Electronic equipment
By using a horizontal backplane in the server to set it in parallel with the computing node and connected orthogonally through the hard disk adapter board, the problem of heat dissipation channel occlusion caused by the large space of the backplane is solved, and a more efficient heat dissipation effect is achieved and the reliability of the equipment is improved.
Patent Information
- Application Number
- CN202422369958.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-26
AI Technical Summary
Due to the large space occupied by the backplane in the server, the heat dissipation channel is blocked, affecting the heat dissipation effect and reducing the operating reliability of electronic devices.
The horizontal backplane is arranged in parallel with the computing node and is connected orthogonally through the hard disk adapter board to prevent the heat dissipation channel from being blocked by the circuit board, and the heat dissipation channel formed by the fan is not blocked.
It improves the heat dissipation effect of electronic devices and improves the reliability of the devices.
Smart Images

Figure CN223180626U_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the field of heat dissipation technology, and in particular to an electronic device. Background Art
[0002] With the development of network technology, the use of electronic devices such as servers to host and store applications is becoming more and more widespread. As the computing workload increases, the heat generated by the servers also gradually increases.
[0003] In a server, compute nodes are deployed for computing and hard disks are deployed for storage. The electrical connection between the compute nodes and hard disks is achieved through a backplane. However, since the backplane needs to provide connectors for the compute nodes and hard disks, it takes up a large space, which requires a large backplane area. When cooling the server through air cooling, the heat dissipation channels occupied by the backplane will affect the heat dissipation of electronic equipment such as the server, causing problems such as overheating and reducing the operational reliability of the electronic equipment. Summary of the Invention
[0004] To overcome the problems existing in the related art, this specification provides an electronic device.
[0005] According to a first aspect of the embodiments of this specification, an electronic device is provided, including:
[0006] Box;
[0007] a fan, disposed in the box;
[0008] a horizontal back plate, fixed to the middle of the box body, with a first connector provided on an edge facing the first side of the box body and a second connector provided on an edge facing the second side of the box body;
[0009] A computing node is horizontally arranged in the box and electrically connected to the horizontal backplane through a third connector and the second connector provided therein;
[0010] a hard disk adapter board, arranged orthogonally to the horizontal backplane, and electrically connected to the horizontal backplane via a fourth connector provided on the hard disk adapter board and the first connector;
[0011] The hard disk is plugged into the hard disk adapter board.
[0012] Optionally, the number of the horizontal back plates is at least two, and the at least two horizontal back plates are stacked in the vertical direction;
[0013] The number of the fourth connectors provided on the hard disk adapter board corresponds to the number of the horizontal backplanes.
[0014] Optionally, the number of the horizontal backplanes is at least two, and the at least two horizontal backplanes are stacked in the vertical direction;
[0015] Two adjacent horizontal backplanes are grouped as a set of horizontal backplanes;
[0016] The number of the fourth connectors provided on the hard disk adapter board corresponds to the number of a set of horizontal backplanes.
[0017] Optionally, the fourth connector is a gold finger.
[0018] Optionally, the electronic device further includes:
[0019] A fitting, disposed in the middle of the box body, separating and supporting the horizontal backplane and the computing node;
[0020] Wherein, insertion interfaces corresponding to the second connector and the third connector are formed on the fitting.
[0021] Optionally, ventilation openings are further formed on the fitting.
[0022] Optionally, the electronic device further includes:
[0023] An interconnection signal board, fixed to the fitting, and electrically connected to the computing nodes plugged on the horizontal backplane respectively.
[0024] Optionally, the fan is located in the middle of the box body.
[0025] Optionally, the fan is located on one side of the air outlet of the box body.
[0026] Optionally, the electronic device is a server.
[0027] The technical solutions provided by the embodiments of this specification may include the following beneficial effects:
[0028] In the embodiments of this specification, in the electronic device, the backplane is horizontally arranged, parallel to the computing node, and orthogonally connected through the hard disk adapter board, so that the heat dissipation channel formed by the fan in the electronic device will not be blocked by the circuit board arranged therein, the heat dissipation effect is improved, and the reliability of the electronic device is enhanced.
[0029] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The accompanying drawings here are incorporated into the specification and constitute a part of this specification, showing the embodiments conforming to this specification, and are used together with the specification to explain the principles of this specification.
[0031] Figure 1 is a schematic top view of an electronic device according to an embodiment of the present application, wherein a portion of the top plate is hidden;
[0032] Figure 2 is a schematic side view of an electronic device according to an embodiment of the present application;
[0033] Figure 3 is a schematic side view of the structure of an electronic device involved in an embodiment of the present application, wherein the horizontal back panels are arranged in groups;
[0034] Figure 4 This is a schematic diagram of the structure of an electronic device involved in an embodiment of the present application, wherein structures such as computing nodes are hidden;
[0035] Figure 5 This is a schematic diagram of the retest structure of an electronic device involved in an embodiment of the present application, wherein the fan is arranged on the second side of the box. DETAILED DESCRIPTION
[0036] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.
[0037] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0038] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are merely used to distinguish information of the same type from one another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information without departing from the scope of this specification. Depending on the context, the term "if" as used herein may be interpreted as "when," "when," or "in response to determining."
[0039] This application provides an electronic device 100, such as Figure 1 Shown, including:
[0040] Cabinet 1, which may include a bottom plate 10, a top plate 11 and side plates 12. An air inlet is formed on the first side 1A of the cabinet 1, and an air outlet is formed on the second side 1B of the cabinet 1. The positions of the air outlet and the air inlet can be set according to actual needs. This is only an exemplary description and is not limited thereto;
[0041] Fan 2, disposed in the cabinet 1. The position of the fan 2 can be set according to actual needs. For example, it can be disposed in the middle of the cabinet 1, at the air outlet or the air inlet. By the operation of the fan 2, cold air can be drawn into the cabinet 1 from the air inlet and discharged from the side of the air outlet of the cabinet 1;
[0042] Horizontal backplane 3, fixed in the middle of the cabinet 1. A first connector 30 is provided at the edge facing the first side 1A of the cabinet 1, and a second connector 31 is provided at the edge facing the second side 1B of the cabinet 1;
[0043] Computing node 4, horizontally disposed in the cabinet 1 and electrically connected to the horizontal backplane 3 through a third connector 40 provided thereon and the second connector 31;
[0044] Hard disk adapter board 5, disposed orthogonally to the horizontal backplane 3 and electrically connected to the horizontal backplane 3 through a fourth connector 50 provided thereon and the first connector 30. Among them, the first connector 30, the second connector 31, the third connector 40 and the fourth connector 50 can be selected according to actual needs;
[0045] Hard disk 6, plugged into the hard disk adapter board 5.
[0046] Figure 1 The display of a part of the top plate 11 is removed to show the internal structure of the electronic device 100.
[0047] The number of the horizontal backplanes 3 and the computing nodes 4 can correspond to each other, or the number of the horizontal backplanes 3 can be set to be greater than that of the computing nodes 4, that is, several horizontal backplanes 3 are left vacant. The two are arranged in parallel, which can avoid the blockage of the heat dissipation channel caused by the vertical arrangement of the backplane.
[0048] In this way, after the cold air is inhaled from the air inlet by the fan 2, it can stably enter the interior of the electronic device 100, avoiding the insufficient heat dissipation efficiency inside the electronic device caused by the blockage of the heat dissipation channel, resulting in the damage of the electronic device, and improving the reliability of the electronic device.
[0049] It should be noted that the electronic device may include a personal computer, a switch, a router, a server, etc. The computing node 4 may be a circuit board provided with a processor. Correspondingly, the horizontal backplane 3 may be a circuit board connecting a power supply, etc., which can be selected according to actual needs.
[0050] In some cases, optionally, as Figure 2 shown, the number of the horizontal backplanes 3 is at least two. In Figure 2 , the horizontal backplane 3 may include a horizontal backplane 3A and a horizontal backplane 3B. At least two horizontal backplanes 3 are stacked in the vertical direction. Specifically, the horizontal backplane 3A may be disposed at the bottom layer, and the horizontal backplane 3B may be disposed on the upper side of the horizontal backplane 3A, thereby forming a stacked relationship in the vertical direction;
[0051] The number of the fourth connectors 50 provided on the hard disk adapter board 5 corresponds to the number of the horizontal backplanes 3.
[0052] Since the function of the hard disk adapter board 5 is to connect the hard disks 6 provided in the electronic device 100, when the number of the hard disks 6 is multiple, it is necessary to make the number of the fourth connectors 50 provided on the hard disk adapter board 5 consistent with the number of the hard disks 6, so that the computing node 4 can access each of the provided hard disks 6 through the horizontal backplane 3. For example, when there are 2 horizontal backplanes 3, 2 fourth connectors 50 also need to be provided on the hard disk adapter board 5, so that each computing node 4 connected to the horizontal backplane 3 can access each hard disk 6. Of course, in some cases, the number of the computing nodes 4 may be less than the number of the horizontal backplanes 3, that is, one position of the computing node 4 is left vacant. If a computing node 4 is plugged in at the vacant position later, the hard disk 6 can also be accessed.
[0053] Optionally, as Figure 3 shown, the number of the horizontal backplanes 3 is at least two. At least two horizontal backplanes 3 are stacked in the vertical direction. In Figure 3 , the horizontal backplane 3 may include a horizontal backplane 3A, a horizontal backplane 3B, a horizontal backplane 3C, and a horizontal backplane 3D;
[0054] Two adjacent horizontal backplanes 3 are divided into a group of horizontal backplanes 32. For example, in Figure 3 , the horizontal backplane 3A and the horizontal backplane 3B are classified into the horizontal backplane group 32A, and the horizontal backplane 3C and the horizontal backplane 3D are classified into the horizontal backplane group 32B;
[0055] The number of the fourth connectors 50 provided on the hard disk adapter board 5 corresponds to the number of a group of horizontal backplanes 3.
[0056] Each hard disk adapter board 5 is connected to a group of horizontal backplanes 3. Then, the number of the fourth connectors 50 on one hard disk adapter board 5 needs to be consistent with the number of the horizontal backplanes 3 included in the group. As Figure 3 shown, that is to say, when a group of horizontal backplanes 3 includes 2 horizontal backplanes, the number of the hard disk adapter boards 5 is also set to 2.
[0057] Of course, the number of the horizontal backplanes 3 included in a set of horizontal backplanes can be set according to actual requirements. Therefore, the number of the fourth connectors 50 provided on each hard disk adapter board 5 can also correspond thereto, without limitation.
[0058] In the case where the above-mentioned hard disk adapter board 5 needs to be connected to a plurality of horizontal backplanes 3, the hard disk 6 can correspond to a multi-port disk. An integrated connector can be provided on the hard disk adapter board 5 and plugged into the port of the hard disk 6. On the side of the hard disk adapter board 5 connected to the horizontal backplane 3, the pins of the port of the hard disk 6 can be distinguished, so as to divide a plurality of fourth connectors 50, so that the number of the fourth connectors 50 corresponds to the horizontal backplane 3, so that a plurality of computing nodes 4 can access the same hard disk 6 through their connection with the horizontal backplane 3.
[0059] In order to improve the insertion and extraction force of the connector between the computing node 4 and the horizontal backplane 3, the second connector 31 on the horizontal backplane 3 can be a connector bent from the board body of the horizontal backplane 3 toward the second side 1B of the box body 1, so as to increase the insertion and extraction force between the second connector 31 and the third connector 40 and avoid loosening of the two.
[0060] Optionally, the fourth connector 50 can be a gold finger or other types of connectors, which can be selected according to the driver's needs.
[0061] Optionally, the electronic device 100, such as Figure 4 shown, further includes:
[0062] A fitting 7 is arranged in the middle of the box body 1 to separate and support the horizontal backplane 3 and the computing node 4. A support portion and a connection portion (such as screw holes matching screws, etc.) can be provided on the fitting 7. The fitting 7 is arranged between the horizontal backplane 3 and the computing node 4 to separate the two, and through the support portions protruding to both sides, the horizontal backplane 3 and / or the computing node 4 can be supported. The connection portion can be used to connect and fix the computing node 4 and / or the horizontal backplane 3;
[0063] Wherein, an insertion port 70 corresponding to the first connector 30 and the third connector 40 is opened on the fitting 7.
[0064] In Figure 4 , the display of the computing node 4 is omitted, and only a part on one side of the horizontal backplane 3 is shown to display structures such as the fitting 7. When installing the horizontal backplane 3, the fitting 7 needs to correspond to the insertion port 70 on the horizontal backplane 3, so that the second connector 31 can be opened to the plugged computing node 4 through the insertion port 70, and the connection between the third connector 40 of the computing node 4 and the second connector 31 of the horizontal backplane 3 can be realized.
[0065] Optionally, a ventilation opening 71 is also provided on the fitting 7.
[0066] On the basis of meeting the requirements of support and connection, the size of the insertion interface 70 can be enlarged as much as possible, and a ventilation opening 71 different from the insertion interface 70 can be provided on the fitting 7, so as to reduce the blockage of the installation of the fitting 7 to the heat dissipation channel. Thus, on the basis of meeting the support and fixation of the horizontal backplane 3 and the computing node 4, the maximum heat dissipation efficiency can be achieved. It should be noted that in some cases, the insertion interface 70 can also serve as the ventilation opening 71.
[0067] Optionally, the electronic device 100 further includes:
[0068] An interconnection signal board 8, fixed to the fitting 7, is electrically connected to the computing nodes 3 plugged into the horizontal backplane 3 respectively.
[0069] The interconnection signal board 8 is connected to a plurality of computing nodes 3 respectively, so that data interaction can be carried out between these computing nodes 3.
[0070] Optionally, as Figure 1 shown, the fan 2 is located in the middle of the box body 1, which can make the cold air inhaled by the electronic device 100 obtain more balanced power to pass through the electronic device 100, and avoid the reduction of the heat dissipation effect caused by the deceleration of the inhaled cold air blocked by the components in the electronic device 100.
[0071] Optionally, as Figure 5 shown, the fan 2 is located on the air outlet side of the box body 1, which can make the cold air inhaled by the electronic device 100 obtain more stable power to be discharged from the electronic device 100, and avoid the reduction of the heat dissipation effect caused by the deceleration of the inhaled cold air blocked by the components in the electronic device 100.
[0072] Optionally, the electronic device 100 is a server.
[0073] The technical solutions provided by the embodiments of this specification may include the following beneficial effects:
[0074] In the embodiments of this specification, in the electronic device, the backplane is horizontally arranged, parallel to the computing node, and orthogonally connected through the hard disk adapter board, so that the heat dissipation channel formed by the fan in the electronic device will not be blocked by the circuit board arranged therein, the heat dissipation effect is improved, and the reliability of the electronic device is enhanced.
[0075] For the specific implementation process of the functions and effects of each module in the above device, please refer to the implementation process of the corresponding steps in the above method for details, which will not be repeated here.
[0076] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to the descriptions in the method embodiments. The device embodiments described above are merely illustrative. The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed to multiple network modules. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution in this specification. A person of ordinary skill in the art can understand and implement it without creative efforts.
[0077] After considering the specification and practicing the invention described herein, those skilled in the art will readily conceive of other embodiments of this specification. This specification is intended to cover any variations, uses, or adaptations of this specification, which follow the general principles of this specification and include common general knowledge or conventional technical means in the technical field not claimed in this specification. The specification and the embodiments are only regarded as exemplary, and the true scope and spirit of this specification are pointed out by the following claims.
[0078] It should be understood that this specification is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of this specification is only limited by the appended claims.
[0079] The above are only the preferred embodiments of this specification and are not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification shall be included within the scope of protection of this specification.
Claims
1. An electronic device, characterized in that, Comprising: A cabinet; A fan, disposed in the cabinet; A horizontal backplane, fixed to the middle of the cabinet, with a first connector provided at the edge facing the first side of the cabinet and a second connector provided at the edge facing the second side of the cabinet; A computing node, horizontally disposed in the cabinet, and electrically connected to the horizontal backplane through a third connector provided thereon and the second connector; A hard disk adapter board, disposed orthogonally to the horizontal backplane, and electrically connected to the horizontal backplane through a fourth connector provided thereon and the first connector; A hard disk, plugged into the hard disk adapter board.
2. The electronic device according to claim 1, wherein The number of the horizontal backplanes is at least two, and at least two horizontal backplanes are stacked in the vertical direction; The number of the fourth connectors provided on the hard disk adapter board corresponds to the number of the horizontal backplanes.
3. The electronic device according to claim 1, characterized in that, The number of the horizontal backplanes is at least two, and at least two horizontal backplanes are stacked in the vertical direction; Two adjacent horizontal backplanes are grouped as a set of horizontal backplanes; The number of the fourth connectors provided on the hard disk adapter board corresponds to the number of a set of horizontal backplanes.
4. The electronic device according to claim 1, wherein The fourth connector is a gold finger.
5. The electronic device according to claim 2, characterized in that, Further comprising: A fitting, disposed in the middle of the cabinet, separating and supporting the horizontal backplane and the computing node; Wherein, insertion ports corresponding to the second connector and the third connector are provided on the fitting.
6. The electronic device according to claim 5, wherein Ventilation openings are further provided on the fitting.
7. The electronic device according to claim 5, characterized in that, Further comprising: An interconnection signal board, fixed to the fitting, and electrically connected to the computing nodes plugged into the horizontal backplane respectively.
8. The electronic device according to claim 1, wherein The fan is located in the middle of the cabinet.
9. The electronic device according to claim 1, wherein The fan is located on the air outlet side of the cabinet.
10. The electronic device according to claim 1, wherein The electronic device is a server.