Ear temperature detection device

Abstract

The utility model provides an ear temperature detection device which comprises a first heating piece and a second heating piece, under the control of a control unit, the first heating piece is used for heating the front end of an infrared detection module, the second heating piece is used for heating the rear end of the infrared detection module, and through the heating arrangement of the front end and the rear end, the ear temperature is detected. Therefore, the overall temperature of the infrared detection module is more uniform in the incident direction of infrared rays (namely the front-back direction of the infrared detection module), the problem of temperature gradient of the infrared detection module is reduced or completely eradicated, and the measurement accuracy of the infrared detection module is further improved.

Description

Technical Field

[0001] The present application relates to body temperature measurement, and more particularly to a detection device for detecting ear temperature using infrared rays. Background Art

[0002] An ear temperature detection device (such as an ear thermometer or other device) is a device for checking the temperature inside the ear canal. Taking an ear thermometer as an example, the detection accuracy of this kind of ear thermometer is greatly affected by the ambient temperature. Especially in winter, the lens usually fogs up due to the low ambient temperature, and there are interferences such as thermal shock and cooling effect, which will lead to inaccurate temperature detection. To this end, a heating element is generally provided in the ear thermometer for heating, so as to reduce the problems caused by the low ambient temperature.

[0003] However, although some existing ear thermometers are provided with heating elements, they still cannot solve the problem of the temperature gradient formed by the infrared sensor itself in the infrared ray incident direction. The infrared sensing wafer inside the infrared sensor captures the temperature difference between the wafer and the target. The formed temperature gradient will seriously affect the temperature difference between the wafer itself and the target, resulting in a huge deviation in temperature measurement. Summary of the Utility Model

[0004] The present application provides an ear temperature detection device to improve the accuracy of temperature detection.

[0005] Based on the above purpose, some embodiments of the present application provide an ear temperature detection device, including:

[0006] A probe housing, the probe housing has a detection end, the detection end has a light incident window, and the probe housing encloses an installation cavity;

[0007] An infrared detection module, the infrared detection module is installed in the installation cavity, and the infrared detection module has a front end facing the light incident window and a rear end facing away from the front end. The front end is arranged facing the light incident window so that the infrared rays emitted by the detection object can enter the front end from the light incident window;

[0008] A first heating element for heating the front end;

[0009] A second heating element for heating the rear end;

[0010] And a control unit, electrically connected to the first heating element and the second heating element, for controlling the first heating element and the second heating element to make the temperature of the infrared detection module more uniform.

[0011] In the ear temperature detection device shown above, it includes a first heating element and a second heating element. Under the control of the control unit, the first heating element is used to heat the front end of the infrared detection module, and the second heating element is used to heat the rear end of the infrared detection module. Through the heating settings at the front and rear ends, the overall temperature of the infrared detection module is made more uniform in the incident direction of the infrared rays (i.e., the front-rear direction of the infrared detection module), reducing or eliminating the problem of the temperature gradient of the infrared detection module itself, thereby improving the measurement accuracy of the infrared detection module.

[0012] In some embodiments, in the axial direction of the light incident window, the first heating element is located on the front side of the front end, and / or the second heating element is located on the rear side of the rear end.

[0013] In some embodiments, the first heating element is a first plate-like structure, the second heating element is a second plate-like structure, the first heating element, the infrared detection module, and the second heating element form a stacked structure, the second disc-shaped structure has a wiring hole, and the connection line of the infrared detection module passes through the wiring hole.

[0014] In some embodiments, in the axial direction of the light incident window, the distance between the first heating element and the infrared detection module is less than or equal to 1 mm.

[0015] In some embodiments, the light incident window is a first through hole, and the first heating element has a second through hole, where:

[0016] The hole wall of the first through hole is folded toward the side where the infrared detection module is located and inserted into the second through hole, forming an optical tunnel to guide the infrared rays to the infrared detection module along the optical tunnel;

[0017] Or, the second through hole communicates with the first through hole and jointly encloses at least a part of the optical tunnel to guide the infrared rays to the infrared detection module along the optical tunnel;

[0018] Or, it further includes an optical guiding member having an optical tunnel for guiding the infrared rays to the infrared detection module, and the optical guiding member is installed in the first through hole and the second through hole.

[0019] In some embodiments, the control unit has a first flexible circuit board, and the first heating element is electrically connected to the first flexible circuit board; and / or,

[0020] The control unit includes a second flexible circuit board, which is electrically connected to the second heating element.

[0021] In some embodiments, one end of the first flexible circuit board is located between the first heating element and the infrared detection module, and the other end of the first flexible circuit board extends along the side of the infrared detection module to the rear side of the infrared detection module; and / or,

[0022] One end of the second flexible circuit board is located on the rear side of the second heating element, and the other end of the second flexible circuit board extends rearward along the axial direction of the light incident window in a manner opposite to the first flexible circuit board; a receiving cavity for installing other components is formed between the first flexible circuit board and the second flexible circuit board.

[0023] In some embodiments, a thermally conductive insulating layer is provided between the first heating element and the infrared detection module, and / or a thermally conductive insulating layer is provided between the infrared detection module and the second heating element.

[0024] In some embodiments, a thermal insulation layer is further included, which is arranged around the circumference of the infrared detection module and separates the infrared detection module from the probe housing.

[0025] In some embodiments, the system further comprises at least one first temperature detection unit, wherein the first temperature detection unit is used to detect the temperature of the front end of the infrared detection module, and the first temperature detection unit is electrically connected to the control unit;

[0026] And / or, it further includes at least one second temperature detection unit, which is used to detect the temperature of the rear end of the infrared detection module; the second temperature detection unit is electrically connected to the control unit.

[0027] In some embodiments, the first temperature detection unit is at least partially attached to the front end of the infrared detection module, and / or the second temperature detection unit is at least partially attached to the rear end of the infrared detection module.

[0028] In some embodiments, the distance between the first temperature detection unit and the infrared detection module is less than or equal to 5 mm, and / or the distance between the second temperature detection unit and the infrared detection module is less than or equal to 5 mm.

[0029] In some embodiments, the infrared detection module has a module shell made of metal material and a thermoelectric sensing unit located inside the module shell, the end of the module shell facing the light incident window is the front end of the infrared detection module, and the end of the module shell away from the front end is the rear end of the infrared detection module.

[0030] In some embodiments, a second temperature detection unit is provided in the module housing, and the second temperature detection unit is used to detect the ambient temperature of the thermoelectric sensing unit.

[0031] In some embodiments, at least a part of the probe housing is made of a metal material, and the first heating element and / or the second heating element are in contact with the metal material part of the probe housing to heat the metal material part.

[0032] In some embodiments, the probe housing includes a probe cap and a cylindrical main body. The probe cap is fixedly connected to the cylindrical main body and encloses to form the installation cavity. The light incident window is arranged on the probe cap, and at least the probe cap is made of a metal material. Description of the Drawings

[0033] Figure 1 It is a schematic diagram of the external structure of the ear temperature detection device in some embodiments of the present application;

[0034] Figure 2 It is a cross-sectional view of the probe part in some embodiments of the present application;

[0035] Figure 3 It is an exploded schematic diagram of the internal components of the probe in some embodiments of the present application;

[0036] Figure 4 It is a cross-sectional view of the probe part in some other embodiments of the present application. Detailed Embodiments

[0037] The present utility model will be further described in detail below in conjunction with the drawings through specific embodiments. Similar elements in different embodiments are labeled with related similar element numbers. In the following embodiments, many details are described to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid the core part of the present application being overwhelmed by excessive description. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0038] In addition, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the various sequences in the specification and drawings are only for clearly describing a certain embodiment and do not mean that they are necessary sequences, unless it is stated that a certain sequence must be followed.

[0039] The serial numbers assigned to the components in this text itself, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. And the "connection" and "coupling" mentioned in this application, unless otherwise specified, both include direct and indirect connection (coupling).

[0040] To solve the problem that the existing ear temperature detection device has inaccurate measurement, especially in a cold environment, some embodiments of this application provide an ear temperature detection device, which improves the measurement accuracy of the ear temperature detection device through a heating element arrangement different from the prior art. The ear temperature detection device can be, but is not limited to, an ear thermometer or other devices that obtain the body temperature of the detection object by measuring the ear temperature. The detection object can be a human or an animal.

[0041] Please refer to Figure 1 , in some embodiments, the ear temperature detection device includes a probe 1 for extending into or approaching the ear canal of the detection object and a holding part 2. In Figure 1 the illustrated embodiment, the holding part 2 is a long strip structure for facilitating the user to hold, and the user can hold the ear temperature detection device with one hand. Of course, in other embodiments, the holding part 2 can also be set to other non-long strip structures, such as a square, circular or other shapes designed to facilitate the user to hold with the thumb and index finger, and it does not have to be set to Figure 1 the long strip shown. Even in some embodiments, in order to make the ear temperature detection device more compact, the ear temperature detection device can also omit the holding part 2, and the user can directly grasp the probe 1 to measure the temperature. In this embodiment, it mainly improves the structure inside the probe 1, and other structures are not limited.

[0042] Further, please refer to Figure 2 and 3 , in some embodiments, the probe 1 includes a probe housing 100, an infrared detection module 200, a first heating element 300, a second heating element 400, and a control unit (such as 610, 620). Of course, according to different requirements, the probe 1 can also have other components, which can refer to the prior art and will not be elaborated here.

[0043] The probe housing 100 has a detection end 101. The detection end 101 is the end of the probe housing 100 facing the detection object during ear temperature detection, and the detection end 101 is the position where the infrared rays emitted by the detection object enter the probe 1.

[0044] In order to enable the infrared rays emitted by the detection object to enter the probe 1, the detection end 101 has a light incident window 102, and the light incident window 102 is a structure that can allow infrared rays to enter. It can be a closed but light-transmitting light-transmitting layer or an opening. For example, in Figure 2In the illustrated embodiment, the light incident window 102 is an opening, which is referred to herein as a first through hole.

[0045] The probe housing 100 forms a mounting cavity, and the infrared detection module 200 is mounted in the mounting cavity. The infrared detection module 200 has a front end facing the light incident window 102 and a rear end facing away from the front end. Figure 2 The front end is positioned toward the light incident window 102 so that infrared rays emitted by the detection object can enter the front end through the light incident window 102. The infrared detection module 200 is a component capable of receiving infrared rays and sensing temperature. For example, it can be a conventional infrared sensor or other sensor component with a pyroelectric sensing unit.

[0046] The control unit is electrically connected to the first heating element 300 and the second heating element 400, and is used to control the first heating element 300 and the second heating element 400. The first heating element 300 is used to heat the front end of the infrared detection module 200, and the second heating element 400 is used to heat the rear end of the infrared detection module 200. Under the control of the control unit, by setting the heating at the front and rear ends of the infrared detection module 200, the heat of the infrared detection module 200 is conducted from the two ends to the middle, which can make the overall temperature of the infrared detection module 200 more uniform in the direction of infrared ray incidence (i.e., the front and rear direction of the infrared detection module 200), reduce or eliminate the problem of temperature gradient of the infrared detection module 200 itself, and thus improve the measurement accuracy of the infrared detection module 200.

[0047] Moreover, the heat emitted by the first heating element 300 and the second heating element 400 can also increase the temperature of the entire probe 1, thereby preventing the light incident window 102 of the probe 1 from fogging, reducing the temperature difference between the infrared detection module 200 and the detection object, and avoiding the probe 1 from lowering the flesh temperature of the detection object, etc., further improving the accuracy of the detection results of the ear temperature detection device.

[0048] Furthermore, in some embodiments, since the first heating element 300 and the second heating element 400 are separately provided, the control unit can also control the first heating element 300 and the second heating element 400 separately, so that the heating temperature of the first heating element 300 and the heating temperature of the second heating element 400 can be the same or different as needed, thereby achieving independent control of the heating of the front and rear ends of the infrared detection module 200. Of course, in some embodiments, to simplify the control difficulty, the control unit can also synchronously control the first heating element 300 and the second heating element 400, that is, the first heating element 300 and the second heating element 400 produce the same temperature change at the same time. For specific control methods, reference can be made to the control methods of heating elements in the prior art.

[0049] In the above embodiments, the first heating element 300 and the second heating element 400 can adopt any heating element that can be applied to the ear temperature detection field. For example, but not limited to, ceramic heating sheets, FeCrAl heating wires, NiCr heating wires, or other types of heating elements.

[0050] To ensure the compactness of the structure, in some embodiments, please refer to Figure 2 , in the axial direction of the light incident window 102, the first heating element 300 is located on the front side of the front end of the infrared detection module 200, and / or the second heating element 400 is located on the rear side of the rear end of the infrared detection module 200. Among them, when the light incident window 102 is a light-transmitting layer, the axial direction of the light incident window 102 is the direction perpendicular to the light-transmitting layer. When the light incident window 102 is an opening, the axial direction of the light incident window 102 is the axial direction of the opening. This setting makes full use of the space in the axial direction of the light incident window 102, conforms to the narrow and long design of the probe 1, and avoids increasing the size of the probe 1 in the transverse direction (i.e., the radial direction or the direction perpendicular to the axial direction).

[0051] Please refer to Figure 2 and 3 , in some more specific embodiments, the first heating element 300 is a first plate-like structure, the second heating element 400 is a second plate-like structure, and the first heating element 300, the infrared detection module 200, and the second heating element 400 form a stacked structure, similar to a sandwich structure. The plate-like heating element and the stacked structure among the three can increase the contact surface between the first heating element 300, the second heating element 400, and the infrared detection module 200, and thus is more conducive to heat conduction. In addition, in some other embodiments, when the first heating element 300 and the second heating element 400 are designed to clamp the infrared detection module 200, the first heating element 300 and the second heating element 400 can also play a role in fixing the infrared detection module 200 to improve the position stability of the infrared detection module 200.

[0052] In the above stacked structure, please refer to Figure 2 and 3 , in some embodiments, the second heating element 400 has a wire routing hole 410, and the connection wire of the infrared detection module 200 passes through the wire routing hole 410. Based on this, the connection wire of the infrared detection module 200 does not need to be led out from the periphery of the second heating element 400, which can avoid increasing the size of the probe 1 in the transverse direction. Of course, in other embodiments, the connection wire of the infrared detection module 200 can also be led out from the periphery of the second heating element 400, and the present application does not limit this.

[0053] In addition to the above-described positional distribution of the first heating element 300, the infrared detection module 200, and the second heating element 400, in other embodiments, the first heating element 300 and / or the second heating element 400 may also be at least partially disposed on the side of the infrared detection module 200, as long as the first heating element 300 and the second heating element 400 can respectively heat the front end and the rear end of the infrared detection module 200.

[0054] Further, in some embodiments, in order to ensure the heating effect of the heating element on the infrared detection module 200, in the axial direction of the light incident window 102, the distance between the first heating element 300 and the infrared detection module 200 is less than or equal to 1 mm. This setting can ensure that the heat of the first heating element 300 can be more easily conducted to the front end of the infrared detection module 200, and the heat of the second heating element 400 can be more easily conducted to the rear end of the infrared detection module 200. Moreover, this distance design also enables the first heating element 300 and the second heating element 400 to be close to the infrared inspection module, improving the compactness of the internal structure of the entire probe 1. In particular, when the first heating element 300 is located on the front side of the front end and the second heating element 400 is located on the rear side of the rear end, it can not only ensure that the overall lateral dimension of the probe 1 is small, but also improve the heating effect of the heating element on the infrared detection module 200.

[0055] In terms of the heat conduction method, the heat conduction between the heating element and the infrared detection module 200 can be achieved by direct contact or indirect contact. For example, the first heating element 300 and / or the second heating element 400 can be in contact with the infrared detection module 200 for heat conduction; or, the first heating element 300 and / or the second heating element 400 can also be in contact with the infrared detection module 200 through other intermediate heat-conducting materials for heat conduction.

[0056] In some embodiments, a heat-conducting insulating layer is provided between the first heating element 300 and the infrared detection module 200, and / or a heat-conducting insulating layer is provided between the infrared detection module 200 and the second heating element 400. In addition to achieving the heat conduction effect, this heat-conducting insulating layer also plays an insulating role, avoiding short-circuit problems.

[0057] The heat-conducting insulating layer can be made of a material that can both conduct heat and insulate. It can either be a specially provided heat-conducting insulating layer (such as the heat-conducting insulating layer 700 between the second heating element 400 and the infrared detection module 200), or can be a component used for other functions that also serves as a heat-conducting insulating layer (such as the first flexible circuit board 610 described later).

[0058] Further, the control unit is a component capable of outputting control signals, which may be one or more circuit boards (such as a flexible circuit board or a PCB board). Regarding the control of the first heating element 300 and the second heating element 400, they can be directly connected to the same control circuit board, or different circuit boards can be respectively provided for control. The control of the first heating element 300 and the second heating element 400 by the control unit can be realized with reference to the prior art. For example, the control unit can control the first heating element 300 and the second heating element 400 to heat within a set temperature range, and this specific control process is the prior art.

[0059] For example, please refer to Figure 2 and 3 , in some embodiments, the control unit has a first flexible circuit board 610, and the first heating element 300 is electrically connected to the first flexible circuit board 610, and the first flexible circuit board 610 controls the first heating element 300.

[0060] Please continue to refer to Figure 2 and 3 , in some embodiments, the control unit includes a second flexible circuit board 620, and the second flexible circuit board 620 is electrically connected to the second heating element 400, and the second flexible circuit board 620 controls the second heating element 400.

[0061] Of course, the control unit for controlling the first heating element 300 and the second heating element 400 may not use a flexible circuit board, and its control can also be realized by a PCB board.

[0062] In addition, in other embodiments, the first heating element 300 and the second heating element 400 can also be connected to the same circuit board through connection lines, and the circuit board controls the first heating element 300 and the second heating element 400. The control of the first heating element 300 and the second heating element 400 by the control unit can be realized with reference to the prior art. For example, the control unit can control the first heating element 300 and the second heating element 400 to heat within a set temperature range, and this specific control process is the prior art.

[0063] Please refer to Figure 2 and 3, in some embodiments, to improve the compactness of the structure, one end of the first flexible circuit board 610 is located between the first heating element 300 and the infrared detection module 200. At this time, the first flexible circuit board 610 can also serve as a thermal conductive insulating layer between the first heating element 300 and the infrared detection module 200. There is no need to separately provide a thermal conductive insulating layer, which can simplify the structure and reduce the structural volume. The other end of the first flexible circuit board 610 extends along the side of the infrared detection module 200 to the rear side of the infrared detection module 200 to facilitate the connection of the first flexible circuit board 610 with other components, such as connecting to the main control circuit board of the ear temperature detection device. The main control circuit board can usually be arranged in the holding part 2, and this application does not limit this.

[0064] Further, please continue to refer to Figure 2 and 3 , in some embodiments, one end of the second flexible circuit board 620 is located at the rear side of the second heating element 400, and the other end of the second flexible circuit board 620 extends axially backward along the light incident window 102 to facilitate the connection of the first flexible circuit board 610 with other components, such as connecting to the main control circuit board of the ear temperature detection device.

[0065] Further, please continue to refer to Figure 2 and 3 , in some embodiments, the first flexible circuit board 610 and the second flexible circuit board 620 extend backward in a relative manner, making full use of the peripheral space inside the probe housing 100, avoiding interference between the first flexible circuit board 610 and the second flexible circuit board 620, and also facilitating the connection of the first flexible circuit board 610 and the second flexible circuit board 620 with other components. Moreover, in this arrangement, a receiving cavity A for installing other components can be formed between the first flexible circuit board 610 and the second flexible circuit board 620. When necessary, the receiving cavity A can be used to place other components, thereby improving the compactness of the entire probe 1 structure and being beneficial to reducing the overall size of the probe 1.

[0066] On the other hand, to improve the accuracy of the temperature control of the infrared detection module 200 by the control unit, in some embodiments, please refer to Figure 2 , and at least one first temperature detection unit 810 is further included. The first temperature detection unit 810 is used to detect the temperature at the front end of the infrared detection module 200. The first temperature detection unit 810 is electrically connected to the control unit, and the control unit adjusts the temperature of the first heating element 300 based on the feedback result of the first temperature detection unit 810. The manner in which the control unit adjusts the temperature of the first heating element 300 based on the feedback result of the first temperature detection unit 810 can refer to the manner in the prior art of controlling the corresponding heating element within a set temperature range based on the detection result of the temperature sensor.

[0067] Further, please refer to Figure 2 In some embodiments, there is also at least one second temperature detection unit 820 for detecting the temperature at the back end of the infrared detection module 200. The second temperature detection unit 820 is electrically connected to the control unit, and the control unit adjusts the temperature of the second heating element 400 based on the feedback result of the second temperature detection unit 820, so as to more precisely adjust the heating temperature of the second heating element 400. The manner in which the control unit adjusts the temperature of the second heating element 400 based on the feedback result of the second temperature detection unit 820 can refer to the manner in the prior art of controlling the corresponding heating element within a set temperature range based on the detection result of a temperature sensor.

[0068] Wherein, the first temperature detection unit 810 and the second temperature detection unit 820 can be disposed either outside or inside the infrared detection module 200.

[0069] Wherein, the first temperature detection unit 810 and the second temperature detection unit 820 can adopt any components capable of being applied to the temperature detection of the infrared detection module 200, such as but not limited to an NTC temperature sensor or other types of temperature sensors, etc. Wherein, the first temperature detection unit 810 and the second temperature detection unit 820 can also be electrically connected to the same circuit board, such as the main control circuit board. Or, the first temperature detection unit 810 and the second temperature detection unit 820 can also be respectively connected to different circuit boards.

[0070] In order to obtain more accurate temperature information, the first temperature detection unit 810 and the second temperature detection unit 820 can be in direct contact with the infrared detection module 200. Please refer to Figure 2 In some embodiments, at least a part of the first temperature detection unit 810 is attached to the front end of the infrared detection module 200, and / or at least a part of the second temperature detection unit 820 is attached to the back end of the infrared detection module 200.

[0071] In some more specific embodiments, at least a part of the first temperature detection unit 810 is attached to the outer wall or the inner wall of the front end of the infrared detection module 200, and / or at least a part of the second temperature detection unit 820 is attached to the outer wall or the inner wall of the back end of the infrared detection module 200.

[0072] In Figure 2 In the illustrated embodiment, the first temperature detection unit 810 is attached to the outer wall of the front end of the infrared detection module 200, and the second temperature detection unit 820 is attached to the inner wall of the back end of the infrared detection module 200. In this embodiment, the second temperature detection unit 820 can be pre-assembled in the infrared detection module 200, such as directly purchasing the infrared detection module 200 with the second temperature detection unit 820, so as to reduce costs.

[0073] Furthermore, in order to improve the accuracy of temperature detection of the infrared detection module 200, in some embodiments, the distance between the first temperature detection unit 810 and the infrared detection module 200 is less than or equal to 5 mm, and / or the distance between the second temperature detection unit 820 and the infrared detection module 200 is less than or equal to 5 mm.

[0074] Furthermore, the infrared detection module 200 used in some embodiments of the present application is also described here. Figure 2 In some embodiments, the infrared detection module 200 includes a module housing 210 and a pyroelectric sensing unit 220 located within the module housing 210. The module housing 210 serves as the outer shell of the entire infrared detection module 200 and may be an integrally formed structure or may be composed of multiple parts. The end of the module housing 210 facing the light incident window 102 is the front end of the infrared detection module 200, and the end of the module housing 210 facing away from the front end is the rear end of the infrared detection module 200. The pyroelectric sensing unit 220 is used to receive infrared rays and obtain an electrical signal that can represent the corresponding temperature. For example, a thermopile sensor or other type of sensor may be used, but is not limited to.

[0075] In some embodiments, in order to enable the infrared detection module 200 to better conduct heat, in some embodiments, the module housing 210 is made of metal material, and the heat generated by the first heating element 300 and the second heating element 400 can be quickly conducted on the module housing 210, thereby making the temperature of the entire infrared detection module 200 more uniform to reduce the temperature gradient.

[0076] Please refer to Figure 2 In this embodiment, a second temperature detection unit 820 is further provided within the module housing 210. The second temperature detection unit 820 is used to detect the ambient temperature of the thermoelectric sensing unit 220. The second temperature detection unit 820 and the thermoelectric sensing unit 220 are both provided on the inner wall at the rear end of the module housing 210. Alternatively, the second temperature detection unit 820 may be provided on a side wall of the module housing 210.

[0077] On the other hand, in order to better guide the infrared rays to propagate toward the infrared detection module 200 , an optical tunnel may be provided in some embodiments. The infrared light incident on the light incident window 102 may enter the infrared detection module 200 along the optical tunnel.

[0078] Please refer to Figure 2 and 3, in some embodiments, the light incident window 102 is a first through hole, and the first heating element 300 has a second through hole 310. Wherein, the hole wall 103 of the light incident window 102 is folded towards the side where the infrared detection module 200 is located and inserted into the second through hole 310 to form an optical tunnel, so as to guide infrared rays to the infrared detection module 200 along the optical tunnel. In this embodiment, the optical tunnel is directly formed by the probe housing 100, and there is no need to additionally provide an optical guide for forming the optical tunnel, which can simplify the internal structure of the probe 1 and is beneficial to the miniaturization design of the probe 1.

[0079] In addition, the folded hole wall 103 of the light incident window 102 passes through the second through hole 310 of the first heating element 300, and it can also limit the position of the first heating element 300 at the same time, reducing the fixing requirements for the first heating element 300. At the same time, through the folded hole wall 103, the contact area between the first heating element 300 and the probe housing 100 increases, which is also beneficial to the transfer of the heat generated by the first heating element 300 to the probe housing 100, thereby increasing the temperature of the probe housing 100.

[0080] In some embodiments, the detection end 101 can be made of a metal material, which can not only achieve the heat conduction effect, but also because the infrared emissivity of the metal is very low, only within 10%, so that during the process of forming the optical tunnel by the folded hole wall 103 of the light incident window 102, the interference caused by the infrared light radiated due to the temperature generated by the self-heating of the folded hole wall 103 entering the infrared detection module 200 can be reduced.

[0081] Of course, in some other embodiments, the second through hole 310 can also communicate with the light incident window 102 and jointly enclose at least a part of the optical tunnel to guide infrared rays to the infrared detection module 200 along the optical tunnel. Or, in some other embodiments, an optical guide is further included. The optical guide has an optical tunnel for guiding infrared rays to the infrared detection module 200, and the optical guide is installed in the light incident window 102 and the second through hole 310.

[0082] In order to ensure that the heat emitted by the heating element can be conducted to the entire infrared detection module 200 more fully and quickly, some embodiments of the present application also provide some other solutions. Specifically, please refer to Figure 3 , in some embodiments, a heat insulation layer 500 is further included. The heat insulation layer 500 is disposed around the circumference of the infrared detection module 200 and separates the infrared detection module 200 from the probe housing 100. The heat insulation layer 500 can be made of any heat insulation material that can be used for the infrared detection module 200, such as heat insulation cotton or other materials.

[0083] When the infrared detection module 200 is covered by the thermal insulation layer 500, on the one hand, the heat dissipation from the infrared detection module 200 can be reduced, especially preventing the heat from dissipating to the probe housing 100, so that more heat is concentrated on the infrared detection module 200, improving the heating efficiency of the heating element for the infrared detection module 200. On the other hand, it can also ensure that the temperature generated by the heating element is better conducted within the infrared detection module 200 itself, making the temperature of the infrared detection module 200 more uniform. In the incident direction of the infrared rays, the overall temperature of the infrared detection module 200 is more uniform, reducing or eliminating the problem of the temperature gradient of the infrared detection module 200 itself, and thus improving the measurement accuracy of the infrared detection module 200.

[0084] In the above embodiments, the first heating element 300 and the second heating element 400 heat the infrared detection module 200 from the front end and the rear end respectively. At this time, with the heat insulation effect of the thermal insulation layer 500, the heat can be quickly conducted from the front end and the rear end of the infrared detection module 200 to the middle, quickly achieving the purpose of heating the entire infrared detection module 200 and making its temperature uniform.

[0085] Of course, in other embodiments, after the thermal insulation layer 500 is adopted, relying on the heating effect of one or more heating elements on the infrared detection module 200 and the heat insulation function of the thermal insulation layer 500, the heat of the heating element can be more concentratedly conducted to the infrared detection module 200. At this time, the heating element is controlled by the control unit and is used to heat the infrared detection module 200. However, the position of the heating element can be set at the front end, the rear end, and / or the side of the infrared detection module 200. For example, the heating element can adopt the layout and structure of the above-mentioned first heating element 300 and / or the second heating element 400, or it can not adopt the layout and structure of the above-mentioned first heating element 300 and / or the second heating element 400.

[0086] On the other hand, regarding the probe housing 100, the probe housing 100 can be an integrally formed structure, such as formed by 3D printing, or can be composed of two or more components joined together. In the joined formation scheme, the sub-components can be fixedly connected or movably connected. The movable connection can be, for example, that a part (such as the probe cap 110 described later) can rotate relative to another part (such as the cylindrical main body 120 described later) or move axially along the probe 1 to meet certain functional requirements. In the fixed connection scheme, the sub-components can be non-detachably fixedly connected (such as ultrasonic welding, bonding or other methods) or detachably connected (such as screwing, clamping or other methods).

[0087] In Figure 2In the illustrated embodiment, the probe housing 100 includes a probe cap 110 and a cylindrical main body 120. The probe cap 110 is fixedly connected to the cylindrical main body 120 and encloses to form an installation cavity, and a light incident window 102 is provided on the probe cap 110. Among them, in the illustrated embodiment, the fixed connection is a detachable fixed connection, so that the probe cap 110 can be conveniently opened to replace internal components. Of course, in other embodiments, the connection between the probe cap 110 and the cylindrical main body 120 may also be a non-detachable fixed connection.

[0088] Generally, the probe housing 100 is made of a non-thermally conductive material, which easily causes a temperature difference between the temperature of the probe housing 100 and the ambient temperature, and further causes problems such as fogging and cooling effects, affecting the measurement accuracy.

[0089] In response to this, in some embodiments of the present application, at least a part of the probe housing 100 is made of a metal material, and the ear temperature detection device has at least one heating element. The heating element can be either the above-mentioned first heating element 300 and / or second heating element 400, or other heating elements. At least one heating element is in thermal contact with the metal material part of the probe housing 100 to heat the metal material part, increase the temperature of the probe housing 100, reduce the problem of affecting the detection result due to too low ambient temperature, and improve the measurement accuracy of the infrared detection module 200.

[0090] Furthermore, in some embodiments, please refer to Figure 2 , at least the probe cap 110 is made of a metal material, and the light incident window 102 is provided on the probe cap 110.

[0091] Furthermore, in some embodiments, the heating element is in thermal contact with the infrared detection module 200, so that the heating element can heat the probe housing 100 and the infrared detection module 200 simultaneously. For example, when the heating element is the first heating element 300 as shown in Figure 2 , it can heat the probe housing 100 and can also heat the infrared detection module 200.

[0092] The above uses specific examples to elaborate on the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the technical field to which the present invention pertains, several simple deductions, deformations or substitutions can also be made according to the idea of the present invention.

Claims

1. An ear temperature detection device, characterized in that, include: A probe housing, the probe housing having a detection end, the detection end having a light incident window, and the probe housing enclosing a mounting cavity; an infrared detection module, the infrared detection module being mounted in the mounting cavity and having a front end facing the light incident window and a rear end facing away from the front end, the front end being disposed toward the light incident window so that infrared rays emitted by a detection object can enter the front end through the light incident window; a first heating element, the first heating element being used to heat the front end; a second heating element, the second heating element being used to heat the rear end; and a control unit electrically connected to the first heating element and the second heating element, for controlling the first heating element and the second heating element so as to make the temperature of the infrared detection module more uniform.

2. The ear temperature detection device according to claim 1, wherein In the axial direction of the light incident window, the first heating element is located at the front side of the front end, and / or the second heating element is located at the rear side of the rear end.

3. The ear temperature detection device according to claim 1, characterized in that, The light incident window is a first through hole, and the first heating element has a second through hole, wherein: The hole wall of the first through hole is folded toward the side where the infrared detection module is located and inserted into the second through hole to form an optical tunnel to guide the infrared ray along the optical tunnel toward the infrared detection module; Alternatively, the second through hole is in communication with the first through hole and together form at least a portion of an optical tunnel to guide the infrared ray along the optical tunnel toward the infrared detection module; Alternatively, the device further includes an optical guide having an optical tunnel for guiding the infrared ray to be emitted toward the infrared detection module, and the optical guide is installed in the first through hole and the second through hole.

4. The ear temperature detection device according to claim 1, wherein, The control unit includes a first flexible circuit board, and the first heating element is electrically connected to the first flexible circuit board; and / or, The control unit includes a second flexible circuit board electrically connected to the second heating element.

5. The ear temperature detection device according to claim 4, wherein One end of the first flexible circuit board is located between the first heating element and the infrared detection module, and the other end of the first flexible circuit board extends along the side of the infrared detection module to the rear side of the infrared detection module; and / or, One end of the second flexible circuit board is located on the rear side of the second heating element, and the other end of the second flexible circuit board extends rearward along the axial direction of the light incident window in a manner opposite to the first flexible circuit board; a receiving cavity for installing other components is formed between the first flexible circuit board and the second flexible circuit board.

6. The ear temperature detection device according to claim 1, wherein, It also includes a heat-insulating layer, which is arranged around the circumference of the infrared detection module and separates the infrared detection module from the probe housing.

7. The ear temperature detection device according to claim 1, characterized in that, It also includes at least one first temperature detection unit, the first temperature detection unit is used to detect the temperature of the front end of the infrared detection module, and the first temperature detection unit is electrically connected to the control unit; And / or, it further includes at least one second temperature detection unit, which is used to detect the temperature of the rear end of the infrared detection module; the second temperature detection unit is electrically connected to the control unit.

8. The ear temperature detection device according to claim 7, wherein, At least part of the first temperature detection unit is attached to the front end of the infrared detection module, and / or at least part of the second temperature detection unit is attached to the rear end of the infrared detection module.

9. The ear temperature detection device according to claim 1, wherein At least a part of the probe housing is made of a metal material, and the first heating element and / or the second heating element are in contact with the metal material part of the probe housing to heat the metal material part.

10. The ear temperature detection device according to claim 9, characterized in that, The probe housing includes a probe cap and a cylindrical main body. The probe cap is fixedly connected to the cylindrical main body and encloses to form the installation cavity. The light incident window is arranged on the probe cap, and at least the probe cap is made of a metal material.

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