OAM assembly structure and OAM equipment

Abstract

The utility model relates to the technical field of OAM equipment, and provides an OAM assembly structure and OAM equipment, and the structure comprises a housing which is provided with a heat dissipation air channel; the first circuit board is arranged in the shell, and a circuit layer is arranged on the first circuit board; the OAM modules are arranged on the first circuit board, the number of the OAM modules is at least three, the OAM modules are arranged line by line in the direction perpendicular to the wind direction of the heat dissipation air channel and form at least one OAM line group, and the circuit layer is connected with the OAM modules so that every two OAM modules in the same OAM line group can be electrically connected. The OAM modules are arranged in the vertical direction of the wind direction of the heat dissipation air duct to form at least one row of OAM row groups, so that the heat dissipation air duct is prevented from having a low wind resistance area, the heat dissipation effect of the heat dissipation air duct on the OAM modules is guaranteed, the heat dissipation reliability is improved, and meanwhile, under the condition that the topological structure is not changed, the number of the OAM modules is flexibly selected according to the computing power requirement, and the cost is reduced. And the method is flexibly suitable for high-computing-power and low-computing-power scenes.

Description

Technical Field

[0001] The utility model relates to the technical field of OAM equipment, in particular to an OAM component structure and an OAM device. Background Art

[0002] An OAM module (OCP accelerator module) is a hardware acceleration module that complies with the Open Compute Project standard and is designed to meet the computing power requirements of high-load scenarios such as AI training and high-performance computing. OAM equipment typically requires multiple modules to provide sufficient computing power. To achieve efficient collaborative computing, each module group requires direct connections between modules using high-speed interconnect technology. Furthermore, due to the high power consumption of OAM modules, they generate a significant amount of heat during operation, requiring the provision of cooling ducts to ensure that the OAM modules operate within an appropriate temperature range.

[0003] In related technologies, the OAM modules in OAM devices are arranged in groups and partitions in a symmetrical manner. The dual-group OAM modules adopt a topology structure with left and right partitions being centrally symmetrical. Although this is conducive to wiring, when only a single group of modules is used, such as in scenarios with low computing power requirements, the vacant partitions will form low wind resistance areas, causing the airflow to bypass the actually running OAM modules, resulting in uneven heat dissipation and poor effects, which in turn causes equipment overheating and unstable operation, resulting in heat dissipation defects.

[0004] Therefore, in OAM devices, when a small number of OAM modules are used in low computing power demand scenarios, there is a problem of forming a low wind resistance area, resulting in the heat dissipation effect not being able to meet the heat dissipation requirements of the OAM modules. Utility Model Content

[0005] The utility model provides an OAM component structure and an OAM device, which are used to solve the problem in the prior art that when a small number of OAM modules are used in low computing power demand scenarios, a low wind resistance area is formed, resulting in a heat dissipation effect that cannot meet the heat dissipation requirements of the OAM modules.

[0006] The utility model provides an OAM component structure, including:

[0007] The housing is provided with a heat dissipation duct;

[0008] A first circuit board is disposed in the housing, and a circuit layer is provided on the first circuit board;

[0009] An OAM module is provided on the first circuit board. There are at least three OAM modules. The OAM modules are arranged in rows along a direction perpendicular to the wind direction of the heat dissipation duct and form at least one row of OAM row groups. The circuit layer is connected to the OAM modules so that the OAM modules in the same OAM row group are electrically connected to each other.

[0010] According to an OAM assembly structure provided by the present invention, adjacent OAM modules in the OAM row group are arranged close to each other with gaps between them, and the width of the heat dissipation duct formed by the shell matches the width of the OAM row group.

[0011] According to an OAM component structure provided by the present invention, the OAM row group has at least two rows, and at least one OAM module in one of two adjacent rows of the OAM row group is electrically connected to the OAM module in the other row through the circuit layer.

[0012] According to an OAM component structure provided by the present invention, the OAM modules in adjacent OAM row groups are aligned in columns, and the two OAM modules in the same column in two adjacent OAM row groups are electrically connected through the circuit layer.

[0013] According to an OAM component structure provided by the utility model, there are four OAM modules, and the four OAM modules are arranged in a row of the OAM row group;

[0014] Alternatively, there are eight OAM modules, and every four OAM modules are arranged in a row to form two rows of OAM row groups.

[0015] According to an OAM component structure provided by the present invention, the OAM module includes a base plate assembly, a computing power chip, a radiator and a protective shell. The computing power chip is arranged on the base plate assembly, the radiator is connected to the base plate assembly so that the radiator and the computing power chip are in contact with each other, the protective shell cover is arranged outside the radiator, and the protective shell is provided with a front air outlet and a rear air outlet exposing the radiator. The relative positions of the front air outlet and the rear air outlet are arranged along the wind direction of the heat dissipation air duct.

[0016] According to an OAM component structure provided by the present invention, the protective shell is provided with a gripping portion, and the gripping portion is provided with a handle.

[0017] According to an OAM component structure provided by the present invention, it also includes a fan module, and the shell includes a bottom plate, a top plate, a left plate, a right plate, a front plate and a back plate. The bottom plate, the top plate, the left plate, the right plate, the front plate and the back plate are combined to form a cavity for accommodating the first circuit board and the OAM module. The fan module is arranged on the front plate, and the back plate is provided with a heat dissipation hole group. The heat dissipation duct is formed between the fan module and the heat dissipation hole group.

[0018] According to an OAM assembly structure provided by the present invention, the shell further includes a reinforcing rod, one end of the reinforcing rod is connected to the left side plate, and the other end of the reinforcing rod is connected to the right side plate.

[0019] The utility model also provides an OAM device, comprising the above-mentioned OAM component structure.

[0020] The present invention provides an OAM assembly structure and OAM device, which have at least one beneficial effect: a housing is provided with a heat dissipation duct. When the OAM modules are installed on a first circuit board, they are arranged row by row perpendicular to the wind direction of the heat dissipation duct, forming at least one OAM row group. The circuit layer provided on the first circuit board electrically connects each OAM module in the OAM row group, thereby achieving direct connection between each OAM module within the group, meeting the operational connection requirements of the OAM modules and improving data transmission efficiency between the OAM modules. Furthermore, because the OAM modules in the OAM row group are arranged perpendicular to the wind direction of the heat dissipation duct, forming at least one OAM row group avoids the presence of low-resistance areas in the heat dissipation duct, ensuring that airflow in the heat dissipation duct flows through each OAM module. Thus, even when a small number of OAM modules are used in low-computing power scenarios, the heat dissipation effect of the heat dissipation duct on the OAM modules is still guaranteed, which helps improve heat dissipation reliability and meet the heat dissipation requirements of the OAM modules. Furthermore, without changing the topology, the number of OAM modules can be flexibly selected based on the computing power requirements, making it suitable for both high-computing power and low-computing power scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present invention or related technologies, the following is a brief introduction to the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the arrangement structure and connection relationship of the OAM modules in one embodiment of an OAM component structure provided by the present invention.

[0023] Figure 2 It is a three-dimensional schematic diagram of one embodiment of an OAM component structure provided by the utility model.

[0024] Figure 3 This is a three-dimensional schematic diagram of a single-row OAM row group in one embodiment of an OAM component structure provided by the present invention.

[0025] Figure 4This is a three-dimensional schematic diagram of an OAM module in one embodiment of an OAM component structure provided by the present invention.

[0026] Figure 5 It is a schematic diagram of the centrally symmetrical arrangement structure and connection relationship of the OAM module in the related art.

[0027] Figure 6 This is a schematic diagram of a low wind resistance area caused by a single set of OAM modules in the related art.

[0028] Reference numerals:

[0029] 100: Shell; 101: Reinforcement rod; 110: Bottom plate; 120: Left side plate; 130: Right side plate; 140: Back plate; 141: Heat dissipation hole group; 200: First circuit board; 300: OAM module; 301: OAM row group; 310: Bottom plate assembly; 320: Radiator; 330: Protective shell; 331: Handle. DETAILED DESCRIPTION

[0030] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the accompanying drawings to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] In the OAM devices of related technologies, each group of OAM modules adopts a central symmetrical layout, such as Figure 5 As shown, two groups of OAM modules are arranged symmetrically at the four corners, with the two groups of OAM modules divided into left and right sections. Placing OAM modules in a symmetrical manner helps shorten the length of interconnecting OAM modules, reduces crossovers, and reduces the difficulty of routing design.

[0032] However, for scenarios with low computing power requirements, such as small computing power model applications, the number of OAM modules used is usually small, such as using only a single set of OAM modules. Due to the centrally symmetrical structure of the OAM modules, each set of OAM modules is arranged in a left-right partitioned manner, such as Figure 5As shown in the example, OAM modules 0 to 3 form a group located in the left partition, and OAM modules 4 to 7 form another group located in the right partition. In the case of a single group of OAM modules, since one OAM module is missing from the left and right partitions, the area without the OAM module in the heat dissipation duct forms a low-resistance area. As a result, most of the airflow flows through the low-resistance area, failing to effectively dissipate heat from the OAM module. This results in poor heat dissipation, leading to problems such as the OAM module failing self-test and unstable operation, and failing to meet the heat dissipation requirements of the OAM module.

[0033] To solve the above problems, the following Figures 1 to 4 The present invention describes an OAM component structure, including:

[0034] The housing 100 is provided with a heat dissipation duct;

[0035] A first circuit board 200 is disposed in the housing 100 , and a circuit layer is disposed on the first circuit board 200 ;

[0036] The OAM modules 300 are arranged on the first circuit board 200. There are at least three OAM modules 300. The OAM modules 300 are arranged in rows perpendicular to the wind direction of the heat dissipation duct and form at least one row of OAM row groups 301. The circuit layer is connected to the OAM modules 300 to electrically connect the OAM modules 300 in the same OAM row group 301.

[0037] The housing 100 is provided with a heat dissipation duct. When installed on the first circuit board 200, the OAM modules 300 are arranged in rows perpendicular to the wind direction of the heat dissipation duct, forming at least one row of OAM row groups 301. The circuit layer provided on the first circuit board 200 electrically connects each OAM module 300 in the OAM row group 301. This enables direct connection between each OAM module 300 within the group, meeting the operational connectivity requirements of the OAM modules 300 and improving data transmission efficiency between the OAM modules 300. Furthermore, because the OAM modules 300 in the OAM row group 301 are arranged perpendicular to the wind direction of the heat dissipation duct, at least one row of OAM row groups 301 avoids low-resistance areas in the heat dissipation duct, ensuring that airflow in the heat dissipation duct flows through each OAM module 300.

[0038] In this way, even when a smaller number of OAM modules 300 are used in low computing power demand scenarios, the heat dissipation effect of the heat dissipation duct on the OAM module 300 can still be guaranteed, which is conducive to improving the reliability of heat dissipation and meeting the heat dissipation requirements of the OAM module 300. At the same time, without changing the topology structure, the number of OAM modules 300 can be flexibly selected according to the computing power requirements, and it is flexibly applicable to high computing power scenarios and low computing power scenarios.

[0039] It's important to emphasize that in the field of OAM devices, technicians typically employ a centrally symmetrical layout as a conventional technique for configuring OAM devices. The key reason for this layout is to effectively shorten the routing length of high-speed interconnects between modules and reduce signal routing crossover, thereby simplifying circuit design and reducing routing complexity. This conventional design is advantageous in high-computing scenarios (multi-module deployments) because it optimizes the physical connection topology between modules, ensuring the stability and performance of collaborative computing. However, the present invention's OAM component structure, by arranging OAM modules 300 in rows perpendicular to the direction of the heat dissipation duct to form at least one row of OAM row groups 301, breaks with conventional thinking in the art regarding the layout of OAM devices.

[0040] Specifically, those skilled in the art usually rely on the center-symmetric layout to optimize the topology of module interconnection, but ignore the heat dissipation defects in low computing power scenarios, such as when only a single group of modules is used. The OAM devices in the same group will be arranged in a center-symmetric layout with one point as the center, forming a square or approximately square grouping area, so that the grouping area will be set in a left-right partitioning manner, such as Figure 5 As shown, Figure 5 OAM devices 0 to 3 form a group in a centrally symmetrical layout and are located in the left partition, while OAM devices 4 to 7 form another group in a centrally symmetrical layout and are located in the right partition. When there is only a single group of OAM devices, one of the left and right partitions is missing, such as the missing left partition of OAM devices 0 to 3 or the missing right partition of OAM devices 4 to 7. The missing partition will create a corresponding low-resistance area in the heat dissipation duct, causing the airflow to flow mainly through the low-resistance area. For example, if OAM devices 4 to 7 are missing, the heat dissipation airflow will mostly flow through the right area where OAM devices 4 to 7 were originally located. Figure 6 As shown, this reduces heat dissipation efficiency. Therefore, a topological structure with a centrally symmetrical layout requires both left and right partitions to ensure that the cooling airflow effectively flows through the OAM devices to meet the heat dissipation requirements. As a result, in low-computing scenarios, even if a large number of OAM devices are not needed to provide computing power, an excessive number of OAM devices are still required to meet the heat dissipation requirements, resulting in higher application costs and a correspondingly higher heat dissipation power requirement.

[0041] The present invention addresses the problems existing in the above-mentioned low computing power scenario by arranging the OAM module 300 in a direction perpendicular to the wind direction of the heat dissipation duct, breaking the conventional thinking in the field of OAM equipment and avoiding the formation of low wind resistance areas. Figure 1 As shown, Figure 1 The OAM modules 300 numbered 0 to 3 form an OAM row group 301, which is combined with Figure 2By forming an OAM row group 301, it is possible to avoid the formation of a low-resistance area of the heat dissipation duct due to the absence of the OAM module 300. This not only maintains the requirement of direct interconnection between the OAM modules 300 in the same group, but also achieves additional technical effects: in low computing power scenarios, there is no need to set up too many OAM modules 300, which can improve the reliability of the heat dissipation duct through heat dissipation, ensure the working stability of the OAM module 300, and also reduce the heat dissipation energy consumption accordingly. At the same time, it can flexibly adapt to scenarios with different computing power requirements without changing the topology structure.

[0042] In some embodiments of the present invention, the first circuit board 200 may be provided with a first connector connected to the circuit layer, and the OAM module 300 may include a second connector. The first connector and the second connector are connected to connect the OAM module 300 to the circuit layer. In some embodiments, the first connector and the second connector may be mezzanine connectors.

[0043] It is understood that multiple first connectors are provided on the first circuit board 200, and they are also arranged in rows perpendicular to the airflow direction of the heat dissipation duct, corresponding to the arrangement of the OAM modules 300. The number of OAM modules 300 is at least sufficient to form an OAM row group 301. The required number of OAM modules 300 is provided based on the requirements of low-computing power and high-computing power scenarios. In application, it is not necessary for each first connector to be connected to an OAM module 300; some first connectors may be empty.

[0044] In some embodiments of the present invention, the first circuit board 200 may also be provided with implementations of functional modules such as a power module and a connection port module to realize functions such as powering the OAM module 300 and connecting with external devices.

[0045] refer to Figure 2 In some embodiments of an OAM component structure provided by the present invention, adjacent OAM modules 300 in the OAM row group 301 are arranged close to each other and gaps are left between adjacent OAM modules 300, and the width of the heat dissipation duct formed by the shell 100 matches the width of the OAM row group 301.

[0046] Within an OAM row group 301, or the same group of OAM modules 300, adjacent OAM modules 300 are positioned closely together with gaps between them. The width of the heat dissipation duct formed by the housing 100 matches the width of the OAM row group 301. This means that the overall width of the OAM modules 300 in the same group matches the width of the heat dissipation duct. This maximizes the heat dissipation of the heat dissipation duct, further reduces the area of low wind resistance, and optimizes the heat dissipation of the airflow within the heat dissipation duct. The close proximity of adjacent OAM modules 300 maximizes the heat exchange surface area of the heat dissipation duct and ensures that the heat dissipation airflow evenly covers the entire duct cross-section. This facilitates uniform flow of heat dissipation through the OAM modules 300, achieving efficient and uniform heat exchange, improving heat dissipation efficiency, and ensuring consistent cooling across each OAM module 300 within the OAM row group 301.

[0047] It should be noted that the gaps between adjacent OAM modules 300 are negligible compared to the cross-sectional area of the heat dissipation duct. Therefore, even if the wind resistance of the gaps is small, they will not substantially affect the heat dissipation effect of the airflow in the heat dissipation duct. Furthermore, the OAM modules 300 include a heat sink 320, and gaps are formed between the heat dissipation fins of the heat sink for the heat dissipation airflow to flow through, facilitating the heat dissipation of the heat dissipation airflow from the heat dissipation fins. The width of the gaps between the heat dissipation fins is not significantly different from the width of the gaps between the OAM modules 300. In some embodiments, the widths of the gaps can be of the same order of magnitude. Therefore, the gaps between the OAM modules 300 do not substantially affect the heat dissipation effect of the heat dissipation duct.

[0048] It is understandable that leaving gaps between OAM modules 300 in the same group also facilitates the installation and disassembly of the OAM modules 300, and also provides physical redundant space for thermal expansion of the OAM modules 300, thereby avoiding extrusion damage caused by thermal expansion deformation under high-temperature working conditions.

[0049] refer to Figure 1 and Figure 2 In some embodiments of an OAM component structure provided by the present invention, the OAM row group 301 has at least two rows, and at least one OAM module 300 in one of two adjacent rows of the OAM row group 301 is electrically connected to the OAM module 300 in the other row through the circuit layer.

[0050] When there are at least two rows of OAM row groups 301, at least one OAM module 300 in two adjacent rows of OAM row groups 301 is directly electrically connected to an OAM module 300 in another row via a circuit layer. This allows the OAM modules 300 in the OAM row group 301 to perform cross-row data transmission with the OAM modules 300 in the other row, thereby improving data transmission efficiency.

[0051] It can be understood that in an embodiment in which multiple first connectors are provided on the first circuit board 200, the connection relationship between the circuit layer and each first connector is set to set the OAM module 300. When applied, the second connector of the OAM module 300 is connected to the first connector of the first circuit board 200 to achieve the required connection relationship of the OAM module 300.

[0052] It should be noted that in an OAM device, the OAM module 300 connects to the processor for data exchange. OAM modules 300 that are not directly connected can exchange data indirectly through the processor or other OAM modules 300. However, indirect data exchange through the processor and OAM module 300 results in relatively large latency, which in turn affects the processing rate of the OAM module 300. Therefore, enabling direct cross-group connection of OAM modules 300 helps improve data exchange efficiency and processing rate.

[0053] refer to Figure 1 and Figure 2 In some embodiments of an OAM component structure provided by the present invention, the OAM modules 300 in adjacent OAM row groups 301 are arranged in aligned columns, and the two OAM modules 300 in the same column in two adjacent rows of the OAM row groups 301 are electrically connected through the circuit layer.

[0054] The OAM modules 300 in each row of the OAM row group 301 are aligned and arranged to form a row and column arrangement structure. Adjacent OAM modules 300 in the same column are electrically connected through the circuit layer, that is, adjacent OAM modules 300 in the same column are directly connected, which is conducive to further improving the efficiency of data exchange across row groups.

[0055] refer to Figure 1 and Figure 3 In some embodiments of the OAM component structure provided by the present invention, there are four OAM modules 300 , and the four OAM modules 300 are arranged as a row of the OAM row group 301 .

[0056] In some embodiments of the present invention, four OAM modules 300 are grouped together and arranged in a row to form an OAM row group 301. Even when there is only one group of OAM modules 300, heat dissipation can still be achieved without the need to set up two or more groups of OAM modules 300, thereby adapting to application scenarios with low computing power requirements.

[0057] refer to Figure 1 and Figure 2 In some embodiments of the OAM component structure provided by the present invention, there are eight OAM modules 300 , and every four OAM modules 300 are arranged in a row to form two rows of OAM row groups 301 .

[0058] In some embodiments of the present invention, four OAM modules 300 are grouped together and arranged in a row to form an OAM row group 301, and eight OAM modules 300 form two rows of OAM row groups 301. OAM modules 300 can be added to the four OAM modules without changing the original topology to meet application scenarios with high computing power requirements.

[0059] It should be noted that when there are multiple rows of OAM row groups 301, the heat dissipation power can be increased, such as by increasing the power of the heat dissipation fan, so as to increase the flow rate of the heat dissipation duct to meet the heat dissipation requirements of multiple rows of OAM row groups 301. Correspondingly, when there is only a single row of OAM row groups 301, the heat dissipation power can also be appropriately reduced.

[0060] refer to Figures 2 to 4 In some embodiments of an OAM component structure provided by the present invention, the OAM module 300 includes a base plate assembly 310, a computing power chip, a radiator 320 and a protective shell 330. The computing power chip is arranged on the base plate assembly 310. The radiator 320 is connected to the base plate assembly 310 so that the radiator 320 and the computing power chip are fitted together. The protective shell 330 is covered outside the radiator 320. The protective shell 330 is provided with a front air outlet and a rear air outlet exposing the radiator 320. The relative positions of the front air outlet and the rear air outlet are set along the wind direction of the heat dissipation air duct.

[0061] In the OAM module 300, the heat sink 320 is connected to the baseplate assembly 310, allowing it to adhere to the computing chip to absorb and dissipate heat generated by the computing chip during operation. A protective shell 330 is provided over the heat sink 320 to protect it from damage. The shell 330 also features front and rear air vents aligned with the cooling air duct to prevent it from interfering with the airflow. This effectively protects the heat sink 320 without compromising heat dissipation, further enhancing the overall reliability of the OAM module 300.

[0062] In some embodiments of the present invention, the base plate assembly 310 may include a second circuit board and a structural reinforcement plate. The computing power chip is arranged on the circuit board. The second circuit board is provided with a second connector electrically connected to the computing power chip. The structural reinforcement plate is connected to the circuit board to enhance the structural strength. The radiator 320 is connected to the circuit board and / or the structural reinforcement plate.

[0063] refer to Figures 2 to 4 In some embodiments of the OAM component structure provided by the present invention, the protective shell 330 is provided with a grabbing portion, and the grabbing portion is provided with a handle 331.

[0064] In order to improve the space utilization efficiency and the utilization rate of the cross-sectional area of the heat dissipation duct, adjacent OAM modules 300 need to be set close to each other. By providing a grabbing portion on the protective shell 330 and a handle 331 on the grabbing portion, it is convenient to apply force to grab the OAM module 300 for moving, plugging, unplugging, etc. during installation or disassembly, which is conducive to adapting the structure of the close arrangement between the OAM modules 300 and making the use and operation more convenient.

[0065] In some embodiments of the present invention, the protective shell 330 can be made of metal or other embodiments. On the premise that the front and rear air outlets of the protective shell 330 do not affect the heat dissipation of the radiator 320, the side surface of the top surface of the protective shell 330 can increase the contact area with the heat dissipation airflow. The protective shell 330 cover is arranged outside the radiator 320, which can increase the heat exchange efficiency of the radiator 320, which is conducive to further improving the heat dissipation effect; the handle 331 can be made of plastic, rubber or other embodiments to increase the friction when grasping and facilitate grasping.

[0066] refer to Figure 2 In some embodiments of an OAM component structure provided by the present invention, a fan module is further included. The housing 100 includes a bottom plate 110, a top plate, a left plate 120, a right plate 130, a front plate and a back plate 140. The bottom plate 110, the top plate, the left plate 120, the right plate 130, the front plate and the back plate 140 together form a cavity for accommodating the first circuit board 200 and the OAM module 300. The fan module is arranged on the front plate, and the back plate 140 is provided with a heat dissipation hole group 141. The heat dissipation duct is formed between the fan module and the heat dissipation hole group 141.

[0067] The housing 100 includes a bottom plate 110, a top plate, a left plate 120, a right plate 130, a front plate, and a back plate 140, which enclose a cavity. The first circuit board 200 and the OAM module 300 are located within the cavity. A fan module is installed on the front plate to draw external air from the front plate into the cavity, forming a wind flow. After passing through the OAM module 300, the air flow is exhausted through the heat dissipation hole group 141 on the back plate 140, forming a heat dissipation duct between the fan module and the heat dissipation hole group 141. This structure creates a simple heat dissipation duct that is easy to implement and apply.

[0068] It should be noted that, in order to conveniently display the internal OAM module 300 arrangement structure, Figure 2 The front plate and top plate of the middle housing are not shown, and the fan module is also not shown.

[0069] The width of the heat dissipation duct formed by the housing 100 can be considered the distance between the left side panel 120 and the right side panel 130. In some embodiments of the present invention, the inner spacing between the left side panel 120 and the right side panel 130 of the housing 100 is configured to match the total width tolerance of the OAM row group 301, for example, a gap of less than or equal to 5mm, to ensure that the heat dissipation duct width matches the width of the OAM row group 301 and the gap between the sidewall forming the heat dissipation duct and the outermost OAM module 300 is within the designed range. Furthermore, the side surface of the protective shell 330 of the OAM module 300 can be designed as a flat surface or a diverting slope to conform to the shape of the inner wall of the duct.

[0070] refer to Figure 2 In some embodiments of an OAM component structure provided by the present invention, the shell 100 further includes a reinforcing rod 101 , one end of the reinforcing rod 101 is connected to the left side plate 120 , and the other end of the reinforcing rod 101 is connected to the right side plate 130 .

[0071] By connecting reinforcing rods 101 to the side panels on both sides, that is, one end of the reinforcing rod 101 is connected to the left side panel 120 and the other end of the reinforcing rod 101 is connected to the right side panel 130, the reinforcing rod 101 makes the structure enclosed by the bottom panel 110, the top panel, the left side panel 120, the right side panel 130, the front panel and the back panel 140 more stable, which is beneficial to improving the reliability of the structure.

[0072] An OAM device provided by the present invention is described below. The OAM device described below and the OAM component structure described above can refer to each other.

[0073] refer to Figures 1 to 4 The present invention also provides an OAM device, including the above-mentioned OAM component structure.

[0074] In the OAM device, the housing 100 is provided with a heat dissipation duct. When installed on the first circuit board 200, the OAM modules 300 are arranged in rows perpendicular to the wind direction of the heat dissipation duct, forming at least one row of OAM row groups 301. The first circuit board 200 is provided with a wiring layer, which electrically connects each OAM module 300 in the OAM row group 301. This enables direct connection between each OAM module 300 within the group, meeting the operational connectivity requirements of the OAM modules 300 and improving data transmission efficiency between the OAM modules 300. Furthermore, because the OAM modules 300 in the OAM row group 301 are arranged perpendicular to the wind direction of the heat dissipation duct, at least one row of OAM row groups 301 avoids low-resistance areas in the heat dissipation duct, ensuring that airflow in the heat dissipation duct flows through each OAM module 300.

[0075] In this way, even if the OAM device is applied to a low computing power requirement scenario and a smaller number of OAM modules 300 are used, the heat dissipation effect of the heat dissipation duct on the OAM module 300 can still be guaranteed, which is conducive to improving the reliability of heat dissipation and meeting the heat dissipation requirements of the OAM module 300. At the same time, without changing the topology structure, the number of OAM modules 300 can be flexibly selected according to the computing power requirements, and it is flexibly applicable to high computing power scenarios and low computing power scenarios.

[0076] It is understandable that in the initial low computing power application scenario, a smaller number of OAM modules 300 are set in the OAM device. As the computing power demand increases, OAM modules 300 can be added to the OAM device to meet the growing computing power demand without the need for overall replacement, which is conducive to flexible adaptation to changes in computing power demand.

[0077] In some embodiments of the present invention, the OAM device may be implemented as an artificial intelligence server, a computing center server, etc.

[0078] In some embodiments of the present invention, an OAM device may include a plurality of the above-mentioned OAM component structures.

[0079] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0080] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An OAM component structure, characterized in that: include: The housing (100) is provided with a heat dissipation duct; A first circuit board (200) is arranged in the housing (100), and a circuit layer is provided on the first circuit board (200); The OAM modules (300) are arranged on the first circuit board (200), and there are at least three OAM modules (300). The OAM modules (300) are arranged row by row along a direction perpendicular to the wind direction of the heat dissipation air duct and form at least one row of OAM row groups (301). The circuit layer is connected to the OAM modules (300) so that the OAM modules (300) in the same OAM row group (301) are electrically connected to each other.

2. An OAM component structure according to claim 1, characterized in that: Adjacent OAM modules (300) in the OAM row group (301) are arranged close to each other and gaps are left between adjacent OAM modules (300). The width of the heat dissipation duct formed by the housing (100) matches the width of the OAM row group (301).

3. An OAM component structure according to claim 1 or 2, characterized in that: The OAM row group (301) has at least two rows, and at least one OAM module (300) in one of two adjacent rows of the OAM row group (301) is electrically connected to the OAM module (300) in the other row through the circuit layer.

4. An OAM component structure according to claim 3, characterized in that: The OAM modules (300) in adjacent OAM row groups (301) are aligned and arranged in columns, and the two OAM modules (300) in the same column in two adjacent rows of the OAM row groups (301) are electrically connected through the circuit layer.

5. An OAM component structure according to claim 1 or 2, characterized in that: There are four OAM modules (300), and the four OAM modules (300) are arranged in a row of the OAM row group (301); Alternatively, there are eight OAM modules (300), and every four OAM modules (300) are arranged in a row to form two rows of OAM row groups (301).

6. An OAM component structure according to claim 1, characterized in that: The OAM module (300) includes a base plate assembly (310), a computing power chip, a radiator (320) and a protective shell (330), wherein the computing power chip is arranged on the base plate assembly (310), the radiator (320) is connected to the base plate assembly (310) so that the radiator (320) and the computing power chip are attached to each other, and the protective shell (330) is covered outside the radiator (320), and the protective shell (330) is provided with a front air outlet and a rear air outlet for exposing the radiator (320), and the relative positions of the front air outlet and the rear air outlet are arranged along the wind direction of the heat dissipation air duct.

7. An OAM component structure according to claim 6, characterized in that: The protective shell (330) is provided with a gripping portion, and the gripping portion is provided with a handle (331).

8. The OAM component structure according to claim 1, characterized in that: The housing (100) further comprises a fan module. The housing (100) comprises a bottom plate (110), a top plate, a left side plate (120), a right side plate (130), a front plate and a back plate (140). The bottom plate (110), the top plate, the left side plate (120), the right side plate (130), the front plate and the back plate (140) are enclosed to form a cavity for accommodating the first circuit board (200) and the OAM module (300). The fan module is arranged on the front plate. The back plate (140) is provided with a heat dissipation hole group (141). The heat dissipation duct is formed between the fan module and the heat dissipation hole group (141).

9. An OAM component structure according to claim 8, characterized in that: The housing (100) further comprises a reinforcing rod (101), one end of the reinforcing rod (101) being connected to the left side plate (120), and the other end of the reinforcing rod (101) being connected to the right side plate (130).

10. An OAM device, characterized in that: The invention comprises an OAM component structure according to any one of claims 1 to 9.

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