Temperature acquisition device and battery module

Abstract

The utility model relates to a temperature acquisition device and a battery module, the temperature acquisition device comprises a packaging shell, a temperature acquisition assembly and a mounting part, the packaging shell is internally provided with an accommodating cavity with an opening at one end, the temperature acquisition assembly extends into the accommodating cavity from the opening and is partially packaged in the accommodating cavity, and the mounting part is arranged in the accommodating cavity. The mounting part comprises a mounting section and a connecting section which are connected with each other, the connecting section is connected with the packaging shell, the mounting section is arranged in a bendable manner, and the mounting section is provided with a mounting surface for fixedly mounting the outer shell of the battery module. According to the temperature acquisition device and the battery module provided by the utility model, the problems of large occupied space and poor installation applicability of the existing temperature sensor are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of energy storage batteries, in particular to a temperature acquisition device and a battery module. Background Art

[0002] In recent years, the new energy electric vehicle industry has developed vigorously, and the power battery technology, the core of electric vehicles, has also made continuous progress, and is constantly developing in the directions of high safety, high integration, light weight, low cost, etc. As one of the key components of new energy battery packs, the materials and integration processes of CCS integrated busbars are also developing in the same direction. The CCS integrated busbar is an electrical connection structural part in the battery module. By integrating components such as information acquisition components (wiring harness / FPC / FFC, etc.), plastic structural parts, and aluminum busbars into a module and installing it in the battery module, functions such as high-voltage series and parallel connection of battery cells, temperature acquisition of the battery, voltage acquisition of battery cells, and overcurrent fusing are realized, and it belongs to a part of the BMS battery management system.

[0003] At present, the temperature sensors responsible for battery temperature acquisition are generally directly installed on the battery housing, occupying a large space, resulting in poor installation applicability of the temperature sensors. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a temperature acquisition device and a battery module, aiming to solve the problems that the existing temperature sensors occupy a large space and have poor installation applicability.

[0005] To achieve the above object, a temperature acquisition device proposed by the utility model includes a packaging housing, a temperature acquisition component, and an installation part. An accommodation cavity with one end open is provided in the packaging housing. The temperature acquisition component extends into and is partially encapsulated in the accommodation cavity from the opening. The installation part includes an installation section and a connection section connected to each other. The connection section is connected to the packaging housing. The installation section is bendable, and the installation section has an installation surface for fixedly installing the outer housing of the battery module.

[0006] According to some embodiments of the utility model, the accommodation cavity is filled with insulating glue.

[0007] According to some embodiments of the utility model, anti-detachment holes are formed in the inner wall of the accommodation cavity, and the anti-detachment holes are filled with the insulating glue.

[0008] According to some embodiments of the utility model, anti-detachment grooves are formed in the inner wall of the accommodation cavity. The extending direction of the anti-detachment grooves is perpendicular to the direction in which the temperature acquisition component extends into and is installed, and the anti-detachment grooves are filled with the insulating glue.

[0009] According to some embodiments of the present utility model, a plurality of anti - detachment grooves are provided, and the plurality of anti - detachment grooves are arranged at intervals along the direction in which the temperature acquisition component extends and is installed.

[0010] According to some embodiments of the present utility model, the temperature acquisition component includes a temperature acquisition element and two wires for connecting to a circuit board, and the two wires are electrically connected to two ends of the temperature acquisition element respectively.

[0011] According to some embodiments of the present utility model, the two wires extend out from the opening of the accommodation cavity, and the two wires are bundled into the same wire harness.

[0012] According to some embodiments of the present utility model, a compressive insulation layer is coated on the temperature acquisition element.

[0013] According to some embodiments of the present utility model, the encapsulation housing is cylindrical.

[0014] In addition, the present utility model also provides a battery module, and the battery module includes the temperature acquisition device as described in any one of the above.

[0015] The present utility model has at least the following beneficial effects:

[0016] In the present utility model, an accommodation cavity with an opening at one end is provided in the encapsulation housing, the temperature acquisition component extends in from the opening and is partially encapsulated in the accommodation cavity, the installation part includes an installation section and a connection section connected to each other, the connection section is connected to the encapsulation housing, the installation section can be bent, and the installation section has an installation surface for fixedly installing the outer housing of the battery module. Compared with the existing temperature sensor where the encapsulation housing is stacked on the installation part, in this application, the encapsulation housing is installed on the connection section of the installation part, greatly reducing the thickness of the temperature acquisition device, thereby reducing the occupied space of the temperature acquisition device. At the same time, the installation section can be bent, enabling the installation part to be installed at any position on the battery module housing, improving the installation applicability of the temperature acquisition device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present utility model, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic structural diagram of a temperature acquisition device provided by an embodiment of the present utility model;

[0019] Figure 2 is Figure 1 a schematic diagram of the internal structure of the encapsulation housing in

[0020] Figure 3 is Figure 1 a side view of the temperature acquisition device in

[0021] Description of the reference numerals:

[0022] 100 - temperature acquisition device; 1 - encapsulation housing; 11 - anti - detachment hole; 12 - anti - detachment groove; 2 - temperature acquisition component; 21 - temperature acquisition element; 22 - wire; 23 - compressive insulation layer; 3 - installation part; 31 - connection section; 32 - installation section; 4 - insulating glue. Specific embodiments

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0025] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0026] The present invention provides a temperature acquisition device and a battery module, Figures 1 to 3 which is a specific embodiment of a temperature acquisition device provided by the present invention.

[0027] As Figure 1 shown, an embodiment of the present utility model provides a temperature acquisition device 100, which includes a packaging housing 1, a temperature acquisition component 2, and a mounting portion 3. The packaging housing 1 is provided with a receiving cavity with an open end. The temperature acquisition component 2 extends into and is partially packaged in the receiving cavity from the opening. The mounting portion 3 includes a mounting section 32 and a connecting section 31 that are connected to each other. The connecting section 31 is connected to the packaging housing 1. The mounting section 32 is bendable, and the mounting section 32 has a mounting surface for fixedly mounting the outer housing of the battery module.

[0028] In the present utility model, the packaging housing 1 is provided with a receiving cavity with an open end. The temperature acquisition component 2 extends into and is partially packaged in the receiving cavity from the opening. The mounting portion 3 includes a mounting section 32 and a connecting section 31 that are connected to each other. The connecting section 31 is connected to the packaging housing 1. The mounting section 32 is bendable, and the mounting section 32 has a mounting surface for fixedly mounting the outer housing of the battery module. Compared with the existing temperature sensor where the packaging housing 1 is stacked on the mounting portion 3, in this application, the packaging housing 1 is mounted on the connecting section 31 of the mounting portion 3, which greatly reduces the thickness of the temperature acquisition device 100, thereby reducing the occupied space of the temperature acquisition device 100. At the same time, the mounting section 32 is bendable, enabling the mounting portion 3 to be mounted at any position on the battery module housing, improving the mounting applicability of the temperature acquisition device 100.

[0029] It should be noted that the material of the mounting portion 3 includes nickel metal material, which is not only corrosion-resistant but also has good thermal conductivity, can improve the thermal conductivity of the temperature acquisition device 100, and at the same time, nickel metal has good ductility and can be bent.

[0030] Generally, the temperature acquisition component 2 needs to be insulated to prevent the temperature acquisition component 2 from being broken down in a strong electric field environment, resulting in temperature acquisition failure. Therefore, in some embodiments, as Figure 1 shown, an insulating glue 4 is filled in the receiving cavity. With this arrangement, the insulating glue 4 wraps the temperature acquisition component 2. On the one hand, it plays an insulating role to prevent the temperature acquisition component 2 from being broken down in a strong electric field environment, resulting in temperature acquisition failure. On the other hand, it plays a buffering role to avoid damage to the temperature acquisition component 2 when the packaging housing 1 is squeezed.

[0031] Specifically, the material of the insulating glue 4 is not limited, as long as it can ensure that the insulating glue 4 can meet the insulation requirements of the temperature acquisition component 2. For example, in some embodiments, the material of the insulating glue 4 includes one of epoxy resin, silicone resin, and phenolic resin. The above several resins all have good insulation performance and heat resistance, and can protect the temperature acquisition component 2 well in a high-temperature working environment.

[0032] Since the temperature acquisition component 2 extends into and is installed in the accommodation cavity from the opening of the accommodation cavity, in order to prevent the temperature acquisition component 2 from being pulled and separated from the accommodation cavity from the opening, in some embodiments, as Figure 2 shown, an anti-disengagement hole 11 is formed in the inner wall of the accommodation cavity, and the insulating glue 4 is filled in the anti-disengagement hole 11. With this arrangement, the insulating glue 4 flows into the anti-disengagement hole 11. Since the insulating glue 4 becomes hard after solidification, the hardened insulating glue 4 abuts against the hole wall of the anti-disengagement hole 11, and the insulating glue 4 wraps the temperature acquisition component 2, thereby restricting the temperature acquisition component 2 from separating from the accommodation cavity from the opening.

[0033] Specifically, the anti-disengagement hole 11 can be a through hole or a blind hole.

[0034] In some embodiments, as Figure 2 shown, an anti-disengagement groove 12 is formed in the inner wall of the accommodation cavity. The extending direction of the anti-disengagement groove 12 is perpendicular to the direction in which the temperature acquisition component 2 extends and is installed. The insulating glue 4 is filled in the anti-disengagement groove 12. The insulating glue 4 flows into the anti-disengagement groove 12. When the insulating glue 4 becomes hard after solidification, the insulating glue 4 abuts against the groove wall of the anti-disengagement groove 12. Since the extending direction of the anti-disengagement groove 12 is perpendicular to the direction in which the temperature acquisition component 2 extends and is installed, with this arrangement, the abutting area between the insulating glue 4 and the groove wall of the anti-disengagement groove 12 reaches the maximum, and at this time, the effect of restricting the temperature acquisition component 2 from separating from the accommodation cavity from the opening is the best.

[0035] Further, the number and layout position of the anti-disengagement grooves 12 are not limited. For example, in some embodiments, as Figure 2 shown, a plurality of anti-disengagement grooves 12 are provided, and the plurality of anti-disengagement grooves 12 are arranged at intervals along the direction in which the temperature acquisition component 2 extends and is installed. With this arrangement, the abutting area between the insulating glue 4 and the groove walls of the plurality of anti-disengagement grooves 12 reaches the maximum, and the temperature acquisition component 2 can be restricted from separating from the accommodation cavity from the opening to the greatest extent.

[0036] In some embodiments, as Figure 1As shown, the temperature acquisition component 2 includes a temperature acquisition element 21 and two wires 22 for connecting to a circuit board. The two wires 22 are electrically connected to both ends of the temperature acquisition element 21 respectively. Specifically, the temperature acquisition element 21 includes a negative temperature coefficient thermistor (NTC), and the higher the temperature, the lower the resistance value.

[0037] There is no limitation on the layout positions of the two wires 22, as long as it is ensured that the two wires 22 are electrically connected to both ends of the temperature acquisition element 21 respectively. For example, in some embodiments, as Figure 1 shown, the two wires 22 extend out from the opening of the accommodation cavity, and the two wires 22 are bundled into the same wire harness. With such a setting, the occupied area of the temperature acquisition device 100 is further reduced, and the two wires 22 being bundled into the same wire harness also makes it easier for the operator to route the wires.

[0038] Furthermore, in some embodiments, as Figure 1 shown, a compressive insulation layer 23 is coated on the temperature acquisition element 21. With such a setting, on the one hand, the insulation effect can be improved, and on the other hand, the temperature acquisition element 21 can be prevented from being damaged due to impact.

[0039] Specifically, the material of the compressive insulation layer 23 is epoxy resin. Epoxy resin not only has good insulation performance but also is heat-resistant and compressive, and can well protect the temperature acquisition element 21.

[0040] There is no limitation on the shape of the encapsulation housing 1, as long as the encapsulation housing 1 can protect the internal temperature acquisition component 2. For example, in some embodiments, as Figure 3 shown, the encapsulation housing 1 is arranged in a cylindrical shape. With such a setting, the curved outer wall can make some impacting objects slide away, thereby reducing the impact on the encapsulation housing 1, and when the temperature acquisition component 2 is in the middle of the accommodation cavity, the distances from all parts of the temperature acquisition component 2 to the inner wall of the encapsulation housing 1 are the same, so that there is no weak part in the encapsulation housing 1 for resisting pressure.

[0041] In addition, the present utility model also provides a battery module, including the temperature acquisition device 100. The temperature acquisition device 100 includes a housing, a temperature acquisition component 2 and a mounting part 3. An accommodation cavity with one end open is provided in the encapsulation housing 1. The temperature acquisition component 2 extends into and is partially encapsulated in the accommodation cavity from the opening. The mounting part 3 includes a mounting section 32 and a connecting section 31 connected to each other. The connecting section 31 is connected to the encapsulation housing 1. The mounting section 32 is bendable, and the mounting section 32 has a mounting surface for fixedly mounting the outer housing of the battery module.

[0042] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A temperature acquisition device, characterized in that, It includes a packaging housing, a temperature acquisition component, and an installation part. An accommodation cavity with one end open is provided inside the packaging housing. The temperature acquisition component extends into and is partially encapsulated in the accommodation cavity from the opening. The installation part includes an installation section and a connection section that are connected to each other. The connection section is connected to the packaging housing. The installation section is bendable. The installation section has an installation surface for fixedly installing the outer casing of the battery module.

2. The temperature acquisition device according to claim 1, characterized in that, The accommodation cavity is filled with insulating glue.

3. The temperature acquisition device according to claim 2, characterized in that, Anti-detachment holes are formed in the inner wall of the accommodation cavity, and the insulating glue is filled in the anti-detachment holes.

4. The temperature acquisition device according to claim 2, wherein, Anti-detachment grooves are formed in the inner wall of the accommodation cavity. The extending direction of the anti-detachment grooves is perpendicular to the direction in which the temperature acquisition component extends into and is installed. The insulating glue is filled in the anti-detachment grooves.

5. The temperature acquisition device according to claim 4, characterized in that There are multiple anti-detachment grooves, and the multiple anti-detachment grooves are arranged at intervals along the direction in which the temperature acquisition component extends into and is installed.

6. The temperature acquisition device according to claim 1, characterized in that, The temperature acquisition component includes a temperature acquisition element and two wires for connecting to a circuit board. The two wires are electrically connected to both ends of the temperature acquisition element respectively.

7. The temperature acquisition device according to claim 6, characterized in that, The two wires extend out from the opening of the accommodation cavity, and the two wires are bundled into the same wire harness.

8. The temperature acquisition device according to claim 6, characterized in that, A compressive insulation layer is coated on the temperature acquisition element.

9. The temperature acquisition device according to claim 1, characterized in that The packaging housing is cylindrical.

10. A battery module, characterized in that, It includes the temperature acquisition device according to any one of claims 1 to 9.

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