Conductive roller device for electroplating into copper tank

Abstract

The utility model discloses a conductive roller device electroplated into a copper tank, and relates to the field of electroplating. The insulating roller is positioned between the first metal roller and the second metal roller; the first end of the insulating roller is connected with the first end of the first metal roller; the second end of the insulating roller is connected with the first end of the second metal roller; the second end of the first metal roller is provided with a first cathode wiring point; the second end of the second metal roller is provided with a second cathode wiring point; the first anode wiring point and the second anode wiring point are respectively positioned on the upper and lower sides of the conductive film; the first anode wiring point and the second anode wiring point are respectively contacted with the conductive film through electrolyte; the first metal roller, the conductive film, the first anode wiring point and the electrolyte form a first closed loop; and the second metal roller, the conductive film, the second anode wiring point and the electrolyte form a second closed loop. According to the utility model, the electrical conductivity of the film electroplating electrified entering groove is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a conductive roller device for electroplating into a copper tank. Background Technique

[0002] The mainstream process route of the composite current collector is magnetron sputtering bottom layer + hydroelectroplating. The thickness of the magnetron sputtering bottom layer is usually only 10 - 50 nm, and the copper sulfate system is used for hydroelectroplating. When the very thin sputtered copper layer enters the copper sulfate plating solution, the surface copper layer will be quickly dissolved by the strongly acidic plating solution, resulting in poor conductivity. The currently adopted method of entering the tank while being charged is to add a conductive roller before entering the copper tank. The structure of the conductive roller is as Figure 2 , and the conductive roller serves as the anode and the clip serves as the cathode to form a circuit as Figure 3 . Electroplating starts when the thin film enters the plating solution to offset the dissolution of the thin film by the acidic plating solution and increase the conductivity of the conductive clip area. The horizontal roll-to-roll electroplating thin film equipment uses a bilateral clamping method for electroplating. The cathode current conducts from both sides to the middle. The clamping area of the clip is the conductive area. For Figure 3 the structure of the conductive roller in this way, although it can partially increase the conductivity of the conductive clip area and reduce the burning phenomenon, it has little obvious effect on the subsequent large current area. Content of the Utility Model

[0003] The purpose of the embodiment of the utility model is to provide a conductive roller device for electroplating into a copper tank to improve the conductivity of the thin film electroplating when entering the tank while being charged.

[0004] To achieve the above purpose, the embodiment of the utility model provides the following solutions:

[0005] A conductive roller device for electroplating into a copper tank includes:

[0006] A first metal roller, an insulating roller, and a second metal roller;

[0007] The insulating roller is located between the first metal roller and the second metal roller;

[0008] The first end of the insulating roller is connected to the first end of the first metal roller; the second end of the insulating roller is connected to the first end of the second metal roller;

[0009] A first negative connection point is provided at the second end of the first metal roller; a second negative connection point is provided at the second end of the second metal roller;

[0010] The first metal roller and the second metal roller are connected to a first positive connection point and a second positive connection point respectively through a conductive film and an electrolyte;

[0011] The first positive electrode connection point and the second positive electrode connection point are respectively located on the upper and lower sides of the conductive film; the first positive electrode connection point and the second positive electrode connection point are respectively in contact with the conductive film through an electrolyte; the first metal roller, the conductive film, the first positive electrode connection point and the electrolyte form a first closed loop; the second metal roller, the conductive film, the second positive electrode connection point and the electrolyte form a second closed loop.

[0012] Optionally, when the first closed loop, and / or the second closed loop is / are conducting, the thickness of the coating on the conductive film becomes larger.

[0013] In an embodiment of the present invention, an insulating roller is located between the first metal roller and the second metal roller; the first end of the insulating roller is connected to the first end of the first metal roller; the second end of the insulating roller is connected to the first end of the second metal roller; a first negative electrode connection point is provided at the second end of the first metal roller; a second negative electrode connection point is provided at the second end of the second metal roller; the first positive electrode connection point and the second positive electrode connection point are respectively located on the upper and lower sides of the conductive film; the first positive electrode connection point and the second positive electrode connection point are respectively in contact with the conductive film through an electrolyte; the first metal roller, the conductive film, the first positive electrode connection point and the electrolyte form a first closed loop; the second metal roller, the conductive film, the second positive electrode connection point and the electrolyte form a second closed loop. The conductivity at the first positive electrode connection point of the conductive film is improved, the burning phenomenon under high current is reduced, and the uniformity and yield of the product are improved. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0015] Figure 1 Schematic diagram of a conductive roller device for electroplating into a copper tank provided by an embodiment of the present invention;

[0016] Figure 2 Structural diagram of a conductive roller in the prior art provided by an embodiment of the present invention;

[0017] Figure 3 Schematic diagram of the action mode of a conductive roller in the prior art provided by an embodiment of the present invention;

[0018] Figure 4 Schematic diagram of the action mode of a conductive roller device for electroplating into a copper tank provided by an embodiment of the present invention. Detailed Embodiments

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0020] The purpose of the present invention is to provide a conductive roller device for electroplating into a copper tank to solve the problem of poor conductivity of the existing film electroplating when charging into the tank.

[0021] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following further details the present invention in conjunction with the accompanying drawings and specific embodiments.

[0022] Figure 1 An exemplary structure of the above-mentioned conductive roller device for electroplating into a copper tank is shown. The following details each module.

[0023] The first metal roller, the insulating roller, and the second metal roller;

[0024] The insulating roller is located between the first metal roller and the second metal roller;

[0025] The first end of the insulating roller is connected to the first end of the first metal roller; the second end of the insulating roller is connected to the first end of the second metal roller;

[0026] The second end of the first metal roller is provided with a first negative connection point; the second end of the second metal roller is provided with a second negative connection point;

[0027] The first metal roller and the second metal roller are connected to the first positive connection point and the second positive connection point through a conductive film and an electrolyte respectively;

[0028] The first positive connection point and the second positive connection point are respectively located on the upper and lower sides of the conductive film; the first positive connection point and the second positive connection point are respectively in contact with the conductive film through the electrolyte; the first metal roller, the conductive film, the first positive connection point, and the electrolyte form a first closed loop; the second metal roller, the conductive film, the second positive connection point, and the electrolyte form a second closed loop.

[0029] When the first closed loop, and / or, the second closed loop is conducting, the thickness of the coating on the conductive film becomes larger.

[0030] In one example, please refer to Figure 4, the conductive roller consists of two parts, namely the first metal roller and the second metal roller on the left and right sides, and the insulating roller in the middle area. The first positive connection point and the second positive connection point are respectively conductive titanium meshes; the conductive titanium meshes are located on the upper and lower sides of the conductive film and do not directly contact the conductive film; the first metal roller and the second metal roller on the left and right sides form circuits with the conductive film and the conductive titanium meshes through the electrolyte respectively. In this way, a thicker coating can be deposited on the film in the conductive clip area more concentratedly, improving the conductivity at the film clip point, reducing the charring phenomenon under high current, and enhancing the uniformity of the product.

[0031] In summary, in the embodiment of the present invention, the insulating roller is located in the middle of the first metal roller and the second metal roller; the first end of the insulating roller is connected to the first end of the first metal roller; the second end of the insulating roller is connected to the first end of the second metal roller; the second end of the first metal roller is provided with a first negative connection point; the second end of the second metal roller is provided with a second negative connection point; the first positive connection point and the second positive connection point are respectively located on the upper and lower sides of the conductive film; the first positive connection point and the second positive connection point are respectively in contact with the conductive film through the electrolyte; the first metal roller, the conductive film, the first positive connection point and the electrolyte form a first closed loop; the second metal roller, the conductive film, the second positive connection point and the electrolyte form a second closed loop. It improves the conductivity at the first positive connection point of the conductive film, reduces the charring phenomenon under high current, and enhances the uniformity and yield of the product.

[0032] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0033] Specific examples are used in this article to elaborate on the principle and implementation manner of the embodiments of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the embodiments of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the embodiments of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the embodiments of the present invention.

Claims

1. A conductive roller device for electroplating into a copper tank, characterized in that: include: a first metal roller, an insulating roller, and a second metal roller; The insulating roller is located between the first metal roller and the second metal roller; The first end of the insulating roller is connected to the first end of the first metal roller; the second end of the insulating roller is connected to the first end of the second metal roller; A first negative electrode connection point is provided at the second end of the first metal roller; a second negative electrode connection point is provided at the second end of the second metal roller; The first metal roller and the second metal roller are connected to the first positive electrode connection point and the second positive electrode connection point respectively through a conductive film and an electrolyte; The first positive electrode connection point and the second positive electrode connection point are respectively located on the upper and lower sides of the conductive film; the first positive electrode connection point and the second positive electrode connection point are respectively in contact with the conductive film through the electrolyte; the first metal roller, the conductive film, the first positive electrode connection point and the electrolyte form a first closed loop; the second metal roller, the conductive film, the second positive electrode connection point and the electrolyte form a second closed loop.

2. The conductive roller device for electroplating into a copper tank according to claim 1, characterized in that: When the first closed loop and / or the second closed loop is turned on, the thickness of the coating on the conductive film increases.

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