Display module and electronic equipment

Abstract

The embodiment of the utility model provides a display module and electronic equipment, and relates to the technical field of display. The display module comprises a display panel and a circuit board. The display panel comprises a display part, a bending part and a packaging part which are connected in sequence, and the packaging part and the circuit board are located on the same side of the display part. The circuit board comprises a main body and a flexible binding body, the flexible binding body is bound to the packaging part, the orthographic projection of the main body and the orthographic projection of the packaging part on the display part are not overlapped, the main body comprises a first part and a second part, and the orthographic projection of the first part and the orthographic projection of the second part on the display part are not overlapped. The thickness of the first part in the thickness direction of the display module is larger than that of the second part in the thickness direction of the display module. Therefore, the battery thickness can be increased, and the battery capacity is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of display technology, and in particular to a display module and an electronic device. Background Art

[0002] Currently, the display panel in electronic devices consists of a display portion, a folding portion, and a packaging portion, which are connected in sequence. The packaging portion is located on the back side of the display portion and is bonded to a flexible printed circuit (FPC) located on the display portion, achieving a narrow-frame design for the electronic device. However, as electronic devices become thinner and lighter, the FPC overlaps with the battery in the thickness direction of the device. This occupies a large space, resulting in less space for the battery, a smaller battery capacity, and a shorter battery life. Utility Model Content

[0003] The embodiments of the present application provide a display module and an electronic device, which can increase the battery thickness and improve the battery capacity.

[0004] In a first aspect, the present application provides a display module comprising a display panel and a circuit board. The display panel comprises a display portion, a bending portion, and an encapsulation portion connected in sequence, wherein the encapsulation portion and the circuit board are located on the same side of the display portion. The circuit board comprises a main body and a flexible binding body, wherein the flexible binding body is bound to the encapsulation portion, wherein the orthographic projections of the main body and the encapsulation portion on the display portion do not overlap, and wherein the main body comprises a first portion and a second portion, wherein the orthographic projections of the first portion and the second portion on the display portion do not overlap, and wherein the thickness of the first portion in the thickness direction of the display module is greater than the thickness of the second portion in the thickness direction of the display module.

[0005] The main body of the circuit board of the display module provided by the embodiment of the present application is composed of a first part and a second part of different thicknesses. The first distance between the first part and the battery is smaller than the second distance between the second part and the battery. The area of the orthographic projection of the first part on the display part is small. The ratio of the area of the orthographic projection of the first part on the display part to the area of the orthographic projection of the battery on the display part is small. The first part has a small impact on the safety of the battery within the allowable range. Then, on the basis of ensuring the safety of the battery, the first part is arranged by occupying a part of the battery expansion space between the battery and the circuit board, thereby increasing the thickness space for arranging the battery in the electronic device, thereby improving the space utilization of the electronic device, and increasing the thickness of the battery, so that the battery capacity is increased. In addition, the first part can be used to arrange the wiring with high signal quality requirements (such as the display signal line), and the second part can be used to arrange the wiring with low signal quality requirements, effectively ensuring the signal quality and ensuring that the signal interference and anti-winding degree are within a reasonable range.

[0006] In some possible implementations, the first portion has a routing layer for routing display signal lines, which can ensure the signal quality of the display signal and the display effect of the display module.

[0007] In some possible implementations, the number of layers of the routing layers of the first part and the second part is greater than or equal to 2, and the number of layers of the routing layers of the first part is greater than the number of layers of the routing layers of the second part.

[0008] In this way, the main body of the circuit board is composed of a first part and a second part with different numbers of routing layers. The second part with fewer routing layers is used to arrange routing with low signal quality requirements, and the first part with more routing layers is used to arrange routing with high signal quality requirements (such as display signal lines), effectively ensuring signal quality and ensuring that the signal interference and anti-winding levels are within a reasonable range.

[0009] In addition, the number of routing layers in the second part is less than the number of routing layers in the first part, which can also make the thickness of the second part less than the thickness of the first part. When the circuit board avoids the battery, the first distance between the first part and the battery is less than the second distance between the second part and the battery. The area of the first part is smaller, and the impact on the battery is smaller. Compared with the prior art, the number of routing layers in the overlapping part of the circuit board and the battery is the number of routing layers of the first part. The ineffective size of the battery in the thickness direction is reduced, the battery thickness can be increased, and the battery capacity can be improved. In other words, on the basis of ensuring battery safety, the first part is arranged by occupying a part of the battery expansion space between the battery and the circuit board. The size of the space for arranging the battery in the thickness direction is increased, the space utilization rate is improved, and the battery capacity is increased. Therefore, the main body of the circuit board is composed of the first part and the second part, which can ensure signal quality and increase the battery arrangement space, thereby achieving the purpose of increasing battery capacity.

[0010] In some possible implementations, the difference between the number of routing layers of the first part and the number of routing layers of the second part is equal to one. While ensuring signal quality, the thickness of the first part is reduced, the thickness of the battery expansion space is reduced, and the battery safety is improved.

[0011] In some possible implementations, the first portion has three routing layers, while the second portion has two. In this case, the first portion is a three-layer PCB design, while the second portion is a two-layer PCB design. This effectively ensures signal quality and ensures that signal interference and immunity levels are within acceptable ranges. Furthermore, the number of routing layers in the main body can be reduced, thereby lowering the cost of the main body.

[0012] In some possible implementations, the first portion includes a first routing layer, a second routing layer, and a third routing layer arranged along the thickness of the display module. The first routing layer is used to route display signal lines, and the third routing layer is used to route touch signal lines. In this way, the second routing layer can serve as a reference layer, separating the display signal lines from the touch signal lines to prevent mutual interference between the display signal lines and the touch signal lines, effectively ensuring the signal quality of the display signal lines and the touch signal lines.

[0013] In some possible implementations, along the thickness direction of the display module, the distance between the top surface of the first portion away from the display portion and the display portion is greater than the distance between the top surface of the second portion away from the display portion and the display portion, so that the distance between the first portion and the battery is smaller than the distance between the second portion and the battery. The portion of the first portion that is higher than the second portion in the thickness direction can be located within the battery expansion space, thereby achieving the purpose of increasing the battery capacity.

[0014] In some possible implementations, the main body has multiple wiring layers, and the flexible binding body extends from at least one wiring layer of the main body. The flexible binding body is a single-layer flexible circuit board structure, which facilitates increased flexibility and reliability of the binding method. Furthermore, the flexible binding body is thin and small in area. While encroaching on a portion of the battery expansion space along the thickness of the display module, the flexible binding body can still ensure battery safety, improve space utilization, increase battery length, and further increase battery capacity.

[0015] In some possible implementations, the flexible binding body extends a wiring from a bottom wiring layer of the main body, where the bottom wiring layer is a layer of the main body's multi-layer wiring layer that is closest to the display portion.

[0016] In this way, the flexible binding body can be connected below the main body, which can reduce the flexible binding body from occupying the battery expansion space and improve the safety of the battery.

[0017] In some possible implementations, the flexible binding body includes an extension section, a transition section, and a binding section that are connected in sequence, the binding section is bound to one end of the packaging portion away from the bending portion, and the extension section is connected to the main body.

[0018] In this way, the transition section can utilize the flexible characteristics of the flexible binding body to make a smooth transition between the extension section and the binding section, so as to ensure that the extension section remains level to avoid the risk of failure caused by the step difference and ensure reliable welding at the binding section.

[0019] In some possible implementations, the circuit board is a flexible circuit board.

[0020] In some possible implementations, the circuit board includes a device area and a non-device area, and the area of the orthographic projection of the device area on the display portion is greater than or equal to 127 mm. 2and less than or equal to 192mm 2 The display module further includes a plurality of electronic components connected to a side of the circuit board facing away from the display portion, wherein the orthographic projections of the plurality of electronic components on the display portion are located inside the orthographic projections of the component region on the display portion.

[0021] In this way, all electronic devices connected to the side of the circuit board facing away from the display part are concentrated in one area. Reasonable design of the position of this area can reduce the generation of ineffective area of the battery in the length direction. For example, all electronic devices are concentrated at one end of the circuit board in the width direction of the display module, and all electronic devices and batteries are arranged in parallel along the width direction of the display module. In other words, the device area and the battery are arranged in parallel along the width direction of the display module, and the device area and the battery are staggered in the length direction of the display module, which can increase the length of the battery and further increase the battery capacity.

[0022] In some possible implementations, the orthographic projection of the device region on the display portion is located inside the orthographic projection of the first portion on the display portion.

[0023] In this way, the electronic device can transmit high-quality signals to the display panel through the first part, thereby ensuring signal quality.

[0024] In some possible implementations, the device area includes a first area and a second area, and the plurality of electronic devices includes a first electronic device and a second electronic device. The height of the first electronic device is less than or equal to a preset height, and the orthographic projection of the first electronic device on the display portion is located within the orthographic projection of the first area on the display portion. The height of the second electronic device is greater than the preset height, and the orthographic projection of the second electronic device on the display portion is located within the orthographic projection of the second area on the display portion.

[0025] In this way, electronic devices can be divided into two categories according to space layout requirements, with taller electronic devices arranged in one area and shorter electronic devices arranged in another area, further improving space utilization.

[0026] In some possible implementations, the first region and the second region are arranged side by side along the length direction of the display module. In this case, the first region can be close to the packaging portion or the second region can be close to the packaging portion, which can further improve space utilization.

[0027] In some possible implementations, the display module further includes adhesive backing, which is attached to the surface of the second portion facing the display portion to ensure a consistent thickness of the circuit board.

[0028] A second aspect of the present application provides an electronic device, which includes a battery and a display module as described in any one of the first aspects. The battery is arranged on the side of the circuit board facing away from the display portion, and the orthographic projection of the battery on the display portion at least partially overlaps with the orthographic projection of the first part on the display portion, and the orthographic projection of the battery on the display portion at least partially overlaps with the orthographic projection of the second part on the display portion.

[0029] In some possible implementations, the ratio of the area of the orthographic projection of the first portion on the display portion to the area of the orthographic projection of the battery on the display portion is less than or equal to 0.35, which can ensure that the impact of the first portion on the safety of the battery is within an allowable range, so that the first portion can occupy a portion of the battery expansion space, increase the battery layout space, and improve the battery capacity.

[0030] In some possible implementations, the electronic device further includes a mainboard, which is disposed on a side of the circuit board facing away from the display portion. The mainboard and the battery are arranged side by side in a direction perpendicular to the thickness of the electronic device, and their orthographic projections on the display portion do not overlap. Electronic components in the display module connected to the side of the circuit board facing away from the display portion are located between the circuit board and the mainboard.

[0031] In this way, the gap between the circuit board and the mainboard is used to accommodate the electronic components on the circuit board, which can avoid the electronic components on the circuit board from overlapping with the battery, and contribute to the thinning design of the electronic equipment and increase the battery capacity.

[0032] In some possible implementations, the electronic device further includes an electronic component connected to a side of the main board facing the display portion, and an electronic component connected to the main board is provided between the main board and the electronic component connected to the circuit board.

[0033] In this way, the electronic components on the mainboard can be opposite to the electronic components on the circuit board along the thickness direction of the electronic device, thereby improving the utilization rate of the mainboard. The mainboard can be made narrower, further improving the utilization rate, increasing the battery layout space, and further increasing the battery capacity.

[0034] In some possible implementations, the distance between the first portion and the battery is greater than or equal to 3.5 percent of the thickness of the battery, and the distance between the second portion and the battery is greater than or equal to 4.5 percent of the thickness of the battery.

[0035] In this way, the gap between the first part, the second part and the battery can absorb the expansion of the battery, prevent the battery from contacting the circuit board, and ensure the safety of the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the three-dimensional structure of a display module in the related art;

[0037] Figure 2 for Figure 1 A schematic top view of the display module shown;

[0038] Figure 3 for Figure 1 A cross-sectional diagram of the display module and battery shown;

[0039] Figure 4 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0040] Figure 5 for Figure 4 A cross-sectional diagram of the display module and battery of the electronic device shown;

[0041] Figure 6 for Figure 5 A schematic diagram of the three-dimensional structure of the display module;

[0042] Figure 7 for Figure 5 A schematic top view of the display module in FIG.

[0043] Figure 8 for Figure 5 A schematic cross-sectional view of a circuit board in FIG.

[0044] Figure 9 for Figure 5 A schematic cross-sectional view of the main body of the circuit board;

[0045] Figure 10 for Figure 5 A cross-sectional diagram showing the coordination between the display module and the mainboard.

[0046] Description of reference numerals:

[0047] 100. Display module;

[0048] 110, display panel; 111, display portion; 112, bending portion; 113, packaging portion;

[0049] 120, circuit board; 121, flexible binding body; 1211, extension section; 1212, transition section; 1213, binding section; 122, main body; 1221, first portion; 1222, second portion; 1223, first board section; 1224, second board section; 123, device area; 1231, first area; 1232, second area; 124, insulation layer; 125, trace layer;

[0050] 130. First stack; 131. Cover plate; 132. Polarizer;

[0051] 140, second laminate; 141, back film; 142, support layer; 143, buffer heat dissipation film;

[0052] 150. Display driver chip;

[0053] 160, adhesive backing;

[0054] 200, middle frame; 210, through hole;

[0055] 300, back cover;

[0056] 400, battery;

[0057] 500, motherboard;

[0058] 600. Electronic devices;

[0059] X, length direction; Y, width direction; Z, thickness direction. DETAILED DESCRIPTION

[0060] Figure 1 Schematic diagram of a three-dimensional structure of a display module in related technology. Figure 2 for Figure 1 The schematic top view of the display module shown in FIG. Figure 3 for Figure 1 The cross-sectional diagram of the display module and battery shown.

[0061] In related art, see Figure 1 As shown, the display module includes a display panel 910 (Panel) and a flexible printed circuit 920 (flexible printed circuit, FPC). Figure 3 As shown, the display panel 910 includes a display portion 911, a bending portion 912, and a packaging portion 913 connected in sequence, and the packaging portion 913 is located on the back side of the display portion 911. The flexible circuit board 920 and the packaging portion 913 are located on the same side of the display portion 911. The flexible circuit board 920 has a binding portion 921 and a main body portion 922. The binding portion 921 is bonded to the packaging portion 913, and the main body portion 922 and the packaging portion 913 are connected along the length direction of the display portion 911 (as shown in FIG. Figure 3 In this way, the packaging portion 913 of the display panel 910 is bent to the back side of the display portion 911 through the bending portion 912, which can reduce the frame space occupied by the electronic device and realize the narrow frame design of the electronic device.

[0062] like Figure 2 As shown, the flexible circuit board 920 has a first device area 923 and a second device area 924, that is, a plurality of devices (such as Figure 2The components are arranged in two areas, so that the flexible circuit board 920 has more space for routing. However, when the components are arranged in a dispersed manner, a battery inactive area will be generated. The battery inactive area refers to the area where the flexible circuit board 920 is located in the thickness direction of the battery 930 (such as Figure 3 The area that cannot overlap with the battery 930 in the Z direction. Figure 2 As shown, there is a battery invalid area 1 (such as Figure 2 W1 in the figure) and the battery invalid area 2 (as shown in the figure Figure 2 (As shown in W2 in the figure), battery inactive area 1 is the area between the bend 912 and the end of the flexible circuit board 920 facing the bend 912. Battery inactive area 2 is the area between the end of the flexible circuit board 920 close to the packaging portion 913 and the end of the second device area 924 facing away from the packaging portion 913. It can be seen that the presence of battery inactive area 1 and battery inactive area 2 reduces the length of the battery 930, resulting in low space utilization under the flexible circuit board 920 (on the side facing the battery 930), reducing the battery capacity. In addition, to ensure signal quality, the main body 922 of the flexible circuit board 920 is a three-layer design. The thickness of the main body 922 of the flexible circuit board 920 is relatively thick, which reduces the thickness of the battery 930 and reduces the battery capacity.

[0063] Especially with the trend toward thinner and lighter electronic devices, the space inside them is further reduced. The flexible circuit board 920 takes up both length and width, creating a significant amount of ineffective space for the battery 930. This further reduces the space available for the battery 930, further reducing the battery capacity and shortening the battery life of the electronic device. Therefore, maximizing battery capacity within this limited space has become a pressing issue.

[0064] To address this issue, in one embodiment, the main body 922 of the flexible circuit board 920 is designed as a two-layer board, and the area where the flexible circuit board 920 and the battery 930 overlap in the thickness direction is a two-layer board. Figure 3 The three-layer board design shown in the figure has a reduced thickness of two layers of boards, and the thickness space occupied by the flexible circuit board 920 is reduced, which reduces the battery expansion space (such as Figure 3 While the thickness of the battery 930 remains unchanged (as shown in Figure H), the battery thickness is increased, thereby improving battery capacity. While a two-layer board design has a positive impact on battery thickness, it also results in insufficient board-level crosstalk margin for the display and touch signal lines. The display signal lines lack a complete reference ground, and the board-level insertion and return losses do not meet design constraints. This also negatively impacts the full-link eye height. In other words, a two-layer board design cannot effectively guarantee signal quality, and the signal interference and immunity levels fail to meet requirements.

[0065] In view of this, the embodiment of the present application provides a display module and an electronic device. By placing all the devices on the side of the display part of the flexible circuit board facing away from the display panel in one area, the area can be decoupled from the length of the battery, and the battery invalid area 2 in the prior art is removed. The battery length can be increased, and even the battery length can be maximized, thereby increasing the battery capacity and increasing the battery life of the electronic device. In addition, the main body of the flexible circuit board adopts a combination design of a two-layer board and a three-layer board. That is to say, a part of the main body of the flexible circuit board adopts a three-layer board design, and the three-layer board is used to route the wiring with high signal quality requirements, effectively ensuring the signal quality and ensuring that the signal interference and anti-interference levels meet the requirements. At the same time, when the main body adopts a combination design of a two-layer board and a three-layer board, the three-layer board occupies a small part of the battery expansion space, which increases the thickness of the battery, improves the battery capacity, and increases the battery life of the electronic device.

[0066] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a point of sales (POS) machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, and other electronic devices with a display module.

[0067] In the embodiments of this application, a mobile phone is used as an example of the electronic device to specifically illustrate the structure of the electronic device. The mobile phone can be a candy bar phone, a folding screen phone, a side-sliding phone, etc. The folding screen phone can be a large inward folding phone, a small inward folding phone, a multi-folding phone, etc. The following description uses a candy bar phone as an example.

[0068] In some scenarios, when the electronic device is a foldable screen mobile phone, the foldable screen mobile phone can adopt a solution of separating the SOC (system on chip) and RFIC (radio frequency integrated circuit), which can improve space utilization and increase the flexibility of antenna layout. Specifically, the SOC and RFIC are placed in two separate shells, the cellular antenna and RFIC are set in the same shell, and the SOC and NC antenna are set in the same shell.

[0069] It should be noted that in the various drawings of the embodiments of the present application, the X-axis can be defined as the length direction of the electronic device, the Y-axis can be defined as the width direction of the electronic device, and the Z-axis can be defined as the thickness direction of the electronic device. More specifically, the light-emitting surface of the display screen of the electronic device can be defined as the positive direction of the Z-axis.

[0070] Figure 4 This is a schematic diagram of an explosion of an electronic device provided in an embodiment of the present application.

[0071] refer to Figure 4 As shown, the electronic device may include a middle frame 200, a display module 100, and a back cover 300. The display module 100 and the back cover 300 are respectively connected to opposite sides of the middle frame 200. The display module 100, the middle frame 200, and the back cover 300 together enclose a housing space, in which components such as a motherboard 500, a battery 400, and a camera module may be placed.

[0072] The motherboard 500 can be fixedly connected to the middle frame 200 by bonding, screwing, or the like. The battery 400 can also be fixedly connected to the middle frame 200 by bonding or the like. The display module 100 and the battery 400 can each be electrically connected to the motherboard 500 by means of a flexible circuit board, a cable, a conductive member, or the like. Furthermore, the motherboard 500 and the battery 400 are offset in the thickness direction Z of the electronic device.

[0073] like Figure 4 As shown, the middle frame 200 has a through-hole 210. A portion of the battery 400 extends into the through-hole 210. The battery 400 and the display module 100 are stacked together, with a gap between them. This gap, also known as the battery expansion space, is used to absorb expansion of the battery 400 and ensure the safety of the battery 400. Furthermore, the display module 100 is also electrically connected to the motherboard 500 through the through-hole 210.

[0074] The middle frame 200 mainly supports the entire device and can be made of metal, ceramic, glass, plastic and other materials. The back cover 300 can be made of metal, ceramic, glass, plastic and other materials. The middle frame 200 and the back cover 300 can be formed separately and fixed by welding, clamping, bonding and the like.

[0075] Figure 5 for Figure 4 The cross-sectional diagram of the display module and battery of the electronic device shown is shown. Figure 6 for Figure 5 Schematic diagram of the three-dimensional structure of the display module, Figure 7 for Figure 5 Schematic diagram of a top view of the display module.

[0076] See also Figure 5 As shown, the display module 100 includes a first stack 130, a second stack 140, a display panel 110 (Panel), a circuit board 120, a display driver chip 150 (display driver integrated circuit, DDIC) and an electronic device 600 (such as Figure 6shown).

[0077] The display panel 110 may be a liquid crystal display (LCD) display panel, an organic light emitting diode (OLED) display panel, or the like.

[0078] like Figure 6 As shown, the display driver chip 150 can be attached to the display panel 110 to drive the display panel 110 to realize the display function. The circuit board 120 is attached to the display panel 110, and various electronic components 600 can be arranged on the circuit board 120, such as a fingerprint module chip and other devices. The display driver chip 150 and the circuit board 120 can both be arranged on the back side of the light-emitting surface of the display panel 110. The electronic components 600 are located on the side of the circuit board 120 that faces away from the display portion 111 of the display panel 110.

[0079] It should be understood that bonding refers to a method of wire bonding used in the production and packaging of microelectronic devices. For example, metal wire (gold wire, etc.) can be used to connect the internal interconnects of solid-state circuits in microelectronic devices using heat, pressure, or ultrasonic energy. The process can include pressure welding, wire bonding, bonding, ball bonding, and flat welding. For example, the display driver chip 150 is bonded to the display panel 110, that is, the display driver chip 150 is physically fixed and electrically connected to the display panel 110 through welding or other methods.

[0080] See also Figure 5 As shown, the display panel 110 may include a display portion 111, a folded portion 112, and an encapsulation portion 113. The encapsulation portion 113 may be bent through the folded portion 112 to the back side of the light-emitting surface of the display portion 111. In other words, the encapsulation portion 113 is spaced apart from the display portion 111 and located on opposite sides of the folded portion 112. The display portion 111 is used to provide a display image for the electronic device, while the encapsulation portion 113 is used to bind the display driver chip 150 and the circuit board 120. The encapsulation portion 113 may be bent to the back side of the light-emitting surface of the display portion 111 to reduce the space occupied by the frame of the electronic device.

[0081] like Figure 5As shown, the first stack 130, the display portion 111, the second stack 140, and the packaging portion 113 are stacked along the thickness direction Z of the electronic device. The first stack 130 may include a cover plate 131 (CG) and a polarizer 132 (POL). The polarizer 132 is located between the cover plate 131 and the display portion 111 of the display panel 110. The cover plate 131 may be made of glass and is used to protect the display module 100. The polarizer 132 is used to reduce the impact of reflected light on the display effect of the display module 100. It should be noted that the first stack 130 may also have other structures. The second stack 140 may include a buffer heat dissipation film 143 (super clean foam, SCF), a back film 141 (back film, BF), and a support layer 142. The support layer 142 is located between the buffer heat dissipation film 143 and the back film 141. The back film 141 is close to the display portion 111, and the buffer heat dissipation film 143 is close to the packaging portion 113 and the circuit board 120. In other words, the packaging portion 113 and the circuit board 120 are arranged on the same side of the buffer heat dissipation film 143. It should be noted that the structure of the second stack 140 may also be other structures.

[0082] like Figure 5 As shown, the circuit board 120 and the packaging part 113 are located on the same side of the display part 111, and the battery 400 is arranged on the side of the circuit board 120 facing away from the display part 111. The circuit board 120 and the battery 400 partially overlap in their orthographic projections on the display part 111. It can be seen that there is an overlapping area of the circuit board 120 in the thickness direction Z of the electronic device. For the safety of the battery 400, there is a gap between the battery 400 and the circuit board 120 in the thickness direction Z of the electronic device. The gap is used as a battery expansion space. When the battery 400 expands, it extends into the gap to prevent the battery 400 from conflicting with the circuit board 120. There is no restriction on the specific depth of the battery expansion space in the thickness direction Z of the electronic device. For example, Figure 5 As shown, the depth of the battery expansion space in the thickness direction Z of the electronic device is L2.

[0083] like Figure 5 As shown, the circuit board 120 includes a main body 122 and a flexible binding body 121. The flexible binding body 121 is bound to the packaging portion 113 and connected to the main body 122. Specifically, one end of the flexible binding body 121 is bound to the end of the packaging portion 113 away from the bending portion 112, and the other end of the flexible binding body 121 is connected to the end of the main body 122 closer to the packaging portion 113. The main body 122 is bound to the packaging portion 113 through the flexible binding body 121. The flexible binding body 121 is located between the bending portion 112 and the main body 122.

[0084] like Figure 5As shown, the flexible binding body 121 may include an extension section 1211, a transition section 1212, and a binding section 1213 connected in sequence. The binding section 1213 is bound to the end of the packaging portion 113 away from the bent portion 112, and the extension section 1211 is connected to the main body 122. In this way, the transition section 1212 can utilize the flexibility of the flexible binding body 121 to achieve a smooth transition between the extension section 1211 and the binding section 1213, thereby ensuring that the extension section 1211 remains level to avoid the risk of failure caused by a step difference, and ensuring reliable welding at the binding section 1213.

[0085] In the embodiment of the present application, the flexible binding body 121 is a single-layer flexible circuit board structure, and the main body 122 is a multi-layer flexible circuit board structure, so the circuit board 120 is a flexible printed circuit board (FPC). Of course, in addition to the multi-layer flexible circuit board structure, in some embodiments, the main body 122 can also be a multi-layer printed circuit board (PCB) structure. In this case, the circuit board 120 is equivalent to a flexible circuit board and a printed circuit board.

[0086] Figure 8 for Figure 5 Schematic diagram of the cross section of the circuit board.

[0087] The main body 122 is a multi-layer circuit board 120 structure, see Figure 8 As shown, the main body 122 may include multiple wiring layers and an insulating layer 124 disposed between two adjacent wiring layers 125. The flexible binding body 121 is formed by extending wires from at least one wiring layer 125 of the main body 122. For example, the flexible binding body 121 is formed by extending wires from one wiring layer 125 of the main body 122. Of course, the flexible binding body 121 may also be formed by extending wires from multiple wiring layers 125 of the main body 122. In this way, the flexible binding body 121 may be connected to the main body 122, so that the wiring inside the flexible binding body 121 (not shown in the figure) is connected to the wiring inside the main body 122 (not shown in the figure).

[0088] Specifically, the flexible binding body 121 has a routing layer 125, which is connected to one of the routing layers 125 of the main body 122, thereby achieving a routing connection between the flexible binding body 121 and the main body 122. When the main body 122 is a multi-layer flexible circuit board structure, the main body 122 and the flexible binding body 121 can be an integral structure. In this case, the routing layer 125 of the flexible binding body 121 and one of the routing layers 125 of the main body 122 are an integral structure.

[0089] The flexible binding body 121 can appear on the side wall of the main body 122 at any layer of wiring, and the specific wiring location is not limited. For example, the flexible binding body 121 can be connected from the bottom wiring layer of the main body 122. The bottom wiring layer is the layer closest to the display unit 111 among the multiple wiring layers of the main body 122, for example, Figure 8 As shown, the main body 122 has three wiring layers 125. Along the thickness direction Z of the electronic device, the bottom wiring layer is the layer closest to the display portion 111 among the three wiring layers 125. In this way, the flexible binding body 121 can be wired out from the bottom of the main body 122.

[0090] The orthographic projections of the main body 122 and the packaging portion 113 on the display portion 111 do not overlap. For example, the orthographic projections of the main body 122 and the packaging portion 113 on the display portion 111 can both be quasi-rectangular, and the corresponding quasi-rectangular shapes of the main body 122 and the packaging portion 113 are arranged at intervals along the length direction X of the electronic device. It can be seen that the main body 122 and the packaging portion 113 are arranged side by side along the length direction X of the electronic device, that is, the main body 122 and the packaging portion 113 are staggered in the thickness direction Z of the electronic device (such as Figure 5 A plurality of electronic components 600 are connected to a side of the main body 122 facing away from the display portion 111 , and the electronic components 600 are electrically connected to the driver chip via the circuit board 120 .

[0091] like Figure 5 As shown, the main body 122 and the battery 400 at least partially overlap in the thickness direction Z of the electronic device, that is, the orthographic projection of at least part of the main body 122 on the display portion 111 is located inside the orthographic projection of the battery 400 on the display portion 111. In order to reduce the influence of the main body 122 on the thickness dimension of the battery 400, as shown in FIG. Figure 6 As shown, the body 122 may include a first portion 1221 and a second portion 1222. The orthographic projections of the first portion 1221 and the second portion 1222 on the display portion 111 do not overlap, and the thickness of the first portion 1221 in the thickness direction Z of the display module 100 is greater than the thickness of the second portion 1222 in the thickness direction Z of the display module 100. The orthographic projection of the battery 400 on the display portion 111 at least partially overlaps with the orthographic projection of the first portion 1221 on the display portion 111. For example, the orthographic projection of the battery 400 on the display portion 111 partially overlaps with the orthographic projection of the first portion 1221 on the display portion 111. The orthographic projection of the battery 400 on the display portion 111 at least partially overlaps with the orthographic projection of the second portion 1222 on the display portion 111. For example, the orthographic projection of the battery 400 on the display portion 111 partially overlaps with the orthographic projection of the second portion 1222 on the display portion 111.

[0092] like Figure 5As shown, the main body 122 of the circuit board 120 is composed of a first part 1221 and a second part 1222 of different thicknesses. The first distance L1 between the first part 1221 and the battery 400 is smaller than the second distance L2 between the second part 1222 and the battery 400. The area of the orthographic projection of the first part 1221 on the display portion 111 is small, and the ratio of the area of the orthographic projection of the first part 1221 on the display portion 111 to the area of the orthographic projection of the battery 400 on the display portion 111 is small. The first part 1221 has little impact on the safety of the battery 400 within the allowable range. Then, on the basis of ensuring the safety of the battery 400, the first part 1221 is arranged by occupying a part of the battery expansion space between the battery 400 and the circuit board 120, thereby increasing the thickness space for arranging the battery 400 in the electronic device, thereby improving the space utilization of the electronic device, and increasing the thickness of the battery 400, so that the battery capacity is increased. In addition, the first part 1221 can be used to arrange routing with high signal quality requirements (such as display signal lines), and the second part 1222 can be used to arrange routing with low signal quality requirements, effectively ensuring signal quality and ensuring that signal interference and anti-winding levels are within a reasonable range.

[0093] The second portion 1222 is located outside the battery expansion space, a portion of the first portion 1221 is located inside the battery expansion space, and another portion of the first portion 1221 is located outside the battery expansion space. Thus, it can be seen that the first portion 1221 encroaches on a portion of the battery expansion space, but a gap is still left between the first portion 1221 and the battery 400, thus ensuring the safety of the battery 400.

[0094] like Figure 5 As shown, along the thickness direction Z of the display module 100, the distance between the first portion 1221 away from the top surface of the display portion 111 and the display portion 111 is greater than the distance between the second portion 1222 away from the top surface of the display portion 111 and the display portion 111, so that the first distance L1 between the first portion 1221 and the battery 400 is smaller than the second distance L2 between the second portion 1222 and the battery 400. The portion of the first portion 1221 that is higher than the second portion 1222 in the thickness direction Z can be located in the battery expansion space, thereby achieving the purpose of increasing the battery capacity.

[0095] For example, see Figure 7 As shown, the second portion 1222 may include a first plate segment 1223 and a second plate segment 1224, which are located on both sides of the first portion 1221 and spaced apart. Of course, the structure of the second portion 1222 may also be other structures, for example, the second portion 1222 may be an integrated plate structure.

[0096] In some possible implementations, the ratio of the area of the orthographic projection of the first portion 1221 on the display portion 111 to the area of the orthographic projection of the battery 400 on the display portion 111 is less than or equal to 0.35. For example, the ratio of the area of the orthographic projection of the first portion 1221 on the display portion 111 to the area of the orthographic projection of the battery 400 on the display portion 111 is equal to 0.3. Other ratios are also possible. This ensures that the impact of the first portion 1221 on the safety of the battery 400 is within an allowable range, thereby allowing the first portion 1221 to occupy a portion of the battery expansion space, thereby increasing the layout space for the battery 400 and improving the battery capacity.

[0097] In some possible implementations, the spacing between the first portion 1221 and the battery 400 is greater than or equal to 3.5 percent of the thickness of the battery 400, and the spacing between the second portion 1222 and the battery 400 is greater than or equal to 4.5 percent of the thickness of the battery 400. In this way, the gaps between the first portion 1221 and the second portion 1222 and the battery 400 can absorb battery expansion, prevent the battery 400 from contacting the circuit board 120, and ensure the safety of the battery 400.

[0098] It should be noted that the distance between the first portion 1221 and the battery 400 is the distance between the first portion 1221 and the battery 400 when the temperature of the battery 400 is a preset temperature. For example, when the temperature of the battery 400 is 25°, the distance between the first portion 1221 and the battery 400 is greater than or equal to 3.5 percent of the thickness of the battery 400. Similarly, the distance between the second portion 1222 and the battery 400 is the distance between the second portion 1222 and the battery 400 when the temperature of the battery 400 is a preset temperature.

[0099] Figure 9 for Figure 5 Schematic cross-section of the main body of the circuit board.

[0100] In the embodiment of the present application, the number of layers of the routing layer 125 of the first part 1221 and the second part 1222 is greater than or equal to 2, and the number of layers of the routing layer 125 of the first part 1221 is greater than the number of layers of the routing layer 125 of the second part 1222. Figure 9 As shown, the first portion 1221 includes three routing layers 125, and the second portion 1222 includes two routing layers 125. In this case, the thickness of the first portion 1221 can be 0.17 mm, and the thickness of the second portion 1222 can be 0.12 mm. The thickness of the first portion 1221 is greater than the thickness of the second portion 1222. It should be noted that the thicknesses of the first portion 1221 and the second portion 1222 are not limited to the thicknesses described in this application.

[0101] It should be noted that, in addition to having three layers, the number of layers of the routing layer 125 of the first portion 1221 may also be more than three. Similarly, in addition to having two layers, the number of layers of the routing layer 125 of the second portion 1222 may also be more than two.

[0102] The number of layers of the routing layer 125 of the first portion 1221 is 3, and the number of layers of the routing layer 125 of the second portion 1222 is 2. Therefore, it can be seen that the difference between the number of layers of the routing layer 125 of the first portion 1221 and the number of layers of the routing layer 125 of the second portion 1222 is equal to 1. However, the difference between the number of layers of the routing layer 125 of the first portion 1221 and the number of layers of the routing layer 125 of the second portion 1222 can also be greater than 1. For example, the number of layers of the routing layer 125 of the first portion 1221 is 4, and the number of layers of the routing layer 125 of the second portion 1222 is 2, so that the difference between the number of layers of the routing layer 125 of the first portion 1221 and the number of layers of the routing layer 125 of the second portion 1222 is equal to 2.

[0103] The number of layers of the routing layer 125 of the first part 1221 is 3, so that the first part 1221 is a three-layer board design, which can be used to arrange routing with high signal quality requirements, such as display signal lines. Specifically, the first part 1221 may include a first routing layer, a second routing layer, and a third routing layer arranged along the thickness direction of the display and module 100, the first routing layer being away from the display unit 111, and the third routing layer being close to the display unit 111. The first routing layer is used to route display signal lines, and the third routing layer is used to route touch signal lines. Among them, the display signal lines can be MIPI lines, and the touch signal lines include touch drive lines Tx and touch sensing lines Rx. By using the second routing layer as a reference layer, the display signal lines and the touch signal lines can be separated, avoiding mutual interference between the signals on the display signal lines and the touch signal lines, and effectively ensuring the signal quality of the display signal lines and the signal quality of the touch signal lines.

[0104] The number of layers of the routing layer 125 of the second part 1222 is 2, so that the second part 1222 is a two-layer board design, which can be used to arrange routing with low signal quality requirements.

[0105] As can be seen, the main body 122 is a combination of three-layer and two-layer boards. The three-layer board meets the routing requirements for high-quality signal routing. Compared to a two-layer design, this improves the board-level crosstalk margin for the display and touch signal lines, ensuring a complete reference ground for the display signal lines, optimizing board-level insertion and return losses, and improving the eye height of the entire link. Therefore, the partial three-layer design of the main body 122 can improve signal quality and ensure that signal interference and anti-winding levels are within reasonable ranges.

[0106] In addition, the depth of the battery expansion space along the thickness direction Z of the electronic device (such as Figure 5 L2 or Figure 3 On the basis of the unchanged H), compared with the prior art, the portion of the circuit board 920 and the battery 930 opposite to each other is a three-layer board design (such as Figure 3 As shown, the circuit board 120 provided in this embodiment of the present application comprises a two-layer design for the majority of the body 122 opposite the battery 400. The battery expansion space is utilized to accommodate a portion of the three-layer design of the circuit board 120, allowing the battery 400 to move 0.05 mm toward the circuit board 120. This reduces the ineffective dimension between the battery 400 and the circuit board 120 by 0.05 mm, increases the thickness of the battery 400 by 0.05 mm, and improves the battery capacity. The 0.05 represents the difference between a three-layer design and a two-layer design.

[0107] To ensure the safety of the battery 400 as much as possible, the area of the first portion 1221 can be minimized to reduce the area of the battery 400 relative to the first portion 1221. In one embodiment, the area of the orthographic projection of the first portion 1221 on the display portion 111 can be one-third of the area of the orthographic projection of the circuit board 120 on the display portion 111. In this case, the area of the orthographic projection of the second portion 1222 on the display portion 111 is larger than the area of the orthographic projection of the first portion 1221 on the display portion 111. Of course, the area of the orthographic projection of the first portion 1221 on the display portion 111 can also be smaller or larger than one-third of the area of the orthographic projection of the circuit board 120 on the display portion 111.

[0108] In order to further increase the battery capacity, in some embodiments, a gap may be provided between the flexible binding body 121 and the battery 400. The distance of the gap in the thickness direction Z of the electronic device is a third distance L3. In this case, there is an overlapping area between the flexible binding body 121 and the battery 400. In other words, the end of the battery 400 facing the bend 112 can be aligned with the end of the flexible binding body 121 facing the bend 112, further increasing the length of the battery 400. Since the area of the flexible binding body 121 is relatively small, the impact of the flexible binding body 121 on battery safety is relatively small. The flexible binding body 121 can also occupy the battery expansion space, thereby improving space utilization, increasing the length of the battery 400, and further increasing the battery capacity.

[0109] Since the main body 122 is composed of a first portion 1221 and a second portion 1222 of different thicknesses, in order to ensure that the thickness of the main body 122 is consistent, in some possible implementations, such as Figure 5As shown, the display module 100 may further include adhesive 160, which is applied to the surface of the second portion 1222 facing the display portion 111. The adhesive 160 is bonded to the second laminate 140. Specifically, the adhesive 160 may be bonded to the buffer heat dissipation film 143. In this case, there is no adhesive 160 area between the first portion 1221 and the buffer heat dissipation film 143.

[0110] The above discussion describes increasing the thickness of battery 400 and thereby increasing battery capacity by optimizing the structure of circuit board 120 and improving space utilization in the thickness direction. However, it is also possible to increase battery capacity by increasing space utilization in the length or width direction, reducing the amount of inactive battery area, and increasing the length or width of battery 400. The following describes how to increase the length or width of battery 400.

[0111] In some possible implementations, such as Figure 7 As shown, the circuit board 120 may include a device area 123 and a non-device area, and the orthographic projections of the device area 123 and the non-device area on the display portion 111 do not overlap. The orthographic projections of the plurality of electronic devices 600 connected to the side of the circuit board 120 facing away from the display portion 111 on the display portion 111 are located within the orthographic projection of the device area 123 on the display portion 111. All electronic devices 600 connected to the side of the circuit board 120 facing away from the display portion 111 are concentrated in one area. By optimizing the position of this area, the generation of ineffective areas of the battery 400 in the length direction X can be reduced, for example Figure 7 As shown, all electronic devices 600 are concentrated at one end of the circuit board 120 in the width direction Y of the display module 100, and all electronic devices 600 and the battery 400 are arranged along the width direction Y of the display module 100. That is, the device area 123 and the battery 400 are parallel to each other in the width direction Y of the electronic device, and the device area 123 and the battery 400 are staggered in the length direction X of the electronic device, thereby improving space utilization. The length dimension of the battery 400 can be maximized, further increasing the length of the battery 400, thereby further increasing the battery capacity.

[0112] The device area 123 can be understood as an area on the circuit board 120 for connecting to the electronic device 600, or in other words, the device area 123 can also be understood as an area on the circuit board 120 where the electronic device 600 is arranged. The non-device area can be understood as an area on the circuit board 120 that is not used for connecting to the electronic device 600, or in other words, the non-device area is an area on the circuit board 120 other than the device area 123.

[0113] It can be understood that all electronic devices 600 are concentrated in one area so that all electronic devices 600 can be decoupled from the battery 400 in the length direction X or width direction Y of the electronic device, thereby increasing the size of the battery 400 in the length direction X or width direction Y of the electronic device and improving the space utilization of the electronic device in the length direction X or width direction Y.

[0114] like Figure 7 As shown, the shape of the device region 123 is similar to a square. Of course, the shape of the device region 123 may also be other shapes.

[0115] For example, the area of the orthographic projection of the device region 123 on the display portion 111 may be greater than or equal to 127 mm. 2 and less than or equal to 192mm 2 For example, the area of the orthographic projection of the device region 123 on the display portion 111 may be 159.125 mm 2 Of course, the area of the orthographic projection of the device region 123 on the display portion 111 may also be other values.

[0116] In some possible implementations, the orthographic projection of the device area 123 on the display portion 111 is located inside the orthographic projection of the first part 1221 on the display portion 111. In this way, the electronic device 600 connected to the side of the circuit board 120 facing away from the display portion 111 can transmit high-quality signals with the display panel 110 through the first part 1221, thereby ensuring signal quality.

[0117] In some possible implementations, such as Figure 7 As shown, the device region 123 may include a first region 1231 and a second region 1232. The orthographic projections of the first region 1231 and the second region 1232 on the display portion 111 do not overlap. For example, the orthographic projections of the first region 1231 and the second region 1232 on the display portion 111 are rectangular, and the rectangles corresponding to the first region 1231 and the second region 1232 do not overlap. However, the orthographic projection of the first region 1231 on the display portion 111 may also be other shapes, and similarly, the orthographic projection of the second region 1232 on the display portion 111 may also be other shapes.

[0118] In one embodiment, the first region 1231 and the second region 1232 are arranged side by side along the length direction X of the display module 100. In this case, the first region 1231 can be close to the packaging portion 113 or the second region 1232 can be close to the packaging portion 113. That is, the first region 1231 can be located between the second region 1232 and the packaging portion 113 (e.g., Figure 7Alternatively, the second region 1232 may be located between the first region 1231 and the packaging portion 113. Of course, in addition to being arranged side by side along the length direction X of the display module 100, the first region 1231 and the second region 1232 may also be arranged in other ways. For example, the first region 1231 and the second region 1232 may also be arranged side by side along the length direction X of the display module 100.

[0119] The multiple electronic devices 600 connected to the side of the circuit board 120 facing away from the display portion 111 may include a first electronic device 600A and a second electronic device 600B. The number of first electronic devices 600A may be one or more, and the number of second electronic devices 600B may be one or more. The height of the first electronic device 600A is less than or equal to a predetermined height, and the orthographic projection of the first electronic device 600A on the display portion 111 is located within the orthographic projection of the first region 1231 on the display portion 111. The height of the second electronic device 600B is greater than the predetermined height, and the orthographic projection of the second electronic device 600B on the display portion 111 is located within the orthographic projection of the second region 1232 on the display portion 111.

[0120] The electronic components 600 connected to the side of the circuit board 120 facing away from the display portion 111 are divided into two categories: shorter electronic components 600 are arranged in a first area 1231, and taller electronic components 600 are arranged in a second area 1232. For example, electronic components 600 with a height of less than 0.36 mm are connected to the first area 1231, and electronic components 600 with a height of more than 0.36 mm are connected to the second area 1232. Arranging the electronic components 600 by category can further improve space utilization.

[0121] The preset height may be other values besides 0.36 mm.

[0122] Figure 10 for Figure 5 A cross-sectional diagram showing the coordination between the display module and the mainboard.

[0123] In order to further increase the battery capacity, in some possible implementations, the mainboard 500 is disposed on the side of the circuit board 120 facing away from the display portion 111 (eg, Figure 10(As shown in FIG. 1 ), the mainboard 500 and the battery 400 are arranged side by side in a direction perpendicular to the thickness direction Z of the electronic device. The orthographic projections of the mainboard 500 and the battery 400 on the display portion 111 do not overlap. The electronic device 600 connected to the circuit board 120 in the display module 100 is located between the circuit board 120 and the mainboard 500. Utilizing the gap between the circuit board 120 and the mainboard 500 to accommodate the electronic device 600 on the circuit board 120 prevents overlap between the electronic device 600 on the circuit board 120 and the battery 400, contributing to the thinning design of the electronic device and increasing battery capacity.

[0124] In some possible implementations, such as Figure 10 As shown, the electronic device further includes an electronic device 600 connected to the side of the mainboard 500 facing the display portion 111. The electronic device 600 connected to the mainboard 500 is disposed between the mainboard 500 and the electronic device 600 connected to the circuit board 120. The electronic device 600 on the mainboard 500 can be positioned opposite the electronic device 600 on the circuit board 120 along the thickness direction Z of the electronic device, thereby improving the utilization of the mainboard 500. The mainboard 500 can be made narrower, further improving utilization, increasing battery placement space, and further increasing battery capacity.

[0125] The electronic device 600 on the mainboard 500 can be located directly below the first area 1231, or directly below the second area 1232, or electronic devices 600 on the mainboard 500 can be located below both the first area 1231 and the second area 1232. It should be noted that the term "below" refers to the state where the mainboard 500 is located below the circuit board 120 and does not limit the relative positions of the mainboard 500 and the circuit board 120.

[0126] It should be noted that the number of electronic devices 600 arranged below the device area 123 on the main board 500 is at least a part of all the electronic devices 600 on the main board 500. For example, there are 5 electronic devices 600 arranged on the main board 500, of which three electronic devices 600 are arranged below the device area 123.

[0127] In summary, by concentrating the electronic components 600 within a single area of the circuit board 120 and employing a two-layer and three-layer design for the main body 122 of the circuit board 120, space utilization is improved, thereby increasing battery capacity. Furthermore, the two-layer and three-layer design for the main body 122 of the circuit board 120 also ensures signal quality, ensuring that signal interference and anti-winding levels meet requirements.

[0128] It should be noted that when the electronic devices 600 are arranged together on the circuit board 120, in addition to adopting a combination design of a two-layer board and a three-layer board for the main body 122 of the circuit board 120, the circuit board 120 can also adopt a multi-layer board design such as a two-layer board design or a three-layer board design. At this time, by improving the space utilization rate of the electronic device in the length direction X or the width direction Y, the length or width of the battery 400 can also be increased, thereby achieving the purpose of increasing the battery capacity.

[0129] Similarly, when the main body 122 of the circuit board 120 adopts a combination design of a two-layer board and a three-layer board, in addition to centrally arranging the electronic devices 600 on the circuit board 120, the electronic devices 600 on the circuit board 120 can also be dispersedly arranged. The electronic devices 600 on the circuit board 120 can be distributed in multiple areas. At this time, by improving the space utilization in the thickness direction Z of the electronic device, the thickness of the battery 400 can also be increased, thereby achieving the purpose of increasing the battery capacity.

[0130] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0131] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0132] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0133] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0134] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0135] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A display module (100), characterized in that: It includes a display panel (110) and a circuit board (120); The display panel (110) comprises a display portion (111), a bending portion (112), and a packaging portion (113) connected in sequence, wherein the packaging portion (113) and the circuit board (120) are located on the same side of the display portion (111); The circuit board (120) comprises a main body (122) and a flexible binding body (121), wherein the flexible binding body (121) is bound to the packaging portion (113), and the orthographic projections of the main body (122) and the packaging portion (113) on the display portion (111) do not overlap. The main body (122) comprises a first portion (1221) and a second portion (1222), and the orthographic projections of the first portion (1221) and the second portion (1222) on the display portion (111) do not overlap. The thickness of the first portion (1221) in the thickness direction of the display module (100) is greater than the thickness of the second portion (1222) in the thickness direction of the display module (100).

2. The display module (100) according to claim 1, characterized in that The first portion (1221) has a routing layer (125) for routing display signal lines.

3. The display module (100) according to claim 1, characterized in that The number of layers of the routing layer (125) of the first part (1221) and the second part (1222) is greater than or equal to 2, and the number of layers of the routing layer (125) of the first part (1221) is greater than the number of layers of the routing layer (125) of the second part (1222).

4. The display module (100) according to claim 3, characterized in that: The difference between the number of layers of the routing layer (125) of the first part (1221) and the number of layers of the routing layer (125) of the second part (1222) is equal to one.

5. The display module (100) according to claim 3, characterized in that: The number of layers of the routing layer (125) of the first part (1221) is 3, and the number of layers of the routing layer (125) of the second part (1222) is 2.

6. The display module (100) according to claim 5, characterized in that: The first portion (1221) comprises a first routing layer, a second routing layer and a third routing layer arranged along the thickness direction of the display module (100), the first routing layer being used for routing display signal lines, and the third routing layer being used for routing touch signal lines.

7. The display module (100) according to claim 1, characterized in that: Along the thickness direction of the display module (100), the distance between the first portion (1221) and the top surface of the display portion (111) is greater than the distance between the second portion (1222) and the top surface of the display portion (111).

8. The display module (100) according to claim 1, characterized in that: The main body (122) has multiple wiring layers, and the flexible binding body (121) extends wires from at least one wiring layer (125) of the main body (122).

9. The display module (100) according to claim 8, characterized in that: The flexible binding body (121) extends from a bottom wiring layer (125) of the main body (122), and the bottom wiring layer (125) is the layer closest to the display portion (111) among the multiple wiring layers of the main body (122).

10. The display module (100) according to any one of claims 1 to 9, characterized in that: The circuit board (120) is a flexible circuit board (120).

11. The display module (100) according to any one of claims 1 to 9, characterized in that: The circuit board (120) comprises a device area (123) and a non-device area, and the area of the orthographic projection of the device area (123) on the display portion (111) is greater than or equal to 127 mm 2 and less than or equal to 192mm 2 ; The display module (100) further comprises a plurality of electronic devices (600) connected to a side of the circuit board (120) facing away from the display portion (111), wherein the orthographic projections of the plurality of electronic devices (600) on the display portion (111) are located inside the orthographic projection of the device region (123) on the display portion (111).

12. The display module (100) according to claim 11, characterized in that: The orthographic projection of the device region (123) on the display portion (111) is located inside the orthographic projection of the first portion (1221) on the display portion (111).

13. The display module (100) according to claim 11, characterized in that: The device region (123) includes a first region (1231) and a second region (1232), and the plurality of electronic devices (600) include a first electronic device (600) and a second electronic device (600); The height of the first electronic device (600) is less than or equal to a preset height, and the orthographic projection of the first electronic device (600) on the display portion (111) is located inside the orthographic projection of the first area (1231) on the display portion (111); The height of the second electronic device (600) is greater than a preset height, and the orthographic projection of the second electronic device (600) on the display portion (111) is located inside the orthographic projection of the second area (1232) on the display portion (111).

14. An electronic device, characterized in that: The invention comprises a battery (400) and a display module (100) according to any one of claims 1 to 13, wherein the battery (400) is arranged on a side of the circuit board (120) facing away from the display portion (111), the orthographic projection of the battery (400) on the display portion (111) at least partially overlaps with the orthographic projection of the first portion (1221) on the display portion (111), and the orthographic projection of the battery (400) on the display portion (111) at least partially overlaps with the orthographic projection of the second portion (1222) on the display portion (111).

15. The electronic device according to claim 14, characterized in that The ratio of the area of the orthographic projection of the first portion (1221) on the display portion (111) to the area of the orthographic projection of the battery (400) on the display portion (111) is less than or equal to 0.

35.

16. The electronic device according to claim 14, characterized in that The electronic device further comprises a mainboard (500), the mainboard (500) being arranged on a side of the circuit board (120) facing away from the display portion (111), the mainboard (500) and the battery (400) being arranged side by side in a direction perpendicular to the thickness direction of the electronic device, and the orthographic projections of the mainboard (500) and the battery (400) on the display portion (111) not overlapping; The electronic device (600) in the display module (100) connected to the side of the circuit board (120) facing away from the display portion (111) is located between the circuit board (120) and the main board (500).

17. The electronic device according to claim 16, wherein: The electronic device further comprises an electronic device (600) connected to a side of the main board (500) facing the display portion (111), and an electronic device (600) connected to the main board (500) is provided between the main board (500) and the electronic device (600) connected to the circuit board (120).

18. The electronic device according to claim 14, wherein: The distance between the first part (1221) and the battery (400) is greater than or equal to 3.5 percent of the thickness of the battery (400), and the distance between the second part (1222) and the battery (400) is greater than or equal to 4.5 percent of the thickness of the battery (400).

Images