Monocrystalline silicon slicing wastewater treatment system

Abstract

The utility model relates to the field of silicon wafer production, in particular to a monocrystalline silicon slicing wastewater treatment system. The system comprises an adjusting tank, the adjusting tank is communicated with a slicing machine to collect slicing wastewater, the adjusting tank is communicated with a cyclone separation device, the cyclone separation device is communicated with a filtering device, clear liquid separated by the cyclone separation device is introduced into the filtering device, and turbid liquid separated by the cyclone separation device is introduced into a waste liquid deep treatment system; the filtering device is communicated with the sterilizing device, the sterilizing device is communicated with the blending water tank, and the blending water tank is communicated with the silicon wafer degumming machine. According to the system, wastewater generated by the slicing machine is introduced into the adjusting tank for sedimentation and then is separated through the cyclone separation device, clear liquid is filtered and disinfected and then stored into the blending water tank for degumming of the silicon wafer degumming machine, and turbid liquid is introduced into the waste liquid deep treatment system for treatment. The system treats waste water generated by slicing to protect the environment, and meanwhile, the treated water is reutilized for degumming of the degumming machine, so that water resources can be saved.

Description

Technical Field

[0001] The utility model relates to the field of silicon slice production, in particular to a single crystal silicon slice wastewater treatment system. Background Art

[0002] Slicing single crystal silicon rods is a key step in the semiconductor manufacturing process. It involves cutting single crystal silicon rods into thin slices, which are called silicon wafers or wafers. These silicon wafers are the basic materials for manufacturing integrated circuits (ICs), solar cells and other semiconductor devices. After the single crystal silicon rods are sliced by the slicer, they need to be debonded. The debonding process is to remove the adhesive used in the slicing process. These adhesives are usually resins or other organic substances. They are used to fix the silicon wafers during the slicing process to prevent the silicon wafers from cracking or deforming during the cutting process. The debonding process is an important step in the silicon wafer manufacturing process because it directly affects the quality of the silicon wafers and the smooth progress of subsequent processing steps.

[0003] However, the above-mentioned slicing and degumming processes require the use of a large amount of pollution-free water, which makes the water cost very high. In addition, a large amount of wastewater is generated during slicing. If the wastewater is not treated in time, it will cause environmental pollution. Utility Model Content

[0004] In order to overcome the above problems, the present invention provides a single crystal silicon slicing wastewater treatment system. The technical solutions adopted by the present invention to solve the technical problems are as follows:

[0005] A single crystal silicon slicing wastewater treatment system includes a regulating tank, which is connected to a slicer to collect slicing wastewater, the regulating tank is connected to a cyclone separator, the cyclone separator is connected to a filter, the clear liquid separated by the cyclone separator is passed into the filter, and the separated turbid liquid is passed into a waste liquid deep treatment system; the filter is connected to a disinfection device, the disinfection device is connected to a mixing water tank, and the mixing water tank is connected to a silicon wafer degumming machine.

[0006] Furthermore, the regulating tank is connected to a dosing device, and the dosing device introduces a sedimentation agent into the regulating tank to precipitate impurities in the wastewater.

[0007] Furthermore, a degumming agent is added into the mixing water tank.

[0008] Furthermore, the waste liquid deep treatment system includes a plate and frame filter press and a sewage treatment station. The plate and frame filter press is connected to the cyclone separation device, and the sewage treatment station is connected to the plate and frame filter press. The turbid liquid separated by the cyclone separation device is passed into the plate and frame filter press to press out mud cake and waste liquid. The mud cake is recycled and the waste liquid is passed into the sewage treatment station.

[0009] Furthermore, the waste liquid deep treatment system also includes an electrochemical device. The plate and frame filter press is connected to the sewage treatment station through the electrochemical device. The waste liquid generated by the plate and frame filter press is first passed into the electrochemical device for treatment and then into the sewage treatment station.

[0010] Furthermore, the electrochemical device processes the waste liquid to generate sludge, which is passed into a plate and frame filter press for circulation treatment.

[0011] Furthermore, the silicon wafer degumming machine is connected to the plate and frame filter press, and the degumming wastewater generated by the silicon wafer degumming machine is passed into the plate and frame filter press.

[0012] The beneficial effects of the utility model are:

[0013] The system includes a regulating tank, which is connected to the slicer to collect slicing wastewater. The regulating tank is connected to a cyclone separator, which is connected to a filter. The clear liquid separated by the cyclone separator is passed to the filter, and the separated turbid liquid is passed to a waste liquid deep treatment system. The filter is connected to a disinfection device, which is connected to a water mixing tank, which is connected to a silicon wafer degumming machine. This system passes the wastewater generated by the slicer into the regulating tank for sedimentation, and then separates it through the cyclone separator. The clear liquid is filtered and disinfected, and then stored in the water mixing tank for use in the silicon wafer degumming machine. The turbid liquid is passed to the waste liquid deep treatment system for treatment. While treating the wastewater generated by slicing to protect the environment, the system also reuses the treated water for degumming in the degumming machine, saving water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, wherein:

[0015] Figure 1 This is a flow chart of the system.

[0016] Figure number mark:

[0017] 100. Equalization tank; 101. Slicer; 102. Cyclone separator; 103. Filter; 104. Disinfection device; 105. Mixing water tank; 106. Wafer degumming machine; 107. Dosing device;

[0018] 200. Plate and frame filter press; 201. Sewage treatment plant; 202. Electrochemical device. DETAILED DESCRIPTION

[0019] In order to better understand the purpose, structure and function of the present invention, the following is a further detailed description of the specific embodiment of the present invention "a single crystal silicon slicing wastewater treatment system" in conjunction with the accompanying drawings.

[0020] See also Figure 1In this embodiment, the system includes a regulating tank 100, which is connected to a slicer 101 to collect slicing wastewater. A sedimentation agent (preferably polyferric sulfate) is added to the regulating tank 100 that collects the slicing wastewater. The sedimentation agent reacts with the slicing wastewater to form sediment. The regulating tank 100 is connected to a cyclone separator 102, and the slicing wastewater after the reaction is passed into the cyclone separator 102 for separation to separate the clear liquid and the turbid liquid; the cyclone separator 102 is connected to a filter 103, and the cyclone separator The clear liquid separated by separation device 102 is passed to filtration device 103 for filtration, and the separated turbid liquid is passed to the waste liquid advanced treatment system for harmless treatment and resource recovery. Filter device 103 is connected to disinfection device 104, and the filtered clear liquid is passed to disinfection device 104 for disinfection. Disinfection device 104 is connected to water tank 105, and the disinfected clear liquid is stored in water tank 105. Water tank 105 is connected to silicon wafer degumming machine 106, and the stored treated clear liquid is used for degumming in silicon wafer degumming machine 106. This system not only treats single crystal silicon slicing wastewater, but also reuses the treated clear liquid for degumming in silicon wafer degumming machine 106, which is environmentally friendly and saves water resources.

[0021] More specifically, in this embodiment, the regulating tank 100 is connected to the dosing device 107, which introduces a sedimentation agent into the regulating tank 100. The dosing device 107 can accurately control the amount of the sedimentation agent according to the amount of wastewater in the regulating tank 100. Of course, in other embodiments, the dosing device 107 can be omitted and manual addition can be performed. As long as the optimal sedimentation effect can be achieved, the addition method is not limited.

[0022] Furthermore, in this embodiment, in order to make the treated clean water stored in the water tank 105 better for degumming in the silicon wafer degumming machine 106 , a degumming agent is added into the water tank 105 .

[0023] See further Figure 1 In this embodiment, the waste liquid deep treatment system includes a plate and frame filter press 200 and a sewage treatment station 201. The plate and frame filter press 200 is connected to the cyclone separation device 102, and the sewage treatment station 201 is connected to the plate and frame filter press 200. The turbid liquid separated by the cyclone separation device 102 is passed into the plate and frame filter press 200 to press out the mud cake and separate the waste liquid. The mud cake is processed as a resource, and the waste liquid is passed into the sewage treatment station 201 for harmless treatment.

[0024] Furthermore, in this embodiment, the waste liquid deep treatment system also includes an electrochemical device 202. The plate and frame filter press 200 is connected to the sewage treatment station 201 through the electrochemical device 202. The waste liquid generated by the plate and frame filter press 200 is first passed into the electrochemical device 202 for treatment, and then passed into the sewage treatment station 201; after treatment by the electrochemical device 202, part of the organic matter is oxidized and removed, and the heavy metal ions are precipitated near the cathode and removed from the water, which facilitates the subsequent harmless treatment of the waste liquid by the sewage treatment station 201.

[0025] It should be noted that, in this embodiment, the plate and frame filter press 200 is directly connected to the sewage treatment station 201 through a branch, and there is another branch that is first connected to the electrochemical device 202 and then to the sewage treatment station 201. Solenoid valves are set to control the on and off of the two branches. By analyzing the amount of heavy metals in the waste liquid, it is determined which branch to take to achieve optimal treatment.

[0026] At the same time, in this embodiment, the electrochemical device 202 has another branch line back to the plate and frame filter press 200. The electrochemical device 202 processes waste liquid to generate dirt, and the dirt is returned to the plate and frame filter press 200 through this branch line for circulation treatment.

[0027] More specifically, in this embodiment, the silicon wafer degumming machine 106 is connected to the plate and frame filter press 200, and the degumming wastewater generated by the silicon wafer degumming machine 106 is passed into the plate and frame filter press 200 for deep treatment of the wastewater.

[0028] It is understood that the present invention is described by way of certain embodiments, and those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. Furthermore, under the guidance of the present invention, these features and embodiments may be modified to suit specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

Claims

1. A single crystal silicon slicing wastewater treatment system, characterized in that: The invention comprises a regulating tank (100), wherein the regulating tank (100) is connected to a slicer (101) to collect slicing wastewater, the regulating tank (100) is connected to a cyclone separation device (102), the cyclone separation device (102) is connected to a filtering device (103), the clear liquid separated by the cyclone separation device (102) is passed into the filtering device (103), and the turbid liquid separated is passed into a waste liquid deep treatment system; the filtering device (103) is connected to a disinfection device (104), the disinfection device (104) is connected to a mixing water tank (105), and the mixing water tank (105) is connected to a silicon wafer degumming machine (106).

2. A single crystal silicon slicing wastewater treatment system according to claim 1, characterized in that: The regulating tank (100) is connected to a dosing device (107), and the dosing device (107) introduces a sedimentation agent into the regulating tank (100) to precipitate impurities in the wastewater.

3. A single crystal silicon slicing wastewater treatment system according to claim 2, characterized in that: Degumming agent is added into the mixing water tank (105).

4. A single crystal silicon slicing wastewater treatment system according to any one of claims 1 to 3, characterized in that: The waste liquid deep treatment system comprises a plate-frame filter press (200) and a sewage treatment station (201); the plate-frame filter press (200) is connected to the cyclone separation device (102); the sewage treatment station (201) is connected to the plate-frame filter press (200); the turbid liquid separated by the cyclone separation device (102) is passed into the plate-frame filter press (200) to press out mud cake and waste liquid; the mud cake is recycled, and the waste liquid is passed into the sewage treatment station (201).

5. A single crystal silicon slicing wastewater treatment system according to claim 4, characterized in that: The waste liquid deep treatment system further comprises an electrochemical device (202); the plate and frame filter press (200) is connected to the sewage treatment station (201) via the electrochemical device (202); the waste liquid generated by the plate and frame filter press (200) is first passed into the electrochemical device (202) for treatment, and then passed into the sewage treatment station (201).

6. A single crystal silicon slicing wastewater treatment system according to claim 5, characterized in that: The electrochemical device (202) processes waste liquid to generate sludge, and the sludge is passed into the plate and frame filter press (200) for circulation treatment.

7. A single crystal silicon slicing wastewater treatment system according to claim 6, characterized in that: The silicon wafer degumming machine (106) is connected to the plate-frame filter press (200), and the degumming wastewater generated by the silicon wafer degumming machine (106) is passed into the plate-frame filter press (200).

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