Microwave level switch

Abstract

The utility model discloses a microwave level switch. Comprising a probe arranged at the end part of the microwave level switch; the main control circuit is arranged in the cavity structure; the signal transceiving device is arranged in the cavity structure and is connected with the probe and the main control circuit respectively; an isolation space is formed in the arrangement space where the probe and the signal receiving and transmitting device are located. The beneficial effects of the utility model are that in the internal cavity structure of the microwave level switch, the signal transmitting and receiving device and the probe are arranged together to form an isolation space, i.e., the space where the main control circuit is located is isolated, so that heat conduction of an external working condition environment can be reduced, and the service life of the microwave level switch is prolonged. And a good protection effect is achieved on components such as a main control circuit in the microwave level switch.

Description

Technical Field

[0001] The utility model relates to the technical field of instruments and meters, in particular to a microwave level switch. Background Art

[0002] A microwave level switch utilizes microwave technology for non-contact level detection. Independent of the color, dielectric constant, density, or viscosity of the medium, it plays a crucial role in industrial process monitoring. The operating principle of a microwave level switch is that a microwave antenna transmits a microwave signal, which is reflected and refracted by the medium. The reflected microwave signal is attenuated, with the degree of attenuation being related to the material's height. By detecting and calculating this change, level information can be obtained and the corresponding switch control can be implemented.

[0003] Due to their superior performance, microwave level switches are widely used in industrial automation and are often deployed in high-temperature environments. Existing products, to dissipate heat and protect the internal structure, feature long external heat sinks. This results in excessive length, hindering on-site operational space layout and creating inconvenience during installation. Furthermore, existing products rely solely on natural air cooling, making it difficult to quantitatively control heat dissipation. High operating temperatures in the field can lead to product failure. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a microwave level switch.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: it is set as a cavity structure, and includes: a probe, which is arranged at the end of the microwave level switch; a main control circuit, which is arranged in the cavity structure; a signal transceiver, which is arranged in the cavity structure and is respectively connected to the probe and the main control circuit; and an isolation space is formed in the arrangement space where the probe and the signal transceiver are located.

[0006] As a preferred solution of the microwave level switch of the utility model, wherein: inside the isolation space, the arrangement space where the probe, or the probe and part of the signal transceiver device are located forms a first isolation subspace; the arrangement space where the signal transceiver device, or part of the signal transceiver device is located, forms a second isolation subspace.

[0007] As a preferred solution of the microwave level switch of the present invention, a ceramic pad is arranged in the isolation space, thereby forming a first isolation subspace together with the arrangement position of the probe; the signal transceiver passes through the ceramic pad and is connected to the probe.

[0008] As a preferred solution of the microwave level switch of the present invention, a thermal insulation pad is provided in the isolation space, thereby forming a second isolation subspace together with the ceramic pad; the signal transceiver passes through the thermal insulation pad and is connected to the main control circuit.

[0009] As a preferred solution of the microwave level switch of the present invention, a cooling hole is provided on the outer shell of the second isolating subspace; the cooling hole is suitable for connecting an external cooling device to control the heat dissipation of the second isolating subspace.

[0010] As a preferred solution of the microwave level switch of the present invention, the external cooling device includes: a connecting pipe suitable for connecting to the cooling hole; a flow valve; and a controller suitable for controlling the flow valve to adjust the flow of the cooling fluid according to the medium temperature obtained by on-site detection, and entering the cooling hole through the connecting pipe to achieve heat dissipation of the so-called microwave level switch.

[0011] As a preferred solution of the microwave level switch of the present invention, a heat sink is provided on the outer shell of the second isolating subspace.

[0012] As a preferred solution of the microwave level switch of the present invention, the outer shell of the second isolating subspace is thinner than the surrounding shell, thereby forming an annular groove; and the heat sink is arranged in the annular groove.

[0013] As a preferred solution of the microwave level switch of the present invention, a high-temperature resistant metal sealing ring is provided at the joint of the process connection of the microwave level switch.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: by arranging the signal transceiver device and the probe together as an isolated space in the internal cavity structure of the microwave level switch, that is, isolating the space where the main control circuit is located, thereby reducing the heat conduction from the external working environment, and providing good protection for the main control circuit and other components inside the microwave level switch; compared with the existing heat dissipation structure of the microwave level switch, the isolation setting inside the microwave level switch is divided into different areas, which can disperse the heat dissipation control and dustproof isolation, so it can be more flexible, thereby achieving better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is an overall schematic diagram of the utility model;

[0016] Figure 2 for Figure 1 A cross-sectional view of the present invention; DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0018] Example 1

[0019] Reference Figure 1 Figure 2 , which is the first embodiment of the present utility model, provides a microwave level switch, which is provided as a cavity structure 1 and includes: a probe 2, which is provided at the end of the microwave level switch; a main control circuit 3, which is provided in the cavity structure 1; a signal transceiver 4, which is provided in the cavity structure 1 and is respectively connected to the probe 2 and the main control circuit 3;

[0020] An isolation space 5 is formed in the arrangement space where the probe 2 and the signal transceiver 4 are located.

[0021] Preferably, the signal transceiver 4 includes an antenna for receiving signals.

[0022] Preferably, the signal transceiver device 4 and the probe 2 are arranged together as an isolation space 5 in the internal cavity structure 1 of the microwave level switch, that is, the space where the main control circuit 3 is located is isolated, thereby reducing the heat conduction of the external working environment and providing good protection for the main control circuit 3 and other components inside the microwave level switch.

[0023] Furthermore, inside the isolation space 5, the arrangement space where the probe 2, or the probe 2 and part of the signal transceiver device 4 are located forms a first isolation subspace 51; the arrangement space where the signal transceiver device 4, or part of the signal transceiver device 4 is located, forms a second isolation subspace 52.

[0024] Preferably, the isolation space 5 is a cavity structure.

[0025] Furthermore, a ceramic pad 6 is provided in the isolation space 5, thereby forming a first isolation subspace 51 together with the arrangement position of the probe 2;

[0026] The signal transceiver 4 passes through the ceramic pad 6 and is connected to the probe 2 .

[0027] Preferably, a ceramic pad 6 is used as an isolation device for the first isolation subspace 51. On the one hand, the ceramic pad 6 has good properties such as high hardness, wear resistance and high temperature resistance, good electrical insulation and chemical stability. At the same time, it also has high thermal conductivity, which can conduct heat to the second isolation subspace 52, thereby relatively reducing the temperature and heat in the first isolation subspace 51. Further preferably, a thermal insulation pad 7 is provided in the isolation space 5, thereby forming the second isolation subspace 52 together with the ceramic pad 6;

[0028] The signal transceiver 4 passes through the thermal insulation pad 7 and is connected to the main control circuit 3 .

[0029] Preferably, a first isolating subspace 51 and a second isolating subspace 52 are provided. On the one hand, the first isolating subspace 51 can achieve dust-proof isolation. On the other hand, a second isolating subspace 52 is provided at the front end of the main control circuit 3 to achieve heat insulation and reduce the impact of heat on the circuit board.

[0030] Furthermore, a cooling hole 8 is provided on the outer shell of the second isolation subspace 52;

[0031] The cooling hole 8 is suitable for connecting to an external cooling device to control the heat dissipation of the second isolation subspace 52 .

[0032] Preferably, a cooling hole 8 is provided on the second isolation subspace 52, and an external cooling device is connected through the cooling hole 8. The external cooling device adjusts the flow rate of the cooling fluid according to the medium temperature detected on site, which can achieve rapid heat dissipation, thereby ensuring that the circuit board operates at an appropriate temperature.

[0033] Furthermore, the external cooling device comprises:

[0034] a connecting pipe, adapted to be connected to the cooling hole 8;

[0035] Flow valve;

[0036] The controller is adapted to control the flow valve to adjust the flow of the cooling fluid according to the medium temperature obtained by on-site detection, and the cooling fluid enters the cooling hole 8 through the connecting pipe to achieve heat dissipation of the so-called microwave level switch.

[0037] Preferably, two cooling holes 8 are provided, one for air injection and the other for air return.

[0038] Furthermore, a heat sink is provided on the outer shell of the second isolation sub-space 52 .

[0039] Furthermore, the outer shell of the second isolation subspace 52 is thinner than the peripheral shell, thereby forming an annular groove 9;

[0040] The heat sink is arranged in the annular groove 9 .

[0041] Preferably, the second isolation subspace 52 may adopt a mesh heat dissipation device.

[0042] Furthermore, a high-temperature resistant metal sealing ring 10 is provided at the joint of the process connection of the microwave level switch.

[0043] Preferably, the microwave level switch is cylindrical in shape, with a ceramic probe 2 at the lower end. Microwave signals are transmitted and received through this probe 2 to the medium. Since the ceramic probe 2 is closest to the medium and the temperature is highest here, an insulation pad 7 is used to prevent the temperature from being transferred to the upper main control circuit 3, thereby affecting the normal operation of the main control circuit 3. A separate isolation space 5 is also provided in the middle. Most of the heat transferred from the ceramic probe 2 and the connecting thread is dissipated by convection in the cavity here. The isolation space 5 is connected to the flow valve and solenoid valve by an air pipe. The PLC adjusts the cooling gas flow according to the medium temperature detected on site, thereby ensuring that the main control circuit 3 operates at the appropriate temperature. Another benefit of the isolation space 5 is that it can ensure that the main control circuit 3 meets dust protection requirements.

[0044] In this solution, to better adapt to high-temperature environments and the needs of the measured medium, the microwave level switch needs to have a better heat dissipation setting. To this end, the microwave level switch in this solution is designed with a heat dissipation section structure to conveniently measure the level of high-temperature media.

[0045] Specifically, a heat-insulating pad 7 is provided at the connection end between the main control circuit 3 and the signal transceiver 4 in the upper section of the microwave level switch, so that the upper section area where the main control circuit 3 is located in the microwave level switch and the second isolating subspace 52 where part of the signal transceiver 4 is located can be separated, thereby better protecting the main control circuit 3. Similarly, a ceramic pad 6 is provided between the second isolating subspace 52 and the first isolating subspace 51, so as to separate the cavities of the second isolating subspace 52 and the first isolating subspace 51. A metal sealing ring 10 is provided at the outer shell of the second isolating space 5 of the microwave level switch, and a pair of seams of the outer shell are sealed. The metal sealing ring 10 adopts a high-temperature resistant metal sealing ring 10 to better adapt to the high-temperature field environment. In this solution, an annular groove 9, i.e., a heat dissipation cavity groove, is also provided on the outer shell of the second isolating space 5, and a number of raised annular heat sinks are also provided in the heat dissipation cavity groove. The heat sink can achieve heat dissipation by increasing the surface area.

[0046] Furthermore, cooling holes 8 are provided on the outer shell of the second insulating subspace 52. The cooling holes 8 can be connected to an external cooling device and the cavity of the second insulating subspace 52. The cooling device can be connected to a controller, thereby adjusting the air flow or changing the air cooling medium according to the on-site environment to achieve a controllable heat dissipation effect.

[0047] Working principle: When the microwave level switch receives an external instruction and starts working, the main control circuit 3 in the circuit board executes the microwave signal to send instructions, and finally performs the corresponding microwave sending action through the signal transceiver 4. When the external ambient temperature reaches the preset value, the external cooling device injects cold air into the cooling hole 8. In practice, the opening of the relevant flow valve can be adjusted according to the difference between the temperature and the preset value. There are two cooling holes 8, one is the air injection port and the other is the return air port. In this way, the internal temperature of the microwave level switch can be effectively adjusted according to the actual situation, so that it has better environmental adaptability. When the temperature reaches above the preset temperature, the controller turns on the control solenoid valve and the flow valve to open, and it can be set so that the opening of the control solenoid valve and the flow valve increases accordingly every time the temperature increases by the preset value.

[0048] In summary, the design concept of this solution is that, compared with the heat dissipation structure of the existing microwave level switch, an isolation setting is performed inside the microwave level switch, which is divided into different areas, and heat dissipation control and dust isolation can be dispersed, so it can be more flexible, thereby achieving a better heat dissipation effect. In the probe 2 part, because the distance to the contact medium may be closer, the entire probe 2 is completely insulated and coated, and the connection seam is encapsulated with a metal sealing ring 10 at the process connection of the microwave level switch to avoid it being affected; in the second isolation subspace 52, the internal area is used as a cavity, and an external cooling device is introduced through the cooling hole 8. The air flow rate can be adjusted or the air-cooling medium can be changed according to the on-site environment to achieve temperature adjustment inside the microwave level switch, so that the overall thermal impact on the main control circuit 3 of the circuit board is greatly reduced. Due to the better heat dissipation effect, the overall structural design of the microwave level switch has a higher design redundancy, and there is no need to design the overall structure to be very long, which affects on-site installation.

[0049] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A microwave level switch, characterized in that: The cavity structure (1) is provided and comprises: A probe (2) is provided at the end of the microwave level switch; A main control circuit (3) is arranged in the cavity structure (1); A signal transceiver (4) is disposed in the cavity structure (1) and is connected to the probe (2) and the main control circuit (3) respectively; An isolation space (5) is formed in the arrangement space where the probe (2) and the signal transceiver (4) are located.

2. The microwave level switch according to claim 1, characterized in that: Inside the isolation space (5), The probe (2), or the arrangement space where the probe (2) and part of the signal transceiver (4) are located, forms a first isolation subspace (51); The arrangement space where the signal transceiver device (4) or part of the signal transceiver device (4) is located forms a second isolation subspace (52).

3. The microwave level switch according to claim 2, characterized in that: A ceramic pad (6) is arranged in the isolation space (5), thereby forming the first isolation subspace (51) together with the arrangement position of the probe (2); The signal transceiver (4) passes through the ceramic pad (6) and is connected to the probe (2).

4. The microwave level switch according to claim 3, characterized in that: A heat insulating pad (7) is provided in the isolation space (5), thereby forming the second isolation subspace (52) together with the ceramic pad (6); The signal transceiver (4) passes through the thermal insulation pad (7) and is connected to the main control circuit (3).

5. The microwave level switch according to claim 2, characterized in that: A cooling hole (8) is provided on the outer shell of the second isolation subspace (52); The cooling hole (8) is suitable for connecting to an external cooling device to control the heat dissipation of the second isolation subspace (52).

6. The microwave level switch according to claim 5, characterized in that: The external cooling device comprises: A connecting pipe adapted to be connected to the cooling hole (8); Flow valve; The controller is adapted to control the flow valve to adjust the flow of the cooling fluid according to the medium temperature obtained by on-site detection, and to enter the cooling hole (8) through the connecting pipe to achieve heat dissipation of the so-called microwave level switch.

7. The microwave level switch according to claim 2, characterized in that: A heat sink is provided on the outer shell of the second isolation subspace (52).

8. The microwave level switch according to claim 7, characterized in that: The outer shell of the second isolation subspace (52) is thinner than the peripheral shell, thereby forming an annular groove (9); The heat sink is arranged in the annular groove (9).

9. The microwave level switch according to claim 1, characterized in that: A metal sealing ring (10) is provided at the joint of the process connection of the microwave level switch.

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