Camera module and electronic equipment

Abstract

The embodiment of the utility model provides a camera module and electronic equipment, and relates to the technical field of cameras. The camera module comprises an image sensor assembly and a shielding layer. The image sensor assembly includes an image sensor and a first circuit board. The image sensor is provided with a light-sensitive surface and a backlight surface which are oppositely arranged, and the first circuit board is located on the side where the light-sensitive surface or the backlight surface is located and electrically connected with the image sensor. The shielding layer is located on the side where the backlight face is located and attached to at least one part of the image sensor assembly. In the embodiment of the invention, the shielding layer can play a role in electromagnetic shielding, the electromagnetic interference caused by the camera module to other devices of the electronic equipment is reduced, and the performance of the electronic equipment is improved. And the shielding layer is prevented from shielding light.

Description

Technical Field

[0001] The embodiments of the present application provide a camera module and an electronic device, relating to the technical field of cameras. Background Art

[0002] Electronic devices include camera modules that can be electrically connected to the device's processor to enable image acquisition. High-speed signals are transmitted between the camera module and the processor, and noise from these signals can cause electromagnetic interference to other components in the electronic device, impacting its performance. Utility Model Content

[0003] Embodiments of the present application provide a camera module and an electronic device for reducing electromagnetic interference caused by the camera module to other components of the electronic device and improving the performance of the electronic device.

[0004] In one aspect, embodiments of the present application provide a camera module. The camera module includes an image sensor and a shielding layer. The image sensor assembly includes an image sensor and a first circuit board. The image sensor has a photosensitive surface and a backlight surface disposed opposite each other. The first circuit board is located on the side of the photosensitive surface or the backlight surface and is electrically connected to the image sensor. The shielding layer is located on the side of the backlight surface and is bonded to at least a portion of the image sensor assembly.

[0005] In the embodiments of the present application, a shielding layer is positioned on the side of the backlight surface to prevent it from blocking light. Furthermore, the shielding layer adheres to at least a portion of the image sensor assembly, providing electromagnetic shielding to reduce electromagnetic interference caused by noise from high-speed signals transmitted between the camera module and the processor on the antenna or other components of the electronic device, thereby improving the performance of the electronic device.

[0006] Moreover, compared with providing a shielding cover, providing a shielding layer can simplify the structure of the camera module and reduce the thickness of the camera module.

[0007] That is, by adopting the above-mentioned setting method, it is possible to reduce the thickness of the camera module and make the electronic device lighter and thinner, while reducing the electromagnetic interference caused by the noise of the high-speed signal transmitted between the camera module and the processor to the antenna or other devices of the electronic device, thereby improving the performance of the electronic device.

[0008] In some possible implementations, at least a portion of the first circuit board is located on the side where the photosensitive surface is located. A first light-transmitting hole is provided on the first circuit board, and the first light-transmitting hole exposes the photosensitive area of the photosensitive surface. The shielding layer is located on the side where the backlight surface is located, and is bonded to at least a portion of the backlight surface. It can be understood that when a portion of the first circuit board is located on the side where the photosensitive surface is located, the first circuit board and the image sensor overlap along the thickness direction of the camera module, and the two share the space in the thickness direction of the camera module, thereby reducing the thickness of the camera module and facilitating the thinness of the electronic device. The first light-transmitting hole is provided on the first circuit board so that the light passing through the first light-transmitting hole can be irradiated to the photosensitive area, thereby avoiding the first circuit board from blocking the light. Providing the shielding layer in contact with the backlight surface can avoid the shielding layer from blocking the light.

[0009] In some possible implementations, the camera module further includes a first support portion, located on a side of the first circuit board near the backlight surface and connected to the first circuit board. This arrangement enables the first support portion to support the first circuit board, thereby increasing the mechanical strength of the camera module and preventing the first support portion from blocking light.

[0010] In some possible implementations, the first supporting portion surrounds the image sensor, so that the first supporting portion can be close to the first light-transmitting hole, thereby improving the supporting effect of the first supporting portion.

[0011] In some possible implementations, the surface of the first support portion, facing away from the first circuit board, protrudes from the shielding layer along the direction from the first circuit board toward the first support portion. This configuration, on the one hand, allows the shielding layer and the first support portion to share space along the thickness direction of the camera module, reducing the thickness of the camera module and facilitating the thinning and lightweight nature of the electronic device. On the other hand, it reduces the risk of damage or detachment of the shielding layer due to scratches between the shielding layer and other components of the electronic device, thereby ensuring the electromagnetic shielding effectiveness of the shielding layer.

[0012] In some possible implementations, the thickness of the first support portion is in the range of 0.1 mm to 0.2 mm. This configuration can prevent the thickness of the first support portion from being too large (e.g., greater than 0.2 mm) and causing an increase in the thickness of the camera module, and can also prevent the thickness of the first support portion from being too small (e.g., less than 0.1 mm) and affecting the mechanical strength of the camera module. In other words, setting the thickness of the first support portion in the range of 0.1 mm to 0.2 mm can achieve a thinner and lighter camera module while ensuring the mechanical strength of the camera module.

[0013] In some possible implementations, the first support portion includes at least one of a metal part and a non-metallic injection-molded part. It can be understood that when the first support portion includes a metal part, on the one hand, the strength of the first support portion can be improved, thereby improving the mechanical strength of the camera module. On the other hand, the metal part is connected to the surface of the first circuit board close to the backlight side, which can serve as an electromagnetic shield for the first circuit board. In this way, the first circuit board can be set as a through-hole board, which simplifies the preparation process of the first circuit board and reduces the cost of the first circuit board. When the first support portion includes a non-metallic injection-molded part, the weight of the first support portion can be reduced, and the cost of the camera module can be reduced. Setting the first support portion to include at least one of a metal part and a non-metallic injection-molded part can meet different needs.

[0014] In some possible implementations, the photosensitive surface also includes a non-photosensitive area, and the non-photosensitive area surrounds the photosensitive area. The first circuit board is divided into a first sub-area and a second sub-area. The first sub-area covers the photosensitive surface. The first light-transmitting hole is opened in the first sub-area and exposes the photosensitive area. The second sub-area surrounds the outer peripheral side of the first sub-area. The orthographic projection of the second sub-area on the plane where the photosensitive surface is located does not overlap with the orthographic projection of the image sensor on the plane where the photosensitive surface is located. Such a setting can avoid the first circuit board from blocking the photosensitive area, so that light can be irradiated to the photosensitive area.

[0015] In some possible implementations, the camera module further includes a lens assembly, which is located on the side of the photosensitive surface. The orthographic projection of the lens assembly on the plane where the photosensitive surface is located at least partially overlaps with the orthographic projection of the first light-transmitting hole on the plane where the photosensitive surface is located. This arrangement allows light passing through the lens assembly to illuminate the first light-transmitting hole. The first light-transmitting hole exposes the photosensitive area, allowing light passing through the first light-transmitting hole to illuminate the photosensitive area, thereby being converted into an electrical signal by the image sensor.

[0016] In some possible implementations, at least a portion of the lens assembly is embedded in the first light-transmitting hole. This arrangement allows at least a portion of the lens assembly and the first circuit board to share space in the thickness direction of the camera module, thereby reducing the thickness of the camera module and facilitating a thinner and lighter electronic device.

[0017] In some possible implementations, a lens assembly includes a lens body and a filter. The filter is located on one side of the lens body, and is closer to the image sensor assembly than the lens body. This arrangement allows light to sequentially pass through the lens body and the filter, irradiate the image sensor in the image sensor assembly, and be converted into an electrical signal by the image sensor.

[0018] In some possible implementations, the first circuit board is located on the side where the backlight surface is located. The shielding layer is in contact with at least a portion of the surface of the first circuit board on the side away from the backlight surface. This arrangement enables, on the one hand, the shielding layer to shield the noise of high-speed signals, and on the other hand, the shielding layer to shield the noise generated by the wiring in the first circuit board to other devices. In this way, the first circuit board can be set as a through-hole board. Compared with setting the first circuit board as a blind hole board, setting the first circuit board as a through-hole board can simplify the preparation process of the first circuit board, reduce the cost of the first circuit board, and thus reduce the cost of the camera module.

[0019] In some possible implementations, the camera module further includes a conductive connection portion located between the image sensor and the first circuit board and electrically connecting the image sensor and the first circuit board. This arrangement can improve the convenience of the electrical connection between the image sensor and the first circuit board.

[0020] In some possible implementations, the shielding layer is made of silver. As can be understood, silver shielding has good density, which ensures the electromagnetic shielding effect of the shielding layer.

[0021] In some possible implementations, the shielding layer includes a plurality of overlapping silver sheets. It is understandable that the silver shielding layer is formed by overlapping and covering a plurality of silver sheets, and has good density, thereby ensuring the electromagnetic shielding effect of the shielding layer.

[0022] In some possible implementations, the thickness of the shielding layer 141 ranges from 0.01 mm to 0.1 mm. This configuration can prevent the shielding layer from being too thick (e.g., greater than 0.1 mm), which would increase the thickness of the camera module, and can also prevent the shielding layer from being too thin (e.g., less than 0.01 mm), thereby ensuring the electromagnetic shielding effect of the shielding layer.

[0023] In some possible implementations, the surface roughness of the shielding layer away from the backlight surface is less than or equal to Such an arrangement can improve the flatness of the surface of the shielding layer away from the backlight surface, thereby improving the electromagnetic shielding effect of the shielding layer.

[0024] In some possible implementations, the impedance of the shielding layer is less than 10 -5 Such a setting can improve the conductivity of the shielding layer, thereby improving the electromagnetic shielding effect of the shielding layer.

[0025] In some possible implementations, the camera module further includes a second circuit board and a connector. The second circuit board is electrically connected to the first circuit board. The second circuit board is a flexible circuit board. The connector is electrically connected to the second circuit board. It is understood that providing the second circuit board as a flexible circuit board and electrically connecting the second circuit board to the first circuit board and the connector can increase the flexibility of the relative position between the first circuit board and the connector, thereby improving the convenience of electrical connection between the camera module and other devices or modules.

[0026] In another aspect, an embodiment of the present application provides an electronic device. The electronic device includes a housing and the camera module described above. The housing has a camera receiving hole, and at least a portion of the camera module is embedded in the camera receiving hole.

[0027] The electronic device provided in the embodiment of the present application includes the camera module as described above, and therefore has all the beneficial effects described above, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0029] Figure 2 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some embodiments;

[0030] Figure 3 A schematic diagram of the structure of a sensor assembly provided in some embodiments of the present application;

[0031] Figure 4 A schematic diagram of the structure of a sensor assembly provided in some other embodiments of the present application;

[0032] Figure 5 A schematic structural diagram of a sensor assembly provided in some other embodiments of the present application;

[0033] Figure 6 A schematic diagram of the structure of the photosensitive surface provided in some embodiments of the present application;

[0034] Figure 7 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments;

[0035] Figure 8 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0036] Figure 9 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0037] Figure 10 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0038] Figure 11 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0039] Figure 12 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0040] Figure 13 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0041] Figure 14 A mirror image diagram of a silver shielding layer provided in some embodiments of the present application;

[0042] Figure 15 A schematic diagram showing a comparison of simulation curves provided in some embodiments of the present application;

[0043] Figure 16 A noise simulation schematic diagram provided for some embodiments of the present application;

[0044] Figure 17 Schematic diagram of noise simulation provided for other embodiments of the present application;

[0045] Figure 18 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0046] Figure 19 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0047] Figure 20 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0048] Figure 21 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0049] Figure 22 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0050] Figure 23 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some further embodiments;

[0051] Figure 24 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. DETAILED DESCRIPTION

[0052] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0053] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0054] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0055] When describing some embodiments, the term "electrically connected" and its derivatives may be used. The term "electrically connected" should be understood in a broad sense. For example, "electrically connected" can mean a direct electrical connection or an indirect electrical connection through other devices.

[0056] As used herein, "equal" includes the stated conditions and conditions that are similar to the stated conditions, where the range of the similar conditions is within an acceptable range of deviation, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "equal" includes absolute equality and approximate equality, where the acceptable range of deviation for approximate equality can be, for example, that the difference between the two is less than or equal to 5% of either.

[0057] Figure 1 A schematic structural diagram of an electronic device provided in some embodiments of the present application.

[0058] like Figure 1 As shown, an embodiment of the present application provides an electronic device 200. For example, the electronic device 200 can be a mobile phone, a tablet computer (pad), a laptop computer, a smart home device, a smart wearable device (for example, a smart watch, a smart bracelet, smart glasses, a smart helmet), a virtual reality (VR) electronic device, an augmented reality (AR) electronic device, etc.

[0059] The electronic device can also be a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future-evolved public land mobile communication network (PLMN), etc. The embodiment of the present application does not further limit the type of electronic device 200.

[0060] In some examples, such as Figure 1 As shown, the electronic device 200 may include a housing 210 and a camera module 100 . The housing 210 is provided with a camera accommodating hole, and at least a portion of the camera module 100 is embedded in the camera accommodating hole.

[0061] like Figure 1 As shown, the housing 210 may include a middle frame 211 and a rear shell 212. The rear shell 212 is connected to the middle frame 211 to enclose a storage space. A camera storage hole may be provided on the rear shell 212, and at least a portion of the camera module 100 is embedded in the camera storage hole, thereby preventing the housing 210 from blocking light and allowing light to reach the camera module 100.

[0062] The electronic device 200 may further include a mainboard (not shown in the figure), which is located in the accommodation space enclosed by the rear shell 212 and the middle frame 211. The camera module 100 may be electrically connected to the mainboard. The electronic device 200 may further include a processor, such as a central processing unit (CPU), a graphics processing unit (GPU), or an image signal processor (ISP). The processor may be electrically connected to the mainboard so that the processor and the camera module 100 can communicate, thereby enabling the electronic device 200 to perform functions such as image acquisition and image processing.

[0063] For example, the camera module 100 and the processor can use the public mobile industry processor interface (MIPI) high-speed interface protocol to transmit signals. Alternatively, the camera module 100 and the processor can also use other protocols for signal transmission. It is understandable that when high-speed signals are transmitted between the camera module 100 and the processor, the noise of the high-speed signals may cause electromagnetic interference to other components of the electronic device 200.

[0064] For example, Figure 1 As shown, the middle frame 211 may include a frame 2111, which may serve as an antenna for the electronic device 200 to radiate signals to the outside world. The camera module 100 is usually placed close to the frame 2111. As a result, noise from high-speed signals may cause electromagnetic interference to the frame 2111, affecting the signal radiation from the frame 2111 to the outside world, thereby affecting the antenna performance of the electronic device 200.

[0065] Figure 2 for Figure 1 A schematic cross-sectional view of the camera module along the A1-A1 direction in some embodiments.

[0066] In some cases, such as Figure 2 As shown, the camera module 100 may include a first circuit board 112, an image sensor 111, and a lens assembly 120, which are stacked in sequence. Furthermore, the camera module 100 may include a shielding cover 101, which covers the lens assembly 120 and the image sensor 111 to reduce electromagnetic interference caused by high-speed signal noise on components such as antennas. However, this increases the thickness of the camera module 100, hindering the lightweight and thinness of the camera module 100 and the electronic device 200.

[0067] For example, considering the electromagnetic shielding requirements of MIPI signal lines, clock signal (clock, CLK) signal lines, power lines and other lines, the first circuit board 112 can be a four-layer blind hole board, and the thickness of the first circuit board 112 is about 0.2 mm (unit: millimeter). The thickness of the image sensor 111 is about 0.15 mm. The thickness of the lens assembly 120 is about 3.2 mm. The thickness of the shielding cover 101 is about 0.1 mm. Considering the distance between the shielding cover 101 and the lens assembly 120, adding the shielding cover 101 will increase the thickness of the camera module 100 by more than 0.1 mm on the basis of the original thickness, which is not conducive to the thinness of the camera module 100 and the electronic device 200.

[0068] Based on this, an embodiment of the present application provides a camera module 100 , and the camera module 100 provided in the embodiment of the present application is described below with examples.

[0069] Figure 3 A schematic structural diagram of a sensor assembly provided in some embodiments of the present application. Figure 4 Schematic diagram of the structure of the sensor assembly provided in some other embodiments of the present application. Figure 5 Schematic diagram of the structure of the sensor assembly provided in some other embodiments of the present application. Figure 6 A schematic structural diagram of the photosensitive surface provided in some embodiments of the present application.

[0070] In some examples, such as Figure 3 、 Figure 4 and Figure 5 As shown, the camera module 100 may include an image sensor assembly 110 , and the image sensor assembly 110 may include an image sensor 111 and a first circuit board 112 .

[0071] The image sensor 111 has a light-sensitive surface P1 and a backlight surface P2 that are arranged opposite to each other. For example, the light-sensitive surface P1 and the backlight surface P2 can be arranged opposite to each other along the thickness direction Z of the camera module 100. The light-sensitive surface P1 and the backlight surface P2 can be smooth planes. In some examples, such as Figure 6 As shown, the photosensitive surface P1 includes a photosensitive area P1a and a non-photosensitive area P1b, and the non-photosensitive area P1b surrounds the photosensitive area P1a.

[0072] For example, the image sensor 111 may include a device such as a photodiode or a phototransistor, so that the image sensor 111 can perform a photoelectric conversion function. Light irradiated to the photosensitive area P1a can be converted into an electrical signal by the image sensor 111, while light irradiated to the non-photosensitive area P1b cannot be converted into an electrical signal by the image sensor 111.

[0073] The first circuit board 112 may be a main board, or may be another circuit board other than the main board in the electronic device 200. The first circuit board 112 may be a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flex printed circuit board (RFPCB).

[0074] In some examples, such as Figure 3 and Figure 4 As shown, the first circuit board 112 can be located on the side where the photosensitive surface P1 is located. In this case, the first circuit board 112 can expose the photosensitive area P1a of the photosensitive surface P1. In other examples, such as Figure 5 As shown, the first circuit board 112 may also be located on the side where the backlight surface P2 is located.

[0075] It can be understood that the first circuit board 112 is electrically connected to the image sensor 111. For example, the first circuit board 112 has a first surface T and a second surface B that are arranged opposite to each other. The first surface T and the second surface B can be arranged opposite to each other along the thickness direction Z of the camera module 100. Figure 3 and Figure 4 As shown, when the first circuit board 112 is located on the side where the photosensitive surface P1 is located, the second surface B of the first circuit board 112 is electrically connected to the image sensor 111. Figure 5 As shown, when the first circuit board 112 is located on the side where the backlight surface P2 is located, the first surface T of the first circuit board 112 is electrically connected to the image sensor 111 .

[0076] The first circuit board 112 and the image sensor 111 may be directly electrically connected. In other examples, such as Figure 3 and Figure 4 As shown, the camera module 100 may further include a conductive connecting portion 142, which is located between the image sensor 111 and the first circuit board 112 and electrically connects the image sensor 111 and the first circuit board 112 to improve the convenience of electrical connection between the image sensor 111 and the first circuit board 112.

[0077] For example, the conductive connection portion 142 may be a solder ball, or may be a conductive column, a wire, or other conductive component. The number of conductive portions 142 may be one or more. The embodiments of the present application do not further limit the specific form and number of the conductive connection portion 142.

[0078] When the first circuit board 112 is located on the side where the photosensitive surface P1 is located, as shown in FIG. Figure 3 and Figure 4 As shown, the conductive connection portion 142 is located between the non-photosensitive area P1b and the first circuit board 112 to prevent the conductive connection portion 142 from blocking the photosensitive area P1a.

[0079] In some examples, the camera module 100 further includes a shielding layer 141 , which is located on the side where the backlight surface P2 is located and is in contact with at least a portion of the image sensor assembly 110 .

[0080] Figure 7 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 8 for Figure 1 A schematic cross-sectional view of the camera module in some embodiments along the A1-A1 direction. Figure 7 and Figure 8 As shown, at least a portion of the first circuit board 112 is located on the side where the photosensitive surface P1 is located, and the shielding layer 141 is attached to at least a portion of the backlight surface P2. It is understandable that the shielding layer 141 can be attached to the entire backlight surface P2, or the shielding layer 141 can be attached to the backlight surface P2 partially.

[0081] Figure 9 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 9 As shown, when at least a portion of the first circuit board 112 is located on the side where the photosensitive surface P1 is located, the shielding layer 141 can also be attached to at least a portion of the backlight surface P2 and at least a portion of the second surface B of the first circuit board 112.

[0082] Figure 10 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. In other examples, such as Figure 10 As shown, the first circuit board 112 is located on the side where the backlight surface P2 is located, and the shielding layer 141 is attached to at least a portion of the surface of the first circuit board 112 away from the backlight surface P2 (i.e., the second surface B of the first circuit board 112). In this case, the shielding layer 141, the first circuit board 112, the image sensor 111, and the lens assembly 120 can be stacked in sequence along the thickness direction Z of the camera module 100.

[0083] Figure 11 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 11As shown, when the first circuit board 112 is located on the side where the backlight surface P2 is located, the shielding layer 141 is also located between the backlight surface P2 and the first circuit board 112 and is in contact with at least a portion of the backlight surface P2.

[0084] Figure 12 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 12 As shown, when the first circuit board 112 is located on the side where the backlight surface P2 is located, the shielding layer 141 can be adhered to the second surface B of the first circuit board 112, and the shielding layer 141 can be located between the backlight surface P2 and the first circuit board 112, and be adhered to at least a portion of the backlight surface P2.

[0085] As can be understood, shielding layer 141 can function as an electromagnetic shield. Positioning shielding layer 141 on the side of backlight surface P2 prevents light from being blocked by shielding layer 141. Laying shielding layer 141 in contact with at least a portion of image sensor assembly 110 can reduce electromagnetic interference caused by noise from high-speed signals transmitted between camera module 100 and processor to the antenna or other components of electronic device 200, thereby improving the performance of electronic device 200.

[0086] Moreover, compared with providing a shielding cover, providing the shielding layer 141 can simplify the structure of the camera module 100 and reduce the thickness of the camera module 100 .

[0087] That is, by adopting the above-mentioned setting method, it is possible to reduce the thickness of the camera module 100 and make the electronic device 200 lighter and thinner, while reducing the electromagnetic interference caused by the noise of the high-speed signal transmitted between the camera module 100 and the processor to the antenna or other devices of the electronic device 200, thereby improving the performance of the electronic device 200.

[0088] The inventors of this application have discovered, through electromagnetic mechanism analysis, that high-speed signal noise radiation primarily originates from the pins of image sensor 111 and backlight surface P2. Therefore, shielding layer 141 is positioned on the side of backlight surface P2 and is bonded to at least a portion of image sensor assembly 110. This allows shielding layer 141 to shield most of the high-speed signal noise, thereby reducing electromagnetic interference caused by the high-speed signal noise to the antenna or other components of electronic device 200.

[0089] When the first circuit board 112 is located on the side where the backlight surface P2 is located and the shielding layer 141 is in contact with at least a portion of the surface of the first circuit board 112 away from the backlight surface P2 (i.e., the second surface B of the first circuit board 112), on the one hand, the shielding layer 141 can shield the noise of high-speed signals, and on the other hand, the shielding layer 141 can shield the noise generated by the wiring in the first circuit board 112 to other devices. In this way, the first circuit board 112 can be set as a through-hole board. Compared with setting the first circuit board 112 as a blind hole board, setting the first circuit board 112 as a through-hole board can simplify the preparation process of the first circuit board 112, reduce the cost of the first circuit board 112, and thus reduce the cost of the camera module 100.

[0090] Figure 13 for Figure 1 A schematic cross-sectional view of the camera module in some embodiments along the A1-A1 direction. Figure 13 As shown, on the basis that the camera module 100 includes the shielding layer 141 , the camera module 100 may also include a shielding cover 101 to improve the electromagnetic shielding effect.

[0091] For example, the shielding layer 141 may be bonded to at least a portion of the image sensor assembly 110 by bonding, or the shielding layer 141 may be bonded to at least a portion of the image sensor assembly 110 by other methods such as curing, electroplating, and welding.

[0092] In some examples, the material of shielding layer 141 includes silver.

[0093] For example, silver paste can be coated on the backlight surface P2, and then the silver paste can be cured by baking to form a silver shielding layer. For example, a low-temperature fast-drying silver paste can be coated on the backlight surface P2, and then baked at about 80°C (unit: degrees Celsius) to 150°C to cure the silver paste to form a silver shielding layer, thereby simplifying the preparation process of the shielding layer 141. It can be understood that the embodiments of the present application do not further limit the baking and curing temperature of the silver paste. Alternatively, a silver shielding layer can be formed on the backlight surface P2 by electroplating silver.

[0094] Understandably, when shielding layer 141 is affixed to backlight surface P2 or the surface of first circuit board 112, wrinkles can easily appear on shielding layer 141, affecting its electromagnetic shielding effectiveness. Furthermore, wrinkles in shielding layer 141 require removal and a new one to be affixed, making repair more difficult and increasing the complexity of camera module 100 production. Furthermore, after affixing shielding layer 141, inconsistent impedance at different locations on shielding layer 141 can affect electromagnetic shielding effectiveness.

[0095] Therefore, forming the shielding layer 141 by curing or electroplating can simplify the preparation process of the shielding layer 141 and ensure the electromagnetic shielding effect of the shielding layer 141 .

[0096] Figure 14 A mirror image diagram of a silver shielding layer provided in some embodiments of the present application.

[0097] In some examples, such as Figure 14 As shown, it can be seen from the mirror image that the shielding layer 141 includes a plurality of silver sheets arranged in an overlapping manner.

[0098] It can be understood that the silver shielding layer is formed by overlapping multiple silver sheets and has good density, thereby ensuring the electromagnetic shielding effect of the shielding layer 141.

[0099] In some examples, the concentration of metallic silver in the shielding layer 141 can be adjusted to adjust the electromagnetic shielding performance of the shielding layer 141 so that the shielding layer 141 can shield electromagnetic waves in a wide frequency band.

[0100] In other examples, the shielding layer 141 may also be other metals, such as gold, aluminum, copper, etc. For example, the shielding layer 141 may be copper foil, aluminum foil, conductive cloth, EMI (electromagnetic interference) electromagnetic film, etc.

[0101] In some examples, the thickness of the shielding layer 141 ranges from 0.01 mm to 0.1 mm. This configuration can prevent the shielding layer 141 from being too thick (e.g., greater than 0.1 mm), which would increase the thickness of the camera module 100, and can also prevent the shielding layer 141 from being too thin (e.g., less than 0.01 mm), thereby ensuring the electromagnetic shielding effect of the shielding layer 141.

[0102] For example, the thickness of the shielding layer 141 may be 0.03 mm, 0.05 mm, or 0.08 mm, etc. The embodiment of the present application does not further limit the thickness of the shielding layer 141 .

[0103] It is understandable that when there is a changing current or a changing electromagnetic field in a conductor, the current will concentrate on the surface of the conductor. The closer to the surface of the conductor, the greater the current density. Conversely, the farther away from the surface of the conductor, the smaller the current density. For example, the above phenomenon can be called the "skin effect". The distance between the surface of the conductor and the position where the current density drops to 0.368 times the current density on the surface of the conductor can be called the "skin depth" or the "penetration depth". The thickness of the shielding layer 141 needs to be greater than the skin depth to ensure the electromagnetic shielding effect of the shielding layer 141.

[0104] For example, the thickness of conductive copper foil or conductive cloth usually needs to be greater than or equal to 0.05 mm to meet the requirement of being greater than the skin depth, which is not conducive to the lightweight and thinning of camera module 100 and electronic device 200. However, the silver shielding layer has better density and a thickness of 0.01 mm to 0.1 mm can be greater than the skin depth, which is conducive to the lightweight and thinning of camera module 100 and electronic device 200.

[0105] In some examples, the surface roughness of the shielding layer 141 on the side away from the image sensor assembly 110 is less than or equal to In this way, the flatness of the surface of the shielding layer 141 away from the image sensor assembly 110 can be improved, thereby improving the electromagnetic shielding effect of the shielding layer 141. For example, the surface roughness of the surface of the shielding layer 141 away from the backlight surface P2 can be or wait.

[0106] In some examples, the impedance of the shielding layer 141 is less than 10 -5 Ω.cm (unit: ohm×cm) In this way, the conductivity of the shielding layer 141 can be improved, thereby improving the electromagnetic shielding effect of the shielding layer 141.

[0107] Figure 15 A schematic diagram for comparing simulation curves provided in some embodiments of the present application. Figure 16 A noise simulation schematic diagram provided for some embodiments of the present application. Figure 17 Schematic diagram of noise simulation provided for other embodiments of the present application.

[0108] For example, Figure 15 As shown, Figure 15 The vertical axis represents the noise value. Curve c represents the ambient noise, curve a represents the noise received by other components (e.g., antenna) of the electronic device 200 when the shielding layer 141 is not provided, and curve b represents the case where the shielding layer 141 is made of silver, has a thickness of 10 μm (unit: micrometer), and has a conductivity greater than 20×10 3 The noise received by other components (such as an antenna) of the electronic device 200 is measured in Siemens per meter (unit: S / m).

[0109] from Figure 15 It can be seen from the figure that after the shielding layer 141 is provided, the noise received by other components of the electronic device 200 (such as the antenna) is greatly reduced and is close to the ambient noise.

[0110] See also Figure 16 and Figure 17 , Figure 16 1 is a schematic diagram of a simulation of noise received by other components (such as an antenna) of the electronic device 200 when the shielding layer 141 is not provided. Figure 17 The material of the shielding layer 141 includes silver, the thickness of the shielding layer 141 is 10 μm (unit: micrometer), and the conductivity of the shielding layer 141 is greater than 20×10 3 A schematic diagram of a simulation of noise received by other components (such as an antenna) of the electronic device 200 in Siemens per meter (unit: S / m).

[0111] from Figure 16 and Figure 17 It can be seen that after the shielding layer 141 is provided, the noise received by other components (such as the antenna) of the electronic device 200 is greatly reduced.

[0112] In some examples, the shielding layer 141 also has advantages such as good adhesion and high hardness. For example, after a 100-grid test, the ratio of the shedding area to the total area of the shielding layer 141 is less than or equal to 5%. The hardness of the shielding layer 141 is greater than 2H (hardness).

[0113] In some examples, the shielding layer 141 can provide a shielding effect greater than or equal to 30 dB on MIPI noise.

[0114] The structure of the camera module 100 is described below by taking an example in which at least a portion of the first circuit board 112 is located on the side where the photosensitive surface P1 is located.

[0115] Figure 18 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. For example, Figure 18 As shown, along the thickness direction Z of the camera module 100, the first circuit board 112 can be partially located on the side where the photosensitive surface P1 is located. In this case, along the thickness direction Z of the camera module 100, the first circuit board 112 and the image sensor 111 overlap, and the two share the space in the thickness direction Z of the camera module 100.

[0116] For example, Figure 18 As shown, along the thickness direction Z of the camera module 100, the first circuit board 112 can be divided into a first part 1123 and a second part 1124. The first part 1123 and the second part 1124 can be electrically connected and integrally formed. The first part 1123 can be located on the side where the photosensitive surface P1 is located, and the second part 1124 can surround the image sensor 111. That is, in the thickness direction Z of the camera module 100, the second part 1124 of the first circuit board 112 and the image sensor 111 can share space. In this way, the thickness of the camera module 100 can be reduced, which is conducive to the lightweight and thinning of the electronic device 200.

[0117] Figure 19 for Figure 1A schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 19 As shown, along the thickness direction Z of the camera module 100 , the first circuit board 112 may also be located as a whole on the side where the photosensitive surface P1 is located. In this case, the first circuit board 112 and the sensor 111 do not overlap in the thickness direction Z of the camera module 100 .

[0118] In some examples, such as Figure 18 and Figure 19 As shown, a first light-transmitting hole Q1 is defined on the first circuit board 112 , and the first light-transmitting hole Q1 exposes the photosensitive area P1 a of the photosensitive surface P1 .

[0119] It is understood that the first light-transmitting hole Q1 penetrates the first circuit board 112 along the thickness direction of the first circuit board 112 (i.e., the thickness direction Z of the camera module 100), so that the first circuit board 112 can expose the photosensitive area P1a. The first light-transmitting hole Q1 can be a rectangular through-hole, a cylindrical through-hole, or a through-hole of another shape. The embodiment of the present application does not further limit the shape of the first light-transmitting hole Q1.

[0120] A first light-transmitting hole Q1 is formed on the first circuit board 112 , so that light passing through the first light-transmitting hole Q1 can be irradiated to the photosensitive area P1 a , thereby preventing the first circuit board 112 from blocking the light.

[0121] In some examples, such as Figure 18 and Figure 19 As shown, the first circuit board 112 is divided into a first sub-area 1121 and a second sub-area 1122 .

[0122] The first sub-region 1121 covers the photosensitive surface P1. The first light-transmitting hole Q1 is opened in the first sub-region 1121 and exposes the photosensitive area P1a, so that light can be irradiated to the photosensitive area P1a. For example, Figure 18 and Figure 19 As shown, the first sub-region 1121 may cover the non-photosensitive region P1b, or the first sub-region 1121 may also cover the non-photosensitive region P1b and part of the photosensitive region P1a.

[0123] Second sub-region 1122 surrounds the outer periphery of first sub-region 1121. The orthographic projection of second sub-region 1122 on the plane of photosensitive surface P1 does not overlap with the orthographic projection of image sensor 111 on the plane of photosensitive surface P1. This prevents second sub-region 1122 from blocking image sensor 111, allowing light to reach photosensitive area P1a.

[0124] Figure 20 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 21 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments.

[0125] In some examples, such as Figure 20 and Figure 21 As shown, the camera module 100 further includes a first support portion 143 . The first support portion 143 is located on a side of the first circuit board 112 close to the backlight surface P2 and is connected to the first circuit board 112 .

[0126] For example, the first support portion 143 may be connected to the second surface B of the second sub-region 1122 , or the first support portion 143 may be connected to the second surface B of the second sub-region 1122 and the surface of the shielding layer 141 away from the image sensor 111 .

[0127] The first support portion 143 is connected to the first circuit board 112 so that the first support portion 143 can support the first circuit board 112, thereby improving the mechanical strength of the camera module 100. The first support portion 143 is disposed on a side of the first circuit board 112 close to the backlight surface P2, thereby avoiding blocking of light by the first support portion 143.

[0128] In some examples, the first support portion 143 includes at least one of a metal part and a non-metal injection molded part.

[0129] For example, the material of the metal part may include metals or alloys such as steel, iron, and aluminum. When the first support portion 143 includes a metal part, on the one hand, the strength of the first support portion 143 can be improved, thereby improving the mechanical strength of the camera module 100. On the other hand, the metal part is connected to the side of the first circuit board 112 close to the backlight surface P2, which can serve as an electromagnetic shield for the first circuit board 112. In this way, the first circuit board 112 can be set as a through-hole board, simplifying the preparation process of the first circuit board 112 and reducing the cost of the first circuit board 112.

[0130] The material of the non-metal injection molded part may include at least one of epoxy resin or silicon dioxide. For example, the non-metal injection molded part may be a hard resin sheet.

[0131] For example, an in-mold molding process can be used to form a non-metallic injection molded part on the first circuit board 112. The non-metallic injection molded part can be connected to the first circuit board 112 as an integrated structural part. The integrated structural part has high precision, and the non-metallic injection molded part and the first circuit board 112 are tightly combined.

[0132] When the first support portion 143 includes a non-metal injection molded part, the weight of the first support portion 143 can be reduced, and the cost of the camera module 100 can be reduced.

[0133] It can be understood that the first support portion 143 includes at least one of a metal part and a non-metal injection molded part, which can meet different needs.

[0134] In some examples, the first support portion 143 surrounds the image sensor 111 , so that the first support portion 143 can be close to the first light-transmitting hole Q1 , thereby improving the supporting effect of the first support portion 143 .

[0135] Continue to refer to Figure 20 and Figure 21 In some examples, along the direction from the first circuit board 112 to the first support portion 143 , the surface of the first support portion 143 away from the first circuit board 112 protrudes from the shielding layer 141 .

[0136] For example, the thickness of the first support portion 143 can be greater than the thickness of the shielding layer 141, so that the surface of the first support portion 143 away from the first circuit board 112 can protrude from the shielding layer 141. Alternatively, the first support portion 143 and the first circuit board 112 can be indirectly connected, and a component located between the first support portion 143 and the first circuit board 112 can raise the first support portion 143, so that the surface of the first support portion 143 away from the first circuit board 112 can protrude from the shielding layer 141.

[0137] The surface of the first support portion 143, which is located away from the first circuit board 112, protrudes from the shielding layer 141. This allows the shielding layer 141 and the first support portion 143 to share space in the thickness direction Z of the camera module 100, reducing the thickness of the camera module 100 and facilitating a thinner and lighter electronic device 200. Furthermore, this reduces the risk of damage or detachment of the shielding layer 141 due to scratches between the shielding layer 141 and other components of the electronic device 200, thereby ensuring the electromagnetic shielding effectiveness of the shielding layer 141.

[0138] Figure 22 for Figure 1 A schematic cross-sectional view of the camera module in some embodiments along the A1-A1 direction. Figure 22 As shown, the shielding layer 141 can be attached to the backlight surface P2 and the surface of the first support portion 143 away from the first circuit board 112 to improve the electromagnetic shielding effect.

[0139] In some examples, the thickness of the first support portion 143 ranges from 0.1 mm to 0.2 mm.

[0140] This prevents the thickness of the first support portion 143 from being too large (e.g., greater than 0.2 mm) and causing an increase in the thickness of the camera module 100, and prevents the thickness of the first support portion 143 from being too small (e.g., less than 0.1 mm) and affecting the mechanical strength of the camera module 100. In other words, by setting the thickness of the first support portion 143 to a value within the range of 0.1 mm to 0.2 mm, the camera module 100 can be made thinner while ensuring its mechanical strength.

[0141] For example, the thickness of the first support portion 143 may be 0.12 mm, 0.15 mm, or 0.18 mm, etc. The embodiment of the present application does not further limit the thickness of the first support portion 143 .

[0142] In some examples, such as Figure 22 As shown, the camera module 100 may further include an adhesive portion 144, which may be filled in the gap between the first circuit board 112, the image sensor 111 and the first support portion 143 to bond the circuit board 112, the image sensor 111 and the first support portion 143, thereby improving the connection reliability between the first circuit board 112, the image sensor 111 and the first support portion 143, thereby improving the mechanical strength of the camera module 100.

[0143] Alternatively, the adhesive portion 144 may also be filled in the gap between the first circuit board 112 and the image sensor 111 , or alternatively, the adhesive portion 144 may also be filled in the gap between the image sensor 111 and the first supporting portion 143 .

[0144] Figure 23 for Figure 1 Schematic cross-sectional view of the camera module along the A1-A1 direction in some other embodiments. Figure 24 for Figure 1 A schematic cross-sectional view of the camera module in some embodiments along the A1-A1 direction. Figure 23 and Figure 24 As shown, the camera module 100 further includes a lens assembly 120 , which is located on the side where the photosensitive surface P1 is located.

[0145] The orthographic projection of the lens assembly 120 on the plane where the photosensitive surface P1 is located at least partially overlaps with the orthographic projection of the first light-transmitting hole Q1 on the plane where the photosensitive surface P1 is located. It is understood that the orthographic projection of the lens assembly 120 on the plane where the photosensitive surface P1 is located and the orthographic projection of the first light-transmitting hole Q1 on the plane where the photosensitive surface P1 is located may coincide with or partially overlap.

[0146] For example, Figure 23As shown, the orthographic projection of the lens assembly 120 on the plane where the photosensitive surface P1 is located can fall within the range of the orthographic projection of the first light-transmitting hole Q1 on the plane where the photosensitive surface P1 is located. Or, as Figure 24 As shown, the orthographic projection of the first light-transmitting hole Q1 on the plane where the photosensitive surface P1 is located can fall within the range of the orthographic projection of the lens assembly 120 on the plane where the photosensitive surface P1 is located.

[0147] It is understood that the orthographic projection of the lens assembly 120 on the plane where the photosensitive surface P1 is located is arranged to at least partially overlap with the orthographic projection of the first light-transmitting hole Q1 on the plane where the photosensitive surface P1 is located, so that light passing through the lens assembly 120 can be irradiated by the first light-transmitting hole Q1. The first light-transmitting hole Q1 exposes the photosensitive area P1a, allowing the light passing through the first light-transmitting hole Q1 to be irradiated by the photosensitive area P1a, thereby being converted into an electrical signal by the image sensor 111.

[0148] In some examples, such as Figure 23 As shown, at least a portion of the lens assembly 120 is embedded in the first light-transmitting hole Q1. This allows at least a portion of the lens assembly 120 and the first circuit board 112 to share space in the thickness direction Z of the camera module 100, thereby reducing the thickness of the camera module 100 and contributing to a slimmer and lighter electronic device 200.

[0149] For example, the lens assembly 120 can be connected to the first circuit board 112. For example, the lens assembly 120 can be connected to the first circuit board 112 by bonding, or the lens assembly 120 can be connected to the first circuit board 112 by other means such as snap-fitting. The embodiments of the present application do not further limit the connection method between the lens assembly 120 and the first circuit board 112.

[0150] In some examples, such as Figure 23 and Figure 24 As shown, the lens assembly may include a lens body 121 and a filter 122. The filter 122 is located on one side of the lens body 121, and the filter 122 is closer to the image sensor assembly 110 relative to the lens body 121.

[0151] For example, the lens body 121 may include at least one of a convex lens, a concave lens or other optical lenses. The filter 122 may be an infrared (IR) filter, which can filter out infrared light in the ambient light and pass visible light. Alternatively, the filter 122 may be a dual-bandpass filter that can select wavelengths within two regions of the ambient light to pass through, such as visible light and infrared light, or visible light and ultraviolet light, or ultraviolet light and infrared light, etc. The embodiments of the present application do not limit the type of the above-mentioned filter 122.

[0152] The filter 122 is arranged close to the image sensor assembly 110 relative to the lens body 121, so that light can pass through the lens body 121 and the filter 122 in sequence and illuminate the image sensor 111 in the image sensor assembly 110, and is converted into an electrical signal by the image sensor 111.

[0153] In some examples, such as Figure 23 As shown, the lens body 121 and the filter 122 can both be embedded in the first light transmission hole Q1 to reduce the thickness of the camera module 100 and facilitate the thinning of the electronic device 200. In other examples, one of the lens body 121 and the filter 122 can also be embedded in the first light transmission hole Q1.

[0154] In some examples, such as Figure 24 As shown, the camera module 100 may include a second support portion 145, which is located on a surface (e.g., first surface T) of the first circuit board 112 away from the image sensor 111. The lens assembly 120 is located on a side of the second support portion 145 away from the first circuit board 112. For example, the lens assembly 120 may be connected to the second support portion 145 by bonding.

[0155] like Figure 24 As shown, the second support portion 145 may be provided with a second light-transmitting hole Q2 , which is connected to the first light-transmitting hole Q1 , so as to prevent the second support portion 145 from blocking light.

[0156] It can be understood that by providing the second support portion 145 , the lens assembly 120 can be supported, thereby reducing the risk of the lens assembly 120 directly exerting pressure on the first circuit board 112 and causing damage to the first circuit board 112 .

[0157] For example, the second support portion 145 can be an injection molded part. For example, the material of the injection molded part can include at least one of epoxy resin or silicon dioxide. The second support portion 145 can be formed on the first circuit board 112 using an in-mold molding process. The second support portion 145 can be connected to the first circuit board 112 to form an integrated structure. This integrated structure has high precision and the second support portion 145 and the first circuit board 112 are tightly bonded.

[0158] like Figure 24As shown, the second support portion 145 may include a connected main body portion 1451 and a stepped portion 1452. The stepped portion 1452 is closer to the second light transmission hole Q2 relative to the main body portion 1451, and the thickness of the stepped portion 1452 is less than that of the main body portion 1451. The filter 122 may cover the second light transmission hole Q2 and the first light transmission hole Q1, and overlap the stepped portion 1452. The lens body 121 may cover the second light transmission hole Q2 and the first light transmission hole Q1, and be connected to the side of the main body portion 1451 away from the first circuit board 112.

[0159] Continue to refer to Figure 24 In some examples, the camera module 100 may further include a second circuit board 151 and a connector 152. The second circuit board 151 is electrically connected to the first circuit board 112 and is a flexible printed circuit board (FPCB). The connector 152 is electrically connected to the second circuit board 151.

[0160] For example, connector 152 may be a board-to-board (BTB) connector. Connector 152 is used to electrically connect to other devices or modules. In some examples, connector 152 may be electrically connected to other devices or modules by plugging. Alternatively, connector 152 may be electrically connected to other devices or modules by welding or other methods.

[0161] The second circuit board 151 is set as a flexible circuit board, and the second circuit board 151 is electrically connected to the first circuit board 112 and the connector 152, which can improve the flexibility of the relative position between the first circuit board 112 and the connector 152, thereby improving the convenience of electrical connection between the camera module 100 and other devices or modules.

[0162] To sum up, in the embodiments of the present application, when a portion of the first circuit board 112 is located on the photosensitive surface P1, the lens assembly 120 and the image sensor 111 can be sunk by opening a first light-transmitting hole Q1 on the first circuit board 112. At least a portion of the lens assembly 120, a portion of the first circuit board 112, and a portion of the image sensor 111 can share the space in the thickness direction Z of the camera module 100, thereby greatly reducing the thickness of the camera module 100 and facilitating the thinness and lightness of the electronic device 200.

[0163] Shielding layer 141 is also provided to reduce electromagnetic interference caused by noise from high-speed signals transmitted between camera module 100 and the processor on other components of electronic device 200, thereby improving the performance of electronic device 200. Shielding layer 141 is ultra-thin, easy to attach, easy to prepare, and has excellent shielding performance, thereby enhancing its electromagnetic shielding effectiveness.

[0164] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A camera module (100), characterized in that: include: An image sensor assembly (110) comprises an image sensor (111) and a first circuit board (112); the image sensor (111) has a photosensitive surface (P1) and a backlight surface (P2) arranged opposite to each other; the first circuit board (112) is located on the side where the photosensitive surface (P1) or the backlight surface (P2) is located, and is electrically connected to the image sensor (111); and The shielding layer (141) is located on the side where the backlight surface (P2) is located, and is in contact with at least a portion of the image sensor assembly (110).

2. The camera module (100) according to claim 1, characterized in that At least a portion of the first circuit board (112) is located on the side where the photosensitive surface (P1) is located; a first light-transmitting hole (Q) is provided on the first circuit board (112), and the first light-transmitting hole (Q) exposes a photosensitive area (P1a) of the photosensitive surface (P1); The shielding layer (141) is bonded to at least a portion of the backlight surface (P2).

3. The camera module (100) according to claim 2, characterized in that: Also includes: The first supporting portion (143) is located on a side of the first circuit board (112) close to the backlight surface (P2) and is connected to the first circuit board (112).

4. The camera module (100) according to claim 3, characterized in that: The first supporting portion (143) surrounds the image sensor (111).

5. The camera module (100) according to claim 3 or 4, characterized in that: Along the direction from the first circuit board (112) to the first supporting portion (143), the surface of the first supporting portion (143) away from the first circuit board (112) protrudes from the shielding layer (141).

6. The camera module (100) according to any one of claims 3 to 5, characterized in that: The thickness of the first support portion (143) ranges from 0.1 mm to 0.2 mm.

7. The camera module (100) according to any one of claims 3 to 6, characterized in that: The first supporting portion (143) includes at least one of a metal part and a non-metal injection molded part.

8. The camera module (100) according to any one of claims 2 to 7, characterized in that: The photosensitive surface (P1) further includes a non-photosensitive area (P1b), and the non-photosensitive area (P1b) surrounds the photosensitive area (P1a); The first circuit board (112) is divided into a first sub-area (1121) and a second sub-area (1122); the first sub-area (1121) covers the photosensitive surface (P1); the first light-transmitting hole (Q) is opened in the first sub-area (1121) and exposes the photosensitive area (P1a); the second sub-area (1122) surrounds the outer periphery of the first sub-area (1121); the orthographic projection of the second sub-area (1122) on the plane where the photosensitive surface (P1) is located does not overlap with the orthographic projection of the image sensor (111) on the plane where the photosensitive surface (P1) is located.

9. The camera module (100) according to any one of claims 2 to 8, characterized in that: Also includes: The lens assembly (120) is located on the side where the photosensitive surface (P1) is located; the orthographic projection of the lens assembly (120) on the plane where the photosensitive surface (P1) is located and the orthographic projection of the first light-transmitting hole (Q) on the plane where the photosensitive surface (P1) is located at least partially overlap.

10. The camera module (100) according to claim 9, characterized in that: At least a portion of the lens assembly (120) is embedded in the first light-transmitting hole (Q).

11. The camera module (100) according to claim 9 or 10, characterized in that: The lens assembly (120) comprises: Lens body (121); The optical filter (122) is located on one side of the lens body (121), and the optical filter (122) is close to the image sensor assembly (110) relative to the lens body (121).

12. The camera module (100) according to claim 1, characterized in that: The first circuit board (112) is located on the side where the backlight surface (P2) is located; the shielding layer (141) is bonded to at least a portion of the surface of the first circuit board (112) on the side away from the backlight surface (P2).

13. The camera module (100) according to any one of claims 1 to 12, characterized in that: It also includes a conductive connecting portion (142), which is located between the image sensor (111) and the first circuit board (112) and electrically connects the image sensor (111) and the first circuit board (112).

14. The camera module (100) according to any one of claims 1 to 13, characterized in that: The material of the shielding layer (141) includes silver.

15. The camera module (100) according to claim 14, characterized in that: The shielding layer (141) comprises a plurality of silver sheets arranged in an overlapping manner.

16. The camera module (100) according to claim 14 or 15, characterized in that: The thickness of the shielding layer (141) ranges from 0.01 mm to 0.1 mm.

17. The camera module (100) according to any one of claims 1 to 16, characterized in that: The surface roughness of the shielding layer (141) on the side away from the sensor component (110) is less than or equal to 18. The camera module (100) according to any one of claims 1 to 17, characterized in that: The impedance of the shielding layer (141) is less than 10 -5 Ω.cm.

19. An electronic device (200), characterized in that include: A housing (210), wherein the housing (210) is provided with a camera accommodating hole; The camera module (100) according to any one of claims 1 to 18, wherein at least a portion of the camera module (100) is embedded in the camera accommodating hole.

Images