Epoxy molding compound carrying and melting device

Abstract

The utility model provides an epoxy molding compound carrying and melting device, which relates to the epoxy molding compound processing technology, and comprises a rotating disc, a plurality of connecting columns are arranged on the upper surface of the rotating disc, and the upper ends of the connecting columns are coaxially connected with a loading disc; the number of the heating bins is smaller than that of the loading discs, the lower ends of the heating bins are open, the heating bins are arranged around the center axis of the rotary disc in an arc array mode, the heating bins move in the axial direction of the heating bins, the connecting positions of the inner side walls and the upper surfaces of the heating bins communicate with material conveying channels, the material conveying channels communicate with material conveying pipes, and heating machines used for heating the interiors of the heating bins are arranged on the heating bins; the conveying track is arranged above the loading disc, a blanking port penetrates through one end of the lower surface of the conveying track, and the axial distance between the blanking port and the rotary disc is equal to the distance between the loading disc and the rotary disc. According to the utility model, the carrying and melting speed of the epoxy molding compound can be increased, and the epoxy molding compound can be loaded at the same point location for a plurality of heating bins, so that the epoxy molding compound loading device has stronger practicability.

Description

Technical Field

[0001] The present application relates to epoxy molding compound processing technology, and in particular to an epoxy molding compound carrying and melting device. Background Art

[0002] Epoxy molding compound is a key material used in semiconductor packaging, primarily protecting chips from external influences. Commonly used for semiconductor encapsulation, epoxy molding compound is typically cylindrical and must be transported to a heating chamber before being heated and melted, then pressed into the subsequent molding mold. Currently, this conventional process of melting epoxy molding compound in the heating chamber is cumbersome and slow, and requires loading at different locations for each heating chamber, resulting in low efficiency. Utility Model Content

[0003] In order to solve the above-mentioned related technical defects, the present application provides an epoxy molding compound transporting and melting device, which can improve the transporting and melting speed of the epoxy molding compound, and can load the epoxy molding compound at the same point for multiple heating chambers, and has strong practicality.

[0004] In order to achieve the above purpose, the utility model adopts the following technologies:

[0005] An epoxy molding compound carrying and melting device, comprising:

[0006] The turntable is arranged to rotate along its own central axis. A plurality of connecting columns parallel to its own central axis are provided on the upper surface of the turntable. The connecting columns are arranged in a circular array around the central axis of the turntable and the upper ends of the connecting columns are coaxially connected to the loading plate;

[0007] The heating bins are provided with multiple units and the number is less than that of the loading disks. The central axes of the heating bins are all parallel to the central axes of the loading disks and the lower ends are all open. The heating bins are arranged in an arc array around the central axis of the turntable. The distance between the axes of adjacent heating bins is equal to the distance between the axes of adjacent loading disks. The diameter of the inner wall of the heating bins matches the diameter of the loading disks. The distance between the axes of the heating bins and the turntable is equal to the distance between the loading disks and the turntable axes. The heating bins all move along their own axes. A material feeding channel is connected at the junction of the inner side wall and the upper surface of the heating bin. The material feeding channel is connected to a material feeding pipe. The heating bin is provided with a heater for heating the interior of the heating bin.

[0008] The conveying track is arranged above the loading plate, and one end of the lower surface of the conveying track is penetrated by a blanking port, and the axial distance between the blanking port and the turntable is equal to the distance between the loading plate and the turntable.

[0009] Furthermore, a mounting plate is spaced apart above the turntable, the mounting plate is connected to a first support column, the first support column is connected to a first fixing bar, a rotating cylinder is provided on the mounting plate, and a driving shaft of the rotating cylinder is coaxially connected to the turntable.

[0010] Furthermore, a linear cylinder is provided on the mounting plate along the axial direction of the turntable, the driving shaft of the linear cylinder is connected to an arc bar, the upper surfaces of the heating bins are coplanar and parallel to the upper surface of the turntable, and the upper surfaces of the heating bins are connected to the arc bar.

[0011] Furthermore, a sliding hole is provided at the edge of the loading disk, and the sliding holes are arranged in a circular array around the axial direction of the loading disk. A sliding rod is provided along the inner axial direction of the turntable in a liquid-tight sliding manner. The lower end of the sliding rod is connected to a lifting ring coaxial with the corresponding connecting column. A spring is provided coaxially on the circumference of the sliding rod, and the upper end of the spring is connected to the loading disk, and the lower end is connected to the lifting ring.

[0012] Furthermore, conveyor belts are provided on the upper ends of the two side plates of the conveying track. The conveyor belts are arranged parallel to the length direction of the conveying track and their conveying surfaces are arranged opposite to each other. The conveying track is connected to a second support column, and the second support column is connected to a second fixing bar.

[0013] The beneficial effects of the present invention are:

[0014] The epoxy molding compound is carried by the conveying track and can be directly dropped onto the loading tray through the blanking port. The loading tray carries the pre-loaded epoxy molding compound. The epoxy molding compound can be directly melted by the cooperation of the heating chamber and the loading tray. The steps are simple and the transportation and melting speed of the epoxy molding compound is improved. Moreover, the epoxy molding compound can be dropped onto different loading trays in sequence from the blanking port on the conveying track, so that the epoxy molding compound can be loaded at the same point, thereby improving the overall efficiency of the transportation and melting of the epoxy molding compound. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional schematic diagram of the epoxy molding compound carrying and melting device according to an embodiment of the present application.

[0016] Figure 2 It is a partially cutaway stereoscopic schematic diagram of the heating chamber, loading tray, and conveying track of an embodiment of the present application.

[0017] Markings in the figure: 1-turntable, 11-connecting column, 12-loading plate, 13-mounting plate, 14-first support column, 15-first fixed bar, 16-rotating cylinder, 17-sliding rod, 18-lifting ring, 19-spring, 2-heating bin, 21-feeding channel, 22-feeding pipe, 23-linear cylinder, 24-arc bar, 25-heating machine, 3-transmission track, 31-dropping port, 32-conveyor belt, 33-second support column, 34-second fixed bar. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] like Figure 1 As shown, this embodiment provides an epoxy molding compound transport and melting device, including a turntable 1, a heating chamber 2, and a conveying track 3.

[0020] Specifically, such as Figure 1 and Figure 2 As shown, the turntable 1 is arranged to rotate along its own central axis, and six connecting columns 11 parallel to its own central axis are provided on the upper surface of the turntable 1. The connecting columns 11 are arranged in a circular array around the central axis of the turntable 1 and the upper ends are coaxially connected to a loading tray 12, which is used to place cylindrical epoxy molding compound.

[0021] Specifically, such as Figure 1 and Figure 2 As shown, the heating chambers 2 are provided with multiple heating chambers 2 and the number is less than the loading trays 12. More specifically, in this example, there are five heating chambers 2. The central axes of the heating chambers 2 are all parallel to the central axes of the loading trays 12 and the lower ends are all open. The heating chambers 2 are arranged in an arc array around the central axis of the turntable 1. The axial spacing between adjacent heating chambers 2 is equal to the axial spacing between adjacent loading trays 12, and the inner wall diameter of the heating chamber 2 matches the diameter of the loading tray 12. More specifically, when the loading tray 12 enters the interior of the heating chamber 2, the contact surface between the heating chamber 2 and the loading tray 12 is liquid-tight. The axial distance between the heating bin 2 and the turntable 1 is equal to the axial distance between the loading disk 12 and the turntable 1, so that when the turntable 1 rotates to a certain position, the heating bin 2 can be coaxial with the loading disk 12 below; the heating bin 2 moves along its own axial direction, and the inner side wall of the heating bin 2 is connected to the upper surface at the junction with the material feeding channel 21, and the material feeding channel 21 is connected to the material feeding pipe 22, and the material feeding pipe 22 is connected to the mechanism for subsequently filling the epoxy molding compound into the molding mold; the heating bin 2 is provided with a heating machine 25 for heating the interior of the heating bin 2.

[0022] Specifically, such as Figure 1 and Figure 2 As shown, the conveying track 3 is arranged above the loading tray 12, and a blanking port 31 is passed through one end of its lower surface. The axial distance between the blanking port 31 and the turntable 1 is equal to the distance between the loading tray 12 and the turntable 1. The conveying track 3 is used to convey the epoxy molding compound.

[0023] During operation, the turntable 1 is rotated so that the loading tray 12 receives the epoxy molding material falling from the blanking port 31 in turn, until there is a coaxial loading tray 12 under the heating chamber 2, and the epoxy molding material is placed on these loading trays 12; the heating chamber 2 is moved downward so that the loading tray 12 enters the heating chamber 2 from the lower end of the heating chamber 2. At this time, the heating machine 25 is used to heat and melt the epoxy molding material in the heating chamber 2. After the epoxy molding material becomes liquid, the heating chamber is further moved downward so that the liquid epoxy molding material enters the feeding pipe 22 through the feeding channel 21. When the upper surface of the loading tray 12 contacts the upper surface inside the heating chamber 2, the molten epoxy molding material is all fed into the feeding channel 21 and enters the feeding pipe 22; the heating chamber 2 is moved upward so that the loading tray 12 exits the heating chamber and can continue to receive the epoxy molding material.

[0024] Preferably, Figure 1 As shown, a mounting plate 13 is spaced apart above the turntable 1, and first support columns 14 are vertically connected to both ends of the mounting plate 13. The first support columns 14 are all connected to the same first fixing bar 15. The first fixing bar 15 is installed on the fixed surface of the device and is used to support the mounting plate 13 through the first support columns 14; a rotating cylinder 16 is provided on the mounting plate 13, and the driving shaft of the rotating cylinder 16 is coaxially connected to the turntable 1 for driving the turntable 1 to rotate;

[0025] Preferably, Figure 1 As shown, a linear cylinder 23 is provided on the mounting plate 13 along the axial direction of the turntable 1, and the driving shaft of the linear cylinder 23 is connected to an arc bar 24. The upper surfaces of the heating bin 2 are coplanar and parallel to the upper surface of the turntable 1, and the upper surfaces of the heating bin 2 are connected to the arc bar 24. The linear cylinder 23 is used to drive the heating bin 2 to move through the arc bar 24.

[0026] Preferably, Figure 2 As shown, four sliding holes are provided at the edge of the loading disk 12, and the sliding holes are arranged in a circular array around the axial direction of the loading disk 12. A sliding rod 17 is provided in the sliding hole to slide liquid-tightly along the axial direction of the turntable 1. The sliding rod 17 is used to contact the epoxy molding compound and limit and fix it; the lower end of the sliding rod 17 is connected to a lifting ring 18 coaxial with the corresponding connecting column 11, and a spring 19 is provided coaxially on the side of the sliding rod 17. The upper end of the spring 19 is connected to the loading disk 12, and the lower end is connected to the lifting ring 18.

[0027] During operation, when the slide rod 17 contacts the inner upper surface of the heating chamber 2, the slide rod 17 and the lifting ring 18 connected thereto are driven downward by the downward movement of the heating chamber 2. At this time, the spring 19 is stretched. When the inner upper surface of the heating chamber 2 contacts the upper surface of the loading tray 12, the solid epoxy molding compound has been completely melted. At this time, the heating chamber 2 is raised, and the slide rod 17 returns to its original position under the action of the spring 19, and the loading tray 12 can continue to receive the epoxy molding compound.

[0028] Preferably, Figure 1 As shown, a conveyor belt 32 is provided on the upper ends of the two side plates of the conveying track 3. The conveyor belt 32 is arranged parallel to the length direction of the conveying track 3 and its conveying surfaces are arranged opposite to each other. The conveying surface of the conveyor belt 32 is used to contact the epoxy molding material in the conveying track 3 and drive it to move; the conveying track 3 is connected to two second support columns 33, and the second support columns 33 are connected to the same second fixing bar 34. The second fixing bar 34 is installed on the fixed surface of the device and is used to support the conveying track 3 through the second support columns 33.

[0029] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. An epoxy molding compound carrying and melting device, characterized in that: include: The turntable (1) is rotatably arranged along its own central axis. A plurality of connecting columns (11) parallel to its own central axis are provided on the upper surface of the turntable (1). The connecting columns (11) are arranged in a circular array around the central axis of the turntable (1) and the upper ends of the connecting columns are coaxially connected to the loading disk (12). The heating bin (2) is provided with a plurality of heating bins and the number of the heating bins is less than the loading disk (12). The central axes of the heating bins (2) are parallel to the central axis of the loading disk (12) and the lower ends are all open. The heating bins (2) are arranged in an arc array around the central axis of the turntable (1). The axial spacing between adjacent heating bins (2) is equal to the axial spacing between adjacent loading disks (12). The inner wall diameter of the heating bin (2) matches the diameter of the loading disk (12). The axial spacing between the heating bin (2) and the turntable (1) is equal to the axial spacing between the loading disk (12) and the turntable (1). The heating bins (2) move along their own axis. The inner side wall of the heating bin (2) is connected to the upper surface at a connection with a material delivery channel (21). The material delivery channel (21) is connected to a material delivery pipe (22). The heating bin (2) is provided with a heating machine (25) for heating the interior of the heating bin (2). The conveying track (3) is arranged above the loading plate (12), and a blanking opening (31) is passed through one end of the lower surface thereof. The axial distance between the blanking opening (31) and the turntable (1) is equal to the distance between the loading plate (12) and the turntable (1).

2. The epoxy molding compound carrying and melting device according to claim 1, characterized in that: A mounting plate (13) is spaced apart above the turntable (1), the mounting plate (13) is connected to a first support column (14), the first support column (14) is connected to a first fixing bar (15), a rotating cylinder (16) is provided on the mounting plate (13), and a driving shaft of the rotating cylinder (16) is coaxially connected to the turntable (1).

3. The epoxy molding compound carrying and melting device according to claim 2, characterized in that: A linear cylinder (23) is provided on the mounting plate (13) along the axial direction of the turntable (1), and a driving shaft of the linear cylinder (23) is connected to an arcuate bar (24). The upper surfaces of the heating chamber (2) are coplanar and parallel to the upper surface of the turntable (1), and the upper surfaces of the heating chamber (2) are connected to the arcuate bar (24).

4. The epoxy molding compound carrying and melting device according to claim 1, characterized in that: A sliding hole is provided at the edge of the loading plate (12), and the sliding holes are arranged in an axial circumferential array around the loading plate (12). A sliding rod (17) is provided in the sliding hole to slide fluid-tightly along the axial direction of the turntable (1). The lower end of the sliding rod (17) is connected to a lifting ring (18) coaxial with the corresponding connecting column (11). A spring (19) is provided on the coaxial sleeve around the sliding rod (17). The upper end of the spring (19) is connected to the loading plate (12), and the lower end is connected to the lifting ring (18).

5. The epoxy molding compound carrying and melting device according to claim 1, characterized in that: A conveyor belt (32) is provided at the upper ends of the two side plates of the conveying track (3). The conveyor belt (32) is arranged parallel to the length direction of the conveying track (3) and its conveying surfaces are arranged opposite to each other. The conveying track (3) is connected to a second support column (33), and the second support column (33) is connected to a second fixing bar (34).

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