Layout and wiring structure of computer mainboard

Abstract

The utility model relates to a layout wiring structure of a computer mainboard. In the scheme, a grounding layer pattern comprises an external interface grounding layer pattern corresponding to a to-be-assembled external interface element on a mainboard, and a mainboard grounding layer pattern not corresponding to the to-be-assembled external interface element on the mainboard; the external interface grounding layer pattern comprises an integrated external interface grounding layer pattern which simultaneously corresponds to a plurality of external interface elements and is connected into a whole, and the integrated external interface grounding layer pattern is separated from the mainboard grounding layer pattern in layout and is electrically connected with the mainboard grounding layer pattern through a 0-ohm resistor; the integrated external interface grounding layer pattern comprises a part transversely extending along the edge direction of the main board and a part longitudinally extending relative to the edge direction of the main board, and the transversely extending part and the longitudinally extending part form a plurality of ring-shaped or semi-ring-shaped patterns which are connected together. According to the utility model, static electricity and EMC of the computer mainboard can be effectively controlled.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic computers, in particular to a layout and wiring structure of a computer mainboard. Background Art

[0002] Electromagnetic compatibility (EMC) refers to the ability of a device or system to operate in accordance with requirements in its electromagnetic environment and not cause intolerable electromagnetic interference to any device in the environment.

[0003] During the design of computer motherboard hardware circuits, static electricity and EMC (electromagnetic compatibility) can have serious consequences. Static electricity can cause interface failures, and EMC (electromagnetic susceptibility) can affect signal integrity, thereby impacting interface speeds and reducing the user experience. EMC can also generate external EMI (electromagnetic interference), impacting human health and the use of other devices.

[0004] Typically, an effective way to shield electronic devices from EMC is to add a shielding case to the device, similar to a Faraday cage. However, for computer motherboards, most usage scenarios and cost constraints prohibit the designer from adding a shielding case, so similar methods are urgently needed to effectively control static electricity and EMC.

[0005] The external interfaces of computer motherboards on the market mainly include: USB interface; video output interface, common video output interfaces include HDMI, DisplayPort, VGA, etc.; audio interface, which is used to connect audio devices and external audio output devices; network interface, common network interface includes Ethernet interface. In terms of location, the external interfaces on the computer motherboard include front interface and rear interface; front interface refers to the interface located on the front panel of the chassis, usually including audio interface, USB interface, SD card reader, etc.; rear interface refers to the interface located on the back of the chassis, usually including audio, video, network, power supply, expansion card, etc.

[0006] Commercially available computer motherboards are all designed and manufactured using PCBs. PCBs (Printed Circuit Boards) are an indispensable component of modern electronic devices, connecting and transmitting signals, and supporting and protecting electronic components. PCBs typically consist of multiple layers, each with distinct functions and characteristics. The signal layer is the main layer connecting various components. Circuits, signal transmission lines, power lines and ground lines are usually arranged on the signal layer. The power layer is usually arranged with power and ground lines to ensure stable and reliable power supply of the entire PCB. The ground layer is mainly used to connect the ground lines of various components. Ground lines and power lines are usually arranged on the ground layer to ensure stable and reliable ground connection of the entire PCB. The pad layer is mainly used to connect components and PCB boards. Pads and jacks are usually arranged on the pad layer to enable components to be connected to the PCB board. The assembly layer is mainly used to assemble components. The installation position and installation method of components are usually arranged on the assembly layer to facilitate PCB manufacturers to assemble and solder components. The solder mask layer is mainly used to prevent short circuits and poor soldering during the soldering process. A layer of green paint is usually applied on the solder mask to protect the PCB board from chemical corrosion and mechanical damage. The copper clad layer is mainly used to provide circuit connection and support. Circuits and signal transmission lines are usually arranged on the copper clad layer to ensure that the circuit connection of the entire PCB is stable and reliable.

[0007] The layout and wiring structure of the utility model is specially designed for the external interface and PCB board of the electronic computer mainboard. Summary of the Invention

[0008] Therefore, the purpose of the present invention is to provide a layout and wiring structure of a computer motherboard, so as to control the static electricity and EMC of the computer motherboard from the layout and wiring structure.

[0009] To achieve the above-mentioned objectives, the present invention provides a layout and wiring structure of a computer motherboard, wherein the motherboard has a ground layer pattern formed by PCB layout and wiring, the ground layer pattern including an external interface ground layer pattern corresponding to the external interface components to be assembled on the motherboard, and a motherboard ground layer pattern not corresponding to the external interface components to be assembled on the motherboard; the external interface ground layer pattern includes an integrated external interface ground layer pattern corresponding to multiple external interface components connected as one, the integrated external interface ground layer pattern is separated from the motherboard ground layer pattern in layout, and is electrically connected to the motherboard ground layer pattern via a 0 ohm resistor; corresponding to the edge of the motherboard where the multiple external interface components are located, the integrated external interface ground layer pattern includes a portion extending laterally along the edge direction of the motherboard and a portion extending longitudinally relative to the edge direction of the motherboard, the laterally extending portion and the longitudinally extending portion forming a plurality of annular or semi-annular patterns connected together.

[0010] The integrated external interface ground layer pattern corresponds to a plurality of adjacent external interface components on the mainboard, and the plurality of adjacent external interface components at least include a first type of external interface components and a second type of external interface components.

[0011] The 0 ohm resistor is a chip resistor in a 0402 package or a 0201 package.

[0012] The integrated external interface ground layer pattern is an external interface ground layer pattern corresponding to the front interface or the rear interface.

[0013] Among them, the optional types of the front interface include audio interface, USB interface, and SD card reader interface.

[0014] Among them, the optional types of the rear interface include audio interface, video interface, network interface, power interface, and expansion card interface.

[0015] In summary, the layout and wiring structure of the computer motherboard of the present invention can effectively control the static electricity and EMC of the computer motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following detailed description of the specific embodiments of the present invention in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present invention apparent.

[0017] Figure 1 This is a schematic diagram of the circuit principle of the layout and wiring structure of the computer motherboard of the utility model;

[0018] Figure 2 and Figure 3This is a schematic diagram of the layout and wiring structure of the rear interface in a preferred embodiment of the layout and wiring structure of the computer motherboard of the present invention;

[0019] Figure 4 A schematic diagram of the layout and wiring structure of the front interface of a computer motherboard in the prior art;

[0020] Figure 5 and Figure 6 This is a schematic diagram of the layout and wiring structure of the front interface in a preferred embodiment of the layout and wiring structure of the computer motherboard of the present invention. DETAILED DESCRIPTION

[0021] See also Figure 1 , which is a schematic diagram of the circuit principle of the layout and wiring structure of the computer motherboard of the utility model. The technical solution of the utility model is to make special treatment on the interface GND pattern of the external interface, such as Figure 1 As shown, the GNDs of the three adjacent external interfaces, including the USB-GND of the USB interface, the LAN_GND of the LAN interface, and the USB-GND2 of the USB interface, are specially processed and connected into one, which is referred to as C-GND. This increases the C-GND area of the front or rear interface, which can effectively optimize the electrostatic test of the device. The C-GND patterns of the front or rear interface are connected together to form a ring or semi-ring, which can play a role similar to a "Faraday cage", thereby optimizing the EMC of the device.

[0022] See also Figures 2 to 6 , showing part of the motherboard layout and wiring structure, where Figure 2 and Figure 3 This is a schematic diagram of the layout and wiring structure of the rear interface in a preferred embodiment of the layout and wiring structure of the computer motherboard of the utility model. Figure 5 and Figure 6 The schematic diagram of the layout and wiring structure of the front interface in the preferred embodiment is as follows: Figure 4 The figure is a schematic diagram of the layout and wiring structure of the rear interface of a computer motherboard in the prior art for comparison.

[0023] The layout and wiring structure of the computer motherboard of the present invention is targeted at a motherboard having a ground layer pattern formed by PCB layout and wiring as described in the background technology. As can be seen from the background technology, the ground layer patterns of the motherboard in the prior art are complex and diverse. In the technical solution of this utility model, for ease of understanding, the ground layer patterns are first divided into external interface ground layer patterns corresponding to external interface components to be assembled on the motherboard, and motherboard ground layer patterns not corresponding to the external interface components to be assembled on the motherboard. In order to further clarify the technical solution of the present utility model, the explanation focuses on a specific type of external interface ground layer patterns proposed in the technical solution of the present utility model, namely, an integrated external interface ground layer pattern that corresponds to the connection of multiple external interface components at the same time. The technical solution of the present utility model proposes this type of integrated external interface ground layer pattern to improve the existing motherboard layout and wiring structure. At least through this type of integrated external interface ground layer pattern, effective control of static electricity and EMC of the computer motherboard is achieved for the corresponding external interface.

[0024] In this preferred embodiment, if Figure 2 and Figure 3 As shown, corresponding to the rear interface of the motherboard, the integrated external interface ground layer pattern 10 is separated from the motherboard ground layer pattern in layout, and is electrically connected to the motherboard ground layer pattern via a 0 ohm resistor, which is located at Figure 2 The position indicated by the arrow in the middle; corresponding to the edge of the mainboard where the multiple external interface components are located, the integrated external interface ground layer pattern 10 includes a portion extending laterally along the edge direction of the mainboard and a portion extending longitudinally relative to the edge direction of the mainboard, the laterally extending portion and the longitudinally extending portion forming a plurality of annular or semi-annular patterns connected together, such as Figure 3 As shown by the middle line, in this preferred embodiment, the integrated external interface ground layer pattern 10 is made into multiple semi-annular patterns connected together, which can play a role similar to a "Faraday cage", effectively shielding external EMI and preventing the radiation of the device itself from interfering with the outside.

[0025] like Figure 5 and Figure 6 As shown, corresponding to the front interface of the motherboard, the integrated external interface ground layer pattern 20 is separated from the motherboard ground layer pattern in layout, and is electrically connected to the motherboard ground layer pattern via a 0 ohm resistor, which is located at Figure 5 The position indicated by the arrow in the middle; corresponding to the edge of the mainboard where the multiple external interface components are located, the integrated external interface ground layer pattern 20 includes a portion extending laterally along the edge direction of the mainboard and a portion extending longitudinally relative to the edge direction of the mainboard, the laterally extending portion and the longitudinally extending portion forming a plurality of annular or semi-annular patterns connected together, such as Figure 6As shown by the middle line, in this preferred embodiment, the integrated external interface ground layer pattern 20 is made into multiple semi-annular patterns connected together, which can play a role similar to a "Faraday cage", effectively shielding external EMI and preventing the radiation of the device itself from interfering with the outside.

[0026] In this preferred embodiment, the integrated external interface ground layer pattern 10 and the integrated external interface ground layer pattern 20 correspond to multiple adjacent external interface elements on the mainboard, and each semi-annular pattern corresponds to an external interface element; in this preferred embodiment, the multiple adjacent external interface elements include at least a first type of external interface element and a second type of external interface element, that is, the ground patterns of different types of external interface elements are integrated, such as a USB interface and a LAN interface.

[0027] See prior art for comparison Figure 4 , which is a schematic diagram of the layout and wiring structure of the rear interface of a computer motherboard in the prior art. In the layout and wiring structure, different external interface ground layer patterns 31, 32, and 33 are arranged for different types of rear interfaces, and the different external interface ground layer patterns 31, 32, and 33 are separated from each other. By adopting a layout structure such as the integrated external interface ground layer patterns 10 and 20, the present invention increases the grounding area of the corresponding external interfaces compared to the prior art solutions, thereby enhancing the motherboard's electrostatic tolerance.

[0028] In this preferred embodiment, the 0 ohm resistor is a chip resistor in 0402 package or 0201 package; the optional types of the front interface include but are not limited to audio interface, USB interface, SD card reader interface; the optional types of the rear interface include but are not limited to audio interface, video interface, network interface, power interface, and expansion card interface.

[0029] comprehensive Figures 1 to 6 As can be seen, the present invention specifically processes the interface GND of external interfaces to create a C-GND. This C-GND of the device's front and rear interfaces is separated from the motherboard's GND during layout, and then connected via a 0-ohm resistor in a 0402 or 0201 package. This approach increases the area of the interface C-GND, enhancing the motherboard's electrostatic tolerance; it also reduces the connection area with the motherboard's GND. When the motherboard interface is subjected to a high current surge, the 0-ohm resistor in the 0402 / 0201 package burns out, protecting the motherboard from damage. While increasing the interface C-GND area during layout, the present invention intentionally creates a circular or semi-circular shape, creating a "Faraday cage" that effectively shields external EMI and prevents external interference from the device's own radiation.

[0030] In summary, the layout and wiring structure of the computer motherboard of the present invention can effectively control the static electricity and EMC of the computer motherboard.

[0031] As described above, for ordinary technicians in this field, various other corresponding changes and modifications can be made according to the technical solution and technical concept of the utility model, and all these changes and modifications should fall within the scope of protection of the claims attached to the utility model.

Claims

1. A layout and wiring structure of a computer motherboard, wherein the motherboard has a ground layer pattern formed by PCB layout and wiring, characterized in that: The ground layer pattern includes an external interface ground layer pattern corresponding to an external interface component to be assembled on the mainboard, and a mainboard ground layer pattern not corresponding to the external interface component to be assembled on the mainboard; the external interface ground layer pattern includes an integrated external interface ground layer pattern corresponding to multiple external interface components connected as one, the integrated external interface ground layer pattern is separated from the mainboard ground layer pattern in layout, and is electrically connected to the mainboard ground layer pattern via a 0-ohm resistor; Corresponding to the edge of the mainboard where the multiple external interface components are located, the integrated external interface ground layer pattern includes a portion extending laterally along the edge direction of the mainboard and a portion extending longitudinally relative to the edge direction of the mainboard, and the laterally extending portion and the longitudinally extending portion form a plurality of annular or semi-annular patterns connected together.

2. The layout and wiring structure of a computer motherboard according to claim 1, wherein: The integrated external interface ground layer pattern corresponds to a plurality of adjacent external interface components on the mainboard, and the plurality of adjacent external interface components at least include a first type of external interface components and a second type of external interface components.

3. The layout and wiring structure of a computer motherboard according to claim 1, wherein: The 0 ohm resistor is a chip resistor in a 0402 package or a 0201 package.

4. The layout and wiring structure of a computer motherboard according to claim 1, wherein: The integrated external interface ground layer pattern is an external interface ground layer pattern corresponding to the front interface or the rear interface.

5. The layout and wiring structure of a computer motherboard according to claim 4, wherein: The optional types of the front interface include an audio interface, a USB interface, and an SD card reader interface.

6. The layout and wiring structure of a computer motherboard according to claim 4, wherein: The optional types of the rear interface include audio interface, video interface, network interface, power interface, and expansion card interface.

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