Ultrathin measuring microphone

Abstract

The utility model provides an ultrathin measuring microphone which converts sound signals into electric signals through vibration of a diaphragm under the action of sound waves. According to the utility model, the assembly mode of the ultrathin measurement microphone is unified into the assembly of each component, and the ultrathin measurement microphone comprises a bottom cover, a PCB, an adapter ring, an outer locking ring, an inner locking ring, an insulating sheet, a back plate, a gasket, a sound head shell, a vibrating diaphragm, a diaphragm ring and an upper cover. According to the ultrathin measuring microphone provided by the utility model, improvement is carried out on the basis of a traditional measuring microphone manufacturing method, the sound head and the PCB are welded through the adapter ring, a traditional probe connection mode is replaced, the volume of the microphone is greatly reduced, and the thickness of the microphone is reduced. The device is small in size and convenient to install, can be applied to wind tunnel noise testing, automobile and airplane surface noise testing and other scenes, and can be fixed to the surface of an automobile or an airplane in an adhesive mode, so that no damage or influence is caused to a tested object.

Description

Technical Field

[0001] The utility model relates to the technical field of measuring microphones, in particular to an ultra-thin measuring microphone. Background Art

[0002] Cars and airplanes have become a frequently used mode of transportation for daily commutes. Noise is an aerodynamic issue that must be addressed during the development phase of these vehicles and aircraft. Severe noise can cause discomfort, such as fatigue in passengers and drivers, increased heart rate, and blood pressure. It can also cause instability and reduced sensitivity in equipment and instruments within vehicles and aircraft due to internal noise and vibration. As the comfort of cars and aircraft continues to improve, noise is receiving increasing attention from the industry. Understanding noise sources and collecting noise data are fundamental to noise reduction research in these industries.

[0003] The main factors affecting automobile exterior noise include engine noise, tire noise, turbulence noise (surface noise), and body structure noise. The main factors affecting aircraft exterior noise include powertrain noise, turbulence noise (surface noise), and other noise. With the better control of engine noise, tire noise, and body structure noise in automobiles, and powertrain noise and other noise in aircraft, turbulence noise from high-speed vehicles and aircraft has become a major noise source, attracting extensive research. This research focuses on measuring the exterior surface noise of automobiles and aircraft to provide data and input for in-vehicle and in-cabin noise assessment models, providing a basis for structural vibration and noise reduction designs, and improving passenger comfort.

[0004] Existing measurement microphones are large in size and will form a bulge on the surface of the object being measured. The airflow above the microphone will form a vortex flow, and the noise generated by the vortex flow is much greater than the surface noise. To reduce the impact of the vortex flow, the microphone can be embedded in the surface being measured, but this will damage the structure of the object being measured. Utility Model Content

[0005] In order to overcome the defects of the above-mentioned technology, the utility model proposes an ultra-thin measurement microphone, which includes a bottom cover, a PCB, an adapter ring, an outer locking ring, an inner locking ring, an insulating sheet, a back plate, a gasket, a sound head shell, a diaphragm, a membrane ring and an upper cover. The insulating sheet, back plate and inner locking ring constitute a back plate group, and the gasket, back plate group, outer locking ring, diaphragm, membrane ring and sound head shell constitute a sound head. The sound head is connected to the PCB through an adapter ring, and the connection structure between the sound head and the PCB is located inside the bottom cover. The upper cover is buckled with the bottom cover, and a sealing layer is provided between the joint surfaces of the upper cover and the bottom cover to form an ultra-thin surface microphone.

[0006] Preferably, the insulating sheet is sleeved on the outer surface of the back plate cylinder, and then the inner locking ring cooperates with the back plate cylinder thread to form a locking structure to form a back plate assembly;

[0007] Preferably, the gasket is arranged between the back plate group and the inner wall of the sound head shell, the outer locking ring and the sound head shell are threadedly matched to form an axial compression structure, and the upper surface of the back plate group is flush with the upper end surface of the sound head shell, forming a sound head shell group;

[0008] Preferably, the diaphragm is fixed on the inner platform of the membrane ring, and the membrane ring is connected to the sound head shell assembly through a threaded structure to form a sound head, and a capacitor structure with a variable spacing is formed between the diaphragm and the back plate;

[0009] Preferably, the adapter ring is fixed to the center of the upper surface of the PCB, and the adapter ring is connected to the sound head housing through a threaded structure, so that the sound head is fixedly connected to the PCB;

[0010] Preferably, components are arranged on the PCB, and the PCB is fixed inside the bottom cover;

[0011] Preferably, a voltage equalizing hole is dug on the PCB.

[0012] This utility model proposes an ultra-thin measurement microphone. When sound waves act on the diaphragm, the change in capacitance caused by the change in the distance between the diaphragm and the back plate when the diaphragm vibrates converts the sound signal into an electrical signal. The beneficial effects of this utility model are:

[0013] 1. Soldering the microphone capsule and PCB through an adapter ring replaces the traditional probe connection method, greatly reducing the size and thickness of the microphone, and minimizing the impact of the ultra-thin measurement microphone itself on the test results.

[0014] 2. Easy to install, it can be fixed on the surface of a car or aircraft by gluing, so it will not cause any damage or impact on the object being measured. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a cross-sectional structural diagram of an ultra-thin measurement microphone of the present utility model;

[0016] Figure 2 This is an enlarged view of the PCB of an ultra-thin measurement microphone of the present invention;

[0017] Figure 3 The figure is a schematic diagram of the appearance of an ultra-thin measurement microphone of the present utility model. DETAILED DESCRIPTION

[0018] The following is a specific implementation of the present invention and, in conjunction with the accompanying drawings, further describes the technical solution of the present invention, but the present invention is not limited to this implementation.

[0019] like Figure 1As shown, the ultra-thin measurement microphone of the present invention includes: a bottom cover 1, a PCB 2, an adapter ring 3, an outer locking ring 4, an inner locking ring 5, an insulating sheet 6, a back plate 7, a gasket 8, a sound head housing 9, a diaphragm ring 10, a diaphragm 11, and an upper cover 12. These components are sequentially installed between the bottom cover 1 and the upper cover 12 to form a complete ultra-thin measurement microphone. The installation sequence is as follows:

[0020] First, the insulating sheet 6 is annular with a circular hole in the center. The insulating sheet 6 is put on the cylinder of the back plate 7. The cylindrical surface of the back plate 7 has threads. The inner locking ring 5 is put on this cylinder and tightened to assemble into a back plate group. The inner locking ring 5 and the insulating sheet 6 have no front and back sides. The upper surface of the insulating sheet 6 is flush with the lower surface of the back plate 7, and the lower surface of the insulating sheet 6 is flush with the inner locking ring 5.

[0021] Furthermore, since the gasket 8 is an annular structure and the diameter of its central circular hole is larger than the diameter of the upper surface of the back plate 7, the gasket 8 and the back plate group are placed in the sound head shell 9, wherein the gasket 8 and the inner platform of the sound head shell 9 are flush, the circular plane of the back plate 7 is oriented in the same direction as the central circular hole of the sound head shell 9, and the inner wall of the sound head shell 9 is threaded. The outer locking ring 4 is inserted into the interior of the sound head shell 9 and locked to assemble into a sound head shell group, wherein the outer locking ring 4 and the inner locking ring 5 are flush, and the outer locking ring 4 and the insulating sheet 6 are respectively flush with the inner platform of the sound head shell 9.

[0022] Furthermore, the sound head housing 9 and the back plate assembly are ground flat to ensure that the upper surface of the sound head housing 9 is in the same plane as the upper surface of the back plate 7, with a height difference of 0 mm. At the same time, the height of the sound head housing 9 after grinding is ensured to be within the range of 2.1 mm ± 0.03 mm. Furthermore, the diaphragm 11 is electroplated onto the inner platform of the membrane ring 10. The inner wall of the membrane ring 10 is threaded. The sound head housing assembly is screwed onto the membrane ring 10 to assemble the sound head. The sound head housing 9 is in contact with the inner platform of the membrane ring 10. At this time, there is a certain distance between the diaphragm 11 and the upper surface of the back plate 7. Under the action of sound waves, the diaphragm 11 vibrates, causing the distance between the diaphragm 11 and the back plate 7 to change, thereby causing the capacitance to change, and ultimately converting the sound signal into an electrical signal. Furthermore, the adapter ring 3 is welded to the center of the upper surface of the PCB 2. The outer wall of the adapter ring 3 is threaded. The adapter ring 3 is screwed onto the sound head housing 9 to connect and fix the sound head to the PCB 2. This structure can greatly reduce the thickness of the ultra-thin measurement microphone. After fixing, the components are welded on the PCB 2, wherein the upper surface of the adapter ring 3 is flush with the outer locking ring 4. Then, the PCB 2 is affixed to the bottom cover 1, and the upper cover 12 is covered. The membrane ring 10 is flush with the upper cover 12 and its size is the same as the center circular hole of the upper cover. Figure 2 As shown, a voltage equalizing hole 2a is dug on the PCB 2.

[0023] Finally, the ultra-thin measurement microphone is sealed by sealing glue, and the ultra-thin measurement microphone of the utility model is assembled. Its appearance is as follows: Figure 3 As shown, the thickness is only 2.5 mm, and there is a wire outlet hole 14 on the side of the shell.

[0024] According to the present invention, the ultra-thin measurement microphone assembled by the above assembly method has the following characteristics: Figure 2 In the structure shown, during the assembly process according to the above-mentioned installation sequence, since the adapter ring 3 and the outer locking ring 4 are respectively connected to the sound head shell 9 through threads, and the diameter of the upper surface of the back plate 7 is smaller than the diameter of the upper surface of the sound head shell 9, a gap 13 will naturally form between the diaphragm 11 and the PCB 2 when the various components are assembled.

Claims

1. An ultra-thin measurement microphone, characterized in that: The ultra-thin measurement microphone includes a bottom cover, a PCB, an adapter ring, an outer locking ring, an inner locking ring, an insulating sheet, a back plate, a gasket, a sound head shell, a diaphragm, a diaphragm ring and an upper cover. The insulating sheet, back plate and inner locking ring constitute a back plate group, and the gasket, back plate group, outer locking ring, diaphragm, diaphragm ring and sound head shell constitute a sound head. The sound head is connected to the PCB via an adapter ring, and the connection structure between the sound head and the PCB is located inside the bottom cover. The upper cover is buckled with the bottom cover, and a sealing layer is provided between the joint surfaces of the upper cover and the bottom cover, forming an ultra-thin surface microphone.

2. The ultra-thin measurement microphone according to claim 1, characterized in that: The insulating sheet is sleeved on the cylindrical outer surface of the back plate, and then the inner locking ring cooperates with the cylindrical thread of the back plate to form a locking structure to form a back plate assembly.

3. An ultra-thin measurement microphone according to claim 1 or 2, characterized in that: The gasket is arranged between the back plate group and the inner wall of the sound head shell, the outer locking ring and the sound head shell are threaded together to form an axial compression structure, and the upper surface of the back plate group is flush with the upper end surface of the sound head shell, forming a sound head shell group.

4. The ultra-thin measurement microphone according to claim 1, characterized in that: The diaphragm is fixed on the inner platform of the membrane ring, and the membrane ring is connected to the sound head shell assembly through a threaded structure to form a sound head. A capacitor structure with a variable spacing is formed between the diaphragm and the back plate.

5. The ultra-thin measurement microphone according to claim 1, characterized in that: The adapter ring is fixed to the center of the upper surface of the PCB, and the adapter ring is connected to the sound head housing through a threaded structure, so that the sound head is fixedly connected to the PCB.

6. The ultra-thin measurement microphone according to claim 1, characterized in that: Components are arranged on the PCB, and the PCB is fixed inside the bottom cover.

7. The ultra-thin measurement microphone according to claim 1, characterized in that: A voltage equalizing hole is dug on the PCB.

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