Wafer defect optical detection equipment

Abstract

The utility model discloses wafer defect optical detection equipment which comprises a laser light source used for emitting an initial light beam with a fixed wavelength, and the initial light beam is emitted along a first path; the compression prism array comprises at least one compression prism pair, and the compression prism pair comprises a first refracting surface and a second refracting surface which form an included angle between surfaces; the bearing device is used for bearing the wafer; a receiving device; wherein the initial light beam reaches the first refracting surface at a vertical angle, reaches the second refracting surface by taking an inter-surface included angle as an incident angle, is refracted, changes a propagation path towards the direction of the second refracting surface, and enters a receiving device after being reflected by the wafer. According to the wafer defect optical detection equipment provided by the embodiment of the invention, the initial light beam reaches the first refracting surface without changing the diameter of the light spot, reaches the second refracting surface, is refracted and changes the propagation path towards the direction of the second refracting surface at the same time, so that the single-dimensional compression of the diameter of the light spot is realized, and then the light spot enters the wafer and is reflected into the receiving device; and completing defect detection.

Description

Technical Field

[0001] The present application relates to the technical field of wafer defect optical detection, and in particular to a wafer defect optical detection device. Background Art

[0002] High-speed and high-precision wafer defect detection technology requires a linear laser spot as the incident spot. The current optical solution for shaping the laser spot to obtain a linear spot usually uses a cylindrical mirror to compress the laser spot in one dimension. However, the current optical solution is affected by the diffraction limit and edge aberration, and cannot further compress the size of the spot shape. Summary of the Invention

[0003] An embodiment of the present application provides a wafer defect optical detection device that can achieve efficient compression in a single dimension of a light beam emitted by a laser light source irradiated onto a wafer to be defect-detected, and shape the light spot into an extremely narrow shape.

[0004] In the first aspect, according to an embodiment of the present application, a wafer defect detection device is provided, including: a laser light source for emitting an initial light beam with a fixed wavelength, the initial light beam being emitted along a first path; a compression prism array, including at least one compression prism pair, arranged on the emission side of the laser light source, the compression prism pair including a pair of first refractive surfaces and a second refractive surface with an inter-surface angle between them; a supporting device for supporting a wafer; a receiving device; wherein the initial light beam is incident on the compression prism array, arrives at the first refractive surface at a vertical angle and arrives at the second refractive surface with the inter-surface angle as the incident angle, refracts and changes the propagation path toward the second refractive surface, and after emitting the compression prism array, is reflected by the side of the wafer located on the supporting device away from the supporting device and is incident on the receiving device.

[0005] According to one aspect of an embodiment of the present application, a compression prism pair includes a first compression prism and a second compression prism, the first compression prism includes a first working surface and a second working surface that are at a first optical wedge angle to each other, the second compression prism includes a third working surface that is at an inter-prism angle to the first working surface, the first working surface is set as a first refractive surface, the second working surface is set as a second refractive surface, and the first optical wedge angle is set as an inter-surface angle at the first compression prism; wherein, after the initial light beam is vertically incident on the first compression prism through the first working surface, it is incident on the second working surface with the first optical wedge angle as the incident angle, and then refracted out of the first compression prism after being deflected at the angle of the inter-prism angle, and is vertically incident on the second compression prism through the third working surface.

[0006] According to one aspect of an embodiment of the present application, the second compression prism also includes a fourth working surface that forms a second optical wedge angle with the third working surface. The third working surface is set as a first refractive surface, the fourth working surface is set as a second refractive surface, and the second optical wedge angle is set as the angle between the surfaces at the second compression prism; wherein, after the initial light beam is vertically incident on the second compression prism through the third working surface, it is incident on the fourth working surface with the second optical wedge angle as the incident angle and is refracted out of the second compression prism.

[0007] According to one aspect of an embodiment of the present application, the angle between the prisms and the second wedge angle are set to be consistent with the first wedge angle.

[0008] According to one aspect of the embodiment of the present application, the setting range of the first optical wedge angle includes 20°-30.5°.

[0009] According to one aspect of an embodiment of the present application, the initial light beam is shaped into a compressed light beam by a compression prism array. The compressed light beam is parallel to the initial light beam, and a vertical spacing H1 between the compressed light beam and the initial light beam is greater than or equal to 0.

[0010] According to one aspect of an embodiment of the present application, a compression prism array includes a compression prism pair, the compression prism pair includes two compression prisms, each compression prism includes two working surfaces at a wedge angle to each other, one working surface is set as a first refractive surface, and the other working surface is set as a second refractive surface, and the wedge angle is configured as an angle between the surfaces; wherein the initial light beam is shaped into a compressed light beam by the compression prism pair, and there is a vertical spacing H1 between the compressed light beam and the initial light beam, H1≠0.

[0011] According to one aspect of an embodiment of the present application, a compression prism array includes a first compression prism pair and a second compression prism pair, the first compression prism pair and the second compression prism pair respectively include two compression prisms, each compression prism includes two working surfaces at a wedge angle to each other, one working surface is set as a first refractive surface, and the other working surface is set as a second refractive surface, and the wedge angle is configured as an angle between the surfaces; wherein, the compressed light beam includes a first compressed light beam and a second compressed light beam, the initial light beam is shaped into the first compressed light beam by the first compression prism pair, and the first compressed light beam is shaped into the second compressed light beam by the second compression prism pair.

[0012] According to one aspect of an embodiment of the present application, the vertical spacing H1 also includes a first vertical spacing H11 and a second vertical spacing H12, there is a first vertical spacing H11 between the initial light beam and the first compressed light beam, there is a second vertical spacing H12 between the initial light beam and the second compressed light beam, there is a third vertical spacing H13 between the first compressed light beam and the second compressed light beam, H12=H11+H13 and H11=H13.

[0013] According to one aspect of the embodiment of the present application, the second compressed light beam and the initial light beam are both distributed along the first path, and H12=0.

[0014] The embodiment of the present application provides an optical detection device for wafer defects. The initial light beam in the optical detection device for wafer defects arrives at the first refractive surface at a vertical angle without changing the spot diameter, and arrives at the second refractive surface with the angle between the surfaces as the incident angle, refracts and changes the propagation path toward the second refractive surface. The initial light beam is deflected at a certain angle, thereby achieving one-dimensional compression of the spot diameter, and then is incident on the wafer to be defect-detected and reflected by the wafer into the receiving device to complete the defect detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the structure and optical path of a cylindrical mirror provided in the related art;

[0017] Figure 2 This is an overall structural diagram of a wafer defect optical detection device provided in an embodiment of the present application;

[0018] Figure 3 yes Figure 2 Schematic diagram of the local amplification structure and optical path of the compression prism array and laser light source;

[0019] Figure 4 yes Figure 2 Another compression prism array and a local amplification structure of a laser light source and a schematic diagram of an optical path;

[0020] Figure 5 yes Figure 2 Schematic diagram of the local magnification structure and optical path of another compression prism array and laser light source.

[0021] in:

[0022] C0-cylindrical mirror;

[0023] 100-Wafer defect optical inspection equipment;

[0024] 10-Laser light source;

[0025] 20-compression prism array; 201-compression prism pair; 202-compression prism; 203-working surface;

[0026] 21-first compression prism; 22-second compression prism; 211-first working surface; 212-second working surface; 221-third working surface; 222-fourth working surface;

[0027] 210 - first compression prism pair; 220 - second compression prism pair;

[0028] 30-supporting device; 31-wafer;

[0029] 40- receiving device;

[0030] S0 - first path;

[0031] R1-first refractive surface; R2-second refractive surface;

[0032] L0-initial beam; L1-compressed beam; L11-first compressed beam; L12-second compressed beam;

[0033] H1-vertical spacing; H11-first vertical spacing; H12-second vertical spacing; H13-third vertical spacing;

[0034] A0-inter-face angle; A1-wedge angle; A11-first wedge angle; A12-second wedge angle; A2-angle between prisms.

[0035] In the drawings, like reference numerals are used for like parts, but the drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0036] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessary ambiguity in the present application; and, for clarity, the sizes of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements not only include those elements, but also include other elements not clearly listed, or also include elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise..." do not exclude the existence of other identical elements in the process, method, article or equipment comprising the elements.

[0038] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the display panel and binding structure of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0039] High-speed, high-precision wafer defect inspection technology involves illuminating the wafer surface with laser light to generate scattered light. As detection accuracy continues to improve, the required laser spot size precision is also decreasing. Furthermore, due to the demand for high-speed inspection, the detection component that captures reflected light in the detection optical path typically uses a linear array camera. This detection component also places certain requirements on the laser spot shape. The spot shape must be compatible with the camera target surface, meaning it must be shaped into a thin, linear shape.

[0040] Figure 1 The structure and optical path of the cylindrical mirror C0 provided in the related art are shown.

[0041] See also Figure 1 At present, the main optical solution for shaping the laser spot is to use a cylindrical mirror C0 to focus the spot in one dimension. However, when the size of the incident spot is not large enough, the optical solution using the cylindrical mirror C0 is limited by the diffraction limit, and the size of the final output spot is large and cannot be further compressed to the submicron level. If the size of the incident spot is increased, there will be large-angle edge light at the edge of the cylindrical mirror C0, which will affect the shape of the spot and produce edge aberrations, which will also limit the further compression of the spot shape. The final spot shape is shaped by focusing, and the minimum size limit that can be obtained is affected by both the diffraction limit and the edge aberration, and the spot shape size cannot be further compressed.

[0042] Based on the consideration and technical needs of solving the above problems, the present application proposes a wafer defect optical inspection device 100.

[0043] Figure 2 FIG. 1 shows the overall structure of a wafer defect optical inspection device 100 provided in an embodiment of the present application. Figure 3 Shown Figure 2 Schematic diagram of the local enlarged structure and optical path of the compression prism array 20 and the laser light source 10.

[0044] See also Figure 2 and Figure 3 An embodiment of the present application provides a wafer defect optical detection device 100, including a laser light source 10, a compression prism array 20, a supporting device 30 and a receiving device 40.

[0045] The laser light source 10 is used to emit an initial light beam L0 with a fixed wavelength, and the initial light beam L0 is emitted along a first path S0.

[0046] The compression prism array 20 includes at least one compression prism pair 201 disposed on the emission side of the laser light source 10 . The compression prism pair 201 includes a pair of first refractive surfaces R1 and second refractive surfaces R2 that form an inter-surface angle A0 .

[0047] The supporting device 30 is used to support the wafer 31 .

[0048] Among them, the initial light beam L0 is incident on the compression prism array 20, reaches the first refractive surface R1 at a vertical angle, and reaches the second refractive surface R2 with the inter-surface angle A0 as the incident angle, refracts and changes the propagation path toward the second refractive surface R2. After exiting the compression prism array 20, it is reflected by the side of the wafer located on the supporting device 30 away from the supporting device 30 and is incident on the receiving device 40.

[0049] The wafer defect optical detection device 100 provided in the embodiment of the present application, the initial light beam L0 in the wafer defect optical detection device 100 arrives at the first refractive surface R1 at a vertical angle, enters the compression prism array 20 without changing the spot diameter, and arrives at the second refractive surface R2 with the inter-surface angle A0 as the incident angle, refracts and changes the propagation path toward the second refractive surface R2. The initial light beam L0 is deflected at a certain angle, thereby realizing one-dimensional compression of the spot diameter, and then is incident on the wafer 31 to be defect-detected and reflected by the wafer 31 into the receiving device 40 to complete the defect detection.

[0050] Lasers are highly monochromatic, coherent, directional, and bright.

[0051] Laser light is highly monochromatic, meaning that the initial light beam L0 emitted from the laser light source 10 has a fixed wavelength. The phrase "initial light beam L0 has a fixed wavelength" should be understood to mean that the wavelength of the initial light beam L0 is a single value selected or a combination of several very close values within a very narrow range.

[0052] Laser light also has a high degree of directionality, so by adjusting the laser light source 10 to a suitable direction, the laser light source 10 will emit along a first path S0 until it enters the compression prism array 20. The first path S0 is a straight line.

[0053] Optionally, the spot diameter of the initial light beam L0 emitted from the laser light source 10 is 1 mm.

[0054] Optionally, before the laser light source 10 starts working each time, the operator can first select a monochromatic light of a fixed wavelength within a certain wavelength range from the laser light source 10, and then start the laser light source 10, and the selected initial light beam L0 of the fixed wavelength is emitted along the first path S0.

[0055] The initial light beam L0 reaches the first refractive surface R1 of the compression prism array 20 at a vertical angle. Therefore, the initial light beam L0 does not undergo refraction to change its optical path when entering the compression prism array 20 , and the initial light beam L0 will continue to propagate until it reaches the second refractive surface R2 .

[0056] The second refractive surface R2 and the first refractive surface R1 form an inter-surface angle A0 with each other. Here, “form an inter-surface angle A0 with each other” should be understood as that the plane where the second refractive surface R2 is located intersects with the plane where the first refractive surface R1 is located and the angle between the two planes is the inter-surface angle A0.

[0057] Optionally, the first refractive surface R1 and the second refractive surface R2 are set as the two surfaces reached by the optical path of the initial light beam L0. After the initial light beam L0 reaches the first refractive surface R1, it undergoes multiple reflections in the compression prism array 20 and then reaches the second refractive surface R2.

[0058] Optionally, the first refractive surface R1 and the second refractive surface R2 are set as the two surfaces reached by the optical path of the initial light beam L0. After the initial light beam L0 reaches the first refractive surface R1, it undergoes multiple refraction processes between multiple elements in the compression prism array 20 and then reaches the second refractive surface R2.

[0059] Optionally, the first refractive surface R1 and the second refractive surface R2 are arranged to include multiple pairs of first refractive surfaces R1 and second refractive surfaces R2. After the initial light beam L0 reaches a pair of first refractive surfaces R1 and second refractive surfaces R2, it reaches another pair of first refractive surfaces R1 and second refractive surfaces R2 in a subsequent light path, thereby achieving multiple single-dimensional compressions.

[0060] Since the second refractive surface R2 and the first refractive surface R1 form an angle A0 between the surfaces, after the initial light beam L0 arrives at the first refractive surface R1 at a vertical angle, when it arrives at the second refractive surface R2, the incident angle formed between the initial light beam L0 and the second refractive surface R2 is consistent with the angle A0 between the surfaces, that is, the initial light beam L0 arrives at the second refractive surface R2 with the angle A0 between the surfaces as the incident angle.

[0061] Since the initial light beam L0 is refracted at the second refractive surface R2 and changes its propagation path toward the second refractive surface R2, the refractive index of the prism material on one side of the second refractive surface R2 is greater than the refractive index of the external medium on the other side of the second refractive surface R2. Therefore, the incident angle at the second refractive surface R2 is smaller than the refraction angle, and the initial light beam L0 will be deflected at a certain angle toward the direction close to the second refractive surface R2, thereby achieving single-dimensional compression of the initial light beam L0 and shaping the initial light beam L0 into the desired slender linear light spot.

[0062] The angle at which the initial light beam L0 is refracted and deflected at the second refractive surface R2 depends on the selection of the prism material and the selection of the fixed wavelength of the initial light beam L0.

[0063] Optionally, the prism material is set to be glass material, and the refractive index selection range includes 1.4 to 1.7.

[0064] Optionally, the fixed wavelength selection range of the initial light beam L0 includes 190 nm to 1000 nm.

[0065] The angle of incidence of the initial light beam L0 on the second refractive surface R2 depends on the angle A0 between the first and second refractive surfaces R1 and R2. This angle A0 must be set within a certain range. If the angle A0 is too small, the compression ratio is limited. If the angle A0 is too large, the initial light beam L0 may be totally reflected by the second refractive surface R2, preventing it from exiting smoothly.

[0066] Optionally, by setting the inter-surface angles A0 of different sizes, it is possible to achieve spot compression of different proportions in a single dimension of the initial light beam L0.

[0067] The initial light beam L0 is compressed by refraction of the compression prism array 20. Since there is no shaping step of focusing the beam to compress the spot shape, it is not affected by the diffraction limit and edge aberration that occur in the focusing solution using the cylindrical mirror C0 in the related art.

[0068] The supporting device 30 is used to support the wafer 31 to be inspected. It can support the wafer 31 while displacing the wafer 31 in a certain direction along the plane, thereby adjusting the position of the light beam emitted by the laser light source 10 to irradiate the surface of the wafer 31 and inspect the entire wafer surface.

[0069] Optionally, the supporting device 30 is a rotatable disc, the shape of the wafer 31 is circular, and the wafer 31 is supported by the supporting device 30 and can rotate around the center of the wafer 31 .

[0070] The receiving device 40 is used to receive and analyze light reflected from the surface of the wafer 31. Optionally, the receiving device 40 is a line array camera, which includes a camera target surface for receiving reflected light and can be suitable for application scenarios of high-speed wafer defect detection.

[0071] See also Figure 3 In some embodiments, the compression prism pair 201 includes a first compression prism 21 and a second compression prism 22, the first compression prism 21 includes a first working surface 211 and a second working surface 212 that form a first optical wedge angle A11 with respect to each other, the second compression prism 22 includes a third working surface 221 that forms an inter-prism angle A2 with respect to the first working surface 211, the first working surface 211 is set as a first refractive surface R1, the second working surface 212 is set as a second refractive surface R2, and the first optical wedge angle A11 is set as an inter-surface angle A0 at the first compression prism 21.

[0072] Among them, after the initial light beam L0 is vertically incident on the first compression prism 21 through the first working surface 211, it is incident on the second working surface 212 with the first light wedge angle A11 as the incident angle, and then refracted out of the first compression prism 21 after being deflected at the angle A2 between the prisms, and is vertically incident on the second compression prism 22 through the third working surface 221.

[0073] In these embodiments, the compression prism pair 201 includes a first compression prism 21 and a second compression prism 22. After the initial light beam L0 completes a single-dimensional compression in the first compression prism 21, it can be vertically incident on the third working surface 221 of the second compression prism 22, adjusting the direction of the initial light beam L0 to prepare for the next single-dimensional compression.

[0074] The inter-prism angle A2 between the third working surface 221 and the first working surface 211 is determined and set based on the angle at which the initial light beam L0 is deflected toward the second refractive surface R2 after being refracted from the second working surface 212 and exiting the first compression prism 21. With this arrangement, the initial light beam L0, after undergoing a single-dimensional compression by the first compression prism 21, can be perpendicularly incident on the third refractive surface.

[0075] See also Figure 3 In some embodiments, the second compression prism 22 further includes a fourth working surface 222 that forms a second wedge angle A12 with the third working surface 221. The third working surface 221 is configured as a first refractive surface R1, the fourth working surface 222 is configured as a second refractive surface R2, and the second wedge angle A12 is configured as an inter-surface angle A0 at the second compression prism 22.

[0076] The initial light beam L0 is vertically incident on the second compression prism 22 via the third working surface 221 , and then is incident on the fourth working surface 222 at the second wedge angle A12 and refracted out of the second compression prism 22 .

[0077] In these embodiments, the compression prism pair 201 realizes refraction at the fourth working surface 222 that forms a second optical wedge angle A12 with the third working surface 221 and emits the second prism. After the initial light beam L0 emits the second prism, it is deflected toward the fourth working surface 222 at a certain angle to achieve a second one-dimensional compression, thereby achieving two one-dimensional compressions in one compression prism pair 201.

[0078] See also Figure 3 In some embodiments, the inter-prism angle A2 and the second wedge angle A12 are set to be consistent with the first wedge angle A11.

[0079] In these embodiments, by configuring the second optical wedge angle A12 of the subsequently arranged second compression prism 22 to be consistent with the first optical wedge angle A11, the inter-prism angle A2 between the first compression prism 21 and the second compression prism 22 is also configured to be consistent with the first optical wedge angle A11. Therefore, only the angle of the first optical wedge angle A11 needs to be configured to complete the specific configuration of the compression prism pair 201 to achieve different compression ratios, which makes it more convenient to control the compression ratio.

[0080] See also Figure 3 In some embodiments, the setting range of the first wedge angle A11 includes 20°-30.5°.

[0081] In these embodiments, by setting the first wedge angle A11 within the range of 20°-30.5°, the compression prism pair 201 can achieve a compression ratio of 1.5 to 5 times.

[0082] Optionally, the laser beam is set to a monochromatic beam with a wavelength of 355 nm, the compression prism pair 201 is made of glass material with a refractive index of 1.47, and the first optical wedge angle A11 is set to 20°, which can achieve a compression ratio of 1.5 times.

[0083] Optionally, the laser beam is set to a monochromatic beam with a wavelength of 355 nm, the compression prism pair 201 is made of glass material with a refractive index of 1.47, and the first optical wedge angle A11 is set to 25°, which can achieve a compression ratio of 2.

[0084] Optionally, the laser beam is set to a monochromatic beam with a wavelength of 355 nm, the compression prism pair 201 is made of glass material with a refractive index of 1.47, and the first optical wedge angle A11 is set to 28°, which can achieve a compression ratio of 3 times.

[0085] Optionally, the laser beam is set to a monochromatic beam with a wavelength of 355 nm, the compression prism pair 201 is made of glass material with a refractive index of 1.47, and the first optical wedge angle A11 is set to 30°, which can achieve a compression ratio of 4 times.

[0086] Optionally, the laser beam is set to a monochromatic beam with a wavelength of 355 nm, the compression prism pair 201 is made of glass material with a refractive index of 1.47, and the first optical wedge angle A11 is set to 30.5°, which can achieve a 5-fold compression ratio.

[0087] Through the above configuration, the compression prism pair 201 can achieve different compression ratios for the initial light beam L0. By combining multiple different compression prism pairs 201, the compression ratios achieved by different compression prism pairs 201 can be multiplied to finally obtain the desired compression ratio.

[0088] Optionally, by setting up 3 groups of prism compression arrays with a compression ratio of 2 times and 3 groups of prism compression arrays with a compression ratio of 5 times, the wafer defect optical detection equipment 100 can compress and shape the initial light beam L0 with a spot diameter of 1 mm into a linear spot with a minimum width of 1 μm.

[0089] Figure 4 Shown Figure 2 Another partial enlarged structure and optical path diagram of the compression prism array 20 and the laser light source 10, Figure 5 Shown Figure 2 Schematic diagram of the local method structure and optical path of another compression prism array 20 and laser light source 10.

[0090] See also Figure 4 and Figure 5 In some embodiments, the initial light beam L0 is shaped into a compressed light beam L1 by the compression prism array 20 . The compressed light beam L1 is parallel to the initial light beam L0 , and a vertical distance H1 between the compressed light beam L1 and the initial light beam L0 is greater than or equal to 0.

[0091] In these embodiments, the compressed light beam L1 and the initial light beam L0 compressed and shaped by the compression prism array 20 can be configured to be parallel to the initial light beam L0 with a vertical spacing H1 greater than or equal to 0 by configuring the specific setting of the compression prism array 20, so as to ensure that the compressed light beam L1 can still be distributed around the first path S0, thereby simplifying the optical path, reducing the risk of failure, and reducing the manufacturing cost of the wafer defect optical inspection device 100.

[0092] See also Figure 4In some embodiments, the compression prism array 20 includes a compression prism pair 201, the compression prism pair 201 includes two compression prisms 202, each compression prism 202 includes two working surfaces 203 with a wedge angle A1 relative to each other, one working surface 203 is set as a first refractive surface R1, and the other working surface 203 is set as a second refractive surface R2, and the wedge angle A1 is configured as an inter-surface angle A0.

[0093] The initial light beam L0 is shaped into a compressed light beam L1 by the compression prism pair 201 . There is a vertical distance H1 between the compressed light beam L1 and the incident light beam, and H1≠0.

[0094] In these embodiments, by adjusting the relative setting of the working surface 203, the initial light beam L0 is deflected at a certain angle toward the working surface 203 close to the exit position by the compression prism 202 before exiting, and is deflected at a certain angle toward the working surface 203 close to the exit position by the compression prism 202 after exiting, so that the shaped compressed light beam L1 is parallel to the initial light beam L0.

[0095] Optionally, when the light exits the first compression prism 202 , the direction toward the working surface 203 is clockwise, and when the light exits the second compression prism 202 , the direction toward the working surface 203 is counterclockwise.

[0096] Optionally, when the light exits the first compression prism 202 , the direction toward the working surface 203 is counterclockwise, and when the light exits the second compression prism 202 , the direction toward the working surface 203 is clockwise.

[0097] By setting the relative positions of the compression prisms 202, the angles of the two deflections that produce the light spot compression effect in the two working surfaces 203 can offset each other, so that the shaped compressed light beam L1 is parallel to the initial light beam L0, and the light path is kept distributed around the first path S0 as much as possible, thereby simplifying the light path and reducing costs.

[0098] There is also a vertical spacing H1 between the compressed light beam L1 and the initial light beam L0. In the compression prism array 20 provided with two compression prisms 202, the light path will shift by the length of the vertical spacing H1, and H1≠0.

[0099] See also Figure 5 In some embodiments, the compression prism array 20 includes a first compression prism pair 210 and a second compression prism pair 220. The first compression prism pair 210 and the second compression prism pair 220 each include two compression prisms 202. Each compression prism 202 includes two working surfaces 203 that form a wedge angle A1 with respect to each other. One working surface 203 is configured as a first refractive surface R1, and the other working surface 203 is configured as a second refractive surface R2. The wedge angle A1 is configured as an inter-surface angle A0.

[0100] The compressed light beam L1 includes a first compressed light beam L11 and a second compressed light beam L12 . The initial light beam L0 is shaped into the first compressed light beam L11 by the first compression prism pair 210 , and the first compressed light beam L11 is shaped into the second compressed light beam L12 by the second compression prism pair 220 .

[0101] In these embodiments, the compression prism array 20 is configured to include a first compression prism pair 210 and a second compression prism pair 220 , achieving four times of one-dimensional compression within one compression prism array 20 .

[0102] See also Figure 5 In some embodiments, the vertical spacing H1 further includes a first vertical spacing H11 and a second vertical spacing H12, the initial light beam L0 and the first compressed light beam L11 have a first vertical spacing H11, the initial light beam L0 and the second compressed light beam L12 have a second vertical spacing H12, and the first compressed light beam L11 and the second compressed light beam L12 have a third vertical spacing H13, H12=H11+H13 and H11=H13.

[0103] In these embodiments, the first compression prism pair 210 shapes the initial light beam L0 into a first compressed light beam L11, and through two deflections in opposite directions refracted out of the working surface 203, an optical path translation of a first vertical spacing H11 length is generated between the first compressed light beam L11 and the initial light beam L0. In the second compression prism pair 220, the first compressed light beam L11 is shaped into a second compressed light beam L12, and through two deflections in opposite directions refracted out of the working surface 203, an optical path translation of a third vertical spacing H13 length is generated between the second compressed light beam L12 and the first compressed light beam L11, and a second vertical spacing H12 is generated between the second compressed light beam L12 and the initial light beam L0.

[0104] Therefore, the second vertical interval H12 is equal to the sum of the first vertical interval H11 and the third vertical interval H13.

[0105] At the same time, by adjusting the arrangement of the compression prisms 202 within the first compression prism pair 210 and the second compression prism pair 220 , the first vertical spacing H11 and the third vertical spacing H13 are made equal, thereby further simplifying the optical path.

[0106] See also Figure 5 In some embodiments, the second compressed light beam L12 and the initial light beam L0 are both distributed along the first path S0, and H12=0.

[0107] In these embodiments, by adjusting the arrangement between the first compression prism pair 210 and the second compression prism pair 220, the optical path translation direction between the first compression beam L11 and the initial beam L0 is opposite to the optical path translation direction between the first compression beam L11 and the second compression beam L12, thereby achieving the distribution of the second compression beam L12 and the initial beam L0 along the first path S0, thereby maintaining the distribution of the optical path along the first path S0 and further simplifying the optical path.

[0108] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and components may be substituted with equivalents without departing from the scope of the present application. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A wafer defect optical detection device, characterized in that: include: a laser light source, configured to emit an initial light beam having a fixed wavelength, wherein the initial light beam is emitted along a first path; A compression prism array, comprising at least one compression prism pair, disposed on the exit side of the laser light source, wherein the compression prism pair comprises a pair of first refractive surfaces and a second refractive surface that form an inter-surface angle with each other; A supporting device for supporting the wafer; receiving device; Among them, the initial light beam is incident on the compression prism array, reaches the first refractive surface at a vertical angle, and reaches the second refractive surface with the angle between the surfaces as the incident angle, refracts and changes the propagation path toward the second refractive surface. After exiting the compression prism array, it is reflected by the side of the wafer located on the supporting device away from the supporting device and is incident on the receiving device.

2. The wafer defect optical inspection device according to claim 1, characterized in that: The compression prism pair includes a first compression prism and a second compression prism, the first compression prism includes a first working surface and a second working surface that form a first optical wedge angle with each other, the second compression prism includes a third working surface that forms an inter-prism angle with the first working surface, the first working surface is set as the first refractive surface, the second working surface is set as the second refractive surface, and the first optical wedge angle is set as the inter-surface angle at the first compression prism; Among them, after the initial light beam is vertically incident on the first compression prism through the first working surface, it is incident on the second working surface with the first optical wedge angle as the incident angle, and then refracted out of the first compression prism after being deflected at the angle between the prisms, and is vertically incident on the second compression prism through the third working surface.

3. The wafer defect optical inspection device according to claim 2, wherein: The second compression prism further includes a fourth working surface that forms a second wedge angle with the third working surface, the third working surface is configured as the first refractive surface, the fourth working surface is configured as the second refractive surface, and the second wedge angle is configured as the inter-surface angle at the second compression prism; The initial light beam is incident vertically onto the second compression prism via the third working surface, and then is incident onto the fourth working surface at the second wedge angle, and is refracted out of the second compression prism.

4. The wafer defect optical inspection device according to claim 3, characterized in that: The angle between the prisms and the second wedge angle are set to be consistent with the first wedge angle.

5. The wafer defect optical inspection device according to claim 4, characterized in that: The setting range of the first wedge angle includes 20°-30.5°.

6. The wafer defect optical inspection device according to claim 1, wherein: The initial light beam is shaped into a compressed light beam by the compression prism array. The compressed light beam is parallel to the initial light beam, and a vertical distance H1 between the compressed light beam and the initial light beam is greater than or equal to 0.

7. The wafer defect optical inspection device according to claim 6, characterized in that: The compression prism array includes a compression prism pair, the compression prism pair includes two compression prisms, each compression prism includes two working surfaces that form a wedge angle with each other, one working surface is configured as the first refractive surface, and the other working surface is configured as the second refractive surface, and the wedge angle is configured as the angle between the surfaces; The initial light beam is shaped into the compressed light beam by the compression prism pair, and there is a vertical distance H1 between the compressed light beam and the initial light beam, where H1≠0.

8. The wafer defect optical inspection device according to claim 6, wherein: The compression prism array includes a first compression prism pair and a second compression prism pair, wherein the first compression prism pair and the second compression prism pair respectively include two compression prisms, each of the compression prisms includes two working surfaces that form a wedge angle with each other, one of the working surfaces is configured as the first refractive surface, and the other working surface is configured as the second refractive surface, and the wedge angle is configured as the angle between the surfaces; The compressed light beam includes a first compressed light beam and a second compressed light beam. The initial light beam is shaped into the first compressed light beam by the first compression prism pair, and the first compressed light beam is shaped into the second compressed light beam by the second compression prism pair.

9. The wafer defect optical inspection device according to claim 8, characterized in that: The vertical spacing H1 also includes a first vertical spacing H11 and a second vertical spacing H12. There is a first vertical spacing H11 between the initial light beam and the first compressed light beam, a second vertical spacing H12 between the initial light beam and the second compressed light beam, and a third vertical spacing H13 between the first compressed light beam and the second compressed light beam, H12=H11+H13 and H11=H13.

10. The wafer defect optical inspection device according to claim 9, wherein: The second compressed light beam and the initial light beam are both distributed along the first path, and H12=0.

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