and the way of evaporation and condensation phase change of the coolant is phase change immersion liquid cooling. Spray liquid cooling is to directly spray the coolant on heating units such as chips and carry out heat dissipation through convective heat transfer. Preferably, the liquid-cooled cabinet of the present utility model includes any one of a single-phase immersion liquid-cooled cabinet, a phase change immersion liquid-cooled cabinet, and a spray liquid-cooled cabinet.

[0052] In some embodiments, the front view of an implementation manner of the liquid-cooled cabinet of the present utility model is as Figure 5 shown, and in some embodiments, the side view of an implementation manner of the liquid-cooled cabinet of the present utility model is as Figure 6 shown.

[0053] The present invention also does not make special restrictions on the coolant, and only needs to satisfy that the contact angle with the above-mentioned hydrophobic coating is greater than 90 degrees and an insulating material is used. Since the electronic components in the liquid-cooled cabinet are extremely easy to be damaged when encountering water, preferably, the immersion coolant adopts liquids that are not easy to conduct electricity such as fluorine-containing compounds (or fluorocarbons) and hydrocarbons (such as mineral oil, synthetic oil, natural oil) for immersion liquid cooling. Among them, a high-boiling-point (higher than the highest temperature of the system) cooling liquid must be used to ensure that the coolant is always in a liquid state during application.

[0054] When determining the material for the coolant, various fluorinated compounds and hydrocarbons should be considered, including: heat transfer performance (long-term stability and reliability, etc.), ease of IT hardware maintenance, fluid cleaning and replacement requirements, material compatibility with device materials, electrical performance, flammability or combustibility, environmental impact, safety-related issues, etc., and the total fluid (maintenance) cost over the life of a single immersion chamber or data center.

[0055] As a second aspect of the present invention, an electronic equipment system is disclosed, such as Figure 4 As shown, it includes an electronic device 3 and a liquid cooling cabinet. The electronic device 3 is arranged in a cabinet body 1 of the liquid cooling cabinet, and the liquid cooling cabinet is the liquid cooling cabinet mentioned above.

[0056] During the operation of the electronic equipment system, there are areas with relatively high local temperatures, such as electronic equipment in a working state in a liquid-cooled cabinet. The electronic components in the electronic equipment, the interfaces for current transmission, or other components that generate heat during operation will all emit relatively high heat, thereby increasing the temperature of the entire electronic equipment. Coolant is injected into the cabinet, submerging the cabinet, and the coolant will perform heat exchange with the heat-generating electronic equipment, taking away the heat generated by it, lowering the temperature of the electronic equipment working environment, and controlling it within a predetermined temperature range. Automatic frequency conversion adjustment can be performed according to system pressure, temperature, and flow rate to control the operating temperature. The above-mentioned liquid-cooled cabinet is used to perform liquid heat dissipation cooling on the electronic equipment. The cabinet provides coolant circulation, saves the air heat exchange link, and saves a lot of energy consumption of the refrigeration system. The liquid-cooled cabinet coated with a hydrophobic coating speeds up the flow of coolant and speeds up the heat exchange of the liquid-cooled cabinet coolant with the electronic equipment, thereby significantly improving the heat dissipation efficiency of the coolant in the cabinet with the electronic equipment.

[0057] As an alternative embodiment, the surface of the electronic device is provided with a fifth hydrophobic coating, and the fifth hydrophobic coating thickness is less than the thickness of other hydrophobic coatings provided in the liquid cooling cabinet. A thinner hydrophobic coating is provided in a region with a higher temperature, which is conducive to promoting the rapid transfer of heat from the component to the coating and being taken away by the coolant on the coating surface, thereby achieving a rapid cooling and heat dissipation effect. Preferably, the thickness of the fifth hydrophobic coating is between 5 microns and 10 microns. A thinner coating helps to transfer heat quickly while maintaining good hydrophobic properties.

[0058] As an optional implementation, a hydrophobic coating is provided on the surface of the heating unit in the electronic device. The above-mentioned heating unit often uses a housing encapsulated with an organic plastic insulating material and is tightly arranged on the circuit board. When the server is working, it operates as a logic unit and often generates a large amount of heat. These heats need to be dissipated as soon as possible to prevent the internal components from being damaged due to the continuous temperature rise of the heating unit. The coolant is the main medium for heat transfer, so it is necessary for the coolant to have good compatibility with the heating element. However, in some cases, some coolants may enter the interior of the heating unit, causing corrosion or biological contamination, resulting in server failures. The present utility model provides a hydrophobic coating on the surface of the heating unit, isolating the direct contact between the coolant and the heating unit, thus avoiding corrosion or contamination. In addition, when the coolant contacts the housing of these heating units, it often remains on the surface to form a thin film-like liquid layer, which is not conducive to heat transfer and the coolant taking away heat. Therefore, the hydrophobic coating provided by the present utility model can also play a role in preventing the generation of the thin film-like liquid layer.

[0059] The thickness of the hydrophobic coating provided on the surface of the heating element should not be too thick. An overly thick hydrophobic coating will affect the heat transfer from the heating element to the coolant. Preferably, the thickness of the hydrophobic coating is between 5 micrometers and 10 micrometers. A thinner hydrophobic coating helps to quickly transfer heat while maintaining good hydrophobic performance.

[0060] In the present utility model, in order to improve the bonding of the hydrophobic coating with the cabinet or the electronic device, before the hydrophobic coating is provided on the surface of the original liquid-cooled cabinet and the electronic device, the surface needs to be thoroughly cleaned by physical or chemical methods to remove grease, dust, and other contaminants that may affect the coating adhesion. Different pre-treatments are carried out on the surfaces of different materials to ensure the best adhesion of the coating. For metal surfaces, clean them with acetone or alcohol. For plastic or other non-metal surfaces, use a suitable material cleaner for surface activation treatment. It can be water, acetone, ethanol, or other commonly used cleaning solvents in the prior art to make the surface smoother, which is beneficial to improving the bonding force between the super-hydrophobic coating and the surface of the cabinet or the electronic device, and then improving the overall performance of the liquid-cooled cabinet. The cleaning method is to wipe or rinse the surface with the corresponding solvent.

[0061] After the surface of the original cabinet or electronic device is cleaned, further processing of the hydrophobic coating can be carried out on the cabinet or electronic device. Through plasma-enhanced chemical vapor deposition, the hydrophobic coating is evenly applied to the smooth surface. The main component of the coating is acrylate, and its purity is greater than 95%, ensuring that the coating has excellent superhydrophobic performance. The application method of the coating will affect its final microstructure and performance, and it may be necessary to select according to actual applications and performance requirements. For example, on the surface of some flat components, the above deposition method can be used to deposit a hydrophobic coating with a uniform thickness; for another example, on the surface of some corners or components with complex structures, the coating material can be evenly arranged on the surface of the cabinet or electronic device by manual brushing, rolling, spraying, or elastic coating. The uniformity of the coating has a great impact on the heat dissipation performance, and it is necessary to carefully control the application process to avoid the generation of bubbles and uneven thickness at the coating-bonding surface, which will cause the subsequent coolant to be unable to effectively transfer heat here, thereby reducing the heat dissipation efficiency.

[0062] After applying the hydrophobic coating, it needs to be cured and dried. This step can be naturally dried at room temperature or the curing process can be accelerated using an oven. The cured and dried hydrophobic coating is denser, binds better to the cabinet and electronic device, and has a better hydrophobic effect.

[0063] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Those skilled in the art should understand that the present utility model includes but is not limited to the content described in the drawings and the above specific implementation manner. Any modification that does not deviate from the functional and structural principles of the present utility model will be included in the scope of the claims.

Claims

1. A liquid-cooled cabinet, the liquid-cooled cabinet comprising a cabinet body (1) and a plurality of liquid inlet pipes (2), the cabinet body having a receiving cavity (12), the liquid inlet pipes penetrating through the inner wall (11) of the cabinet body in the thickness direction, a distribution channel (13) being formed on the inner wall of the cabinet body, one end of the liquid inlet pipe (2) being inserted into the distribution channel (13), and a plurality of liquid inlets (131) communicating with the distribution channel (13) being further formed on the inner wall of the cabinet body (1), the distribution channel communicating with the receiving cavity through the liquid inlets, characterized in that, A first hydrophobic coating is provided on the inner surface of at least one of the liquid inlet pipes (2). The liquid inlet pipe (2) provided with the first hydrophobic coating includes a straight pipe portion (21) and a bent pipe portion (22). The straight pipe portion (21) communicates with the bent pipe portion (22). The first hydrophobic coating includes a first hydrophobic portion (211) provided on the inner surface of the straight pipe portion (21) and a second hydrophobic portion (221) provided on the inner surface of the bent pipe portion (22). The thickness of the first hydrophobic portion (211) is less than the thickness of the second hydrophobic portion (221).

2. The liquid-cooled cabinet according to claim 1, wherein, The thickness of the second hydrophobic portion (221) is 5 to 20 microns greater than the thickness of the first hydrophobic portion (211).

3. The liquid-cooled cabinet according to claim 2, wherein The thickness of the first hydrophobic portion (211) is between 5 and 20 microns, and the thickness of the second hydrophobic portion (221) is between 10 and 25 microns.

4. The liquid-cooled cabinet according to claim 1, wherein A second hydrophobic coating is provided on the inner wall of the liquid inlet (131).

5. The liquid-cooled cabinet according to claim 4, wherein The plurality of liquid inlets (131) are all circular holes. The liquid inlets (131) are spaced apart along the length direction of the distribution channel (13). The liquid inlet (131) includes a first liquid inlet and a second liquid inlet. The first liquid inlet corresponds to the liquid inlet pipe (2). The second liquid inlet is distributed in a direction away from the liquid inlet pipe (2). The diameter of the first liquid inlet is smaller than the diameter of the second liquid inlet. The thickness of the second hydrophobic coating is between 5 and 25 microns.

6. The liquid-cooled cabinet according to claim 1, characterized in that A third hydrophobic coating is provided on the inner wall (11) of the cabinet (1).

7. The liquid-cooled cabinet according to claim 6, wherein The thickness of the third hydrophobic coating is between 15 and 35 microns.

8. The liquid-cooled cabinet according to any one of claims 1 to 7, characterized in that The liquid-cooled cabinet further includes a flow equalizing plate and a sensor. A fixed card slot is formed on one inner wall of the cabinet. The flow equalizing plate is provided with uniformly distributed flow guiding through holes. One side of the flow equalizing plate is detachably arranged in the fixed card slot. A cooling cavity is formed between the flow equalizing plate and the corresponding inner wall through the fixed card slot. The sensor is arranged in the cooling cavity. A fourth hydrophobic coating is provided on the flow equalizing plate.

9. An electronic device system includes an electronic device and a liquid-cooled cabinet, and the electronic device is disposed in the liquid-cooled cabinet, characterized in that, The liquid-cooled cabinet is the liquid-cooled cabinet according to any one of claims 1 to 8.

10. The electronic device system according to claim 9, characterized in that, A fifth hydrophobic coating is provided on the surface of the electronic device.

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