Chip batch testing device

Abstract

The utility model discloses a chip batch testing device which comprises a rack, a stock bin assembly, a feeding and discharging assembly, a testing assembly, an X-direction driving module, a Y-direction driving module movably installed on the X-direction driving module, a Z-axis driving module movably installed on the Y-direction driving module and a plurality of suction nozzles used for picking up chips. The stock bin assembly comprises at least one feeding box and at least two discharging boxes, a plurality of chip trays arranged in the vertical direction are arranged in the feeding boxes and the discharging boxes, one surface of the movable carrier plate is installed on the Z-axis driving module, a variable-pitch module is installed on the other surface of the movable carrier plate, and a supporting strip is installed on each variable-pitch sliding block of the variable-pitch module. According to the utility model, a plurality of chips can be simultaneously picked up and carried between the stock bin assembly and the test assembly, and the position difference of the chips between the stock bin assembly and the test assembly can be compensated by adjusting the distance between the suction nozzles, so that the conveying efficiency and the test efficiency of the chips are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip batch testing device. Background Art

[0002] In recent years, the trend toward miniaturization of MEMS chips has become increasingly evident, and the demand for MEMS chip testing is also increasing. There are many types of MEMS, with hundreds of millions consumed worldwide each year. These MEMS chips are widely used in smartphones, automotive electronics, smart manufacturing, and other fields. Furthermore, the market share of MEMS chips depends largely on their quality. Quality testing of MEMS chips typically requires the use of corresponding test sockets to ensure quality control. However, existing MEMS chip testing products are too expensive to manufacture and cannot be effectively promoted and applied on a larger scale. This significantly increases the manufacturing costs and testing cycles of MEMS chip manufacturers, hindering their economic benefits. Utility Model Content

[0003] The utility model aims to provide a chip batch testing device, which can compensate for the chip position gap between the hopper component and the testing component by adjusting the distance between the suction nozzles, thereby improving the chip transportation efficiency and testing efficiency.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a chip batch testing device, comprising: a frame and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively installed on the frame, the loading and unloading assembly comprising: an X-axis drive module, a Y-axis drive module movably installed on the X-axis drive module, a Z-axis drive module movably installed on the Y-axis drive module and a plurality of suction nozzles for picking up chips, the vertically arranged suction nozzles are movably installed on the Z-axis drive module, the hopper assembly comprises at least one loading box and at least two unloading boxes, and the loading box and the unloading box are each provided with a plurality of chip trays arranged in the vertical direction, one surface of a movable carrier plate movable in the vertical direction is installed on the Z-axis drive module, and a variable pitch module is installed on the other surface of the movable carrier plate, each variable pitch slider of the variable pitch module is installed with a support bar, and the lower end of each of the support bars connected to the variable pitch slider at the upper end is installed with a suction nozzle for picking up chips.

[0005] The further improved scheme in the above technical scheme is as follows:

[0006] 1. In the above scheme, the test assembly arranged on one side of the hopper assembly and below the loading and unloading assembly includes: a marble base plate mounted horizontally on a frame, a first support plate mounted vertically on the upper surface of the marble base plate, a second support plate and a test carrier plate arranged between the first support plate and the second support plate, the test carrier plate being mounted on a rotating portion of a first turntable rotatable about a first direction, the fixed portion of the first turntable being mounted on a rotating base, the other end of the rotating base rotatably connected to the first support plate at one end being mounted on a rotating portion of a second turntable rotatable about a second direction, the fixed portion of the second turntable being mounted on the second support plate, a test board for communicating with a host computer and a chip carrier plate electrically connected to the test board being sequentially arranged above the test carrier plate, the chip carrier plate being provided with a plurality of chip holders on the upper surface opposite to the test board, and when the pressing plate movable in the vertical direction moves to the lowest position, the pressing head on the pressing plate is pressed and contacted with the chip in the chip holder.

[0007] 2. In the above solution, a vision bracket is installed on the Y-axis driving module and on one side of the Z-axis driving module. A camera and a light source located directly below the camera are installed on the surface of the vision bracket that is movable along the Y-axis and is opposite to the driving module.

[0008] 3. In the above solution, the first support plate and the second support plate are both marble support plates.

[0009] 4. In the above solution, the pressure head is a silicone pressure head, a rubber pressure head or a polyurethane pressure head.

[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0011] The present invention provides a chip batch testing device, wherein one surface of a movable carrier that can move in the vertical direction is mounted on a Z-axis driving module, and a variable pitch module is mounted on the other surface of the movable carrier, and each variable pitch slider of the variable pitch module is mounted with a support bar, and the lower end of each support bar connected to the variable pitch slider at the upper end is mounted with a suction nozzle for picking up chips, which can realize the simultaneous picking and transportation of multiple chips between the hopper assembly and the test assembly, and can also compensate for the chip position difference between the hopper assembly and the test assembly by adjusting the distance between the suction nozzles, thereby improving the chip transportation efficiency and test efficiency; in addition, its test assembly includes: a marble base plate mounted horizontally on a frame, a first support plate mounted vertically on the upper surface of the marble base plate, a second support plate, and a test carrier arranged between the first support plate and the second support plate. The test carrier is mounted on a rotating part of a first turntable that can rotate around a first direction, the fixed part of the first turntable is mounted on a rotating base, one end of the rotating base is rotatably connected to the first support plate, and the other end of the rotating base is mounted on a rotating part of a second turntable that can rotate around a second direction, and the fixed part of the second turntable is mounted on the second support plate, and a test board communicating with the upper computer and a chip carrier electrically connected to the test board are sequentially arranged above the test carrier, and a plurality of chip holders are provided on the upper surface of the chip carrier opposite to the test board. When the pressing plate that can move in the vertical direction moves to the lowest position, the pressing head is squeezed and contacted with the chip in the chip holder, which can not only perform dual-axis and multi-angle rotation on multiple chips, thereby realizing batch testing of multiple chips, but also ensure the stability and consistency of the force applied to the chip during the rotation, thereby ensuring the accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Attachment Figure 1 This is a schematic diagram of the overall structure of the chip batch testing device of the present invention;

[0013] Attachment Figure 2 This is a schematic diagram of the local structure of the chip batch testing device of the utility model;

[0014] Attachment Figure 3 This is a schematic diagram of the structure of the rotary test table of the chip batch testing device of the utility model;

[0015] Attachment Figure 4 for Figure 3 A magnified view of the structure at point A.

[0016] In the above drawings: 100, rack; 200, chip; 300, chip tray; 1, marble substrate; 2, first support plate; 3, second support plate; 4, test carrier; 51, first turntable; 52, second turntable; 53, rotating motor; 54, routing slip ring; 6, rotating base; 7, test board; 8, chip carrier; 9, chip holder; 10, pressing plate; 11, pressing head; 21, X-axis drive module; 22, Y-axis drive module; 221, visual bracket; 222, camera; 223, light source; 23, Z-axis drive module; 24, suction nozzle; 25, movable carrier; 26, variable pitch module; 261, variable pitch slider; 27, support bar; 31, loading box; 32, unloading box. DETAILED DESCRIPTION

[0017] The present invention can be further understood through the following specific embodiments, but they are not intended to limit the present invention.

[0018] Example 1: A chip batch testing device, comprising: a rack 100 and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the rack 100, wherein the loading and unloading assembly comprises: an X-axis driving module 21, a Y-axis driving module 22 movably mounted on the X-axis driving module 21, a Z-axis driving module 23 movably mounted on the Y-axis driving module 22, and a plurality of suction nozzles 24 for picking up chips 200, wherein the vertically arranged suction nozzles 24 are movably mounted on the Z-axis driving module 23, and the hopper assembly comprises at least one upper A material box 31 and at least two unloading boxes 32, each of which is provided with a plurality of chip trays 300 arranged in a vertical direction, a surface of a movable carrier 25 that can move in the vertical direction is installed on the Z-axis drive module 23, and a variable pitch module 26 is installed on the other surface of the movable carrier 25, and each variable pitch slider 261 of the variable pitch module 26 is installed with a support bar 27, and the lower end of each of the support bars 27 whose upper end is connected to the variable pitch slider 261 is installed with a suction nozzle 24 for picking up the chip 200.

[0019] The test assembly arranged on one side of the silo assembly and below the loading and unloading assembly includes: a marble base plate 1 mounted horizontally on a frame 100, a first support plate 2 and a second support plate 3 mounted vertically on the upper surface of the marble base plate 1, and a test carrier 4 arranged between the first support plate 2 and the second support plate 3, wherein the test carrier 4 is mounted on a rotating portion of a first turntable 51 that can rotate around a first direction, and the fixed portion of the first turntable 51 is mounted on a rotating base 6, and the turntable 51, one end of which is rotatably connected to the first support plate 2, is provided with a plurality of test carriers. The other end of the dynamic base 6 is mounted on the rotating part of a second turntable 52 that can rotate around a second direction. The fixed part of the second turntable 52 is mounted on the second support plate 3. A test board 7 that communicates with the host computer and a chip carrier 8 that is electrically connected to the test board 7 are sequentially arranged above the test carrier 4. The chip carrier 8 is provided with a plurality of chip seats 9 on the upper surface opposite to the test board 7. When the pressure plate 10 that can move in the vertical direction moves to the lowest position, the pressure head 11 is squeezed and contacted with the chip 200 in the chip seat 9.

[0020] The first support plate 2 and the second support plate 3 are both marble support plates.

[0021] A rotating motor 53 and a routing slip ring 54 for driving the rotating parts of the first turntable 51 and the second turntable 52 are installed on their respective fixed parts. The first turntable, the second turntable, the rotating motor and the routing slip ring are all purchased from outside and belong to the scope of the existing technology, and will not be described in detail in this application.

[0022] The indenter 11 is a silicone indenter.

[0023] Example 2: A chip batch testing device, comprising: a rack 100 and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the rack 100, wherein the loading and unloading assembly comprises: an X-axis driving module 21, a Y-axis driving module 22 movably mounted on the X-axis driving module 21, a Z-axis driving module 23 movably mounted on the Y-axis driving module 22, and a plurality of suction nozzles 24 for picking up chips 200, wherein the vertically arranged suction nozzles 24 are movably mounted on the Z-axis driving module 23, and the hopper assembly comprises at least one loading box 3 1 and at least 2 unloading boxes 32, each of the loading box 31 and the unloading box 32 is provided with a plurality of chip trays 300 arranged in the vertical direction, characterized in that: one surface of a movable carrier 25 movable in the vertical direction is mounted on the Z-axis drive module 23, a variable pitch module 26 is mounted on the other surface of the movable carrier 25, each variable pitch slider 261 of the variable pitch module 26 is mounted with a support bar 27, and the lower end of each of the support bars 27 whose upper end is connected to the variable pitch slider 261 is mounted with a suction nozzle 24 for picking up the chip 200.

[0024] The test assembly arranged on one side of the silo assembly and below the loading and unloading assembly includes: a marble base plate 1 mounted horizontally on a frame 100, a first support plate 2 and a second support plate 3 mounted vertically on the upper surface of the marble base plate 1, and a test carrier 4 arranged between the first support plate 2 and the second support plate 3, wherein the test carrier 4 is mounted on a rotating portion of a first turntable 51 that can rotate around a first direction, and the fixed portion of the first turntable 51 is mounted on a rotating base 6, and the turntable 51, one end of which is rotatably connected to the first support plate 2, is provided with a plurality of test carriers. The other end of the dynamic base 6 is mounted on the rotating part of a second turntable 52 that can rotate around a second direction. The fixed part of the second turntable 52 is mounted on the second support plate 3. A test board 7 that communicates with the host computer and a chip carrier 8 that is electrically connected to the test board 7 are sequentially arranged above the test carrier 4. The chip carrier 8 is provided with a plurality of chip seats 9 on the upper surface opposite to the test board 7. When the pressure plate 10 that can move in the vertical direction moves to the lowest position, the pressure head 11 is squeezed and contacted with the chip 200 in the chip seat 9.

[0025] A visual bracket 221 is installed on the Y-axis driving module 22 and located on one side of the Z-axis driving module 23. The visual bracket 221 which can move along the Y direction is installed with a camera 222 and a light source 223 located directly below the camera 222 on the surface opposite to the driving module 22.

[0026] The pressure head 11 is a rubber pressure head.

[0027] First, the piston rods of the vertical cylinder and the horizontal cylinder of the test assembly are placed in the first state, so that the pressure head moving with the vertical cylinder is vertically away from the chip holder, and the strip-shaped through-hole on the pressure plate moving with the horizontal cylinder is moved to above the chip holder, so that the chip can be placed in the chip holder;

[0028] The nozzle of the loading and unloading assembly picks up the chip tray on the top layer from the loading box of the hopper assembly, picks up the chip to be tested, and then moves the chip to be tested into the chip holder of the test assembly through the combined movement of the X, Y and Z axes of the loading and unloading assembly;

[0029] When picking up the chips to be tested in the loading box, the distance between adjacent variable-pitch sliders on the variable-pitch module is consistent with the distance between adjacent chips in the loading box. Before placing the chips to be tested on the suction nozzle into the chip seat of the test assembly, the variable-pitch module is used to adjust the distance between adjacent variable-pitch sliders so that it is consistent with the distance between adjacent chip seats, so that the chips to be tested on each suction nozzle can be placed into the chip seat at the same time. The adjustment of the distance between the suction nozzles by the variable-pitch module compensates for the chip position difference between the hopper assembly and the test assembly, thereby improving the chip transportation efficiency and testing efficiency. The variable-pitch module is obtained through external purchase and belongs to the scope of existing technology, which will not be described in detail here.

[0030] Switch the piston rods of the horizontal cylinder and vertical cylinder of the test assembly from the first state to the second state, so that the row of press heads on the pressure plate moving with the horizontal cylinder moves above the chip to be tested in the chip holder, and the press heads moving with the vertical cylinder approach the chip holder in the vertical direction and press the chip to be tested;

[0031] The first and second turntables are driven to rotate by a rotary motor, thereby driving the chip to be tested in the chip holder to rotate in two directions. During this process, the performance of the chip is tested and the chip is classified according to the test results. The specific testing process, testing software, etc. are not part of the invention of this application and will not be described in detail here.

[0032] After the test is completed, the first turntable and the second turntable are reset, and the piston rods of the vertical cylinder and the horizontal cylinder of the test assembly are switched from the second state to the first state again, so that the pressure head moving with the vertical cylinder is moved away from the chip holder in the vertical direction, and the strip through hole on the pressure plate moving with the horizontal cylinder is moved to the top of the chip holder, so as to facilitate the picking of the tested chips in the chip holder and the placement of the next batch of chips to be tested in the chip holder;

[0033] The nozzle of the loading and unloading assembly is used to pick up the tested chip from the chip holder, and then the combined movement of the X, Y and Z axes in the loading and unloading assembly is used to move the tested chip part to the chip tray in the unloading box. Then, the nozzle of the loading and unloading assembly is used to pick up the chip tray on the top layer from the loading box of the silo assembly to pick up the chip to be tested, and then the combined movement of the X, Y and Z axes in the loading and unloading assembly is used to move the chip to be tested to the chip holder of the testing assembly for the next round of testing, and this cycle is repeated.

[0034] When using the above chip batch testing device, it can not only realize the simultaneous picking and transportation of multiple chips between the hopper assembly and the testing assembly, but also compensate for the chip position difference between the hopper assembly and the testing assembly by adjusting the distance between the suction nozzles, thereby improving the chip transportation efficiency and testing efficiency;

[0035] In addition, it can not only perform dual-axis and multi-angle rotation on multiple chips, thereby realizing batch testing of multiple chips, but also ensure the stability and consistency of the force applied to the chips during the rotation process, thereby ensuring the accuracy of the test.

[0036] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.

Claims

1. A chip batch testing device, comprising: A rack (100) and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the rack (100), wherein the loading and unloading assembly comprises: an X-axis driving module (21), a Y-axis driving module (22) movably mounted on the X-axis driving module (21), a Z-axis driving module (23) movably mounted on the Y-axis driving module (22), and a plurality of suction nozzles (24) for picking up chips (200), wherein the vertically arranged suction nozzles (24) are movably mounted on the Z-axis driving module (23), and the hopper assembly comprises at least one loading box (31) and at least two unloading boxes (32). , a plurality of chip trays (300) arranged in a vertical direction are provided in the loading box (31) and the unloading box (32), and the characteristics are as follows: one surface of a movable carrier (25) movable in the vertical direction is mounted on the Z-axis driving module (23), a variable pitch module (26) is mounted on the other surface of the movable carrier (25), a support bar (27) is mounted on each variable pitch slider (261) of the variable pitch module (26), and a suction nozzle (24) for picking up the chip (200) is mounted on the lower end of each support bar (27) whose upper end is connected to the variable pitch slider (261).

2. The chip batch testing device according to claim 1, characterized in that: The test assembly is arranged on one side of the silo assembly and below the loading and unloading assembly, and comprises: a marble base plate (1) mounted horizontally on a frame (100), a first support plate (2) mounted vertically on the upper surface of the marble base plate (1), a second support plate (3), and a test carrier plate (4) arranged between the first support plate (2) and the second support plate (3), wherein the test carrier plate (4) is mounted on a rotating portion of a first turntable (51) that can rotate around a first direction, and a fixed portion of the first turntable (51) is mounted on a rotating base (6), and one end of the rotating base (6) is rotatably connected to the first support plate (2). The other end is mounted on a rotating portion of a second turntable (52) that can rotate about a second direction, and the fixed portion of the second turntable (52) is mounted on a second support plate (3). A test board (7) that communicates with a host computer and a chip carrier (8) that is electrically connected to the test board (7) are sequentially arranged above the test carrier (4). The chip carrier (8) is provided with a plurality of chip seats (9) on the upper surface opposite to the test board (7). When the pressing plate (10) that can move in the vertical direction moves to the lowest position, the pressing head (11) on the pressing plate (10) is in press contact with the chip (200) in the chip seat (9).

3. The chip batch testing device according to claim 1 or 2, characterized in that: A visual support (221) is installed on the Y-axis driving module (22) and located on one side of the Z-axis driving module (23). A camera (222) and a light source (223) located directly below the camera (222) are installed on the surface of the visual support (221) that is movable along the Y direction and is opposite to the driving module (22).

4. The chip batch testing device according to claim 2, characterized in that: The first support plate (2) and the second support plate (3) are both marble support plates.

5. The chip batch testing device according to claim 2, characterized in that: The pressure head (11) is a silicone pressure head, a rubber pressure head or a polyurethane pressure head.

Images