Separate excitation type ultrasonic nebulizer circuit board structure and nebulizer

Abstract

The utility model discloses a separately excited ultrasonic nebulizer circuit board structure which comprises a first distribution area, a third distribution area and a second distribution area arranged between the first distribution area and the third distribution area. The first distribution area is used for installing a power supply unit, and the third distribution area is used for installing an atomization unit; the second distribution area is used for mounting an atomizing sheet; the surface of the second distribution area is covered with a metal shielding assembly, and the power unit of the first distribution area is electrically connected with the atomization unit of the third distribution area through the metal shielding assembly. An atomizing sheet mounting area is arranged on the surface of the second distribution area, fourth connecting parts used for fixing an atomizing sheet are symmetrically arranged in the atomizing sheet mounting area, and the atomizing sheet is detachably connected with the circuit board structure through the fourth connecting parts. The utility model further discloses an atomizer. The technical problems that a circuit board of an existing separately-excited atomizer is serious in heating, low in heat dissipation efficiency and difficult to meet electromagnetic compatibility are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of atomizers, in particular to a circuit board structure and an atomizer of a heterodyne ultrasonic atomizer. Background Art

[0002] Ultrasonic atomizers have been widely used in life, such as ultrasonic atomizing humidifiers, ultrasonic atomizing aromatherapy machines, medical atomizers, etc. The working principle of an ultrasonic atomizer is to break up the water molecular structure into the air through the high-frequency resonance of an atomizing sheet. At present, most of the AC-powered ultrasonic atomizer products on the market adopt the traditional self-excited oscillation atomization circuit scheme. The AC power is converted into a DC voltage of about 30V by a switching power supply to supply power to the atomization circuit. This scheme is all single-sided boards, without MCU participation in control. The power device is a triode, with relatively low efficiency, high energy consumption, and serious heat generation of the power triode. A large-area metal heat sink is required to assist in heat dissipation. If the heat sink is omitted, the power triode will be burned out quickly. In addition, there are also a small number of heterodyne atomizer schemes that adopt the same circuit board structure and layout as the traditional self-excited atomization scheme. For example, a heterodyne ultrasonic atomizer circuit disclosed in the patent document with the application number 202420041018.5 uses a MOS tube with a TO-220 package as the power device, which is externally connected to the heat sink for heat dissipation. Although the heat generation problem is improved to a certain extent, the drain of the MOS tube with a TO-220 package is connected to the heat sink, and high-frequency voltage interference will be radiated out through the metal heat sink, making it difficult to meet the electromagnetic compatibility requirements and difficult to pass the EMC test. There is also no cost advantage. There is also a part of the scheme. In order to pass the EMC-related tests and reduce costs, the metal heat sink is omitted, and a MOS tube with a TO-252 surface mount package is used. The MCU and the power MOS tube of the atomization part are placed as close as possible, and various interference suppression measures are added to the MOS tube for the purpose of passing the EMC test by other means, resulting in huge heat generation of the MOS tube, indirectly causing the temperature of the MCU to be too high, exceeding the normal working temperature range of the MCU, which may cause abnormal operation of the MCU and pose great potential hazards. Therefore, it is urgent to propose a circuit board structure and an atomizer of a heterodyne ultrasonic atomizer to solve the technical problems of serious heat generation, low heat dissipation efficiency, and difficulty in meeting electromagnetic compatibility of the existing heterodyne atomizer circuit board. Summary of the Utility Model

[0003] The main purpose of the utility model is to propose a circuit board structure and an atomizer of a heterodyne ultrasonic atomizer, aiming to solve the technical problems of serious heat generation, low heat dissipation efficiency, and difficulty in meeting electromagnetic compatibility of the existing heterodyne atomizer circuit board.

[0004] To achieve the above object, the utility model provides a circuit board structure of a heterodyne ultrasonic atomizer, wherein the circuit board structure of the heterodyne ultrasonic atomizer includes:

[0005] A first distribution area, a third distribution area, and a second distribution area disposed between the first distribution area and the third distribution area;

[0006] The first distribution area is used for installing a power supply unit, and the third distribution area is used for installing an atomization unit;

[0007] The second distribution area is used for installing an atomization sheet; a shielding component made of metal is covered on the surface of the second distribution area, and the power supply unit in the first distribution area is electrically connected to the atomization unit in the third distribution area through the shielding component made of metal; an atomization sheet installation area is provided on the surface of the second distribution area, and fourth connection parts for fixing the atomization sheet are symmetrically arranged in the atomization sheet installation area, and the atomization sheet is detachably connected to the circuit board structure through the fourth connection parts.

[0008] One of the preferred solutions is that the shielding component made of metal is arranged in a strip or sheet structure and installed on the surface of the second distribution area, and the shielding component made of metal is connected to the ground terminal.

[0009] One of the preferred solutions is that the shielding component made of metal is attached to the surface of the second distribution area by any one of electroplating, spraying, coating, or welding.

[0010] One of the preferred solutions is that the shielding component made of metal is a copper foil.

[0011] One of the preferred solutions is that a plurality of second connection parts and fixing parts are provided in the atomization sheet installation area, and the fixing parts pass through the second connection parts and are fixedly connected to the atomizer base.

[0012] An atomizer including the circuit board structure of the self-excited ultrasonic atomizer described above, comprising:

[0013] An atomizer base and a water tank detachably installed on the atomizer base;

[0014] The atomizer base includes a bottom plate and a bottom shell, the bottom shell surrounds the bottom plate and is vertically arranged with the bottom plate to form a receiving cavity; an atomization sheet, an atomization sheet bracket, a circuit board structure, and a fixing part are provided in the receiving cavity, the atomization sheet is placed between the circuit board structure and the atomization sheet, and the fixing part sequentially passes through the circuit board structure and the atomization sheet to fixedly install the circuit board structure and the atomization sheet bracket on one side of the bottom shell close to the water tank.

[0015] One of the preferred solutions is that the atomization sheet bracket includes a mounting seat, a protruding part, and a plurality of first and fourth connection parts; the protruding part is arranged on the upper surface of the mounting seat, and a plurality of the first and fourth connection parts are spaced apart and arranged on the outer side surface of the mounting seat.

[0016] One of the preferred solutions is that the mounting base is provided with a first connection hole, and the inner diameter of the first connection hole is the same as the outer diameter of the atomizing sheet.

[0017] One of the preferred solutions is that the convex part is provided with a second connection hole, and the inner diameter of the second connection hole is smaller than the inner diameter of the first connection hole.

[0018] One of the preferred solutions is that the surface of the bottom shell is provided with a third connection hole, and the inner diameter of the third connection hole is the same as the outer diameter of the second connection hole.

[0019] In the above technical solution of the present invention, the circuit board structure of the externally-excited ultrasonic atomizer includes: a first distribution area, a third distribution area, and a second distribution area disposed between the first distribution area and the third distribution area; the first distribution area is used for installing a power supply unit, and the third distribution area is used for installing an atomizing unit; the second distribution area is used for installing an atomizing sheet; the surface of the second distribution area is covered with a shielding component made of metal, and the power supply unit in the first distribution area is electrically connected to the atomizing unit in the third distribution area through the shielding component made of metal; the surface of the second distribution area is provided with an atomizing sheet installation area, and the atomizing sheet installation area is symmetrically provided with fourth connection parts for fixing the atomizing sheet, and the atomizing sheet is detachably connected to the circuit board structure through the fourth connection parts. The present invention solves the technical problems of serious heat generation, low heat dissipation efficiency, and difficulty in meeting electromagnetic compatibility of the existing externally-excited atomizer circuit board.

[0020] In the present invention, by setting the circuit board structure into three areas, wherein the second distribution area is disposed between the first distribution area and the third distribution area, that is, the second distribution area is disposed between the two circuit installation areas, and copper foil is covered on the second distribution area, so as to conduct heat and dissipate heat for the power devices in the first distribution area and the third distribution area, reduce heat accumulation, and the heat dissipation of the power devices can be realized without installing a heat sink again, greatly reducing the cost, avoiding the problem that the PCB board of the atomizer does not meet electromagnetic compatibility due to the high heat dissipation of the power devices on the PCB board, providing other heat dissipation paths, enabling the power devices and the MCU to work within a normal and controllable safe temperature range, and increasing the reliability of the product.

[0021] In the present invention, by covering a large area of copper foil on the second distribution area, the ground wire impedance is reduced, and the electromagnetic compatibility and power supply efficiency of the circuit are improved. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0023] Figure 1 It is a schematic diagram of the circuit board structure of a self-excited ultrasonic atomizer according to an embodiment of the present invention;

[0024] Figure 2 It is a schematic diagram of an atomizer according to an embodiment of the present invention;

[0025] Figure 3 It is a cross-sectional view of an atomizer according to an embodiment of the present invention;

[0026] Figure 4 It is a bottom view of an atomizer according to an embodiment of the present invention.

[0027] Explanation of the reference numerals in the drawings:

[0028] 1. First distribution area;

[0029] 2. Second distribution area; 21. Atomizing sheet installation area; 22. Fourth connection part; 23. Second connection part; 24. Through hole;

[0030] 3. Third distribution area; 4. Atomizer base; 5. Sealing ring; 6. Atomizing sheet bracket; 7. Circuit board structure; 8. Atomizing sheet; 9. Mounting seat; 10. Protrusion; 11. First connection part; 12. Third connection part; 13. Bottom plate.

[0031] The realization of the purpose, functional characteristics and advantages of the present invention will be further described with reference to the embodiments and the drawings. Specific embodiments

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0033] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present utility model are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture (as shown in the attached drawings). If the specific posture changes, the directional indications will also change accordingly.

[0034] In addition, in the present utility model, descriptions such as "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0035] Moreover, the technical solutions between the various embodiments of the present utility model can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or is impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0036] See Figures 1-4 , according to one aspect of the present utility model, the present utility model provides a circuit board structure for a heterodyne ultrasonic atomizer, wherein the circuit board structure for the heterodyne ultrasonic atomizer includes:

[0037] A first distribution area 1, a third distribution area 3, and a second distribution area 2 disposed between the first distribution area 1 and the third distribution area 3;

[0038] The first distribution area 1 is used for installing a power supply unit, and the third distribution area 3 is used for installing an atomization unit;

[0039] The second distribution area 2 is used for installing an atomization sheet; the surface of the second distribution area 2 is covered with a shielding component made of metal, and the power supply unit in the first distribution area 2 is electrically connected to the atomization unit in the third distribution area 3 through the shielding component made of metal; an atomization sheet installation area 21 is provided on the surface of the second distribution area 2, and fourth connection parts 22 for fixing the atomization sheet are symmetrically arranged in the atomization sheet installation area 21, and the atomization sheet is detachably connected to the circuit board structure through the fourth connection parts 22.

[0040] Specifically, in this embodiment, the metal shielding component is attached to the surface of the second distribution area 2 by any one of electroplating, spraying, coating or welding, so as to conduct heat and dissipate heat to the power devices in the first distribution area 1 and the third distribution area, reduce heat accumulation, and no longer need to install a heat sink to achieve heat dissipation of the power devices, thereby greatly reducing costs and avoiding the problems of high heat generation and low heat dissipation efficiency of the power devices on the atomizer PCB board; the power devices and MCU can be operated below the temperature threshold, thereby increasing product reliability. In the present utility model, the temperature threshold is 60°C, and the circuit modules such as the power supply unit and the atomization unit of the first distribution area 1 and the third distribution area 3 are conventionally installed centrally. When the power supply unit and the atomization unit are installed, the operating ambient temperature of the power devices and the MCU of the circuit board exceeds 60°C. In a high temperature environment, it will cause performance degradation of the circuit devices in the circuit board, mechanical performance degradation and shortened life. For example, in a high temperature environment, the resistance value of the conductor material of the power device increases, and the electrical properties of the dielectric material change, resulting in a decrease in circuit performance. The utility model installs the power supply unit and the atomization unit in partitions, and sets a second distribution area 2 between the power supply unit and the atomization unit. A metal shielding component is set on the surface of the second distribution area 2, so that the power devices and the MCU work within a normal and controllable safe temperature range, that is, the temperature is controlled below 60°C, thereby enhancing the reliability of the product.

[0041] Specifically, in this embodiment, the metal shielding component is arranged in a plurality of strip or sheet-like structures and installed on the surface of the second distribution area 2, and is electrically connected to the power supply unit and the atomization unit in the first distribution area 1 and the third distribution area 3. The metal shielding component is also connected to the ground terminal. Among them, the plurality of strip or sheet-like metal shielding components can be closely connected or spaced from each other, so as to conduct heat and dissipate heat from the power devices in the first distribution area 1 and the third distribution area 3, provide multiple heat dissipation channels, reduce heat accumulation, and realize the heat dissipation of the power devices without additionally installing a heat sink, which greatly reduces the cost and avoids the problems of high heat generation and low heat dissipation efficiency of the power devices on the atomizer PCB board. The power devices and the MCU can work below the temperature threshold, increasing the reliability of the product. In the present utility model, the temperature threshold is 60 °C. When the circuit modules such as the power supply unit and the atomization unit in the first distribution area 1 and the third distribution area 3 are conventionally installed centrally, the ambient temperature at which the power devices and the MCU on the circuit board work exceeds 60 °C, which will cause problems such as degradation of the performance of the circuit devices, degradation of the mechanical performance, and shortening of the service life in a high-temperature environment. For example, in a high-temperature environment, the resistance value of the conductor material of the power device increases, and the electrical properties of the dielectric material change, resulting in a decrease in circuit performance. However, in the present utility model, by installing the power supply unit and the atomization unit in separate areas and arranging a second distribution area 2 between the power supply unit and the atomization unit, and installing a metal shielding component on the surface of the second distribution area 2, the power devices and the MCU work within a normal and controllable safe temperature range, that is, the temperature is controlled below 60 °C, enhancing the reliability of the product.

[0042] Specifically, in this embodiment, the metal shielding component is a copper foil. By covering the copper foil on the surface of the second distribution area, the electrical connection between the power supply unit in the first distribution area 1 and the atomization unit in the third distribution area 3 is realized. At the same time, as a shielding layer, it suppresses electromagnetic interference and improves the electromagnetic compatibility of the circuit board.

[0043] Specifically, in this embodiment, the atomization sheet installation area 21 is provided with at least a pair of fourth connection parts, and the fourth connection parts 22 are symmetrically arranged in the atomization sheet installation area 21. The fourth connection part 22 is a buckle structure. The atomization sheet is detachably connected to the circuit board structure through the buckle structure.

[0044] Specifically, in this embodiment, the atomizing sheet installation area 21 is provided with a plurality of second connection parts 23 and fixing parts. The fixing parts pass through the second connection parts 23 and are fixedly connected to the atomizer base. The fixing parts adopt bolts. By connecting the fixing parts to pass through a plurality of corresponding second connection parts 23, the circuit board structure is fixedly connected to the atomizer base. By providing a plurality of the second connection parts 23 on the circuit board structure, the atomizing sheet is directly installed on the atomizing sheet base, eliminating the structure of the atomizing sheet fixing metal component and saving the manufacturing cost of the atomizer. In the present invention, the atomizing sheet installation area 21 is provided with four second connection parts 23, and the number of the fixing parts is four. The present invention does not make specific limitations and can be specifically set according to needs.

[0045] Specifically, in this embodiment, a through hole 24 is provided at the center of the atomizing sheet installation area 21. The central axis of the through hole 24 coincides with the central axis of the atomizing sheet. The through hole 24 is used to ventilate the sealed space formed by the atomizing sheet and the atomizing sheet installation area 21 of the circuit board structure.

[0046] Specifically, in this embodiment, the length of the circuit board structure of the externally excited ultrasonic atomizer is 115 mm, and the width is 50 mm. The present invention does not make specific limitations and can be specifically set according to needs.

[0047] Specifically, in this embodiment, the circuit board structure of the externally excited ultrasonic atomizer is set as a square structure or an L-shaped structure, and can also be set as an S-shaped structure, etc. according to the needs of the atomizer structure. The present invention does not make specific limitations and can be specifically set according to needs.

[0048] Specifically, in this embodiment, by providing the second distribution area 2, the first distribution area 1 and the third distribution area 3 for installing the power supply unit and the atomizing unit are separated, so that the heat dissipation of the power devices provided in the power supply unit and the atomizing unit is separated, thereby reducing the concentrated heat dissipation of the circuit board structure and reducing the mutual interference between the first distribution area 1 and the third distribution area 3. At the same time, a metal shielding component is covered on the second distribution area 2 to conduct heat and dissipate heat from the power devices in the first distribution area 1 and the third distribution area 3, reducing heat accumulation. There is no need to install heat sinks for the power devices, greatly reducing the cost of the atomizer, and also avoiding the high heat dissipation of the power devices of the circuit board structure, resulting in damage to the functions of the circuit board structure devices. By providing the second distribution area 2, the power devices and the MCU work within a normal and controllable safe temperature range, improving the reliability of the product. By covering a large area of the second distribution area 2 with a metal shielding component, the ground wire impedance is reduced, the electromagnetic compatibility and power supply efficiency of the circuit are improved, enabling the circuit board structure to meet the requirements of electromagnetic compatibility, that is, meeting the EMC test.

[0049] An atomizer including the above-described self-excited ultrasonic atomizer circuit board structure 7, comprising:

[0050] An atomizer base and a water tank detachably mounted on the atomizer base 4;

[0051] The atomizer base 4 includes a bottom plate 13 and a bottom shell. The bottom shell surrounds the bottom plate 13 and is perpendicularly arranged with respect to the bottom plate 13 to form a receiving cavity. An atomizing sheet 8, an atomizing sheet bracket 6, a circuit board structure 7, and a fixing member are provided in the receiving cavity. The atomizing sheet 8 is placed between the circuit board structure 7 and the atomizing sheet 8. The fixing member sequentially passes through the circuit board structure 7 and the atomizing sheet 8 to fixedly mount the circuit board structure 7 and the atomizing sheet bracket 6 on one side of the bottom shell close to the water tank.

[0052] Specifically, in this embodiment, a step is provided on the outer side surface of the atomizer base 4 on the side close to the water tank, and the water tank realizes the plug-in fit with the atomizer base 4 through the step.

[0053] Specifically, in this embodiment, the atomizing sheet bracket 6 includes a mounting seat 9, a convex portion 10, and a plurality of first connecting portions 11. The convex portion 10 is provided on the upper surface of the mounting seat 9, and the plurality of first connecting portions 11 are spaced apart on the outer side surface of the mounting seat 9. The mounting seat 9 is provided with a first connecting hole, and the inner diameter of the first connecting hole is the same as the outer diameter of the atomizing sheet 8. The convex portion 10 is provided with a second connecting hole, and the inner diameter of the second connecting hole is smaller than the inner diameter of the first connecting hole. The first connecting hole and the second connecting hole are correspondingly and conductively arranged. The atomizing sheet 8 is placed in the first connecting hole of the mounting seat 9, and the upper surface of the atomizing sheet 8 abuts against the surface of the convex portion 10 close to the mounting seat 9, thereby realizing the positioning and installation of the atomizing sheet 8 on the atomizing sheet bracket 6.

[0054] Specifically, in this embodiment, the atomizing sheet 8 is connected to the circuit board structure 7 through a wire. When the module components in the circuit board structure 7 are powered on, the high-frequency resonance of the atomizing sheet 8 breaks up the liquid water molecular structure to generate water mist.

[0055] Specifically, in this embodiment, the atomizing sheet bracket 6 is made of plastic material, simplifying the structure of the conventional heat sink and the atomizing sheet 8 pressing cover, avoiding the use of cast iron material, and reducing the cost.

[0056] Specifically, in this embodiment, the mounting seat 9 is in a circular ring shape, and the convex portion 10 is in a circular ring shape.

[0057] Specifically, in this embodiment, a third connection hole is provided on the surface of the bottom shell, and the inner diameter of the third connection hole is the same as the outer diameter of the second connection hole. The third connection hole provided on the bottom shell is used to install the convex portion 10 structure of the atomization sheet bracket 6.

[0058] Specifically, in this embodiment, a sealing ring 5 is provided between the convex portion 10 of the atomization sheet bracket 6 and the third connection hole of the bottom shell. The sealing ring 5 is used to block the reverse flow of the liquid in the water tank into the inside of the atomizer base 4 and prevent the circuit board inside the atomizer base 4 from getting wet.

[0059] Specifically, in this embodiment, the inner diameter of the sealing ring 5 is the same as the outer diameter of the second connection hole. The sealing ring 5 is sleeved on the convex portion 10 of the atomization sheet bracket 6. When installing the atomization sheet bracket 6, the convex portion 10 of the atomization sheet bracket 6 is placed in the third connection hole, and the sealing installation between the atomization sheet bracket 6 and the bottom shell is realized through the sealing ring 5, thereby avoiding the reverse flow of the liquid into the inside of the atomizer base 4.

[0060] Specifically, in this embodiment, the circuit board structure 7 is provided with second connection portions having the same number as the first connection portions 11. A third connection portion 12 is provided on one side of the inside of the housing close to the atomization sheet bracket 6. The number of the third connection portions 12 is the same as the number of the first connection portions 11. The fixing member sequentially passes through the second connection portion and the first connection portion 11 and is fixedly connected to the third connection portion 12 of the bottom shell.

[0061] Specifically, in this embodiment, the fixing member is a bolt. A plurality of bolts sequentially pass through the second connection portions and the first connection portions 11 having the same number and are fixedly connected to the third connection portion 12 of the bottom shell. Through a plurality of bolts, the fixing between the circuit board structure 7, the atomization sheet 8, the atomization sheet bracket 6 and the bottom shell can be realized, simplifying the assembly method and the difficulty of manual production, and the assembly structure is simplified, so that the circuit board structure 7 has better EMC test technical indexes.

[0062] Specifically, in this embodiment, the number of the first connection portions 11 is at least two. In the present invention, the number of the first connection portions 11 is four.

[0063] The above is only the preferred embodiment of the present invention, and does not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A structure of a circuit board for a separately-excited ultrasonic atomizer, characterized in that, Comprising: A first distribution area, a third distribution area, and a second distribution area disposed between the first distribution area and the third distribution area; The first distribution area is used for installing a power supply unit, and the third distribution area is used for installing an atomization unit; The second distribution area is used for installing an atomization sheet; a shielding component made of metal is covered on the surface of the second distribution area, and the power supply unit in the first distribution area is electrically connected to the atomization unit in the third distribution area through the shielding component made of metal; an atomization sheet installation area is provided on the surface of the second distribution area, and fourth connection parts for fixing the atomization sheet are symmetrically arranged in the atomization sheet installation area, and the atomization sheet is detachably connected to the circuit board structure through the fourth connection parts.

2. The structure of the driving circuit board of a self-excited ultrasonic atomizer according to claim 1, wherein, The shielding component made of metal is arranged in a strip or sheet structure and installed on the surface of the second distribution area, and the shielding component made of metal is connected to the ground terminal.

3. A structure of a driving - type ultrasonic atomizer circuit board according to any one of claims 1 - 2, characterized in that, The shielding component made of metal is attached to the surface of the second distribution area by any one of electroplating, spraying, coating, or welding.

4. A structure of a self-excited ultrasonic atomizer circuit board according to any one of claims 1-2, characterized in that, The shielding component made of metal is a copper foil.

5. A structure of a driving ultrasonic atomizer circuit board according to any one of claims 1-2, characterized in that, The atomization sheet installation area is provided with a plurality of second connection parts and fixing parts, and the fixing parts pass through the second connection parts and are fixedly connected to the atomizer base.

6. An atomizer comprising the atomizer circuit board structure of any one of claims 1-5, characterized in that, Comprising: An atomizer base and a water tank detachably installed on the atomizer base; The atomizer base includes a bottom plate and a bottom shell, the bottom shell surrounds the bottom plate and is perpendicular to the bottom plate to form an accommodation cavity; an atomization sheet, an atomization sheet bracket, a circuit board structure, and a fixing part are arranged in the accommodation cavity, the atomization sheet is placed between the circuit board structure and the atomization sheet, and the fixing part sequentially passes through the circuit board structure and the atomization sheet to fixedly install the circuit board structure and the atomization sheet bracket on one side of the bottom shell close to the water tank.

7. An atomizer according to claim 6, characterized in that, The atomization sheet bracket includes a mounting seat, a protruding part, and a plurality of first and fourth connection parts; the protruding part is arranged on the upper surface of the mounting seat, and the plurality of first and fourth connection parts are arranged at intervals on the outer side surface of the mounting seat.

8. An atomizer according to claim 7, characterized in that, The mounting seat is provided with a first connection hole, and the inner diameter of the first connection hole is the same as the outer diameter of the atomization sheet.

9. The atomizer according to claim 8, wherein, The protruding part is provided with a second connection hole, and the inner diameter of the second connection hole is smaller than the inner diameter of the first connection hole.

10. An atomizer according to claim 9, characterized in that, The surface of the bottom shell is provided with a third connection hole, and the inner diameter of the third connection hole is the same as the outer diameter of the second connection hole.

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