Laser power sensor performance detection device

Abstract

The utility model discloses a performance detection device for a laser power sensor. The performance detection device comprises a heat conducting plate used for absorbing and conducting heat, an FPC (Flexible Printed Circuit) board and a semiconductor substrate used for detecting the power performance of the laser power sensor, the rear end face of the FPC board is fixedly attached to the front end face of the heat conducting plate, the semiconductor substrate is attached to the front end face of the FPC board, and the FPC board is provided with a first wiring terminal and a second wiring terminal which are correspondingly connected to the two ends of the semiconductor substrate. The beneficial effects are that the heat conduction plate is used as a heat conduction material for heat conduction, the FPC board is used as a base material, the thickness of the FPC board can be controlled to be 0.1 mm, when the rear end face of the FPC board is fixedly attached to the front end face of the heat conduction plate, the speed of heat conduction from the heat conduction plate to the FPC board can be very high, and then the heat can be rapidly conducted and acts on the semiconductor substrate; therefore, when the power performance of the laser power sensor to be detected is tested, the hysteresis of heat transmission does not exist easily, and the laser power of the laser power sensor can be analyzed quickly, scientifically and accurately.

Description

Technical Field

[0001] The utility model relates to the technical field of laser sensors, in particular to a performance detection device for a laser power sensor. Background Art

[0002] Laser power sensor is a device that uses laser technology for measurement. It is widely used in industrial automation, environmental monitoring, medical diagnosis and scientific research.

[0003] Its working principle is mainly based on the characteristics of lasers, such as high directivity, high monochromaticity and high brightness. After modulation and processing, the light beam emitted by the laser power sensor can be used to detect the specific position, size, shape, speed, vibration and temperature of the object. According to the different parameters to be measured and the application scenarios, it can be divided into many categories, including laser ranging sensors, laser displacement sensors, laser speed sensors and laser spectrum sensors.

[0004] The power measurement of laser power sensors in the prior art is usually to irradiate the light beam emitted by the laser power sensor onto the surface of an aluminum plate according to a preset stroke, and then conduct heat to the PCB board through the aluminum plate to act on the N-type material set on the corresponding PCB board. Then, by detecting the voltage drawn from the leads at both ends of the N-type material, the power performance of the relevant laser power sensor can be measured.

[0005] However, during the power performance test of the above-mentioned related laser power sensor, if the power of the laser power sensor jumps, there will often be a hysteresis effect when the laser power sensor is working. As a result, when testing its power performance, due to the long heat conduction distance, there will be a lag in heat transfer, which is not conducive to the rapid and scientific and accurate analysis of its laser power.

[0006] In this regard, the inventor of this patent combined his work experience, conducted in-depth thinking on the problems encountered in the work, read a large amount of scientific research materials and literature, and through searching and novelty, gradually conceived and designed this application to solve the relevant technical problems. Utility Model Content

[0007] The present invention aims to solve at least one of the technical problems in the related art to a certain extent. To this end, the present invention aims to provide a performance detection device for a laser power sensor.

[0008] To achieve one of the above objectives, a laser power sensor performance detection device according to an embodiment of the present utility model includes a heat conducting plate for absorbing and conducting heat, an FPC board, and a semiconductor substrate for detecting the power performance of the laser power sensor;

[0009] The rear end face of the FPC board is fixedly attached to the front end face of the heat conducting plate, the semiconductor substrate is mounted on the front end face of the FPC board, and the FPC board is provided with a first terminal and a second terminal correspondingly connected to both ends of the semiconductor substrate.

[0010] In addition, the laser power sensor performance detection device according to the above embodiment of the present invention may also have the following additional technical features:

[0011] According to one embodiment of the present invention, it further includes a first conductive line and a second conductive line;

[0012] The first conductive line connection end is connected to the first wiring terminal; the second conductive line connection end is connected to the second wiring terminal.

[0013] According to one embodiment of the present invention, it further includes a first conductive head and a second conductive head;

[0014] The first conductive head connection end is connected to the end of the first wiring terminal; the second conductive head connection end is connected to the end of the second wiring terminal.

[0015] According to an embodiment of the present invention, the heat conducting plate is an aluminum plate, an aluminum alloy plate or a copper plate, and is provided with a fixing installation hole. The thickness is D, and D=1.0 mm-3.0 mm.

[0016] According to an embodiment of the present invention, the rear end surface of the FPC board is adhered to the front end surface of the heat conducting plate as a whole by strong adhesive.

[0017] According to an embodiment of the present invention, the semiconductor substrate is adhered to the front end surface of the FPC board by strong adhesive.

[0018] According to an embodiment of the present invention, the semiconductor substrate is made of N-type semiconductor material.

[0019] According to an embodiment of the present invention, the heat conducting plate and the FPC board are both shaped into a circle, an ellipse, a triangle, a rectangle, a square, other polygons or other irregular shapes.

[0020] According to one embodiment of the present invention, the semiconductor substrate is formed into a strip structure, and multiple strips are provided and connected in series between the first terminal and the second terminal. The multiple semiconductor substrates are adhered and evenly fixed to the front end surface of the FPC board by strong adhesive.

[0021] According to one embodiment of the present invention, the first ends of the plurality of semiconductor substrates are evenly arranged to point to the center point of the front end surface of the FPC board, and the second ends are evenly arranged to point to the periphery of the front end surface of the FPC board in a divergent shape, so that the overall structure formed by them is shaped like a sunflower diverging.

[0022] The beneficial effects of the utility model are:

[0023] First, the laser power sensor performance detection device provided by the present application, when implemented, fixes the heat conducting plate, FPC board and the semiconductor substrate for detecting the power performance of the laser power sensor into one body, so that the overall structure is relatively compact. When it is used as a laser power sensor performance detection device, it is easy to use. In addition, the present application uses the heat conducting plate as the heat conducting material for heat conduction, and uses the FPC board made of polyimide material as the base material. The thickness of the FPC board can be controlled to be 0.1 mm or less. When the rear end face of the heat conducting plate is fixed to the front end face of the heat conducting plate, the heat conducting plate can be easily connected to the heat conducting plate. The speed at which heat is conducted from the heat conducting plate to it can be very rapid, so that it can be quickly conducted and act on the semiconductor substrate. Even if the power of the laser power sensor to be detected jumps, even if there is a hysteresis effect when it is working, the heat generated by the light beam it emits can still be relatively quickly conducted through the FPC board with a thickness of 0.1 mm or less and act on the semiconductor substrate. When the power performance of the laser power sensor to be detected is tested through it, there is less likely to be a hysteresis in heat transfer, which is conducive to the rapid, scientific and accurate analysis of its laser power.

[0024] Secondly, by providing the first conductive wire and the second conductive wire, it is easier to connect their ends to an external pressure measuring device to test the power performance of the laser power sensor to be tested, thereby eliminating the need to find additional conductive wires for connection, making the present application convenient to use.

[0025] Third, since the semiconductor substrate is formed into a strip structure and is provided with multiple strips, which are connected in series between the first terminal and the second terminal, and are evenly adhered to the front end surface of the FPC board by strong adhesive, after the FPC board is quickly heated, the heat can be conducted as quickly as possible to the multiple evenly arranged semiconductor substrates, so that after they are stacked in series, a more stable voltage can be quickly generated between the first terminal and the second terminal, so that the power performance of the laser power sensor to be detected can be better tested by detecting the voltage generated between its two ends.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0028] Figure 1 This is a front view of the laser power sensor performance detection device of the utility model;

[0029] Figure 2 This is a rear view of the utility model laser power sensor performance detection device;

[0030] Figure 3 This is a front view of the laser power sensor performance detection device of the utility model when the heat conducting plate is removed;

[0031] Figure 4 This is a circuit structure diagram showing the performance detection device for the laser power sensor of the utility model;

[0032] Figure 5 This is a physical display diagram of the laser power sensor performance detection device of the utility model;

[0033] Reference numerals:

[0034] Laser power sensor performance detection device 1000;

[0035] Heat conducting plate 10;

[0036] Fixed mounting hole 101;

[0037] FPC board 20;

[0038] First terminal 201;

[0039] Second terminal 202;

[0040] Semiconductor substrate 30;

[0041] a first conductive line 40;

[0042] a second conductive line 50;

[0043] a first conductive head 60;

[0044] a second conductive head 70;

[0045] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0046] The following describes in detail embodiments of the present invention. Examples of the embodiments are shown in the accompanying drawings. The same or similar reference numerals throughout the specification represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings of the specification, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0049] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0050] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0051] The laser power sensor performance detection device 1000 according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0052] Reference Figures 1 to 5 As shown, the laser power sensor performance detection device 1000 provided according to an embodiment of the present invention includes a heat conducting plate 10 for absorbing and conducting heat, an FPC board 20, and a semiconductor substrate 30 for detecting the power performance of the laser power sensor;

[0053] The rear end face of the FPC board 20 is fixed to the front end face of the heat conducting plate 10, and the semiconductor substrate 30 is mounted on the front end face of the FPC board 20. The FPC board 20 is provided with a first terminal 201 and a second terminal 202 correspondingly connected to the two ends of the semiconductor substrate 30.

[0054] Based on the above, it is clear that when the present application is implemented, it is mainly used as a laser power sensor performance detection device 1000.

[0055] Specifically, when applying the present application, the present application is assembled according to the above-mentioned structure, and the laser power sensor to be detected is turned on so that the light beam emitted by it is irradiated from back to front according to a preset distance to the rear end face of the heat conducting plate 10. After being heated, the heat conducting plate 10 can conduct heat to the FPC board 20 and act on the semiconductor substrate 30, so that a weak voltage is generated at both ends of the semiconductor substrate 30. The first terminal 201 and the second terminal 202 connected to the two ends of the semiconductor substrate 30 are connected to an external pressure measuring device, and the voltage value of the generated weak voltage can be measured to evaluate the power performance of the laser power sensor being detected based on the corresponding voltage value.

[0056] For the power performance of the laser power sensor to be tested, the test standard is: as the temperature of the heat conducting plate 10 increases, the temperature of the heat conducted and acting on the semiconductor substrate 30 will increase, causing the tested voltage to change to a certain extent and become higher and higher. The steeper the tested voltage changes from low to high, the better the power performance of the laser power sensor to be tested. Conversely, when the tested voltage changes from low to high relatively slowly, it indicates that the power performance of the laser power sensor to be tested is average.

[0057] And the use of the above-mentioned application will obviously have the following technical effects:

[0058] On the one hand, the present application fixes the heat conducting plate 10, the FPC board 20 and the semiconductor substrate 30 for detecting the power performance of the laser power sensor into one body, making the overall structure more compact. When it is used as a laser power sensor performance detection device 1000, it is easy to use.

[0059] On the other hand, the present application uses the heat conducting plate 10 as the heat conducting material for heat conduction, and uses the FPC board 20 made of polyimide material as the base material, the thickness of which can be controlled at 0.1 mm or less. When its rear end face is attached and fixed to the front end face of the heat conducting plate 10, the speed at which heat is conducted from the heat conducting plate 10 to it can be very fast, so that it can be quickly conducted and act on the semiconductor substrate 30, so that even if the power of the laser power sensor to be detected has a jump condition, then even if there is a hysteresis effect when it is working, the heat generated by the light beam it emits can still be relatively quickly conducted and act on the semiconductor substrate 30 through the FPC board 20 with a thickness of 0.1 mm or less, so that when the power performance of the laser power sensor to be detected is tested through it, it is not easy to have a hysteresis in heat transfer, which is conducive to the rapid and scientific and accurate analysis of its laser power.

[0060] Furthermore, through the above-mentioned optimized design, the overall structure of the present application is highly practical and has good use effect.

[0061] Furthermore, in a specific implementation, according to an embodiment of the present invention, the present invention further includes a first conductive line 40 and a second conductive line 50;

[0062] The connecting end of the first conductive wire 40 is connected to the first wiring terminal 201 ; the connecting end of the second conductive wire 50 is connected to the second wiring terminal 202 .

[0063] Therefore, by setting the first conductive wire 40 and the second conductive wire 50, it is easier to connect the ends thereof to an external pressure measuring device to test the power performance of the laser power sensor to be detected, thereby eliminating the need to find additional conductive wires for connection, making the present application convenient to use.

[0064] Furthermore, in a specific implementation, according to an embodiment of the present invention, the present invention further includes a first conductive head 60 and a second conductive head 70;

[0065] The connecting end of the first conductive head 60 is connected to the end of the first wiring terminal 201 ; the connecting end of the second conductive head 70 is connected to the end of the second wiring terminal 202 .

[0066] Therefore, by setting the first conductive head 60 and the second conductive head 70, it is possible to better connect the end of the first conductive wire 40 and the end of the second conductive wire 50 to an external pressure measuring device to test the power performance of the laser power sensor to be detected, making the present application more convenient to use.

[0067] Preferably, in the present technical solution, according to an embodiment of the present utility model, the heat conducting plate 10 is an aluminum plate, an aluminum alloy plate or a copper plate, on which a fixing installation hole 101 is opened, and its thickness is D, wherein D=1.0mm-3.0mm.

[0068] Therefore, by inserting a fixing rod or other fixing parts into the fixing installation hole 101, the entire application can be fixed, making it difficult for the application to shift during actual use.

[0069] In addition, in a specific implementation, according to an embodiment of the present invention, the rear end surface of the FPC board 20 is adhered to the front end surface of the heat conducting plate 10 by strong adhesive.

[0070] In this way, when the FPC board 20 and the heat conducting plate 10 are fixed as one, they are not easy to tear or loosen, and the FPC board 20 and the heat conducting plate 10 are firmly attached to each other, so that the heat conduction stability from the heat conducting plate 10 to the FPC board 20 is good.

[0071] Furthermore, in a specific implementation, according to an embodiment of the present invention, the semiconductor substrate 30 is fixed to the front end surface of the FPC board 20 by means of a strong adhesive.

[0072] In this way, even if the semiconductor substrate 30 and the FPC board 20 are fixed as one, they are not easy to tear or loosen, and the semiconductor substrate 30 and the FPC board 20 are firmly attached, so that the heat conduction stability from the FPC board 20 to the semiconductor substrate 30 is also good.

[0073] In this technical solution, according to an embodiment of the present invention, the semiconductor substrate 30 is made of N-type semiconductor material.

[0074] It should be noted here that, as a matter of prior art, N-type semiconductor materials are semiconductor materials with electrons as the majority carriers, and N stands for Negative. N-type semiconductors are formed by introducing donor-type impurities. Impurities are doped into pure semiconductor materials to create impurity energy levels in the band gap. If the impurity atoms can donate electrons, their energy levels are donor levels, and the semiconductor is an N-type semiconductor. For example, adding arsenic, a Group V element, to silicon, a Group IV semiconductor, can change the conductivity and conductivity type of the semiconductor. For N-type semiconductors, electrons are excited into the conduction band and become the main carriers. For example, silicon and germanium doped with Group 15 (VA) elements (phosphorus, arsenic, antimony, bismuth, etc.) are always N-type. Some solids, such as ZnO, TiO, V2O5, and MoO3, are always N-type.

[0075] Therefore, in N-type semiconductor materials, free electrons are majority carriers and holes are minority carriers, and electrical conductivity is primarily achieved through free electrons. The greater the amount of impurities incorporated, the higher the concentration of majority carriers (free electrons), and the stronger the electrical conductivity. Given the excellent electrical conductivity of N-type semiconductor materials, their use as semiconductor substrate 30 is particularly useful for testing the power performance of a laser power sensor by detecting the voltage generated between their terminals.

[0076] Again, in specific implementation, according to one embodiment of the present invention, the heat conducting plate 10 and the FPC board 20 are preferably formed into a circle, an ellipse, a triangle, a rectangle, a square, other polygons or other irregular shapes.

[0077] That is to say, in the present application, the shapes of the heat conducting plate 10 and the FPC board 20 may not be particularly limited, as long as they are fixed together and combined with the semiconductor substrate 30, and the whole they form can test the power performance of the laser power sensor to be detected, they can have any shape.

[0078] Moreover, in the specific implementation, as a preferred solution, according to an embodiment of the present invention, the semiconductor substrate 30 is formed into a strip structure, and a plurality of them are provided and connected in series between the first terminal 201 and the second terminal 202. The plurality of semiconductor substrates 30 are adhered and evenly fixed to the front end surface of the FPC board 20 by strong adhesive.

[0079] In this regard, it is clear that since the semiconductor substrate 30 is formed into a strip structure and is provided with multiple strips, which are connected in series between the first terminal 201 and the second terminal 202, and are adhered and evenly bonded to the front end surface of the FPC board 20 by strong adhesive, after the FPC board 20 can be quickly heated, the heat can be conducted as quickly as possible to the multiple evenly arranged semiconductor substrates 30, so that after they are stacked in series, a more stable voltage can be quickly generated between the first terminal 201 and the second terminal 202, so that the power performance of the laser power sensor to be detected can be better tested by detecting the voltage generated between its two ends.

[0080] And preferably, in the present application, according to one embodiment of the utility model, the first ends of the plurality of semiconductor substrates 30 are evenly arranged to point to the center point of the front end surface of the FPC board 20, and the second ends are evenly arranged to point to the periphery of the front end surface of the FPC board 20 in a divergent shape, so that the overall shape formed by them is divergent in the shape of a sunflower.

[0081] In this way, multiple semiconductor substrates 30 can be heated quickly, and the front end of the entire FPC board 20 of the present application looks more beautiful and elegant.

[0082] It should be added that, in a specific implementation, according to the laser power sensor performance detection device 1000 provided in an embodiment of the present invention, when a plurality of the semiconductor substrates 30 are connected in series, the connected parts are connected through electrical connecting wires placed on the FPC board 20, and the ends thereof are welded to the electrical connecting wires through solder. The electrical connecting wires used will obviously be very thin, so that they do not take up space, so that the overall structure of the present application will indeed be very compact and exquisite.

[0083] Other embodiments and the like are not described here as examples.

[0084] In summary, the laser power sensor performance detection device 1000 provided by the present application, when implemented, fixes the heat conducting plate 10, the FPC board 20 and the semiconductor substrate 30 for detecting the power performance of the laser power sensor into one body, so that the overall structure is relatively compact. When it is used as the laser power sensor performance detection device 1000, it is easy to use. In addition, the present application uses the heat conducting plate 10 as the heat conducting material for heat conduction, and uses the FPC board 20 made of polyimide material as the base material, the thickness of which can be controlled to be 0.1 mm or less, and its rear end face is in contact with the front end face of the heat conducting plate 10. When fixed, the speed at which heat is conducted from the heat conducting plate 10 to it can be very rapid, so that it can be quickly conducted and act on the semiconductor substrate 30, so that even if the power of the laser power sensor to be detected has a jump condition, then even if there is a hysteresis effect when it is working, the heat generated by the light beam it emits can still be relatively quickly conducted and act on the semiconductor substrate 30 through the FPC board 20 with a thickness of 0.1 mm or less, so that when the power performance of the laser power sensor to be detected is tested, there is less likely to be a lag in heat transfer, which is conducive to the rapid, scientific and accurate analysis of its laser power.

[0085] In addition, by providing the first conductive wire 40 and the second conductive wire 50, it is easier to connect their ends to an external pressure measuring device to test the power performance of the laser power sensor to be tested, thereby eliminating the need to find additional conductive wires for connection, making the present application convenient to use.

[0086] Furthermore, since the semiconductor substrate 30 is formed into a strip structure and is provided with multiple strips, which are connected in series between the first terminal 201 and the second terminal 202, and are adhered and evenly fixed to the front end surface of the FPC board 20 by strong adhesive, after the FPC board 20 is quickly heated, the heat can be conducted as quickly as possible to the multiple evenly arranged semiconductor substrates 30, so that after they are stacked in series, a more stable voltage can be quickly generated between the first terminal 201 and the second terminal 202, so that the power performance of the laser power sensor to be detected can be better tested by detecting the voltage generated between its two ends.

[0087] Furthermore, the laser power sensor performance detection device 1000 provided in this application is indeed extremely practical and has excellent performance, which means that this application will inevitably have great market promotion value, and this application will inevitably be very popular and will be effectively popularized.

[0088] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0089] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A laser power sensor performance detection device, characterized in that: It includes a heat conducting plate for absorbing and conducting heat, an FPC board, and a semiconductor substrate for detecting the power performance of the laser power sensor; The rear end face of the FPC board is fixedly attached to the front end face of the heat conducting plate, the semiconductor substrate is mounted on the front end face of the FPC board, and the FPC board is provided with a first terminal and a second terminal correspondingly connected to both ends of the semiconductor substrate.

2. The laser power sensor performance detection device according to claim 1, characterized in that: Also includes a first conductive line and a second conductive line; The first conductive line connection end is connected to the first wiring terminal; the second conductive line connection end is connected to the second wiring terminal.

3. The laser power sensor performance detection device according to claim 2, characterized in that: Also includes a first conductive head and a second conductive head; The first conductive head connection end is connected to the end of the first wiring terminal; the second conductive head connection end is connected to the end of the second wiring terminal.

4. The laser power sensor performance detection device according to claim 1, characterized in that: The heat conducting plate is an aluminum plate, an aluminum alloy plate or a copper plate, and is provided with a fixing installation hole. The thickness is D, where D=1.0 mm-3.0 mm.

5. The laser power sensor performance detection device according to claim 1, characterized in that: The rear end surface of the FPC board is adhered to the front end surface of the heat conducting plate by strong adhesive.

6. The laser power sensor performance detection device according to claim 1, characterized in that: The semiconductor substrate is adhered to the front end surface of the FPC board by strong adhesive.

7. The laser power sensor performance detection device according to claim 1, characterized in that: The semiconductor substrate is made of N-type semiconductor material.

8. The laser power sensor performance detection device according to claim 1, characterized in that: The heat conducting plate and the FPC plate are both shaped into a circle, an ellipse, a triangle, a rectangle, a square or other polygons.

9. The laser power sensor performance detection device according to any one of claims 1 to 8, characterized in that: The semiconductor substrate is formed into a strip structure, and multiple strips are provided and connected in series between the first terminal and the second terminal. The multiple semiconductor substrates are adhered and evenly fixed to the front end surface of the FPC board by strong adhesive.

10. The laser power sensor performance detection device according to claim 9, characterized in that: The first ends of the plurality of semiconductor substrates are evenly and circularly directed to the center point of the front end surface of the FPC board, and the second ends are evenly and divergently directed to the periphery of the front end surface of the FPC board, so that the whole is formed into a sunflower divergent shape.

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