Wafer ink dot printing device

Abstract

The utility model relates to a wafer ink dot printing device, which comprises an operation table, a plurality of ink dots, a plurality of ink dots and a plurality of ink dots, the tray is mounted on the horizontal table top and is used for accommodating a wafer; the two scale bars are respectively arranged on the horizontal table top along an X axis and a Y axis; the ink dot printing assembly is located above the tray and comprises a first pointer, a second pointer and an ink pen, the ink pen is used for printing ink dots on a to-be-marked chip on the wafer, the first pointer and the second pointer are of a middle hollow structure so as to form a first sliding rail and a second sliding rail respectively, the first pointer is parallel to the X axis, the second pointer is parallel to the Y axis, and the first sliding rail and the second sliding rail are arranged in parallel. The first pointer and the second pointer intersect perpendicularly, the ink pen is arranged at the intersection of the first pointer and the second pointer, the first pointer can move along the Y axis and drive the ink pen to move along the second sliding rail, and the second pointer can move along the X axis and drive the ink pen to move along the first sliding rail. The wafer ink dot printing device is simple in structure, low in manufacturing cost and capable of rapidly printing ink dots on chips.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer ink dotting device. Background Art

[0002] Currently, after wafer fabrication, hundreds, even thousands, of unpackaged chips are regularly distributed across the wafer. On wafers that haven't been diced and packaged, probes connect the exposed chips to a tester, allowing them to undergo CP testing. This testing targets every chip on the entire wafer, with the goal of screening out products that meet device characteristics or design specifications. Therefore, after CP testing, the coordinates (X, Y) of the unqualified chips are typically entered into an inkjet printer. This printer then applies ink dots to the unqualified chips, ensuring that only qualified products are tested during subsequent packaging and testing, reducing unnecessary overhead.

[0003] Advanced ink-dumping machines are widely used in mass production. They are expensive, bulky, and have strict requirements for the environment, space, and operators. They also require regular maintenance and consumables, resulting in high operating costs. During the R&D phase, small batches of wafers are often produced intermittently, and both good and defective products require ink-dumping. Conventional ink-dumping machines, as large-scale equipment, face this small-scale, flexible use scenario, but they still require a series of cumbersome and time-consuming preparations, including power-on reset, wafer feeding, position detection, and coordinate entry. Furthermore, the ink-dumping requirements and execution come from engineers with different backgrounds, and their familiarity with the ink-dumping machine varies, resulting in low overall efficiency.

[0004] Therefore, the existing ink dot machines cannot meet the needs of the R&D stage very well. There is an urgent need for a small wafer ink dot device that is simple to operate (no threshold for operators), flexible and lightweight (no restrictions on the use site), efficient and reliable (simple structure, no maintenance requirements). Utility Model Content

[0005] The purpose of the utility model is to provide a wafer ink dot device to solve the problem that the existing ink dot machine is not suitable for the intermittent trial production of small batches of wafer ink dot needs in the research and development stage.

[0006] In order to achieve the above-mentioned object, the utility model provides a wafer ink dotting device, comprising:

[0007] The operating table has a horizontal surface;

[0008] a tray, mounted on the horizontal platform and used to accommodate a wafer;

[0009] Two scale bars are mounted on the horizontal platform along the X-axis and the Y-axis respectively, wherein the X-axis and the Y-axis are two directions perpendicular to each other;

[0010] An ink dot assembly is located above the tray, and includes a first pointer, a second pointer, and an ink pen. The ink pen is used to mark ink dots on the chips to be marked on the wafer. The first pointer and the second pointer are both hollow structures in the middle to form a first slide rail and a second slide rail, respectively. The first pointer is set parallel to the X-axis, and the second pointer is set parallel to the Y-axis. The first pointer and the second pointer intersect vertically. The ink pen is set at the intersection of the first pointer and the second pointer. The first pointer can move along the Y-axis and drive the ink pen to move along the second slide rail. The second pointer can move along the X-axis and drive the ink pen to move along the first slide rail.

[0011] Optionally, a first mounting area for accommodating a first wafer is provided on the tray.

[0012] Optionally, a second mounting area for accommodating a second wafer is further provided in the first mounting area, the center of the first mounting area coincides with the center of the second mounting area, and the size of the second wafer is smaller than the size of the first wafer.

[0013] Optionally, the scale bar is detachably mounted on the horizontal surface.

[0014] Optionally, the scale interval between the two scale bars is equal to the length and width of the chip respectively.

[0015] Optionally, the ink dot assembly also includes a first drive mechanism, a first transmission mechanism, a second drive mechanism and a second transmission mechanism. The first drive mechanism is connected to the first pointer through the first transmission mechanism to drive the first pointer to move along the Y axis, and the second drive mechanism is connected to the second pointer through the second transmission mechanism to drive the second pointer to move along the X axis.

[0016] Optionally, the first driving mechanism and / or the second driving mechanism is a stepping motor.

[0017] Optionally, the first transmission mechanism and / or the second transmission mechanism is a rack and pinion transmission mechanism.

[0018] Optionally, the first pointer is located above the second pointer, the ink pen includes an ink pen rod and an ink pen barrel mounted outside the ink pen rod, the ink pen rod can move vertically relative to the ink pen barrel to mark ink dots on the chip to be marked on the wafer, and the ink pen barrel is placed on the first slide rail and passes through the second slide rail.

[0019] Optionally, the ink pen barrel includes a central barrel and a first frustum and a second frustum respectively located at the top and bottom ends of the central barrel, the top surfaces of the first frustum and the second frustum are both connecting surfaces with the central barrel, the first frustum can be slidably placed on the first slide rail, and the inner side of the first slide rail has a first guide surface abutting against the outer surface of the first frustum, and the inner side of the second slide rail has a second guide surface abutting against the outer surface of the second frustum.

[0020] The wafer ink dot device provided by the utility model has at least one of the following beneficial effects:

[0021] 1) Compact size and light weight. The entire platform only needs to be slightly larger than the wafer, which can be transported and used between different sites;

[0022] 2) Simple structure and reliable operation. The unique hollow pointer design enables the ink pen to move simultaneously on the first and second vertical slide rails, quickly reaching any coordinate position on the wafer, and is easy to operate.

[0023] 3) Multi-type adaptability and strong versatility. The tray is equipped with dual card slots to accommodate mainstream 8-inch and 12-inch wafers, and the detachable scale bar can flexibly adapt to various chip sizes.

[0024] 4) Two modes, efficient and fast. For small-scale inking needs, the pointer can be manually moved to the specified position according to the scale, and the ink pen can be manually pressed to complete the inking. For large-scale processing, the pointer can be automatically moved to the specified position by the power device, and the ink pen can be pressed by the pressure device to complete the inking.

[0025] 5) The wafer ink dot device provided by the utility model is particularly suitable for the small-batch wafer ink dot needs in the research and development stage, filling the application gap of conventional ink dot machines outside the mass production stage, reducing the occupation of space, personnel and costs, and meeting another usage scenario with good economy, flexibility and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Those skilled in the art will appreciate that the accompanying drawings are provided to better understand the present invention and do not constitute any limitation on the scope of the present invention.

[0027] Figure 1 This is a schematic structural diagram of a wafer ink dotting device provided in the first embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of ink dots on a wafer provided in Example 1 of the present utility model;

[0029] Figure 3 A schematic diagram of the connection between the ink pen and the first pointer provided in the first embodiment of the present invention;

[0030] Figure 4 A schematic diagram of the connection between the ink pen and the second pointer provided in the first embodiment of the present invention;

[0031] Figure 5 This is a structural schematic diagram of the ink pen holder provided in Example 1 of the present utility model.

[0032] in:

[0033] 1-Horizontal table; 2-Tray; 3-Wafer; 3-1-Chip; 4-Scale bar; 5-First pointer; 5-1-First slide rail; 6-Second pointer; 6-1 Second slide rail; 7-Ink pen; 7-1-Ink pen holder; 7-2-Ink pen tube; 7-21-Center tube; 7-22-First truncated table; 7-23-Second truncated table; 8-Ink dot. DETAILED DESCRIPTION

[0034] In order to make the purpose, advantages and features of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Any modification of the structure, change in the proportional relationship or adjustment of the size, under the condition that the effect produced by the present invention and the purpose that can be achieved are the same or similar, should still fall within the scope of the technical content disclosed in the present invention.

[0035] As used in the present invention, the singular forms "a", "an" and "the" include plural objects, unless the content clearly indicates otherwise. As used in the present invention, the term "or" is generally used in a sense including "and / or", unless the content clearly indicates otherwise. As used in the present invention, the term "several" is generally used in a sense including "at least one", unless the content clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in a sense including "two or more", unless the content clearly indicates otherwise. In addition, the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features.

[0036] In the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0037] Please refer to Figure 1 and Figure 2 This embodiment provides a wafer ink dot device, comprising:

[0038] An operating table having a horizontal surface 1;

[0039] A tray 2 is mounted on the horizontal surface 1 and is used to accommodate a wafer 3;

[0040] Two scale bars 4 are mounted on the horizontal platform 1 along the X-axis and the Y-axis, respectively, and the X-axis and the Y-axis are two directions perpendicular to each other;

[0041] The ink dot assembly is located above the tray 2. The ink dot assembly includes a first pointer 5, a second pointer 6 and an ink pen 7. The ink pen 7 is used to mark ink dots 8 on the chip 3-1 to be marked on the wafer 3. The first pointer 5 and the second pointer 6 are both hollow structures in the middle to form a first slide rail and a second slide rail respectively. The first pointer 5 is set parallel to the X-axis, and the second pointer 6 is set parallel to the Y-axis. The first pointer 5 and the second pointer 6 intersect vertically. The ink pen 7 is set at the intersection of the first pointer 5 and the second pointer 6. The first pointer 5 can move along the Y-axis and drive the ink pen 7 to move along the second slide rail. The second pointer 6 can move along the X-axis and drive the ink pen 7 to move along the first slide rail.

[0042] The wafer ink dot device provided in this embodiment has a simple structure and low production cost. It can quickly perform ink dot 8 on the chip 3-1 on the wafer 3 and is easy to operate. It is particularly suitable for the intermittent trial production of small batches of wafers 3 to meet the ink dot needs during the research and development stage.

[0043] Specifically, in this embodiment, a tray 2 is provided on the horizontal surface 1 of the operating table. The tray 2 is provided with a first carrying area for accommodating the first wafer 3. The size of the first carrying area can be designed according to the size of the first wafer 3, and this application does not impose any restrictions on this. The tray 2 can be fixed to the horizontal surface 1 by conventional means such as threaded connection and snap connection, and this application also does not impose any restrictions on this. The entire horizontal platform is slightly larger than the wafer, which can meet the needs of transportation and use between different locations.

[0044] Preferably, a second bearing area for accommodating the second wafer 3 is further provided in the first bearing area, the center of the first bearing area coincides with the center of the second bearing area, and the size of the second wafer 3 is smaller than the size of the first wafer 3. By adding a second bearing area in the first bearing area, the second wafer 3 can be accommodated, so the tray 2 provided in the present application can simultaneously adapt to wafers 3 of different sizes, such as 8-inch and 12-inch wafers, and is more versatile. Of course, more card slots can be designed according to the size of the wafer 3 that needs to be adapted, and this application does not impose any restrictions on this. The first bearing area and the second bearing area can be designed as a groove structure or a support structure, and this application does not impose any restrictions on this.

[0045] In this embodiment, the scale bar 4 is detachably mounted on the horizontal surface 1. This detachable mounting method facilitates replacement of the scale bar 4 with different scale intervals according to the size of the chip 3-1, thereby more accurately moving the first pointer 5 and the second pointer 6. Alternatively, the scale bar 4 can be fixed to the horizontal surface 1 by conventional means such as threaded connection, snap connection, etc., which is not limited in this application.

[0046] Preferably, the scale spacing of the two scale bars 4 is equal to the length and width of the chip 3-1, respectively. The length of the chip 3-1 can be understood as the length of the chip 3-1 along the X-axis direction, and the width of the chip 3-1 can be understood as the length of the chip 3-1 along the Y-axis direction. Therefore, the scale spacing of the scale bars 4 set along the X-axis can be equal to the length of the chip 3-1, and the scale spacing of the scale bars 4 set along the Y-axis can be equal to the width of the chip 3-1, thereby facilitating the accurate and rapid movement of the two pointers to locate the chip 3-1 that needs to be marked with ink dots 8.

[0047] In this embodiment, the ink dot 8 assembly includes a first pointer 5, a second pointer 6, and an ink pen 7. The ink pen 7 is used to mark the ink dot 8 on the chip 3-1 to be marked on the wafer 3. The first pointer 5 and the second pointer 6 are used to drive the ink pen 7 to move so as to accurately locate the chip 3-1 to be marked with the ink dot 8. It should be noted that the ink pen 7 is a conventional device and generally adopts a press-type ink dot design. The top of the ink pen 7 is pressed manually or automatically (such as using a pressure device) to drive the ink pen rod 7-1 to extend downward and contact the chip 3-1 to be marked. When the top of the ink pen 7 is released, the ink pen rod 7-1 can be reset under the action of the built-in spring.

[0048] In this embodiment, the first pointer 5 and the second pointer 6 can move separately. For example, when the first pointer 5 moves along the Y axis, it drives the ink pen 7 to move along the second slide rail 6-1. When the second pointer 6 moves along the X axis, it drives the ink pen 7 to move along the first slide rail 5-1. When the intersection of the first pointer 5 and the second pointer 6 is located just above the chip 3-1 to be marked, the first pointer 5 and the second pointer 6 are both moved into place. At this time, the ink pen 7 is located just above the chip 3-1 to be marked and is vertically aligned with the chip 3-1 to be marked. Of course, the first pointer 5 and the second pointer 6 can also move at the same time to quickly reach any coordinate position of the wafer, and the operation is simple and easy. In actual applications, in the face of small-scale ink printing needs, the two pointers can be manually moved to the specified position according to the scale on the scale bar 4, and the ink pen can be manually pressed to complete the ink printing; when processing in large quantities, the pointer can be automatically dragged to the specified position by relying on the power device, and the ink pen can be pressed under the action of the pressure device to complete the ink printing.

[0049] In addition, a distance should be left between the first pointer 5 and the second pointer 6 to avoid contact friction during movement.

[0050] In this embodiment, the first pointer 5 and the second pointer 6 are both hollow structures in the middle to form the first slide rail 5-1 and the second slide rail 6-1 respectively. The first pointer 5 and the second pointer 6 are at different heights and their projections on the horizontal surface intersect vertically. The ink pen 7 is set at the intersection of the first pointer 5 and the second pointer 6. The connection method of the ink pen 7 with the first pointer 5 and the second pointer 6 can be referred to. Figure 3 and Figure 4 The ink pen 7 is directly placed on the first slide rail 5 - 1 of the first pointer 5 , which can support the ink pen 7 on the one hand and guide the movement of the ink pen 7 on the other hand.

[0051] Specifically, the first pointer 5 is located above the second pointer 6. The ink pen 7 includes an ink pen rod 7-1 and an ink pen barrel 7-2 that is sleeved outside the ink pen rod 7-1. The ink pen rod 7-1 can move vertically relative to the ink pen barrel 7-2 to mark the chip 3-1 to be marked on the wafer 3. The ink pen barrel 7-2 rests on the first slide rail 5-1 and extends through the second slide rail 6-1. It should be noted that the first pointer 5 can be located above or below the second pointer 6, and this application does not limit this. When the second pointer 6 is located above the first pointer 5, the ink pen barrel 7-2 rests on the second slide rail 6-1.

[0052] Further, such as Figure 5As shown, the ink pen barrel 7-2 includes a central barrel 7-21 and a first truncated cone 7-22 and a second truncated cone 7-23 located at the top and bottom ends of the central barrel 7-21, respectively. The top surfaces of the first truncated cone 7-22 and the second truncated cone 7-23 (i.e., the smaller end planes) are both connecting surfaces with the central barrel 7-21. The first truncated cone 7-22 is slidably mounted on the first slide rail 5-1, and the inner side of the first slide rail 5-1 has a first guide surface that abuts against the outer surface of the first truncated cone 7-22. The inner side of the second slide rail 5-2 has a second guide surface that abuts against the outer surface of the second truncated cone 7-23. Preferably, the ink dot 8 assembly further includes a first drive mechanism, a first transmission mechanism, a second drive mechanism, and a second transmission mechanism. The first drive mechanism is connected to the first pointer 5 through the first transmission mechanism to drive the first pointer 5 to move along the Y axis, and the second drive mechanism is connected to the second pointer 6 through the second transmission mechanism to drive the second pointer 6 to move along the X axis.

[0053] Exemplarily, the first driving mechanism and / or the second driving mechanism is a stepper motor, which has high control accuracy and good reliability and is a better choice.

[0054] Exemplarily, the first transmission mechanism and / or the second transmission mechanism is a rack and pinion transmission mechanism. It should be noted that the rack and pinion transmission mechanism is a well-known technology in the art, and this application has not made any improvements thereto. Those skilled in the art should be aware of the connection between the belt transmission mechanism and the corresponding drive mechanism and the pointer. For example, the rack and pinion transmission mechanism includes meshing gears and racks, the gears are connected to the output shaft of the stepper motor, the racks are connected to the pointer (such as the first pointer 5 or the second pointer 6), and the stepper motor drives the gears to rotate, thereby driving the racks to move in a straight line, thereby driving the pointer to move in a straight line. Of course, in addition to using transmission mechanisms well known in the art, existing power devices such as hydraulic cylinders / electric telescopic rods can also be used to directly drive the pointer to move. Even when there are fewer chips 3-1 on the wafer 3, the pointer can be moved directly by manually pushing it. The pointer can be automatically or manually positioned according to demand, and its use is not restricted by site and personnel, and its flexibility is high.

[0055] In summary, the embodiment of the utility model provides a wafer ink dot device, which is particularly suitable for the small-batch wafer ink dot needs in the research and development stage, filling the application gap of conventional ink dot machines outside the mass production stage, reducing the occupation of space, personnel and costs, and meeting another usage scenario with good economy, flexibility and reliability.

[0056] Furthermore, it should be recognized that although the present invention has been disclosed above with reference to preferred embodiments, the above embodiments are not intended to limit the present invention. Any person skilled in the art will be able to utilize the above-disclosed technical content to make numerous possible variations and modifications to the present invention, or to modify the present invention into equivalent embodiments with equivalent variations, without departing from the scope of the present invention. Therefore, any simple modifications, equivalent variations, and modifications to the above embodiments that do not depart from the present invention and are based on the technical essence of the present invention remain within the scope of protection of the present invention.

Claims

1. A wafer ink dot device, characterized in that: include: The operating table has a horizontal surface; a tray, mounted on the horizontal platform and used to accommodate a wafer; Two scale bars are mounted on the horizontal platform along the X-axis and the Y-axis respectively, wherein the X-axis and the Y-axis are two directions perpendicular to each other; An ink dot assembly is located above the tray, and includes a first pointer, a second pointer, and an ink pen. The ink pen is used to mark ink dots on the chips to be marked on the wafer. The first pointer and the second pointer are both hollow structures in the middle to form a first slide rail and a second slide rail, respectively. The first pointer is set parallel to the X-axis, and the second pointer is set parallel to the Y-axis. The first pointer and the second pointer intersect vertically. The ink pen is set at the intersection of the first pointer and the second pointer. The first pointer can move along the Y-axis and drive the ink pen to move along the second slide rail. The second pointer can move along the X-axis and drive the ink pen to move along the first slide rail.

2. The wafer ink dotting device according to claim 1, characterized in that: The tray is provided with a first carrying area for accommodating the first wafer.

3. The wafer ink dotting device according to claim 2, characterized in that: A second carrying area for accommodating a second wafer is further provided in the first carrying area. The center of the first carrying area coincides with the center of the second carrying area. The size of the second wafer is smaller than that of the first wafer.

4. The wafer ink dotting device according to claim 1, characterized in that: The scale bar is detachably mounted on the horizontal surface.

5. The wafer ink dotting device according to claim 4, characterized in that: The scale intervals between the two scale bars are respectively equal to the length and width of the chip.

6. The wafer ink dotting device according to claim 1, characterized in that: The ink dot assembly also includes a first drive mechanism, a first transmission mechanism, a second drive mechanism and a second transmission mechanism. The first drive mechanism is connected to the first pointer through the first transmission mechanism to drive the first pointer to move along the Y axis, and the second drive mechanism is connected to the second pointer through the second transmission mechanism to drive the second pointer to move along the X axis.

7. The wafer ink dotting device according to claim 6, characterized in that: The first driving mechanism and / or the second driving mechanism is a stepping motor.

8. The wafer ink dotting device according to claim 6, characterized in that: The first transmission mechanism and / or the second transmission mechanism is a rack and pinion transmission mechanism.

9. The wafer ink dotting device according to claim 1, wherein: The first pointer is located above the second pointer. The ink pen includes an ink pen rod and an ink pen barrel mounted outside the ink pen rod. The ink pen rod can move vertically relative to the ink pen barrel to mark ink dots on the chips to be marked on the wafer. The ink pen barrel is placed on the first slide rail and passes through the second slide rail.

10. The wafer ink dotting device according to claim 9, characterized in that: The ink pen holder includes a central tube and a first frustum and a second frustum located at the top and bottom ends of the central tube respectively. The top surfaces of the first frustum and the second frustum are both connecting surfaces with the central tube. The first frustum can be slidably placed on the first slide rail, and the inner side of the first slide rail has a first guide surface abutting the outer surface of the first frustum. The inner side of the second slide rail has a second guide surface abutting the outer surface of the second frustum.

Images