Device for testing temperature change performance of scintillator array

Abstract

The utility model discloses a device for testing the temperature change performance of a scintillator array, which belongs to the technical field of scintillator array temperature control and measurement detection devices and comprises a bottom plate, a heating plate, a test plate, a temperature measurement probe and a PLC (programmable logic controller) system. The heating sheet is arranged on the bottom plate; the test plate covers the heating sheet, an FOP detector is arranged in the middle of the test plate, a scintillator array is arranged in the middle of the FOP detector, and a CMOS detector is arranged below the scintillator array; the temperature measurement probes are arranged on the test board and on the two sides of the FOP area; the PLC system receives signals of the temperature measuring probe and controls the heating temperature of the heating piece, and it is guaranteed that the working temperature is kept stable. The device is simple in structure and convenient to use, the PLC system is controlled by a temperature control system program to automatically realize temperature control and balance to ensure that each area of the testing device is stable, so that the device is balanced, the testing precision of equipment is ensured, and the testing performance accuracy and the testing efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of a temperature control, temperature measurement and detection device for a scintillator array, and particularly relates to a device for testing the temperature change performance of a scintillator array. Background Art

[0002] At present, for a light output test system of a scintillator array, it is necessary to test the change of the light output of the scintillator array with temperature change, and the surface temperature of the scintillator array needs to be precisely controlled during the test process.

[0003] In a general device structure, a silicone heating sheet heats a detector circuit, a CMOS detector, and an FOP in sequence, and finally conducts heat to the scintillator array. During the operation of the detector, the internal chip continuously dissipates heat. In order to make the detector work properly, the structure must be optimized to remove the heat generated by the detector. While the heating sheet heats the scintillator array, it will first heat the detector circuit, and the heat will then be conducted to the CMOS detector, FOP, and scintillator through the detector circuit in sequence. The reasonable operating temperature of the detector is <55°C. Excessive temperature will affect the test accuracy of the detector and even cause high-temperature damage to electronic components. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a device for testing the temperature change performance of a scintillator array to solve the problem that the test accuracy of the device decreases due to uncontrollable temperature, which affects the reliability of the test data of the sample.

[0005] Technical Solution: The utility model provides a device for testing the temperature change performance of a scintillator array, including: a bottom plate, a heating sheet, a test plate, a temperature measurement probe, and a PLC system; the heating sheet is arranged on the bottom plate; the test plate is covered on the heating sheet, an FOP detector is arranged in the middle of the test plate, a scintillator array is arranged in the middle of the FOP detector, and a CMOS detector is arranged below the scintillator array; the temperature measurement probe is arranged on the test plate, on both sides of the FOP detector; the PLC system receives the signal of the temperature measurement probe and controls the heating temperature of the heating sheet to ensure that the working temperature remains stable. The temperature measurement probe tests the surface temperature of the product in the scintillator array and the surface temperature of the CMOS detector at any time and transmits them to the PLC system in real time for stable regulation.

[0006] Further, for the above device for testing the temperature change performance of a scintillator array, the heating sheet adopts a silicone heating sheet, and the temperature control range reaches 25 - 80°C.

[0007] Further, for the above device for testing the temperature change performance of a scintillator array, there are inwardly recessed notches on both sides of the test plate, so that the heating sheet extends out from the notches on both sides of the test plate.

[0008] Further, for the above device for testing the temperature change performance of a scintillator array, a protective film is provided on the surface of the FOP detector.

[0009] Further, for the above device for testing the temperature change performance of a scintillator array, a scintillator array product to be tested is placed on the scintillator array area.

[0010] Further, for the above device for testing the temperature change performance of a scintillator array, the temperature measurement probe includes: an FOP surface temperature measurement probe and a scintillator array physical temperature measurement probe. The FOP surface temperature measurement probe is connected to the FOP detector to monitor its surface temperature, and the scintillator array physical temperature measurement probe is connected to the scintillator array product to measure the temperature of the scintillator array product therein.

[0011] Further, for the above device for testing the temperature change performance of a scintillator array, the scintillator array physical temperature measurement probe is connected to an instrument temperature controller to display the temperature of the scintillator array product, and the instrument temperature controller is connected to the PLC system to control and adjust the temperature through the PLC system.

[0012] Further, for the above device for testing the temperature change performance of a scintillator array, the PLC system is connected to the temperature control system at the host end using a data communication line to automatically control the temperature through the temperature control system. Program temperature control is adopted. After the temperature of the CMOS detector exceeds the upper limit, heating is stopped. When the scintillator array product is taken out by opening the test device, temperature control is automatically stopped, and temperature control is automatically started after the test device is closed.

[0013] Further, for the above device for testing the temperature change performance of a scintillator array, the instrument temperature controller is also directly connected to the heating sheet to display the actual temperature of the heating sheet.

[0014] From the above technical solutions, it can be seen that the present utility model has the following beneficial effects: The device for testing the temperature change performance of a scintillator array according to the present utility model has a simple structure and is convenient to use. The temperature control system programs to control the PLC system to automatically achieve temperature control, evenly ensuring the stability of each area of the test device, making it reach equilibrium, ensuring the test accuracy of the equipment, increasing the test performance accuracy rate by 30%, and increasing the test efficiency by 60%. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of the device for testing the temperature change performance of a scintillator array according to the present utility model;

[0016] Figure 2 is a schematic structural design diagram of the temperature control and temperature measurement systems of the present utility model.

[0017] In the figure: bottom plate 1, heating sheet 2, test plate 3, temperature measurement probe 4, FOP detector 31, scintillator array 32, FOP surface temperature test probe 41, scintillator array physical temperature test probe 42. Detailed implementation

[0018] Example 1

[0019] As Figure 1-2 shown, a device for testing the temperature change performance of a scintillator array includes: a bottom plate 1, a heating sheet 2, a test plate 3, a temperature measurement probe 4, and a PLC system; the heating sheet 2 is arranged on the bottom plate 1; the test plate 3 is covered on the heating sheet 2, a FOP detector 31 is provided in the middle of the test plate 3, a scintillator array 32 is arranged in the middle of the FOP detector 31, a CMOS detector is provided below the scintillator array 32, and a scintillator array product to be tested is placed on the scintillator array 32; the temperature measurement probe 4 is arranged on the test plate 3, on both sides of the FOP detector 31; the PLC system receives the signal of the temperature measurement probe 4 and controls the heating temperature of the heating sheet 2 to ensure that the working temperature remains stable. The temperature measurement probe 4 tests the surface temperature of the product in the scintillator array 32 and the surface temperature of the CMOS detector at any time, and transmits them to the PLC system in real time for stable regulation.

[0020] In this embodiment, the heating sheet 2 is a silicone heating sheet, and the temperature control range reaches 25 - 80 °C. There are inwardly concave notches on both sides of the test plate 3, so that the heating sheet 2 extends out from the notches on both sides of the test plate 3.

[0021] As Figure 2 shown, a device for testing the temperature change performance of a scintillator array, the temperature measurement probe 4 includes: a FOP surface temperature test probe 41 and a scintillator array physical temperature test probe 42. The FOP surface temperature test probe 41 is connected to the FOP detector 31 to monitor its surface temperature, and the scintillator array physical temperature test probe 42 is connected to the scintillator array 32 to test the temperature of the scintillator array product therein.

[0022] Example 2

[0023] Based on Example 1, in this embodiment, as Figure 2 shown, a device for testing the temperature change performance of a scintillator array, the scintillator array physical temperature test probe 42 is connected to an instrument temperature controller to display the temperature of the scintillator array product, and the instrument temperature controller is connected to the PLC system to control and adjust the temperature through the PLC system.

[0024] In this embodiment, the PLC system is connected to the temperature control system at the host end using a data communication line, and the temperature is automatically controlled through the temperature control system. The instrument temperature controller is also directly connected to the heating element 2 to display the actual temperature of the heating element. Program temperature control is adopted. After the temperature of the CMOS detector exceeds the upper limit, heating is stopped. When the scintillator array product is taken out by opening the test device, temperature control is automatically stopped, and temperature control is automatically started after the test device is closed. The temperature control is automatically realized by the PLC system through the temperature control system program, ensuring the stability of each area of the test device evenly and improving the test accuracy of the equipment.

[0025] In this embodiment, a protective film is provided on the surface of the FOP detector 31.

[0026] It should be noted that the above is only the technical solution of the utility model rather than a limitation. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solution of the utility model can be modified or equivalently replaced without departing from the scope of the technical solution of the present utility model, and all of them should be covered by the scope of the claims of the present utility model.

Claims

1. A test device for the temperature change performance of a scintillator array, characterized in that: Comprising: Base plate (1); Heating sheet (2), which is arranged on the base plate (1); Test plate (3), which covers the heating sheet (2). An FOP detector (31) is provided in the middle of the test plate (3). A scintillator array (32) is arranged in the middle of the FOP detector (31). A CMOS detector is provided below the scintillator array (32); Temperature measurement probe (4), which is arranged on the test plate (3) and on both sides of the FOP detector (31); PLC system, which receives the signal from the temperature measurement probe (4) and controls the heating temperature of the heating sheet (2) to ensure that the working temperature remains stable.

2. The test device for the temperature change performance of a scintillator array according to claim 1, characterized in that: The heating sheet (2) adopts a silicone heating sheet, and the temperature control range reaches 25 - 80 °C.

3. The test device for the temperature change performance of a scintillator array according to claim 1, characterized in that: There are inwardly recessed notches on both sides of the test plate (3), so that the heating sheet (2) extends out from the notches on both sides of the test plate (3).

4. A test device for the temperature change performance of a scintillator array according to claim 1, characterized in that: A protective film is provided on the surface of the FOP detector (31).

5. The test device for the temperature change performance of a scintillator array according to claim 1, wherein: The scintillator array product to be measured is placed on the scintillator array (32).

6. The test device for the temperature change performance of a scintillator array according to claim 1, characterized in that: The temperature measurement probe (4) includes: FOP surface temperature measurement probe (41), scintillator array product physical temperature measurement probe (42). The FOP surface temperature measurement probe (41) is connected to the FOP detector (31) to monitor its surface temperature. The scintillator array physical temperature measurement probe (42) is connected to the scintillator array (32) to measure the temperature of the scintillator array product therein.

7. The test device for the temperature change performance of a scintillator array according to claim 1, wherein: The scintillator array physical temperature measurement probe (42) is connected to an instrument temperature controller to display the temperature of the scintillator array product. The instrument temperature controller is connected to the PLC system, and the temperature is controlled and adjusted through the PLC system.

8. The test device for the temperature change performance of a scintillator array according to claim 7, characterized in that: The PLC system is connected to the temperature control system at the host end using a data communication line, and the temperature is automatically controlled through the temperature control system.

9. The test device for the temperature change performance of a scintillator array according to claim 8, wherein: [[ID=

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