Crystal grain transfer equipment

Abstract

The utility model discloses crystal grain transfer equipment, which is suitable for transferring a plurality of crystal grains on at least one first carrier plate to at least one second carrier plate in turn, and comprises a machine table, a first carrier table, a second carrier table, a third carrier table and a laser module, the machine table comprises a rail and a frame body located above the rail. The track comprises a machining area, a first area and a second area, the first carrying table is connected with the frame body and is suitable for loading or unloading the first carrying plate. The second carrying table and the third carrying table are respectively connected with the track and are suitable for loading or unloading the first carrying plate and the second carrying plate, and the second carrying table is suitable for moving between the first area and the machining area. The third stage is adapted to move between the second region and the processing region. When one of the second carrying table and the third carrying table leaves from the processing area, the other one of the second carrying table and the third carrying table is suitable for moving into the processing area. The laser module is suitable for providing a processing light beam to a first carrying plate on the first carrying table.

Description

Technical Field

[0001] The utility model relates to a grain processing device, in particular to a grain transfer device. Background Art

[0002] A micro light-emitting diode display (Micro LED Display) is a display that uses micro light-emitting diodes as light sources. A micro light-emitting diode is a product that thins, miniaturizes, and arrays a light-emitting diode (Light-Emitting Diode, LED), and reduces the size of the light-emitting diode to the micron level.

[0003] The manufacturing process of a micro light-emitting diode display includes forming an epitaxial layer including a plurality of micro dies on a wafer substrate, and then performing mass transfer to transfer the micro dies to a driving substrate. Since even among light-emitting diodes that appear to have the same color emission to the naked eye, in fact, light-emitting diodes produced on different substrates still have minute and difficult-to-directly-identify, but actually different color emission differences. Such individual differences may be observed by the human eye as the number of light-emitting diodes on the product increases. In this regard, in order to manufacture products with better color emission, the industry groups different light-emitting diodes by parameters such as lumens, voltage, and color (this concept is called sorting, or Bin), and achieves color emission consistency by logically allocating light-emitting diodes with complementary color emission characteristics by position during mass transfer (this concept is also called Bin mixing).

[0004] Moreover, the current technologies used for mass transfer include pick-and-place technology (Pick&Place), fluid transfer, and laser transfer. Among them, laser transfer technology has the potential for development because it has a higher transfer speed compared to pick-and-place technology, and has higher transfer accuracy and is relatively easy to repair compared to fluid transfer. Summary of the Utility Model

[0005] The utility model provides a grain transfer device to improve the grain transfer efficiency of Bin mixing.

[0006] To achieve the above advantages, an embodiment of the present utility model provides a die transfer device, which is adapted to transfer multiple dies on a plurality of first carriers to at least one second carrier in turn. The die transfer device includes: a machine platform, a first carrier stage, a second carrier stage, a third carrier stage, and a laser module. The machine platform includes a track and a frame located above the track. The track has a processing area below the frame and a first area and a second area on both sides of the processing area. The first carrier stage is connected to the frame and is adapted to load or unload the first carrier. The second carrier stage and the third carrier stage are each connected to the track and are adapted to load or unload the first carrier and are also adapted to load or unload the second carrier. The second carrier stage is adapted to move between the first area of the track and the processing area. The third carrier stage is adapted to move between the second area of the track and the processing area, and when one of the second carrier stage and the third carrier stage leaves the processing area, the other of the second carrier stage and the third carrier stage is adapted to move into the processing area. The laser module is adapted to provide a processing beam to the first carrier on the first carrier stage.

[0007] In an embodiment of the present utility model, the machine platform further includes a base and a moving platform. The moving platform is connected to the base and is adapted to move relative to the base along a first direction parallel to the track. The frame is connected to the moving platform and is adapted to move along the first direction with the moving platform. The track is fixed on the moving platform. The second carrier stage and the third carrier stage are directly connected to the track and are adapted to move independently relative to the moving platform.

[0008] In an embodiment of the present utility model, the second carrier stage and the third carrier stage include a base and a carrier seat. The base is adapted to drive the carrier seat to move along a first direction. The carrier seat is adapted to connect the first carrier or the second carrier and drive the first carrier or the second carrier to move relative to the base along a second direction perpendicular to the first direction, and is also adapted to drive the second carrier to rotate with the second direction as the axis direction.

[0009] In an embodiment of the present utility model, the machine platform further includes a base and a moving platform. The moving platform is connected to the base through a track. The frame is connected to the base and is adapted to move along a first direction on the base. The second carrier stage and the third carrier stage are fixed at both ends of the moving platform.

[0010] In an embodiment of the present utility model, the second carrier stage and the third carrier stage include a base and a carrier seat. The base is fixed on the moving platform. The carrier seat is adapted to connect the first carrier or one of the second carriers and drive the first carrier or one of the second carriers to move relative to the base along a second direction perpendicular to the first direction, and is also adapted to drive the second carrier to rotate with the second direction as the axis direction.

[0011] In an embodiment of the present utility model, the second carrier stage and the third carrier stage include a base and a carrier seat. The base is adapted to drive the carrier seat to move along a first direction. The carrier seat is adapted to connect to the first carrier plate or the second carrier plate, and drive the first carrier plate or the second carrier plate to move relative to the base along a second direction perpendicular to the first direction, and is further adapted to drive the second carrier plate to rotate with the second direction as the axis direction.

[0012] In an embodiment of the present utility model, along the optical path of the processing light beam, the laser module includes: a laser light source, a beam shaping element, a reticle, a mirror assembly, and a projection lens. The laser light source is adapted to provide a laser beam. The beam shaping element is adapted to adjust the laser beam into a processing light beam with a flat-top energy distribution. The reticle is adapted to change the spot shape of the processing light beam. The mirror assembly is adapted to reflect the processing light beam. The projection lens is adapted to focus the processing light beam on the first carrier plate, and is further adapted to drive the processing light beam to move in a second direction perpendicular to the first direction.

[0013] In an embodiment of the present utility model, the die transfer device further includes a first loading and unloading device and a second loading and unloading device. The first area has a first loading and unloading position, and the second area has a second loading and unloading position. The first loading and unloading device is adapted to load and unload the first carrier plate or the second carrier plate of the second carrier stage positioned at the first loading and unloading position. The second loading and unloading device is adapted to load and unload the first carrier plate or the second carrier plate of the third carrier stage positioned at the second loading and unloading position.

[0014] In an embodiment of the present utility model, the die transfer device further includes: a first imaging unit and a second imaging unit. The first imaging unit is adapted to image the first carrier plate or the second carrier plate on the second carrier stage positioned at the first loading and unloading position. The second imaging unit is adapted to image the first carrier plate or the second carrier plate on the third carrier stage positioned at the second loading and unloading position.

[0015] In an embodiment of the present utility model, the die transfer device further includes an imaging unit, which is adapted to image the first carrier plate on the first carrier stage.

[0016] In an embodiment of the present utility model, the die transfer device further includes an imaging unit adapted to image the first carrier plate or one of the second carrier plates on the second carrier stage or the third carrier stage in the processing area.

[0017] In an embodiment of the present utility model, the machine table further includes a support beam, a support assembly, and a flexible connection assembly. The support beam is movably arranged on the support assembly, and the support beam is indirectly connected to the support assembly through the flexible connection assembly. The laser module is arranged on the support beam and moves along the first direction or the second direction with the support beam.

[0018] In an embodiment of the present utility model, the machine platform further includes a driving motor assembly, which is directly connected to the support beam and directly connected to the support assembly.

[0019] Through the above description, the die transfer device of the embodiment of the present utility model can load and unload the carrier plates to be die transferred on another carrier platform (the third carrier platform) and make preparations in other areas (such as the second area) while performing die transfer operations on one of the carrier platforms (such as the second carrier platform) in the processing area of the machine platform, because it has the second carrier platform and the third carrier platform that can carry the first carrier plate or the second carrier plate. In this way, after completing one die transfer operation, the next die transfer operation can be quickly carried out to improve efficiency. In addition to preparing the carrier plates to be die transferred, it can also prepare the carrier plates to provide dies.

[0020] The above description is only an overview of the technical solution of the present utility model. In order to understand the technical means of the present utility model more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features and advantages of the present utility model more obvious and understandable, the following specific preferred embodiments are given and described in detail in conjunction with the accompanying drawings. Description of the Drawings

[0021] Figure 1 A three-dimensional schematic diagram of the machine platform of the die transfer device according to an embodiment of the present utility model;

[0022] Figure 2 For Figure 1 A schematic diagram of the relationship between the laser module and the machine platform of the die transfer device;

[0023] Figure 3 For Figure 1 A schematic diagram of the installation position of the camera unit of the machine platform;

[0024] Figure 4 For Figure 1 A simplified schematic diagram of the machine platform in

[0025] Figure 5 For Figure 1 In the embodiment, a schematic diagram of the process of the machine platform installing the first carrier plate;

[0026] Figures 6A to 6E For Figure 5 A schematic diagram of the actions of the machine platform in the process;

[0027] Figure 7 For Figure 1 In the embodiment, a schematic diagram of the process of the machine platform exchanging the first carrier plate to prepare for die transfer;

[0028] Figure 8 For Figure 1In the embodiment, a schematic flow chart of the machine platform installing the second carrier plate to prepare for die transfer;

[0029] Figures 9A to 9D For Figure 1 In the embodiment, a schematic diagram of the actions of the machine platform during die transfer Figure 10 For Figure 1 In the embodiment, a schematic flow chart of the machine platform exchanging the second carrier plate;

[0030] Figures 11A to 11D For Figure 10 A schematic diagram of the actions of the machine platform in the process;

[0031] Figure 12 This is a simplified schematic diagram of the machine platform of the die transfer device according to another embodiment of the present invention. Detailed implementation manners

[0032] In the following text, for the terms used in the description of the embodiments according to the present invention, such as: "upper", "lower", etc., which indicate the orientation or positional relationship, the description is based on the orientation or positional relationship shown in the used drawings. The above terms are only for the convenience of describing the present invention and do not limit the present invention, that is, they do not indicate or imply that the mentioned elements must have a specific orientation or be constructed in a specific orientation. In addition, the terms "first", "second", etc. mentioned in this specification or the scope of the patent application are only used to name the elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limits of the number of elements.

[0033] Figure 1 This is a three-dimensional schematic diagram of the machine platform of the die transfer device according to an embodiment of the present invention. Figure 2 For Figure 1 A schematic diagram of the relationship between the laser module of the die transfer device and the machine platform. Figure 3 For Figure 1 A schematic diagram of the installation position of the photography unit of the machine platform. Figure 4 For Figure 1 A simplified schematic diagram of the machine platform in

[0034] Please refer to Figures 1 to 4 As shown, in the die transfer device 1 in this embodiment, it is adapted to transfer multiple dies P on the first carrier plate F1 to at least one second carrier plate F2 in turn. The types of transfer operations are not limited. It can be a transfer operation in which the relative positions of the dies P do not change (such as an operation to flip the die P), or a transfer operation in which the relative positions of the dies P change (such as a Bin Mixing operation), or it can be used for transfer during die repair operations, which can be changed according to requirements. The die transfer device 1 includes: a machine platform 10, a first carrier 2 (see Figure 4) The second stage 3, the third stage 4, and the laser module 5 (for ease of explanation, the projection lens 55 of the laser module 5 is used to indicate its installation position. And the die P is drawn in Figure 6A ). The machine platform 10 includes a track 11 and a frame 103 located above the track 11. The track 11 has a processing area S located below the frame 103 and a first area A1 and a second area A2 located on both sides of the processing area S. The first stage 2 is connected to the frame 103, and the first stage 2 is adapted to load or unload the first carrier plate F1; the second stage 3 and the third stage 4 are each connected to the track 11, adapted to load or unload the first carrier plate F1 and are also adapted to load or unload the second carrier plate F2. The second stage 3 is adapted to move between the first area A1 of the track 11 and the processing area S, and the third stage 4 is adapted to move between the second area A2 of the track 11 and the processing area S. And when one of the second stage 3 and the third stage 4 leaves the processing area S, the other of the second stage 3 and the third stage 4 is adapted to move into the processing area S. The laser module 5 is adapted to provide a processing beam L to the first carrier plate F1 on the first stage 2.

[0035] As Figure 1 shown, in this embodiment, the die transfer device 1 is, for example, an electrical connection control unit (not shown in the figure), and each element in the die transfer device 1 is driven by the control unit to act. The machine platform 10 further includes, for example, a base 101 and a moving platform 102. The moving platform 102 is, for example, a substantially rectangular platform, and is movably disposed on the base 101 through a slide rail 101a provided on the base 101. The track 11 is fixed on the moving platform 102, and the extending direction of the track 11 is, for example, the same as the long axis direction of the moving platform 102. The second stage 3 and the third stage 4 are, for example, directly connected to the track 11 and are adapted to move independently relative to the moving platform 102 in a first direction D1 in the extending direction of the track 11. In other words, in this embodiment, the second stage 3 and the third stage 4 can move relative to the base 101 in the first direction D1 along with the movement of the moving platform 102, and can also move independently of the moving platform 102 and move relative to the base 101 in the first direction D1. The extending direction of the slide rail 101a is, for example, the same as the first direction D1, but is not limited thereto.

[0036] In this embodiment, the frame 103 is, for example, fixed at the center of the moving platform 102. Among them, in other embodiments, the frame 103 can be a component that can move along with the moving platform 102. Therefore, the aforementioned processing area S located below the frame 103 can refer to the sum of the areas located below the frame 103 within the movable range of the frame 103, but is not limited thereto. In addition, to clarify the relative position relationship between the frame 103 and the moving platform 102, in Figure 4In [the figure], a base of the frame 103 is schematically shown below the mobile platform 102, which is connected to the frame 103 by a line.

[0037] As Figure 1 and Figure 4 shown, in this embodiment, the first carrier 2 can also, for example, move in a third direction D3 perpendicular to the first direction D1 and the second direction D2 (the second direction D2 is perpendicular to the first direction D1 and lies on the same horizontal plane) relative to the frame 103. (The third direction D3 is Figure 4 in [the figure] the direction perpendicular to the plane of the mobile platform 102), so that the first carrier plate F1 carried on the first carrier 2 can move along the third direction D3, but this is not limiting.

[0038] As Figure 1 shown, in this embodiment, the machine 10 further includes, for example, a support frame 104 movably connected to the base 101 along the first direction D1 and the second direction D2. The support frame 104 is adapted to support the laser module 5 on the base 101 above the mobile platform 102. Although there is no special limitation on whether the support frame 104 itself is movable, in this embodiment, the laser module 5 can move relative to the mobile platform 102 along the first direction D1 and the second direction D2 with the movement of the support frame 104 and change the irradiation position of the processing beam L, but the movement mode of the laser module 5 is not limited to this.

[0039] Support components 1041 located on both sides of the mobile platform 102 and a support beam 1042 spanning the tops of the two support components 104. The specific shape of the support component 1041 is, for example, two plate bodies extending along the first direction D1 and opposite to each other, and the mobile platform 102 is located between these two plate bodies, but the specific shape is not limited to this. The laser module 5 is mounted on the support beam 1042. Among them, the support frame 104 is provided with guide rails 1043 extending along the first direction D1 at the tops of the support components 1041 (the tops of the two plate bodies), and the support beam 1042 is connected to the support components 1041 through these guide rails 1043.

[0040] To enable the support beam 1042 to move on the guide rail 1043, in this embodiment, the support frame 104 has, for example, two positioning rails 1044 and a drive motor assembly 1045. The two positioning rails 1044 are respectively arranged beside each guide rail 1043, for example, between the two plate bodies of the support component 1041. These positioning rails 1044 are, for example, opposite to each other and each extend along the first direction D1. The drive motor assembly 1045 includes, for example, two drive motors. The drive motor assembly 1045 is connected to the support beam 1042 and these drive motors (see Figure 1The markings of the middle drive motor assembly 1045) are respectively arranged at both ends of the support beam 1042 and are directly connected to the positioning rails 1044 respectively. With this structure, when the drive motor assembly 1045 actuates, the support beam 1042 will be jointly pulled by the two drive motors and the two positioning rails 1044 and move on the two guide rails 1043, driving the laser module 5 on the support beam 1042 to move. It should be noted that the loads exerted by the support beam 1042 and the laser module 5 on the support assembly 1041 are mainly supported by the guide rails 1043. The positioning rails 1044 mainly only assist in positioning the position of the support beam 1042 on the guide rails 1043. Therefore, the specific shape and type of the positioning rails 1044 are not limited. For example, they can be known components such as positioning grooves or racks.

[0041] Please refer to Figure 1 As shown, in this embodiment, the support beam 1042 includes, for example, a first beam member 1042a and two second beam members 1042b. The flexible connection assembly 1046 includes, for example, two flexible connectors (see Figure 1 the symbol of the flexible connection assembly 1046 in). The two second beam members 1042b are directly connected to the two guide rails 1043 respectively. The first beam member 1042a is connected between the two second beam members 1042b through the two flexible connectors, and the laser module 5 is mounted on the first beam member 1042a. The aforementioned drive motor assembly 1045 is directly connected to the first beam member 1042a and is not directly connected to the second beam members 1042b. In other words, the first beam member 1042a is connected to the support assembly 1041 through two combinations: the combination of the drive motor assembly 1045 and the positioning rails 1044, and the combination of the flexible connection assembly 1046, the second beam members 1042b, and the guide rails 1043.

[0042] The specific structure of the flexible connection assembly 1046 is not limited as long as it is a component that preferentially deforms when the support beam 1042 is deformed by an external force. Specifically, the flexible connection assembly 1046 can be a component constructed by elements such as metal plates, metal blocks, or springs, but is not limited thereto.

[0043] With this structure, since the laser module 5 is mainly indirectly connected to the guide rail 1043 through two flexible connection components 1046, and the position of the laser module 5 is indirectly moved on the guide rail 1043 by the drive of the drive motor assembly 1045. Therefore, when the laser module 5 generates a position deviation caused by the machining accuracy or installation accuracy of components such as the guide rail 1043 during the movement to a specific local position, the displacement can be corrected by the two drive motors of the drive motor assembly 1045, and the deformation of the two flexible connectors of the flexible connection component 1046 can be used to correct the precise position of the laser module 5 at that place. Specifically, according to the direction of the correction values of the two drive motors, for example, when the two drive motors correct in the same direction, the laser module 5 can perform displacement correction; when the two motors correct in different directions, the laser module 5 can perform rotation correction.

[0044] It should be understood that the specific shape of the support frame 104 or the form and quantity of each component above can be set according to requirements. The above description of how to perform correction in the first direction D1 is only an example. In actual use, similar component groups can be set according to requirements to perform correction in other directions, such as the second direction D2. Please refer to Figure 2 As shown, in this embodiment, on the optical path of the processing beam L, the laser module 5 includes, for example, a laser light source 51, a beam shaping element 52, a mask 53, a mirror assembly 54, and a projection lens 55. And on one side of the mask 53, a photographing device 56 facing the mask 53 may also be provided, but not limited thereto. The laser light source 51 is adapted to provide a laser beam. In this embodiment, the laser beam provided by the laser light source 51 is, for example, a Gaussian beam, but not limited thereto. The beam shaping element 52 is, for example, adapted to shape the laser beam into a flat-top laser with a flat-top energy distribution, but the type of the processing beam L is not limited thereto. The mask 53 is, for example, adapted to change the spot shape of the processing beam L. In this embodiment, for example, the mask 53 is replaced by a robotic arm (not shown in the figure) cooperating with a housing device (not shown in the figure) housing different types of masks 53, but not limited thereto. The mirror assembly 54 is adapted to reflect the processing beam L so that the processing beam L can be directed towards the projection lens 55 along an appropriate optical path. The photographing device 56 is adapted to position the mask 53 through imaging.

[0045] In this embodiment, the projection lens 55 is, for example, a component adapted to focus the processing beam L and project it toward the first carrier F1, and is also, for example, a component adapted to move along the first direction D1 and the second direction D2 as the support frame 104 moves, but is not limited thereto. The projection lens 55 includes, for example, a mirror (not shown in the figure) and a focusing lens (not shown in the figure). The mirror and the focusing lens are, for example, elements assembled together and capable of moving together in the second direction D2 and the third direction D3, but are not limited thereto. Thereby, the focal position of the processing beam L in the third direction D3 can be changed by the movement of the projection lens 55 in the third direction D3. From the above description, it can be seen that in this embodiment, the processing beam L irradiated on the first carrier F1 is irradiated on different positions of the first carrier F1 by the movement of the support frame 104 driving the laser module 5 and the projection lens 55 in the first direction D1 and the second direction D2. In addition, the mechanism for relatively moving the processing beam L and the first carrier F1 is not limited to this manner. For example, in an embodiment, the laser module 5 may include a galvanometer scanning module adapted to drive the processing beam L to move in the first direction D1 and the second direction D2.

[0046] As Figure 1 and Figure 4 shown, in this embodiment, the first stage 2 includes, for example, a carrier base 202, and the carrier base 202 is, for example, adapted to drive the first carrier F1 to rotate with the third direction D3 as the axis direction. The second stage 3 includes, for example, a base 301 and a carrier base 302. The base 301 is adapted to drive the carrier base 302 to move along the first direction D1, and the carrier base 302 is adapted to connect the first carrier F1 or the second carrier F2, including a first component 302a and a second component 302b. The first component 302a is connected to the base 301 and is adapted to drive the first carrier F1 or the second carrier F2 to move relative to the base 301 along the second direction D2 perpendicular to the first direction D1. The second component 302b is connected to the first component 302a and is adapted to drive the second carrier F2 to rotate with the third direction D3 as the axis direction, but the detailed driving manner is not limited thereto and can be changed according to requirements. The third stage 4 includes, for example, a corresponding base 401, a carrier base 402, a first component 402a, and a second component 402b corresponding to the structure of the second stage 3, and the functions can be referred to the description of the foregoing second stage 3 and will not be elaborated.

[0047] As Figure 1 and Figure 3As shown, in this embodiment, the second carrier 3 is, for example, provided with a second through hole 31 that penetrates the base 301 and the carrier 302 along the third direction D3. The third carrier 4 is, for example, provided with a third through hole 41 that penetrates its base 401 and the carrier 402 along the third direction D3. The first carrier 2 is also, for example, provided with a first through hole 21 that penetrates the components of the first carrier 2 along the third direction D3. A through hole 1031 corresponding to the first through hole 21 is also provided on the frame 103. The above first through hole 21, second through hole 31, and third through hole 41 are adapted to be used in conjunction with the later-described photographing units 8a, 8b, 8c, and 8d. Therefore, the settings are not limited thereto. Among them, the first carrier 2, the second carrier 3, and the third carrier 4 can carry the first carrier plate F1 and the second carrier plate F2, for example, by existing tapes, adsorption modules, or by existing methods such as setting a fixture module in the above first through hole 21, second through hole 31, and third through hole 41. However, the present invention is not limited thereto.

[0048] As Figure 1 and Figure 4 shown, in this embodiment, the die transfer device 1 includes, for example, a first loading and unloading device 6a and a second loading and unloading device 6b disposed beside the machine 10, and a first storage box 7a, a second storage box 7b, a third storage box 7c, and a fourth storage box 7d disposed in accordance with the positions of the first loading and unloading device 6a and the second loading and unloading device 6b. The first loading and unloading device 6a and the second loading and unloading device 6b are, for example, robotic arms in this embodiment, but are not limited thereto. Among them, the first area A1 has a first loading and unloading position L1, and the second area A2 has a second loading and unloading position L2. The first loading and unloading device 6a is adapted to load and unload the first carrier plate F1 or the second carrier plate F2 on the second carrier 3 positioned at the first loading and unloading position L1. The second loading and unloading device 6b is adapted to load and unload the first carrier plate F1 or the second carrier plate F2 on the third carrier 4 positioned at the second loading and unloading position L2. And in this embodiment, the first loading and unloading position L1 can, for example, be used as the standby position when the second carrier 3 is on standby, and the second loading and unloading position L2 can, for example, be used as the standby position when the third carrier 4 is on standby, but is not limited thereto.

[0049] In this embodiment, the first storage box 7a and the second storage box 7b are disposed corresponding to the setting position of the first loading and unloading device 6a, while the third storage box 7c and the fourth storage box 7d are disposed corresponding to the setting position of the second loading and unloading device 6b, but are not limited thereto. The first storage box 7a is adapted to be used as a storage box for providing the first carrier plate F1. The second storage box 7b and the third storage box 7c are adapted to be used as storage boxes for providing the second carrier plate F2. The fourth storage box 7d is adapted to be used as a storage box for storing the used first carrier plate F1. However, the types and functions of the storage boxes 7a, 7b, 7c, and 7d are not limited thereto. Existing known storage boxes can be used, or they can be set according to actual needs.

[0050] As Figure 3 and Figure 4 shown, in this embodiment, the crystal grain transfer device 1 further includes: a first photographing unit 8a, a second photographing unit 8b, a third photographing unit 8c, and a fourth photographing unit 8d ( Figure 3 the fourth photographing unit 8d is omitted in Figure 4 ). The first photographing unit 8a, the second photographing unit 8b, the third photographing unit 8c, and the fourth photographing unit 8d are, for example, mounted on the machine table 10 ( Figure 4 in order to facilitate representation, the positions of the respective photographing units 8a, 8b, 8c, 8d are moved).

[0051] The first photographing unit 8a is, for example, adapted to photograph the first carrier plate F1 or the second carrier plate F2 on the second carrier stage 3 at the first loading / unloading position L1. The second photographing unit 8b is, for example, adapted to photograph the first carrier plate F1 or the second carrier plate F2 on the third carrier stage 4 at the second loading / unloading position L2. The third photographing unit 8c is, for example, adapted to photograph the first carrier plate F1 on the first carrier stage 2, and the fourth photographing unit 8d is, for example, adapted to photograph the first carrier plate F1 or the second carrier plate F2 on the second carrier stage 3 or the third carrier stage 4 in the processing area S.

[0052] The control unit, for example, controls the operations of the respective carrier stages 2, 3, 4 by means of vision and memory based on the image data transmitted back by the above-mentioned respective photographing units 8a, 8b, 8c, 8d, so as to determine whether the positions and angles of the first carrier plate F1 and the second carrier plate F2 meet the processing requirements, and to determine the acting position of the processing beam L.

[0053] As Figure 3 shown, in terms of the detailed installation method of each photographing unit, for example, first grooves (not shown in the figure) and second grooves (not shown in the figure) with openings facing upward can be respectively formed on the moving platform 102 corresponding to the first loading / unloading position L1 and the second loading / unloading position L2, and the first photographing unit 8a and the second photographing unit 8b are respectively arranged in the corresponding grooves, so that the first photographing unit 8a and the second photographing unit 8b can photograph upward from below toward the corresponding through-holes (the second through-hole 31, the third through-hole 41). In this embodiment, the first photographing unit 8a and the second photographing unit 8b can, for example, move in the first direction D1 along with the moving platform 102, but this is not limited thereto. The third photographing unit 8c is, for example, arranged on the support frame 104 and faces the first carrier stage 2 for photographing (see Figure 4) The fourth imaging unit 8d is, for example, disposed on the mounting base 101 and captures images upward (toward the first stage 2) through the through slot 1021 formed in the moving platform 102 corresponding to the processing area S. However, the detailed arrangement of each imaging unit is not limited to this and can be set according to requirements. For example, in another embodiment of this case, the first imaging unit 8a and the second imaging unit 8b can be arranged above the second stage 3 or the third stage 4. In this case, even if the second through opening 31 and the third through opening 41 are not provided on the second stage 3 and the third stage 4, the first imaging unit 8a and the second imaging unit 8b can still perform their functions.

[0054] The following will describe each process and action of the machine 10 in the die transfer operation. Figure 5 For Figure 1 In the embodiment, a schematic diagram of the process of the machine mounting the first carrier plate. Figures 6A to 6E For Figure 5 A schematic diagram of the action of the machine in the process. Figure 7 For Figure 1 In the embodiment, a schematic diagram of the process of the machine exchanging the first carrier plate to prepare for die transfer. Figure 8 For Figure 1 In the embodiment, a schematic diagram of the process of the machine mounting the second carrier plate to prepare for die transfer. Figures 9A to 9D For Figure 1 In the embodiment, a schematic diagram of the action of the machine during die transfer. Figure 10 For Figure 1 In the embodiment, a schematic diagram of the process of the machine exchanging the second carrier plate.

[0055] Figures 11A to 11D For Figure 10 A schematic diagram of the action of the machine in the process. Additionally, in Figures 9A to 9D The die transfer operation shown is a transfer operation that changes the relative positions of the dies P with respect to each other. After the transfer, the relative positions of the different dies originally on the first carrier plate F1 with respect to each other will be different from the relative positions of the different dies on the second carrier plate F2a with respect to each other, but the type of transfer operation is not limited to this.

[0056] As Figure 1 , Figure 5 and even Figures 6A to 6E shown, before actually performing the die P transfer operation, first, the first carrier plate F1, which is the carrier plate of the dies P to be transferred, needs to be mounted on the first stage 2 (or referred to as the wafer loading process P1). In this embodiment, for example, the robotic arm, which serves as the first loading and unloading device 6a, first takes out the first carrier plate F1 from the first storage box 7a. Then, the first carrier plate F1 is placed on the second stage 3 located at the first loading and unloading position L1 ( Figure 6A)。Next, the image transmitted after the first carrier plate F1 is photographed by the first photographing unit 8a is used to perform position correction and angle rotation correction (hereinafter referred to as angle alignment) on the first carrier plate F1 on the second stage 3 through the movement and rotation alignment of the base 301 and the carrier 302 relative to the moving platform 102. In this embodiment, in order to make the crystal grains P on the first carrier plate F1 face downward when carried on the first stage 2, when carrying the first carrier plate F1, an auxiliary member F10 may be provided on the second stage 3, for example, but not limited thereto.

[0057] As Figure 6B shown, after that, the second stage 3 drives the first carrier plate F1 into the processing area S and positions it directly below the first stage 2. Then, as Figures 6C to 6D shown, the first stage 2 moves along the third direction D3 towards the second stage 3 and picks up the first carrier plate F1 on the second stage 3, and then drives the first carrier plate F1 away from the second stage 3 along the third direction D3 to reach a predetermined height (the first stage 2 returns to its original position). Next, the third photographing unit 8c photographs the first carrier plate F1 carried by the first stage 2 from top to bottom, and the transmitted image is used to perform position correction and angle alignment on the first carrier plate F1 through the frame 103 and the first stage 2, and the projection lens 55 of the laser module 5 is moved to the desired position along the second direction D2 (due to the angle relationship, Figures 6A to 6E the movement of the projection lens 55 in the second direction D2 is not shown), thereby positioning the positions and angles of the crystal grains P on the first carrier plate F1 and positioning the relative position relationship between the processing beam L and the crystal grains P on the first carrier plate F1. The detailed steps of when and how each of the photographing units 8a, 8b, 8c, 8d photographs the first carrier plate F1 and performs position memory and correction are not limited to the above order. After that, the first stage 2 returns to its original position and completes the loading of the first carrier plate F1 (completes the loading process P1) so as to be able to execute the crystal grain P transfer operation according to the instructions of the control unit in the subsequent steps.

[0058] As Figure 6E shown, when the first carrier plate F1 is separated from the second stage 3, the second stage 3 leaves the processing area S and returns to the first loading and unloading position L1. The auxiliary member F10 originally retained on the second stage 3 is removed by the first loading and unloading device 6a, for example, so as to load and unload the second carrier plate F2 in the subsequent steps, but not limited thereto. In addition, the movement of the second stage 3, the removal action of the auxiliary member F10, etc. can be carried out simultaneously with the position correction and angle alignment of the first carrier plate F1 described above, but not limited thereto.

[0059] Please refer to Figure 1 、 Figure 6E and Figure 7As shown. The chips P on the first carrier F1 do not necessarily need to be all transferred to the same second carrier F2 (details will be described later). When the chips P on the first carrier F1 are used up after, for example, multiple transfer operations, it is necessary to remove the used first carrier F1 on the first stage 2 and install a new first carrier F1. (Hereinafter referred to as the first exchange process P2. Since multiple first carriers F1 will be mentioned in the following description, the first carriers F1a and F1b are used for name distinction, but neither of them is drawn in the figure), as Figure 7 shown. In this process, the method of placing the new first carrier F1b on the first stage 2 is substantially the same as that in the Figure 5 process described above. The main difference is that before the second stage 3 receives the new first carrier F1b and enters the processing area S, the third stage 4 will first enter the processing area S and move directly below the first stage 2 to obtain the used first carrier F1a from the first stage 2. Then, while (or before) the second stage 3 receives the new first carrier F1b and enters the processing area S, the third stage 4 drives the used first carrier F1a to the second loading / unloading position L2 in the second area A2, and removes the used first carrier F1a through the robotic arm serving as the second loading / unloading device 6b to move the first carrier F1a to the fourth storage box 7d (completing the first exchange process P2). The process of storing the first carrier F1a moved to the second area A2 can be carried out simultaneously with the loading process P1 of the first carrier F1b on the first stage 2.

[0060] In addition, in one embodiment, the die transfer device 1 may be provided with a temporary storage box (not shown in the figure, for example, the first storage box 7a and the fourth storage box 7d may be made to have the function of temporarily storing the first carrier plate, or a new storage box may be provided) suitable for temporarily placing the first carrier plates F1a and F1b. The installation position thereof is, for example, corresponding to the installation position of the first loading and unloading device 6a or / and the second loading and unloading device 6b. In this embodiment, for example, after the second carrier plate F2 on the second carrier stage 3 receives a part of the dies P on the first carrier plate F1a, the second carrier stage 3 can first drive the second carrier plate F2 away from the processing area S. Then, the third carrier stage 4 (connected with the auxiliary component F10) moves into the processing area S and receives the first carrier plate F1a from the first carrier stage 2, then drives the first carrier plate F1a to move into the second area A2, and then the first carrier plate F1a is stored in the temporary storage box by the robotic arm. After that, the first carrier plate F1b in the temporary storage box is set on the third carrier stage 4 by the robotic arm. The first carrier plate F1b is set on the first carrier stage 2 by the foregoing method, and then the die transfer between the first carrier plate F1b and the second carrier plate F2 is performed. Similarly, after the dies P on the first carrier plate F1b required for the transfer are transferred, the first carrier plate F1b can return to the temporary storage box through a process similar to the foregoing, and the first carrier plate F1a is set on the first carrier stage 2 to mix and transfer the dies P from the first carrier plate F1a and the first carrier plate F1b on the second carrier plate F2. In other words, in one embodiment of the present invention, in the case of providing a storage box for temporarily storing the first carrier plates (F1a, F1b, etc.), the die transfer device 1 can not only perform the one-to-many (transferring the dies P from one first carrier plate F1 to multiple different second carrier plates, as described in the next paragraph) die transfer operation described in the foregoing paragraph, but also perform the many-to-one die transfer operation described in this paragraph.

[0061] For the detailed part of carrying the second carrier plate F2 and transferring the dies P, please refer to Figure 1 , Figures 8 to 9D as shown. First, the robotic arm serving as the first loading and unloading device 6a takes out the second carrier plate F2a from the second storage box 7b (since multiple second carrier plates F2 will be drawn in the following description, the second carrier plates F2a and F2b are used for distinction). The robotic arm serving as the first loading and unloading device 6a places the second carrier plate F2a on the second carrier stage 3. Then, the second carrier plate F2a is positioned by the first imaging unit 8a and the angle is corrected (as shown in Figure 9A , and the detailed operation can refer to the description of the second carrier stage 3 carrying the first carrier plate F1 mentioned above). Next, the second carrier stage 3 drives the second carrier plate F2a into the processing area S and positions it directly below the first carrier stage 2. After that, the second carrier stage 3 is controlled to position and correct the angle of the second carrier plate F2a by the image obtained by photographing the second carrier plate F2a by the fourth imaging unit 8d. (As shown in Figure 9B)After the above processes are completed (after the preparatory process P3 is completed), the die transfer is performed according to the instructions of the control unit.

[0062] Among them, please refer to Figure 1 , Figure 9C and Figure 9D . During the transfer process, in order to align the processing beam L, the die P at a specific position on the first carrier F1, and the predetermined position on the second carrier F2a where the die P is to be preset in a straight line. For example, in this embodiment, with the first carrier F1 stationary, the support frame 104 drives the projection lens 55 to move relative to the moving platform 102, causing the processing beam L to move relative to the base 101 and the first carrier F1 along the first direction D1 and the second direction D2, so that the processing beam L moves above the position of the die P to be transferred on the first carrier F1. And the second stage 3 drives the second carrier F2a to move relative to the moving platform 102 along the first direction D1 and the second direction D2, so that the second carrier F2a moves below the position of the die P to be transferred on the first carrier F1. Additionally, during other transfer operations not shown in the figure, such as transfer operations that do not change the relative positions of the dies P to each other, the second stage 3 may remain stationary, and only the support frame 104 (including the projection lens 55 connected to the support frame 104) moves. With the above structure, the die P at a specific position on the first carrier F1, the predetermined position on the second carrier F2a where the die P is to be preset, and the processing beam L can be aligned in a straight line. The die P is detached from the first carrier F1 by the processing beam L and transferred to the second carrier F2a along the third direction D3. However, in other embodiments, the detailed alignment method and actions can be changed according to the machine design or the type of transfer.

[0063] From the above description, since the second stage 3 and the third stage 4 are independent of each other, in one embodiment, when the first carrier F1 is provided to the first stage 2 and the first carrier F1 is set on the second stage 3, the second carrier F2 can be simultaneously set on the third stage 4. Then, when the first carrier F1 undergoes the wafer loading process P1 through the second stage 3, the position of the second carrier F2 on the third stage 4 is first positioned and the angle is corrected, so as to control the third stage 4 to drive the second carrier F2 to perform the subsequent die P transfer operation while (or after) the second stage 3 leaves the processing area S, but this is not limited thereto.

[0064] Please refer to Figure 1 , Figures 9B to 11D for the description. When the die P transfer is completed on one second carrier F2a and there are still dies P on the first carrier F1 (such as Figure 11A ), or when the second carrier F2a is being positioned and the angle is corrected by the fourth imaging unit 8d (such as Figure 9B), corresponding to the position of the third stage 4, the robotic arm of the second loading and unloading device 6b can take out a new second carrier plate F2b from the third storage box 7c and place it on the third stage 4. Then, the second carrier plate F2b is positioned by the second imaging unit 8b and rotated to the correct angle (as Figure 11A shown. For the detailed operations, please refer to the foregoing description). Next, the second stage 3 leaves the processing area S and enters the first area A1, while the third stage 4 drives the second carrier plate F2b into the processing area S and positions it directly below the first stage 2. After that, the second carrier plate F2b is photographed by the fourth imaging unit 8d in the same way, and the second stage 3 is controlled to position the second carrier plate F2b and rotate it to the correct angle. (As Figure 11B ) After the above processes are completed (the second wafer exchange process P4 is completed), the die transfer operation is started according to the instructions of the control unit.

[0065] As Figure 1 , Figure 11B and Figure 11C shown, during the process of calibrating and positioning the second carrier plate F2b in the processing area S, the processed second carrier plate F2a located at the first loading position L1 can be returned to the second storage box 7b by the robotic arm, for example. Then, the robotic arm takes a second carrier plate F2c that has not been transferred with dies P in the second storage box 7b and sets it on the second stage 3, and then the positioning and rotation operations of the second carrier plate F2a as described above are performed again.

[0066] As described above, the die transfer device according to the embodiment of the present invention has a second stage and a third stage that can carry the first carrier plate or the second carrier plate. Therefore, while one of the stages (for example, the second stage) is performing the die transfer operation in the processing area on the machine table, the carrier plate to be subjected to the die transfer operation can be loaded and prepared on the other stage (the third stage) in other areas, so as to quickly perform the next die transfer operation after one die transfer operation is completed, thereby improving the efficiency. In addition to preparing the carrier plate to be transferred with dies, the preparation operation for providing the carrier plate for the dies can also be performed. Furthermore, in the embodiment having a storage box suitable for temporarily storing the carrier plates, the transfer operation of multiple first carrier plates to a single second carrier plate or multiple first carrier plates to multiple second carrier plates can also be performed.

[0067] Figure 12 is a simplified schematic diagram of the machine table 10a of the die transfer device 1 according to another embodiment of the present invention. As shown in Figures 1 to 4 and Figure 12 shown, in this embodiment, since some components and their installation methods are the same as those in the foregoing Figure 1 embodiment, they will not be described in detail here. Only the differences will be described in this paragraph. As Figure 12As shown, in this embodiment, the machine tool 10a includes a base 101 and a moving platform 102a. Although in this embodiment the moving platform 102a is also connected to the base 101 through a slide rail 101a, in this embodiment the frame 103a is connected to the base 101 and is, for example, adapted to be installed on other slide rails (not shown in the figure) and can independently move relative to the moving platform 102a on the base 101 along a first direction D1 and a second direction D2. The second carrier 3a and the third carrier 4a are fixed at both ends of the moving platform 102a.

[0068] In other words, in this embodiment, the position where the processing beam L forms a light spot on the first carrier F1 is controlled by the movement of the projection lens 55 in the first direction D1 and the second direction D2 and the movement of the frame 103a in the first direction D1 and the second direction D2. The position where the processing beam L forms a light spot on the second carrier F2 is controlled by the movement of the moving platform 102a in the first direction D1 and the movement of the carrier seat 302 of the second carrier 3a and the carrier seat 402 of the third carrier 4a in the second direction D2, but not limited thereto. Additionally, in the foregoing Figure 1 embodiment, the function of the track 11 guiding the second carrier 3 and the third carrier 4 to move along the first direction D1 is Figure 12 replaced in the present embodiment shown by the slide rail 101a (which is also a kind of track and can also define the processing area S, the first area A1 and the second area A2) that guides the moving platform 102a.

[0069] The above are only the preferred embodiments of the present invention and do not impose any formal limitations on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, can make some changes or modifications to the above-disclosed methods and technical contents to form equivalent embodiments of equivalent changes. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A die transfer device adapted to transfer a plurality of dies on at least one first carrier plate to at least one second carrier plate in turn, characterized in that Comprising: A machine platform, including a track and a frame located above the track. The track has a processing area below the frame and a first area and a second area on both sides of the processing area; A first carrier stage, connected to the frame, and the first carrier stage is adapted to load or unload the at least one first carrier plate; A second carrier stage and a third carrier stage, each connected to the track, adapted to load or unload the at least one first carrier plate, and also adapted to load or unload the at least one second carrier plate. The second carrier stage is adapted to move between the first area of the track and the processing area, and the third carrier stage is adapted to move between the second area of the track and the processing area. And when one of the second carrier stage and the third carrier stage leaves the processing area, the other of the second carrier stage and the third carrier stage is adapted to move into the processing area; and A laser module, adapted to provide a processing beam to the at least one first carrier plate on the first carrier stage.

2. The die transfer device according to claim 1, wherein The machine platform further includes a base and a moving platform. The moving platform is connected to the base and is adapted to move relative to the base along a first direction parallel to the track. The frame is connected to the moving platform and is adapted to move with the moving platform in the first direction. The track is fixed on the moving platform. The second carrier stage and the third carrier stage are directly connected to the track and are adapted to move independently relative to the moving platform.

3. The grain transfer device according to claim 2, characterized in that, Each of the second carrier stage and the third carrier stage includes a base and a carrier seat. The base is adapted to drive the carrier seat to move along the first direction. The carrier seat is adapted to connect the at least one first carrier plate or one of the at least one second carrier plates, and drive the at least one first carrier plate or one of the at least one second carrier plates to move relative to the base along a second direction perpendicular to the first direction, and is also adapted to drive the at least one second carrier plate to rotate with the second direction as the axis direction.

4. The die transfer device according to claim 1, characterized in that, The machine platform further includes a base and a moving platform. The moving platform is connected to the base through the track. The frame is connected to the base and is adapted to move on the base along a first direction parallel to the track. The second carrier stage and the third carrier stage are fixed at both ends of the moving platform.

5. The grain transfer device according to claim 4, characterized in that, Each of the second carrier stage and the third carrier stage includes a base and a carrier seat. The base is fixed on the moving platform. The carrier seat is adapted to connect the at least one first carrier plate or one of the at least one second carrier plates, and drive the at least one first carrier plate or one of the at least one second carrier plates to move relative to the base along a second direction perpendicular to the first direction, and is also adapted to drive the at least one second carrier plate to rotate with the second direction as the axis direction.

6. The grain transfer device according to claim 1, characterized in that, The laser module along the optical path of the processing beam includes: A laser light source, adapted to provide a laser beam; A beam shaping element, adapted to adjust the laser beam into the processing beam with a flat-top energy distribution; A mask, adapted to change a spot shape of the processing beam; A mirror assembly, adapted to reflect the processing beam; and A projection lens, adapted to focus the processing beam on the at least one first carrier plate, and is also adapted to drive the processing beam to move in a second direction perpendicular to a first direction parallel to the track.

7. The die transfer device according to claim 1, wherein The die transfer device further includes a first loading and unloading device and a second loading and unloading device. The first area has a first loading and unloading position, and the second area has a second loading and unloading position. The first loading and unloading device is adapted to load and unload the at least one first carrier plate or one of the at least one second carrier plates on the second carrier table positioned at the first loading and unloading position. The second loading and unloading device is adapted to load and unload the first carrier plate or one of the at least one second carrier plates on the third carrier table positioned at the second loading and unloading position.

8. The grain transfer device according to claim 7, wherein, The die transfer device further includes: a first imaging unit adapted to image the at least one first carrier plate or one of the at least one second carrier plates on the second carrier table positioned at the first loading and unloading position; and a second imaging unit adapted to image the at least one first carrier plate or one of the at least one second carrier plates on the third carrier table positioned at the second loading and unloading position.

9. The grain transfer device according to claim 1, wherein The die transfer device further includes an imaging unit adapted to image the at least one first carrier plate on the first carrier table.

10. The grain transfer device according to claim 1, characterized in that, The die transfer device further includes an imaging unit adapted to image the at least one first carrier plate or one of the at least one second carrier plates on the second carrier table or the third carrier table positioned in the processing area.

11. The die transfer device according to claim 1, wherein, The machine further includes a support beam, a support assembly, and a flexible connection assembly. The support beam is movably disposed on the support assembly, and the support beam is indirectly connected to the support assembly through the flexible connection assembly. The laser module is disposed on the support beam and moves along a first direction parallel to the track or a second direction perpendicular to the first direction with the support beam.

12. The grain transfer device according to claim 11, wherein, The machine further includes a drive motor assembly directly connected to the support beam and directly connected to the support assembly.

Images